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C68600-002

C68600-002

  • 厂商:

    INTEL

  • 封装:

  • 描述:

    C68600-002 - Intel Desktop Boards Technical Product Specification - Intel Corporation

  • 数据手册
  • 价格&库存
C68600-002 数据手册
Intel® Desktop Boards D915GAV/D915GAG Technical Product Specification December 2004 Order Number: C68600-002 The Intel® Desktop Board D915GAV/D915GAG may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D915GAV/D915GAG Specification Update. Revision History Revision -001 -002 Revision History First release of the Product Specification. Intel® Desktop Board D915GAV/D915GAG Technical Date June 2004 December 2004 Second release of the Intel Desktop Board D915GAV/D915GAG Technical Product Specification. This product specification applies to only standard Intel Desktop Boards D915GAV and D915GAV with BIOS identifier EV91510A.86A. Changes to this specification will be published in the Intel Desktop Board D915GAV/D915GAG Specification Update before being incorporated into a revision of this document. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel® desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 5937 Denver, CO 80217-9808 or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333. Intel, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for these Intel® Desktop Boards: D915GAV and D915GAG. It describes the standard product and available manufacturing options. Intended Audience The TPS is intended to provide detailed, technical information about the Desktop Boards D915GAV and D915GAG and their components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences. What This Document Contains Chapter 1 2 3 4 Description A description of the hardware used on the Desktop Boards D915GAV and D915GAG A map of the resources of the Desktop Boards The features supported by the BIOS Setup program A description of the BIOS error messages, beep codes, and POST codes Typographical Conventions This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type. Notes, Cautions, and Warnings NOTE Notes call attention to important information. INTEGRATOR’S NOTES Integrator’s notes are used to call attention to information that may be useful to system integrators. CAUTION Cautions are included to help you avoid damaging hardware or losing data. iii Intel Desktop Board D915GAV/D915GAG Technical Product Specification WARNING Warnings indicate conditions, which if not observed, can cause personal injury. Other Common Notation # (NxnX) Used after a signal name to identify an active-low signal (such as USBP0#) When used in the description of a component, N indicates component type, xn are the relative coordinates of its location on the Desktop Boards D915GAV and D915GAG, and X is the instance of the particular part at that general location. For example, J5J1 is a connector, located at 5J. It is the first connector in the 5J area. Gigabyte (1,073,741,824 bytes) Gigabytes per second Kilobyte (1024 bytes) Kilobit (1024 bits) 1000 bits per second Megabyte (1,048,576 bytes) Megabytes per second Megabit (1,048,576 bits) Megabits per second An address or data value ending with a lowercase h indicates a hexadecimal value. Volts. Voltages are DC unless otherwise specified. This symbol is used to indicate third-party brands and names that are the property of their respective owners. GB GB/sec KB Kbit kbits/sec MB MB/sec Mbit Mbit/sec xxh x.x V * iv Contents 1 Product Description 1.1 1.2 1.3 PCI Bus Terminology Change...................................................................................... 11 Board Differences ........................................................................................................ 11 Overview ...................................................................................................................... 12 1.3.1 Feature Summary.......................................................................................... 12 1.3.2 Manufacturing Options .................................................................................. 13 1.3.3 Board Layouts ............................................................................................... 14 1.3.4 Block Diagram ............................................................................................... 18 Online Support ............................................................................................................. 19 Processor ..................................................................................................................... 19 System Memory ........................................................................................................... 20 1.6.1 Memory Configurations ................................................................................. 22 ® 915G Chipset ..................................................................................................... 26 Intel 1.7.1 Intel 915G Graphics Subsystem.................................................................... 26 1.7.2 USB ............................................................................................................... 28 1.7.3 IDE Support ................................................................................................... 28 1.7.4 Real-Time Clock, CMOS SRAM, and Battery................................................ 30 PCI Express Connectors.............................................................................................. 30 I/O Controller................................................................................................................ 31 1.9.1 Serial Ports .................................................................................................... 31 1.9.2 Parallel Port ................................................................................................... 31 1.9.3 Diskette Drive Controller................................................................................ 32 1.9.4 Keyboard and Mouse Interface ..................................................................... 32 Audio Subsystem ......................................................................................................... 32 1.10.1 Audio Subsystem Software ........................................................................... 33 1.10.2 Audio Connectors .......................................................................................... 33 1.10.3 Intel® High Definition Audio Subsystem ........................................................ 34 LAN Subsystem ........................................................................................................... 35 1.11.1 10/100 Mbits/sec LAN Subsystem................................................................. 35 1.11.2 Gigabit LAN Subsystem ................................................................................ 36 1.11.3 Alert Standard Format (ASF) Support ........................................................... 37 1.11.4 LAN Subsystem Software.............................................................................. 38 Hardware Management Subsystem............................................................................. 38 1.12.1 Hardware Monitoring and Fan Control ASIC ................................................. 38 1.12.2 Thermal Monitoring........................................................................................ 39 1.12.3 Fan Monitoring............................................................................................... 41 1.12.4 Chassis Intrusion and Detection.................................................................... 41 Power Management ..................................................................................................... 41 1.13.1 ACPI .............................................................................................................. 41 1.13.2 Hardware Support ......................................................................................... 44 Trusted Platform Module (Optional) ............................................................................. 48 1.14.1 System Requirements ................................................................................... 48 1.14.2 Warning of Potential Data Loss ..................................................................... 48 1.14.3 Security Precautions...................................................................................... 49 1.4 1.5 1.6 1.7 1.8 1.9 1.10 1.11 1.12 1.13 1.14 v Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.14.4 1.14.5 1.14.6 1.14.7 1.14.8 1.14.9 2.1 2.2 Trusted Platform Module Ownership ............................................................. 50 Enabling the Trusted Platform Module .......................................................... 51 Assuming Trusted Platform Module Ownership ............................................ 51 Recovery Procedures .................................................................................... 52 Clearing Trusted Platform Module Ownership............................................... 53 Software Support........................................................................................... 54 2 Technical Reference Introduction .................................................................................................................. 