SPP03N60S5_03

Final data SPP03N60S5 SPB03N60S5 VDS RDS(on) ID P-TO263-3-2 Cool MOS™ Power Transistor Feature • New revolutionary high voltage technology • Ultra low gate charge • Periodic avalanche rated • Extreme dv/dt rated • Ultra low effective capacitances • Improved transconductance 600 1.4 3.2 V Ω A P-TO220-3-1 Type SPP03N60S5 SPB03N60S5 Package P-TO220-3-1 P-TO263-3-2 Ordering Code Q67040-S4184 Q67040-S4197 Marking 03N60S5 03N60S5 Maximum Ratings Parameter Continuous drain current TC = 25 °C TC = 100 °C Pulsed drain current, tp limited by Tjmax Avalanche energy, single pulse I D = 2.4 A, VDD = 50 V Avalanche energy, repetitive tAR limited by Tjmax1) EAR I D = 3.2 A, VDD = 50 V Avalanche current, repetitive tAR limited by Tjmax I AR Gate source voltage VGS Gate source voltage AC (f >1Hz) Power dissipation, TC = 25°C Operating and storage temperature VGS Ptot T j , T stg 3.2 ±20 ±30 38 -55... +150 W °C A V 0.2 I D puls EAS Symbol ID 3.2 2 5.7 100 mJ Value Unit A Page 1 2003-10-06 Final data Maximum Ratings Parameter Drain Source voltage slope V DS = 480 V, I D = 3.2 A, Tj = 125 °C SPP03N60S5 SPB03N60S5 Symbol dv/dt Value 20 Unit V/ns Thermal Characteristics Parameter Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB: @ min. footprint @ 6 cm 2 cooling area 2) Soldering temperature, 1.6 mm (0.063 in.) from case for 10s 3) Electrical Characteristics, at Tj=25°C unless otherwise specified Parameter Symbol Conditions min. Drain-source breakdown voltage V(BR)DSS V GS=0V, ID=0.25mA Drain-Source avalanche V(BR)DS V GS=0V, ID=3.2A breakdown voltage Gate threshold voltage Zero gate voltage drain current VGS(th) I DSS ID=135µΑ, VGS=VDS V DS=600V, VGS=0V, Tj=25°C, Tj=150°C Symbol min. RthJC RthJA RthJA Tsold - Values typ. 35 max. 3.3 62 62 260 Unit K/W °C Values typ. 700 4.5 0.5 1.26 3.4 max. 5.5 600 3.5 - Unit V µA 1 70 100 1.4 nA Ω Gate-source leakage current I GSS V GS=20V, VDS=0V V GS=10V, ID=2A, Tj=25°C Tj=150°C Drain-source on-state resistance RDS(on) Page 2 2003-10-06 Final data Electrical Characteristics , at Tj = 25 °C, unless otherwise specified Parameter Transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Qgs Qgd Qg V DD=350V, ID=3.2A, V GS=0 to 10V V DD=350V, ID=3.2A SPP03N60S5 SPB03N60S5 Values min. typ. 1.8 420 150 3.6 35 25 40 15 22.5 max. ns S pF Unit Symbol g fs Ciss Coss Crss td(on) tr td(off) tf Conditions V DS≥2*I D*RDS(on)max, ID=2A V GS=0V, V DS=25V, f=1MHz V DD=350V, V GS=0/10V, ID=3.2A, RG=20Ω - 3.5 7 12.4 8 16 - nC V(plateau) V DD=350V, ID=3.2A V 1Repetitve avalanche causes additional power losses that can be calculated as P =EAR*f. AV 2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 3Soldering temperature for TO-263: 220°C, reflow Page 3 2003-10-06 Final data Electrical Characteristics , at Tj = 25 °C, unless otherwise specified Parameter Inverse diode continuous forward current Inverse diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge VSD t rr Q rr VGS =0V, I F=IS VR =350V, IF=IS , diF/dt=100A/µs SPP03N60S5 SPB03N60S5 