55 Memory Resources ...................................................................................................... 55 2.2.1 Addressable Memory..................................................................................... 55 2.2.2 Memory Map.................................................................................................. 57 DMA Channels ............................................................................................................. 57 Fixed I/O Map............................................................................................................... 58 PCI Configuration Space Map...................................................................................... 59 Interrupts ...................................................................................................................... 60 PCI Conventional Interrupt Routing Map ..................................................................... 61 Connectors................................................................................................................... 63 2.8.1 Back Panel Connectors ................................................................................. 64 2.8.2 Component-side Connectors......................................................................... 66 Jumper Block ............................................................................................................... 77 Mechanical Considerations .......................................................................................... 78 2.10.1 D915GAV Board Form Factor ....................................................................... 78 2.10.2 D915GAG Board Form Factor....................................................................... 79 2.10.3 I/O Shield....................................................................................................... 80 Electrical Considerations.............................................................................................. 81 2.11.1 DC Loading.................................................................................................... 81 2.11.2 Add-in Board Considerations......................................................................... 81 2.11.3 Fan Connector Current Capability ................................................................. 82 2.11.4 Power Supply Considerations ....................................................................... 82 Thermal Considerations ............................................................................................... 83 Reliability...................................................................................................................... 85 Environmental .............................................................................................................. 86 Regulatory Compliance................................................................................................ 87 2.15.1 Safety Regulations ........................................................................................ 87 2.15.2 EMC Regulations........................................................................................... 87 2.15.3 European Union Declaration of Conformity Statement.................................. 88 2.15.4 Product Ecology Statements ......................................................................... 89 2.15.5 Product Certification Markings (Board Level) ................................................ 90 Introduction .................................................................................................................. 91 BIOS Flash Memory Organization ............................................................................... 92 Resource Configuration ............................................................................................... 92 3.3.1 PCI Autoconfiguration.................................................................................... 92 3.3.2 PCI IDE Support ............................................................................................ 92 System Management BIOS (SMBIOS) ........................................................................ 93 Legacy USB Support.................................................................................................... 93 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2.15 3 Overview of BIOS Features 3.1 3.2 3.3 3.4 3.5 vi Contents 3.6 3.7 3.8 3.9 4.1 4.2 4.3 4.4 4.5 BIOS Updates .............................................................................................................. 94 3.6.1 Language Support ......................................................................................... 94 3.6.2 Custom Splash Screen.................................................................................. 94 Boot Options ................................................................................................................ 95 3.7.1 CD-ROM Boot ............................................................................................... 95 3.7.2 Network Boot ................................................................................................. 95 3.7.3 Booting Without Attached Devices ................................................................ 95 3.7.4 Changing the Default Boot Device During POST .......................................... 95 Fast Booting Systems with Intel® Rapid BIOS Boot..................................................... 96 3.8.1 Peripheral Selection and Configuration ......................................................... 96 3.8.2 Intel Rapid BIOS Boot ................................................................................... 96 BIOS Security Features ............................................................................................... 97 BIOS Error Messages .................................................................................................. 99 Port 80h POST Codes ............................................................................................... 101 Bus Initialization Checkpoints .................................................................................... 105 Speaker...................................................................................................................... 106 BIOS Beep Codes...................................................................................................... 106 4 Error Messages and Beep Codes Figures 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. D915GAV Board Components ..................................................................................... 14 D915GAG Board Components..................................................................................... 16 Block Diagram.............................................................................................................. 18 Memory Channel and DIMM Configuration.................................................................. 22 Dual Channel (Interleaved) Mode Configuration with Two DIMMs .............................. 23 Dual Channel (Interleaved) Mode Configuration with Three DIMMs............................ 23 Dual Channel (Interleaved) Mode Configuration with Four DIMMs.............................. 24 Single Channel (Asymmetric) Mode Configuration with One DIMM............................. 25 Single Channel (Asymmetric) Mode Configuration with Three DIMMs ........................ 25 Front/Back Panel Audio Connector Options for High Definition Audio Subsystem...... 34 High Definition Audio Subsystem Block Diagram ........................................................ 34 LAN Connector LED Locations .................................................................................... 36 LAN Connector LED Locations .................................................................................... 37 Thermal Monitoring for D915GAV Board ..................................................................... 39 Thermal Monitoring for D915GAG Board..................................................................... 40 Location of the Standby Power Indicator LED ............................................................. 47 Detailed System Memory Address Map....................................................................... 56 Back Panel Connectors................................................................................................ 64 D915GAV Board Component-side Connectors............................................................ 66 D915GAG Board Component-side Connectors ........................................................... 68 Connection Diagram for Front Panel Connector .......................................................... 74 Connection Diagram for Front Panel USB Connectors................................................ 76 Connection Diagram for IEEE 1394a Connectors........................................................ 76 Location of the Jumper Block....................................................................................... 77 D915GAV Board Dimensions....................................................................................... 78 D915GAG Board Dimensions ...................................................................................... 79 vii Intel Desktop Board D915GAV/D915GAG Technical Product Specification 27. 28. 29. I/O Shield Dimensions.................................................................................................. 80 Processor Heatsink for Omni-directional Airflow.......................................................... 83 Localized High Temperature Zones ............................................................................. 84 Tables 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 41. 42. Summary of Board Differences .................................................................................... 11 Feature Summary ........................................................................................................ 12 Manufacturing Options ................................................................................................. 13 D915GAV Board Components Shown in Figure 1 ....................................................... 15 D915GAG Board Components Shown in Figure 2....................................................... 17 Supported System Bus Frequency and Memory Speed Combinations ....................... 20 Supported Memory Configurations .............................................................................. 21 LAN Connector LED States ......................................................................................... 36 LAN Connector LED States ......................................................................................... 37 Effects of Pressing the Power Switch .......................................................................... 42 Power States and Targeted System Power ................................................................. 43 Wake-up Devices and Events ...................................................................................... 44 System Memory Map ................................................................................................... 57 DMA Channels ............................................................................................................. 57 I/O Map ........................................................................................................................ 58 PCI Configuration Space Map...................................................................................... 59 Interrupts ...................................................................................................................... 60 PCI Interrupt Routing Map ........................................................................................... 62 Back Panel Connectors Shown in Figure 18................................................................ 65 Component-side Connectors Shown in Figure 19 ....................................................... 67 Component-side Connectors Shown in Figure 20 ....................................................... 69 S/PDIF Connector (Optional) ....................................................................................... 70 ATAPI CD-ROM Connector (Optional)......................................................................... 70 Front Panel Audio Connector....................................................................................... 70 Serial Port B Connector (optional) ............................................................................... 70 Chassis Intrusion Connector ........................................................................................ 70 SCSI Hard Drive Activity LED Connector (Optional).................................................... 71 Serial ATA Connectors................................................................................................. 71 Processor Fan Connector ............................................................................................ 71 Chassis Fan Connectors.............................................................................................. 71 Main Power Connector................................................................................................. 72 ATX12V Power Connector ........................................................................................... 73 Alternate Power Connector .......................................................................................... 73 Auxiliary Front Panel Power/Sleep LED Connector ..................................................... 74 Front Panel Connector ................................................................................................. 74 States for a One-Color Power LED .............................................................................. 75 States for a Two-Color Power LED .............................................................................. 75 BIOS Setup Configuration Jumper Settings................................................................. 77 DC Loading Characteristics ......................................................................................... 81 Fan Connector Current Capability................................................................................ 82 Thermal Considerations for Components .................................................................... 85 Environmental Specifications ....................................................................................... 86 viii Contents 43. 44. 45. 46. 47. 48. 49. 50. 51. 52. 53. 54. 55. 56. 57. Safety Regulations ....................................................................................................... 87 EMC Regulations ......................................................................................................... 87 Product Certification Markings ..................................................................................... 90 BIOS Setup Program Menu Bar................................................................................... 92 BIOS Setup Program Function Keys............................................................................ 92 Boot Device Menu Options .......................................................................................... 95 Supervisor and User Password Functions ................................................................... 97 BIOS Error Messages .................................................................................................. 99 Uncompressed INIT Code Checkpoints..................................................................... 101 Boot Block Recovery Code Checkpoints ................................................................... 101 Runtime Code Uncompressed in F000 Shadow RAM ............................................... 102 Bus Initialization Checkpoints .................................................................................... 105 Upper Nibble High Byte Functions ............................................................................. 105 Lower Nibble High Byte Functions ............................................................................. 106 Beep Codes ............................................................................................................... 106 ix Intel Desktop Board D915GAV/D915GAG Technical Product Specification x 1 Product Description What This Chapter Contains 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 1.10 1.11 1.12 1.13 1.14 PCI Bus Terminology Change...................................................................................... 11 Board Differences ........................................................................................................ 11 Overview ...................................................................................................................... 12 Online Support ............................................................................................................. 19 Processor ..................................................................................................................... 19 System Memory ........................................................................................................... 20 Intel® 915G Chipset ..................................................................................................... 26 PCI Express Connectors.............................................................................................. 30 I/O Controller................................................................................................................ 31 Audio Subsystem ......................................................................................................... 32 LAN Subsystem ........................................................................................................... 35 Hardware Management Subsystem............................................................................. 38 Power Management ..................................................................................................... 41 Trusted Platform Module (Optional) ............................................................................. 