Values min. typ. 1 1000 2.3 max. 3.2 5.7 1.2 1700 V ns µC A Unit Symbol IS I SM Conditions TC=25°C Typical Transient Thermal Characteristics Symbol Thermal resistance Rth1 Rth2 Rth3 Rth4 Rth5 Rth6 0.054 0.103 0.178 0.757 0.682 0.202 K/W Value typ. Thermal capacitance Cth1 Cth2 Cth3 Cth4 Cth5 Cth6 0.00005232 0.0002034 0.0002963 0.0009103 0.002084 0.024 Ws/K Unit Symbol Value typ. Unit Tj P tot ( t) R th1 R th,n T case E xternal H eatsink C th1 C th2 C th,n T am b Page 4 2003-10-06 Final data 1 Power dissipation Ptot = f (TC) 40 SPP03N60S5 SPP03N60S5 SPB03N60S5 2 Safe operating area ID = f ( V DS ) parameter : D = 0 , T C=25°C 10 1 W A 32 28 10 0 Ptot 24 20 16 ID 10 -1 12 8 4 0 0 10 -2 0 10 tp = 0.001 ms tp = 0.01 ms tp = 0.1 ms tp = 1 ms DC 20 40 60 80 100 120 °C 160 10 1 10 2 TC 10 V VDS 3 3 Transient thermal impedance ZthJC = f (t p) parameter: D = tp/T 10 1 4 Typ. output characteristic ID = f (VDS); Tj=25°C parameter: tp = 10 µs, VGS 10 A K/W 8 10V 20V 12V ZthJC 10 0 7 ID 6 5 9V 8.5V 4 10 -1 3 2 1 10 -2 -5 10 -4 -3 -2 -1 0 8V 7.5V 7V 6.5V 10 10 10 10 s 10 0 0 5 10 15 V VDS 25 tp Page 5 2003-10-06 Final data 5 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 2 A, VGS = 10 V 8 SPP03N60S5 SPP03N60S5 SPB03N60S5 6 Typ. transfer characteristics ID= f ( VGS ); V DS≥ 2 x ID x RDS(on)max parameter: tp = 10 µs 8 Ω 6 A RDS(on) 6 5 ID 98% typ °C 5 4 4 3 3 2 2 1 1 0 -60 -20 20 60 100 180 0 0 4 8 12 V 20 Tj VGS 7 Typ. gate charge VGS = f (QGate ) parameter: ID = 3.2 A pulsed 16 V 0.2 VDS max SPP03N60S5 8 Forward characteristics of body diode IF = f (VSD) parameter: Tj , tp = 10 µs 10 1 SPP03N60S5 A 12 0.8 VDS max VGS 10 0 8 6 IF 10 -1 Tj = 25 °C typ Tj = 150 °C typ Tj = 25 °C (98%) Tj = 150 °C (98%) 2 4 6 8 10 12 14 16 nC 19 10 -2 0 0.4 0.8 1.2 1.6 2 2.4 V 3 10 4 2 0 0 QGate Page 6 VSD 2003-10-06 Final data 9 Avalanche SOA IAR = f (tAR) par.: Tj ≤ 150 °C 3.5 SPP03N60S5 SPB03N60S5 10 Avalanche energy EAS = f (Tj) par.: ID = 2.4 A, V DD = 50 V 120 A Tj(START) =25°C 2.5 mJ 2 60 1.5 Tj(START) =125°C 40 1 20 0.5 0 -3 10 EAS -2 -1 0 1 2 4 IAR 80 10 10 10 10 10 µs 10 tAR 0 20 40 60 80 100 120 °C 160 Tj 11 Drain-source breakdown voltage V(BR)DSS = f (Tj) 720 SPP03N60S5 12 Typ. capacitances C = f (VDS) parameter: V GS=0V, f=1 MHz 10 4 V pF V(BR)DSS 680 660 640 620 600 10 3 Ciss C 10 2 Coss 10 1 580 560 540 -60 10 0 0 Crss -20 20 60 100 °C 180 10 20 30 40 50 60 70 80 V VDS 100 Tj Page 7 2003-10-06 Final data SPP03N60S5 SPB03N60S5 Definition of diodes switching characteristics Page 8 2003-10-06 Final data P-TO-220-3-1 B 10 ±0.4 3.7 ±0.2 A 1.27±0.13 4.44 SPP03N60S5 SPB03N60S5 15.38 ±0.6 2.8 ±0.2 C 5.23 ±0.9 13.5 ±0.5 3x 0.75 ±0.1 1.17 ±0.22 2x 2.54 0.25 M 0.5 ±0.1 2.51±0.2 ABC All metal surfaces tin plated, except area of cut. Metal surface min. x=7.25, y=12.3 P-TO-263-3-2 (D 2-PAK) 9.98 ±0.48 0.05 Page 9 2003-10-06 Final data Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. SPP03N60S5 SPB03N60S5 Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Page 10 2003-10-06