48 1.1 PCI Bus Terminology Change Previous generations of Intel® Desktop Boards used an add-in card connector referred to as PCI. This generation of Intel Desktop Boards adds a new technology for add-in cards: PCI Express. The 32-bit parallel bus previously referred to as PCI is now called PCI Conventional. 1.2 Board Differences This TPS describes these Intel Desktop Boards: D915GAV and D915GAG. The Desktop Boards are identical with the exception of the items listed in Table 1. Table 1. Form factor PCI Conventional Bus add-in card connectors PCI Express x1 bus addin card connectors Chassis fan connectors LAN configuration Summary of Board Differences D915GAV ATX Four Two Three: front chassis, rear chassis 1, and rear chassis 2 10/100 Mbits/sec LAN subsystem only D915GAG microATX Two One Two: front chassis and rear chassis One of the following: • Gigabit (10/100/1000 Mbits/sec) LAN subsystem • 10/100 Mbits/sec LAN subsystem • No LAN subsystem 11 Intel Desktop Board D915GAV/D915GAG Technical Product Specification NOTE Most of the illustrations in this document show only the Desktop Board D915GAV. When there are significant differences between the two Desktop Boards, illustrations of both boards are provided. 1.3 Overview 1.3.1 Feature Summary Feature Summary • D915GAV: ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters]) • D915GAG: microATX Form Factor (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]) Processor Memory Support for an Intel® Pentium® 4 processor in an LGA775 socket with an 800 or 533 MHz system bus • Four DDR SDRAM Dual Inline Memory Module (DIMM) sockets • Support for DDR 400 MHz and DDR 333 MHz DIMMs • Support for up to 4 GB of system memory Chipset Intel® 915G Chipset, consisting of: • Intel® 82915G Graphics Memory Controller Hub (GMCH) • Intel® 82801FB I/O Controller Hub (ICH6) • 4 Mbit Firmware Hub (FWH) Video Audio I/O Control USB Peripheral Interfaces Intel® GMA900 onboard graphics subsystem Intel® High Definition Audio subsystem using the Realtek ALC860 audio codec LPC Bus I/O controller Support for USB 2.0 devices • Eight USB ports • One serial port • One parallel port • Four Serial ATA interfaces • One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support • One diskette drive interface • PS/2* keyboard and mouse ports LAN Support • D915GAV: 10/100 Mbits/sec LAN subsystem using the Intel® 82562EZ Platform LAN Connect (PLC) device • D915GAG: Refer to Table 3 on page 13 for a description of LAN subsystem options. BIOS • Intel/AMI BIOS (resident in the 4 Mbit FWH) • Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS continued Table 2 summarizes the major features of the Desktop Boards D915GAV and D915GAG. Table 2. Form Factor 12 Product Description Table 2. Feature Summary (continued) • PCI Conventional bus connectors (four on the D915GAV; two on the D915GAG) • PCI Express x1 bus add-in card connectors (two on the D915GAV; one on the D915GAG) • One PCI Express x16 bus add-in card connector (both boards) • Support for PCI Local Bus Specification Revision 2.2 • Support for PCI Express Revision 1.0a • Suspend to RAM support • Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports Expansion Capabilities Instantly Available PC Technology Hardware Monitor Subsystem • Hardware monitoring and fan control ASIC • Voltage sense to detect out of range power supply voltages • Thermal sense to detect out of range thermal values • Three fan connectors • Three fan sense inputs used to monitor fan activity • Fan speed control 1.3.2 Manufacturing Options Table 3 describes the manufacturing options on the Desktop Boards D915GAV and D915GAG. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you. Table 3. Manufacturing Options A connector for attaching an internal CD-ROM drive to the onboard audio subsystem Additional fan connector for use in larger chassis (D915GAV board only) IEEE-1394a controller and three IEEE-1394a connectors (one back panel connector, two front-panel connectors) The D915GAG board provides one of the following: • Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Marvel* Yukon* 88E8050 PCI Express Gigabit Ethernet Controller • 10/100 Mbits/sec LAN subsystem using the Intel® 82562EZ Platform LAN Connect (PLC) device • No LAN subsystem SCSI Hard Drive Activity LED Connector Serial Port B S/PDIF Connector Trusted Platform Module (TPM) Allows add-in hard drive controllers (SCSI or other) to use the same LED as the onboard IDE controller. Second serial port accessible via a connector on the component side of the board A 1 x 3 connector (mounted on the component side of the board) that provides digital audio signals in S/PDIF format A component that enhances platform security ATAPI CD-ROM Connector ATX fan connector IEEE-1394a Interface LAN subsystem For information about Available configurations for the Desktop Boards D915GAV and D915GAG Refer to Section 1.4, page 19 13 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.3.3 Board Layouts Figure 1 shows the location of the major components on the Desktop Board D915GAV. A DFG B C E HI J K L M N O MM LL KK JJ P Q R II S T U HH FF GG EE DD BB CC AA Z Y X WV OM16666 Figure 1. D915GAV Board Components Table 4 lists the components identified in Figure 1. 14 Product Description Table 4. D915GAV Board Components Shown in Figure 1 Description Rear fan connector 2 Speaker PCI Express x1 bus add-in card connectors ATAPI CD-ROM connector (optional) S/PDIF connector (optional) Realtek ALC860 audio codec Front panel audio connector PCI Conventional bus add-in card connectors Ethernet PLC device (optional) PCI Express x16 bus add-in card connector Rear chassis fan connector 1 Back panel connectors Alternate power connector +12V power connector (ATX12V) LGA775 processor socket Processor fan connector Intel 82915G GMCH DIMM Channel A sockets Serial port B connector (optional) DIMM Channel B sockets SCSI LED (optional) I/O controller Power connector Diskette drive connector Parallel ATE IDE connector Battery Chassis intrusion connector BIOS Setup configuration jumper block 4 Mbit Firmware Hub (FWH) Front chassis fan connector Serial ATA connectors Auxiliary front panel power LED connector Front panel connector ATX fan connector (optional) Front panel USB connector Intel 82801FB I/O Controller Hub (ICH6) Front panel IEEE-1394a connectors (optional) IEEE-1394a controller (optional) PCI Conventional bus add-in card connectors Item/callout from Figure 1 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA BB CC DD EE FF GG HH II JJ KK LL MM 15 Intel Desktop Board D915GAV/D915GAG Technical Product Specification Figure 2 shows the location of the major components on the Desktop Board D915GAG. ACE BD FG H I J K L KK M JJ II HH N O P Q R S T GG EE FF DD CC AA BB Z Y X W V U OM16656 Figure 2. D915GAG Board Components Table 5 lists the components identified in Figure 2. 16 Product Description Table 5. D915GAG Board Components Shown in Figure 2 Description ATAPI CD-ROM connector (optional) PCI Express x1 bus add-in card connectors Realtek ALC860 audio codec S/PDIF connector (optional) Front panel audio connector PCI Conventional bus add-in card connectors Ethernet PLC device (optional) PCI Express x16 bus add-in card connector Rear chassis fan connector Back panel connectors Alternate power connector +12V power connector (ATX12V) LGA775 processor socket Hardware monitoring and fan control ASIC Processor fan connector Intel 82915G GMCH DIMM Channel A sockets Serial port B connector (optional) DIMM Channel B sockets SCSI LED connector (optional) I/O controller Power connector Diskette drive connector Parallel ATE IDE connector Battery Chassis intrusion connector BIOS Setup configuration jumper block 4 Mbit Firmware Hub (FWH) Front chassis fan connector Serial ATA connectors Auxiliary front panel power LED connector Front panel connector Front panel USB connector Intel 82801FB I/O Controller Hub (ICH6) Front panel IEEE-1394a connectors (optional) IEEE-1394a controller (optional) Speaker Item/callout from Figure 2 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA BB CC DD EE FF GG HH II JJ KK 17 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.3.4 Block Diagram Figure 3 is a block diagram of the major functional areas of the boards. D915GAG only PCI Express x1 Interface PCI Express x1 Slot 1 PCI Express x1 Slot 2 D915GAV only USB Gigabit Ethernet Controller (Optional) LAN Connector Back Panel/Front Panel USB Ports Serial Ports Parallel ATA IDE Connector Parallel ATA IDE Interface LPC Bus I/O Controller Parallel Port PS/2 Mouse PS/2 Keyboard LGA775 Processor Socket System Bus (800/533 MHz) LPC Bus DMI Interconnect Diskette Drive Connector PCI Express x16 Interface PCI Express x16 Connector VGA Port Intel 82915G Graphics and Memory Controller Hub (GMCH) Intel 82801FB I/O Controller Hub (ICH6) LPC Bus 4 Mbit Firmware Hub (FWH) Intel 915G Chipset TPM Component (Optional) High Definition Audio Link Channel A DIMMs (2) Channel B DIMMs (2) Dual-Channel Memory Bus SMBus LAN Connect Interface Display Interface 10/100 LAN PLC (Optional) LAN Connector IEEE-1394a Connectors (Optional) PCI Bus PCI Slot 1 PCI Slot 2 PCI Slot 3 PCI Slot 4 D915GAV only PCI Bus Serial ATA IDE Interface Serial ATA IDE Connectors (4) Mic In/Retasking Jack B Line In/Retasking Jack C SMBus Audio Codec Line Out/Retasking Jack D Retasking Jack E [Port 1] Retasking Jack F [Port 2] CD-ROM (optional) S/PDIF (optional) Hardware Monitoring and Fan Control ASIC = connector or socket OM17551 Figure 3. Block Diagram 18 Product Description 1.4 Online Support To find information about… Intel Desktop Boards D915GAV and D915GAG under “Desktop Board Products” or “Desktop Board Support” Available configurations for the Desktop Board D915GAV Available configurations for the Desktop Board D915GAG Processor data sheets ICH6 addressing Custom splash screens Audio software and utilities LAN software and drivers Visit this World Wide Web site: http://www.intel.com/design/motherbd http://support.intel.com/support/motherboards/desktop http://developer.intel.com/design/motherbd/av/av_available.htm http://developer.intel.com/design/motherbd/ag/ag_available.htm http://www.intel.com/design/litcentr http://developer.intel.com/design/chipsets/datashts http://intel.com/design/motherbd/gen_indx.htm http://www.intel.com/design/motherbd http://www.intel.com/design/motherbd 1.5 Processor The boards are designed to support Intel Pentium 4 processors in an LGA775 processor socket with an 800 or 533 MHz system bus. See the Intel web site listed below for the most up-to-date list of supported processors. For information about… Supported processors for the D915GAV board Supported processors for the D915GAG board Refer to: http://www.intel.com/design/motherbd/av/av_proc.htm http://www.intel.com/design/motherbd/ag/ag_proc.htm CAUTION Use only the processors listed on web site above. Use of unsupported processors can damage the board, the processor, and the power supply. INTEGRATOR’S NOTE • • Use only ATX12V-compliant power supplies. Refer to Table 6 on page 20 for a list of supported system bus frequency and memory speed combinations. Refer to Section 2.8.2.2, page 72 For information about Power supply connectors 19 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.6 System Memory The boards have four DIMM sockets and support the following memory features: • 2.5 V (only) DDR SDRAM DIMMs with gold-plated contacts • Unbuffered, single-sided or double-sided DIMMs with the following restriction: • • • • • Double-sided DIMMS with x16 organization are not supported. 4 GB maximum total system memory. Refer to Section 2.2.1 on page 55 for information on the total amount of addressable memory. Minimum total system memory: 128 MB Non-ECC DIMMs Serial Presence Detect DDR 400 MHz and DDR 333 MHz SDRAM DIMMs Table 6 lists the supported system bus frequency and memory speed combinations. Table 6. DDR 400 DDR 333 (Note) Note: Supported System Bus Frequency and Memory Speed Combinations The processor's system bus frequency must be… 800 MHz 800 or 533 MHz To use this type of DIMM… When using an 800 MHz system bus frequency processor, DDR 333 memory is clocked at 320 MHz. This minimizes system latencies to optimize system throughput. NOTES • • Remove the PCI Express x16 video card before installing or upgrading memory to avoid interference with the memory retention mechanism. To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency. 20 Product Description Table 7 lists the supported DIMM configurations. Table 7. DIMM Capacity 128 MB 256 MB 256 MB 512 MB 512 MB 512 MB 1024 MB 1024 MB 2048 MB Supported Memory Configurations Configuration SS SS SS DS SS SS DS SS DS SDRAM Density 256 Mbit 256 Mbit 512 Mbit 256 Mbit 512 Mbit 1 Gbit 512 Mbit 1 Gbit 1 Gbit SDRAM Organization Front-side/Back-side 16 M x 16/empty 32 M x 8/empty 32 M x 16/empty 32 M x 8/32 M x 8 64 M x 8/empty 64 M x 16/empty 64 M x 8/64 M x 8 128 M x 8/empty 128 M x 8/128 M x 8 Number of SDRAM Devices 4 8 4 16 8 4 16 8 16 Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to single-sided memory modules (containing one row of SDRAM). INTEGRATOR’S NOTE It is possible to install four 2048 MB (2 GB) modules for a total of 8 GB of system memory, however, only 4 GB of address space is available. Refer to Section 2.2.1, on page 55 for additional information on available memory. 21 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.6.1 Memory Configurations The Intel 82915G GMCH supports two types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used. • Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used. Figure 4 illustrates the memory channel and DIMM configuration. NOTE The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels are black. Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1 OM16667 Figure 4. Memory Channel and DIMM Configuration 22 Product Description 1.6.1.1 Dual Channel (Interleaved) Mode Configurations Figure 5 shows a dual channel configuration using two DIMMs. In this example, the DIMM0 (blue) sockets of both channels are populated with identical DIMMs. 1 GB Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1 1 GB OM17123 Figure 5. Dual Channel (Interleaved) Mode Configuration with Two DIMMs Figure 6 shows a dual channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B. 256 MB 256 MB 512 MB Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1 OM17122 Figure 6. Dual Channel (Interleaved) Mode Configuration with Three DIMMs 23 Intel Desktop Board D915GAV/D915GAG Technical Product Specification Figure 7 shows a dual channel configuration using four DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels. 256 MB 512 MB 256 MB 512 MB Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1 OM17124 Figure 7. Dual Channel (Interleaved) Mode Configuration with Four DIMMs 24 Product Description 1.6.1.2 Single Channel (Asymmetric) Mode Configurations NOTE Dual channel (Interleaved) mode configurations provide the highest memory throughput. Figure 8 shows a single channel configuration using one DIMM. In this example, only the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated. 256 MB Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1 OM17125 Figure 8. Single Channel (Asymmetric) Mode Configuration with One DIMM Figure 9 shows a single channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A does not equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B. 256 MB 512 MB 512 MB Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1 OM17126 Figure 9. Single Channel (Asymmetric) Mode Configuration with Three DIMMs 25 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.7 Intel® 915G Chipset The Intel 915G chipset consists of the following devices: • Intel 82915G Graphics Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect • Intel 82801FB I/O Controller Hub (ICH6) with DMI interconnect • Firmware Hub (FWH) The GMCH is a centralized controller for the system bus, the memory bus, the PCI Express bus, and the DMI interconnect. The ICH6 is a centralized controller for the board’s I/O paths. The FWH provides the nonvolatile storage of the BIOS. For information about The Intel 915G chipset Resources used by the chipset Refer to http://developer.intel.com/ Chapter 2 1.7.1 Intel 915G Graphics Subsystem The Intel 915G chipset contains two separate, mutually exclusive graphics options. Either the GMA900 graphics controller (contained within the 82915G GMCH) is used, or a PCI Express x16 add-in card can be used. When a PCI Express x16 add-in card is installed, the GMA900 graphics controller is disabled. 1.7.1.1 Intel® GMA900 Graphics Controller The Intel GMA900 graphics controller features the following: • Integrated graphics controller ⎯ 32 bpp (Bits Per Pixel) graphics engine ⎯ 333 MHz core frequency ⎯ 256-bit 2-D engine ⎯ 32-bit 3-D engine ⎯ Motion video acceleration ⎯ Pixel Shader 2.0 ⎯ 4-pixel pipes ⎯ DirectX* 9.0 Hardware Acceleration ⎯ Software Vertex Shader • Up to 2048 x 1536 at 75 Hz refresh • With Advanced Digital Display 2 (ADD2) card support flat panel displays up to 2048 x 1536 at 75 Hz or digital CRTs/HDTV displays at 1920 x 1080 at 85 Hz • High performance 3-D setup and render engine • High quality/performance texture engine • Display ⎯ Integrated 24-bit 400 MHz RAMDAC ⎯ DDC2B compliant interface 26 Product Description • • • Video ⎯ Asynchronous dual monitor display with ADD2 card ⎯ Hardware motion compensation for software MPEG2 decode ⎯ Two multiplexed DVO port interfaces with 200 MHz pixel clocks using an ADD2 card Dynamic Video Memory Technology (DVMT) support up to 224 MB Intel® Zoom Utility Refer to Section 1.7.1.2, page 27 Section 1.4, page 19 For information about DVMT Obtaining graphics software and utilities 1.7.1.2 Dynamic Video Memory Technology (DVMT) DVMT enables enhanced graphics and memory performance through Direct AGP, and highly efficient memory utilization. DVMT ensures the most efficient use of available system memory for maximum 2-D/3-D graphics performance. Up to 224 MB of system memory can be allocated to DVMT on systems that have 512 MB or more of total system memory installed. Up to 128 MB can be allocated to DVMT on systems that have 256 MB but less than 512 MB of total installed system memory. Up to 64 MB can be allocated to DVMT when less than 256 MB of system memory is installed. DVMT returns system memory back to the operating system when the additional system memory is no longer required by the graphics subsystem. DVMT will always use a minimal fixed portion of system physical memory (as set in the BIOS Setup program) for compatibility with legacy applications. An example of this would be when using VGA graphics under DOS. Once loaded, the operating system and graphics drivers allocate additional system memory to the graphics buffer as needed for performing graphics functions. NOTE The use of DVMT requires operating system driver support. 1.7.1.3 Advanced Digital Display 2 (ADD2) Card Support The GMCH routes two multiplexed DVO ports that are each capable of driving up to a 200 MHz pixel clock to the PCI Express x16 connector. The DVO ports can be paired for a dual channel configuration to support up to a 400 MHz pixel clock. When an ADD2 card is detected, the Intel GMA900 graphics controller is enabled and the PCI Express x16 connector is configured for DVO mode. DVO mode enables the DVO ports to be accessed by the ADD2 card. An ADD2 card can either be configured to support simultaneous display with the primary VGA display or can be configured to support dual independent display as an extended desktop configuration with different color depths and resolutions. ADD2 cards can be designed to support the following configurations: • TV-Out (composite video) • Transition Minimized Differential Signaling (TMDS) for DVI 1.0 • Low Voltage Differential Signaling (LVDS) • Single device operating in dual channel mode • VGA output • HDTV output 27 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.7.1.4 Configuration Modes A list of supported modes for the Intel GMA900 graphics controller is available as a downloadable document. For information about Supported modes for the D915GAV board Supported modes for the D915GAG board Refer to http://www.intel.com/design/motherbd/av/av_prdoc.htm http://www.intel.com/design/motherbd/ag/ag_prdoc.htm 1.7.2 USB The boards support up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers. The ICH6 provides the USB controller for all ports. The port arrangement is as follows: • Four ports are implemented with dual stacked back panel connectors adjacent to the audio connectors • Four ports are routed to two separate front panel USB connectors NOTE Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices. For information about The location of the USB connectors on the back panel The location of the front panel USB connectors on the D915GAV board The location of the front panel USB connectors on the D915GAG board Refer to Figure 18, page 64 Figure 19, page 66 Figure 20, page 68 1.7.3 IDE Support The boards provides five IDE interface connectors: • One parallel ATA IDE connector that supports two devices • Four serial ATA IDE connectors that support one device per connector 1.7.3.1 Parallel ATE IDE Interface The ICH6’s Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes: • Programmed I/O (PIO): processor controls data transfer. • 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec. • Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 33 MB/sec. • ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible. • ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH6’s ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec. 28 Product Description NOTE ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling. The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA devices using the transfer modes. The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS. The boards support Laser Servo (LS-120) diskette technology through the Parallel ATA IDE interfaces. An LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot menu to one of the following: • ARMD-FDD (ATAPI removable media device – floppy disk drive) • ARMD-HDD (ATAPI removable media device – hard disk drive) For information about The location of the Parallel ATA IDE connector on the D915GAV board The location of the Parallel ATA IDE connector on the D915GAG board Refer to Figure 19, page 66 Figure 20, page 68 1.7.3.2 Serial ATA Interfaces The ICH6’s Serial ATA controller offers four independent Serial ATA ports with a theoretical maximum transfer rate of 150 MB/s per port. One device can be installed on each port for a maximum of four Serial ATA devices. A point-to-point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel. For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP and Windows 2000 operating systems. NOTE Many Serial ATA drives use new low-voltage power connectors and require adaptors or power supplies equipped with low-voltage power connectors. For more information, see: http://www.serialata.org/ For information about The location of the Serial ATA IDE connectors on the D915GAV board The location of the Serial ATA IDE connectors on the D915GAG board Refer to Figure 19, page 66 Figure 20, page 68 29 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.7.3.3 SCSI Hard Drive Activity LED Connector (Optional) The SCSI hard drive activity LED connector is a 1 x 2-pin connector that allows an add-in hard drive controller to use the same LED as the onboard IDE controller. For proper operation, this connector should be wired to the LED output of the add-in hard drive controller. The LED indicates when data is being read from, or written to, either the add-in hard drive controller or the onboard IDE controller (Parallel ATA or Serial ATA). For information about The location of the SCSI hard drive activity LED connector on the D915GAV board The location of the SCSI hard drive activity LED connector on the D915GAG board The signal names of the SCSI hard drive activity LED connector Refer to Figure 19, page 66 Figure 20, page 68 Table 27, page 71 1.7.4 Real-Time Clock, CMOS SRAM, and Battery A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied. NOTE If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on. 1.8 PCI Express Connectors The boards provide the following PCI Express connectors: • One PCI Express x16 connector supporting simultaneous transfer speeds up to 8 GBytes/sec • Two PCI Express x1 connectors. The x1 interfaces support simultaneous transfer speeds up to 500 MBytes/sec The PCI Express interface supports the PCI Conventional bus configuration mechanism so that the underlying PCI Express architecture is compatible with PCI Conventional compliant operating systems. Additional features of the PCI Express interface include the following: • Support for the PCI Express enhanced configuration mechanism • Automatic discovery, link training, and initialization • Support for Active State Power Management (ASPM) • SMBus 2.0 support • Wake# signal supporting wake events from ACPI S1, S3, S4, or S5 • Software compatible with the PCI Power Management Event (PME) mechanism defined in the PCI Power Management Specification Rev. 1.1 30 Product Description 1.9 I/O Controller The I/O controller provides the following features: • Two serial ports (Serial Port B is optional) • One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support • Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems • PS/2-style mouse and keyboard interfaces • Interface for one 1.44 MB or 2.88 MB diskette drive • Intelligent power management, including a programmable wake-up event interface • PCI Conventional bus power management support The BIOS Setup program provides configuration options for the I/O controller. 1.9.1 Serial Ports The Desktop Board can support up to two serial port connectors. Serial port A is located on the back panel. Serial port B (optional) is accessible using a connector on the component side of board. The serial ports support data transfers at speeds up to 115.2 kbits/sec with BIOS support. For information about The location of the serial port A connector The location of the serial port B connector on the D915GAV board The location of the serial port B connector on the D915GAG board The signal names of the serial port B connector Refer to Figure 18, page 64 Figure 19, page 66 Figure 20, page 68 Table 25, page 70 1.9.2 Parallel Port The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup program to set the parallel port mode. For information about The location of the parallel port connector Refer to Figure 18, page 64 31 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.9.3 Diskette Drive Controller The I/O controller supports one diskette drive. Use the BIOS Setup program to configure the diskette drive interface. For information about The location of the diskette drive connector on the D915GAV board The location of the diskette drive connector on the D915GAG board Refer to Figure 19, page 66 Figure 20, page 68 1.9.4 Keyboard and Mouse Interface NOTE PS/2 keyboard and mouse connectors are located on the back panel. The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected. For information about The location of the keyboard and mouse connectors Refer to Figure 18, page 64 1.10 Audio Subsystem The boards support the Intel High Definition audio subsystem based on the Realtek ALC860 codec. The audio subsystem supports the following features: • Advanced jack sense (front and rear panel) that enables the audio codec to recognize the device that is connected to an audio port. All jacks are capable of retasking according to user’s definition, or can be automatically switched depending on the recognized device type. • Stereo input and output for all jacks • A signal-to-noise (S/N) ratio of 90 dB INTEGRATOR’S NOTE For the front panel jack sensing and automatic retasking feature to function, a front panel daughter card that is designed for Intel High Definition Audio must be used. Otherwise, an AC ’97 style audio front panel connector will be assumed and the Line Out and Mic In functions will be permanent. 32 Product Description 1.10.1 Audio Subsystem Software Refer to Section 1.4, page 19 Audio software and drivers are available from Intel’s World Wide Web site. For information about Obtaining audio software and drivers 1.10.2 Audio Connectors The boards contain audio connector on both the back panel and the component side of the board. The component-side audio connectors include the following: • Front panel audio (a 2 x 5-pin connector that provides mic in and line out signals for front panel audio connectors) • ATAPI CD-ROM (an optional 1 x 4-pin ATAPI-style connector for connecting an internal ATAPI CD-ROM drive to the audio mixer) • S/PDIF (an optional 1 x 3 connector that provides S/PDIF output signals) The functions of the back panel audio connectors are dependent on which subsystem is present. For information about The location of the front panel audio connector, the optional ATAPI CD-ROM connector, and the optional S/PDIF connector on the D915GAV board The location of the front panel audio connector, the optional ATAPI CD-ROM connector, and the optional S/PDIF connector on the D915GAG board The signal names of the front panel audio connector The signal names of the optional ATAPI CD-ROM connector The signal names of the optional S/PDIF connector Refer to Figure 19, page 66 Figure 20, page 68 Table 24, page 70 Table 23, page 70 Table 22, page 70 33 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.10.3 Intel® High Definition Audio Subsystem The Intel High Definition Audio subsystem includes the following: • Intel 82801FB I/O Controller Hub (ICH6) • Realtek ALC860 audio codec • Microphone input that supports a single dynamic, condenser, or electret microphone The front and back audio connectors are configurable through the audio device drivers. The available configurable audio ports are shown in Figure 10. Front Panel Audio Connectors Back Panel Audio Connectors Line Out/ Retasking Jack F [Port 2] Mic In/ Retasking Jack E [Port 1] Line In/ Retasking Jack C Line Out/ Retasking Jack D Mic In/ Retasking Jack B OM16989 Figure 10. Front/Back Panel Audio Connector Options for High Definition Audio Subsystem Figure 11 is a block diagram of the High Definition audio subsystem. Mic In/Retasking Jack B Line In/Retasking Jack C 82801FB I/O Controller Hub (ICH6) Intel High Definition Audio Link ALC860 Audio Codec Line Out/Retasking Jack D Front Panel Mic In/Retasking Jack E [Port 1] Front Panel Line Out/Retasking Jack F [Port 2] CD-ROM (optional) S/PDIF (optional) OM16990 Figure 11. High Definition Audio Subsystem Block Diagram For information about The back panel audio connectors Refer to Figure 18, page 64 34 Product Description 1.11 LAN Subsystem NOTE The D915GAV board provides a 10/100 Mbits/sec LAN subsystem. The D915GAG board supports a manufacturing option for one of the following: • Gigabit (10/100/1000 Mbits/sec) LAN subsystem • 10/100 Mbits/sec LAN subsystem • No LAN subsystem The LAN subsystem consists of the following: • Physical layer interface device. As a manufacturing option, the board includes one of the following Platform LAN Connect (PLC) devices: ⎯ Intel® 82562EZ PLC for 10/100 Mbits/sec Ethernet LAN connectivity ⎯ Marvel Yukon 88E50 for Gigabit (10/100/1000 Mbits/sec) Ethernet LAN connectivity (D915GAG board only) • RJ-45 LAN connector with integrated status LEDs Additional features of the LAN subsystem include: • CSMA/CD protocol engine • LAN connect interface that supports the 82562EZ • PCI Conventional bus power management ⎯ Supports ACPI technology ⎯ Supports LAN wake capabilities 1.11.1 10/100 Mbits/sec LAN Subsystem The 10/100 Mbits/sec LAN subsystem includes the ICH6, the Intel 82562EZ PLC, and an RJ-45 LAN connector with integrated status LEDs. 1.11.1.1 Intel® 82562EZ Physical Layer Interface Device The Intel 82562EZ provides the following functions: • Basic 10/100 Ethernet LAN connectivity • Full device driver compatibility • Programmable transit threshold • Configuration EEPROM that contains the MAC address 35 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.11.1.2 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 12). Green LED Yellow LED OM15076 Figure 12. LAN Connector LED Locations Table 8 describes the LED states when the board is powered up and the 10/100 Mbits/sec LAN subsystem is operating. Table 8. LED Color Green LAN Connector LED States LED State Off On Blinking Condition LAN link is not established. LAN link is established. LAN activity is occurring. 10 Mbits/sec data rate is selected 100 Mbits/sec data rate is selected Yellow Off On 1.11.2 Gigabit LAN Subsystem The Gigabit (10/100/1000 Mbits/sec) LAN subsystem includes the Marvel Yukon 88E50 and an RJ-45 LAN connector with integrated status LEDs. NOTE The Gigabit LAN subsystem is a manufacturing option available only with the D915GAG board. 1.11.2.1 Marvel Yukon 88E8050 PCI Express 1.0a Integrated MAC/PHY Gigabit Ethernet Controller The Marvel Yukon 88E8050 provides the following functions: • x1 PCI Express link • Basic 10/100/1000 Ethernet LAN connectivity • IEEE 802.1p and 802.1q support • 10/100/1000 IEEE 802.3 compliant • Compliant to 802.3x flow control support • Jumbo frame support • TCP, IP, UDP checksum offload • Automatic MDI/MDIX crossover • Full device driver compatibility • Configuration EEPROMs that contain the MAC address and ASF 2.0 support • Wake On LAN technology power management support • PCI Express Active State Power Management Support (L0s) • ASF 2.0 support 36 Product Description 1.11.2.2 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (as shown in Figure 13). Table 9 describes the LED states when the board is powered up and the Gigabit LAN subsystem is operating. Green LED Green/Yellow LED OM16513 Figure 13. LAN Connector LED Locations Table 9. LED Left LAN Connector LED States Color Green LED State Off On Blinking N/A Off On On Condition LAN link is not established. LAN link is established. LAN activity is occurring. 10 Mbits/sec data rate is selected. 100 Mbits/sec data rate is selected. 1000 Mbits/sec data rate is selected. Right Green Yellow 1.11.3 Alert Standard Format (ASF) Support The boards provide the following ASF support for the onboard 10/100/1000 LAN subsystem, PCI Express x1 bus add-in LAN cards, and PCI Conventional bus add-in LAN cards installed in PCI Conventional bus slot 2: • Monitoring of system firmware progress events, including: ⎯ BIOS present ⎯ Primary processor initialization ⎯ Memory initialization ⎯ Video initialization ⎯ PCI resource configuration ⎯ Hard-disk initialization ⎯ User authentication ⎯ Starting operating system boot process • Monitoring of system firmware error events, including: ⎯ Memory missing ⎯ Memory failure ⎯ No video device ⎯ Keyboard failure ⎯ Hard-disk failure ⎯ No boot media • Boot options to boot from different types of boot devices • Reset, shutdown, power cycle, and power up options 37 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.11.4 LAN Subsystem Software Refer to Section 1.4, page 19 LAN software and drivers are available from Intel’s World Wide Web site. For information about Obtaining LAN software and drivers 1.12 Hardware Management Subsystem The hardware management features enable the Desktop Boards to be compatible with the Wired for Management (WfM) specification. The Desktop Board has several hardware management features, including the following: • Fan monitoring and control (through the hardware monitoring and fan control ASIC) • Thermal and voltage monitoring • Chassis intrusion detection 1.12.1 Hardware Monitoring and Fan Control ASIC The features of the hardware monitoring and fan control ASIC include: • Internal ambient temperature sensor • Two remote thermal diode sensors for direct monitoring of processor temperature and ambient temperature sensing • Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.5 V, and +VCCP) to detect levels above or below acceptable values • Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or switch the fans on or off as needed • SMBus interface For information about The location of the fan connectors and sensors for thermal monitoring on the D915GAV board The location of the fan connectors and sensors for thermal monitoring on the D915GAG board Refer to Figure 14, page 39 Figure 15, page 40 38 Product Description 1.12.2 Thermal Monitoring Figure 14 shows the location of the sensors and fan connectors for the D915GAV board. 1 3 3 1 A 4 1 C B D 1 3 1 3 H Item A B C D E F G H G F E OM16669 Description Thermal diode, located on processor die Remote ambient temperature sensor Ambient temperature sensor, internal to hardware monitoring and fan control ASIC Processor fan Rear chassis fan 1 Front chassis fan ATX fan (optional) Rear chassis fan 2 Figure 14. Thermal Monitoring for D915GAV Board 39 Intel Desktop Board D915GAV/D915GAG Technical Product Specification Figure 15 shows the location of the sensors and fan connectors for the D915GAG board. 3 1 A 4 1 C B D 1 3 F Item A B C D E F Description E OM16659 Thermal diode, located on processor die Remote ambient temperature sensor Ambient temperature sensor, internal to hardware monitoring and fan control ASIC Processor fan Rear chassis fan Front chassis fan Figure 15. Thermal Monitoring for D915GAG Board 40 Product Description 1.12.3 Fan Monitoring Fan monitoring can be implemented using Intel® Desktop Utilities, LANDesk* software, or thirdparty software. The level of monitoring and control is dependent on the hardware monitoring ASIC used with the Desktop Board. For information about The functions of the fan connectors Refer to Section 1.13.2.2, page 45 1.12.4 Chassis Intrusion and Detection The boards support a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion connector. When the chassis cover is removed, the mechanical switch is in the closed position. 1.13 Power Management Power management is implemented at several levels, including: • Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan connectors ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Resume on Ring ⎯ Wake from USB ⎯ Wake from PS/2 devices ⎯ Power Management Event signal (PME#) wake-up support 1.13.1 ACPI ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with these boards requires an operating system that provides full ACPI support. ACPI features include: • Plug and Play (including bus and device enumeration) • Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives • Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state • A Soft-off feature that enables the operating system to power-off the computer • Support for multiple wake-up events (see Table 12 on page 44) • Support for a front panel power and sleep mode switch 41 Intel Desktop Board D915GAV/D915GAG Technical Product Specification Table 10 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system. Table 10. Effects of Pressing the Power Switch …and the power switch is pressed for Less than four seconds Less than four seconds More than four seconds Less than four seconds More than four seconds …the system enters this state Power-on (ACPI G0 – working state) Soft-off/Standby (ACPI G1 – sleeping state) Fail safe power-off (ACPI G2/G5 – Soft off) Wake-up (ACPI G0 – working state) Power-off (ACPI G2/G5 – Soft off) If the system is in this state… Off (ACPI G2/G5 – Soft off) On (ACPI G0 – working state) On (ACPI G0 – working state) Sleep (ACPI G1 – sleeping state) Sleep (ACPI G1 – sleeping state) 1.13.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state. 42 Product Description Table 11 lists the power states supported by the boards along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states. Table 11. Power States and Targeted System Power Sleeping States S0 – working S1 – Processor stopped S3 – Suspend to RAM. Context saved to RAM. S4 – Suspend to disk. Context saved to disk. S5 – Soft off. Context not saved. Cold boot is required. No power to the system. Processor States C0 – working C1 – stop grant No power Device States D0 – working state. D1, D2, D3 – device specification specific. D3 – no power except for wake-up logic. D3 – no power except for wake-up logic. D3 – no power except for wake-up logic. D3 – no power for wake-up logic, except when provided by battery or external source. Targeted System Power (Note 1) Full power > 30 W 5 W < power < 52.5 W Global States G0 – working state G1 – sleeping state G1 – sleeping state G1 – sleeping state G2/S5 Power < 5 W (Note 2) No power Power < 5 W (Note 2) No power Power < 5 W (Note 2) G3 – mechanical off AC power is disconnected from the computer. Notes: 1. 2. No power No power to the system. Service can be performed safely. Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis’ power supply. Dependent on the standby power consumption of wake-up devices used in the system. 43 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.13.1.2 Wake-up Devices and Events Table 12 lists the devices or specific events that can wake the computer from specific states. Table 12. LAN Modem (back panel Serial Port A) PME# signal Power switch PS/2 devices RTC alarm USB WAKE# signal Note: Wake-up Devices and Events …from this state S1, S3, S4, S5 (Note) S1, S3 S1, S3, S4, S5 (Note) S1, S3, S4, S5 S1, S3 S1, S3, S4, S5 S1, S3 S1, S3, S4, S5 These devices/events can wake up the computer… For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to Power On will enable a wake-up event from LAN in the S5 state. NOTE The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events. 1.13.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. The boards provide several power management hardware features, including: • Power connector • Fan connectors • LAN wake capabilities • Instantly Available PC technology • Resume on Ring • Wake from USB • Wake from PS/2 keyboard • PME# signal wake-up support • WAKE# signal wake-up support LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line. 44 Product Description Resume on Ring enables telephony devices to access the computer when it is in a power-managed state. The method used depends on the type of telephony device (external or internal). NOTE The use of Resume on Ring and Wake from USB technologies from an ACPI state requires an operating system that provides full ACPI support. 1.13.2.1 Power Connector ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages. When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu. For information about The location of the main power connector on the D915GAV board The location of the main power connector on the D915GAG board The signal names of the main power connector Refer to Figure 19, page 66 Figure 20, page 68 Table 31, page 72 1.13.2.2 Fan Connectors The function/operation of the fan connectors is as follows: • The fans are on when the board is in the S0 or S1 state. • The fans are off when the board is off or in the S3, S4, or S5 state. • Each fan connector is wired to a fan tachometer input of the hardware monitoring and fan control ASIC. • All fan connectors support closed-loop fan control that can adjust the fan speed or switch the fan on or off as needed. • All fan connectors have a +12 V DC connection. For information about The location of the fan connectors on the D915GAV board The location of the fan connectors on the D915GAG board The location of the fan connectors and sensors for thermal monitoring on the D915GAV board The location of the fan connectors and sensors for thermal monitoring on the D915GAG board The signal names of the processor fan connector The signal names of the chassis fan connectors Refer to Figure 19, page 66 Figure 20, page 68 Figure 14, page 39 Figure 15, page 40 Table 29, page 71 Table 30, page 71 45 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.13.2.3 LAN Wake Capabilities CAUTION For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply. LAN wake capabilities enable remote wake-up of the computer through a network. The LAN network adapter monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer. Depending on the LAN implementation, the boards support LAN wake capabilities with ACPI in the following ways: • The PCI Express WAKE# signal • The PCI Conventional bus PME# signal for PCI 2.2 compliant LAN designs • The onboard LAN subsystem 1.13.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instantly Available PC technology enables the boards to enter the ACPI S3 (Suspend-to-RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 12 on page 44 lists the devices and events that can wake the computer from the S3 state. The boards support the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer. The use of Instantly Available PC technology requires operating system support and PCI 2.2 compliant add-in cards, PCI Express add-in cards, and drivers. 1.13.2.5 Resume on Ring The operation of Resume on Ring can be summarized as follows: • Resumes operation from ACPI S1 or S3 states • Detects incoming call similarly for external and internal modems • Requires modem interrupt be unmasked for correct operation 1.13.2.6 Wake from USB USB bus activity wakes the computer from ACPI S1 or S3 states. NOTE Wake from USB requires the use of a USB peripheral that supports Wake from USB. 46 Product Description 1.13.2.7 Wake from PS/2 Devices PS/2 device activity wakes the computer from an ACPI S1 or S3 state. 1.13.2.8 PME# Signal Wake-up Support When the PME# signal on the PCI Conventional bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS). 1.13.2.9 WAKE# Signal Wake-up Support When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state. 1.13.2.10 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 16 shows the location of the standby power indicator LED in the D915GAV board. The LED is in the same location on the D915GAG board. CAUTION If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices. CR3J1 OM16668 Figure 16. Location of the Standby Power Indicator LED 47 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.14 Trusted Platform Module (Optional) The optional Trusted Platform Module (TPM) is a component on the desktop board that is specifically designed to enhance platform security above-and-beyond the capabilities of today’s software by providing a protected space for key operations and other security critical tasks. Using both hardware and software, the TPM protects encryption and signature keys at their most vulnerable stages—operations when the keys are being used unencrypted in plain-text form. The TPM is specifically designed to shield unencrypted keys and platform authentication information from software-based attacks. 1.14.1 • • • • • System Requirements Intel Desktop Board D915GAV or D915GAG Microsoft Windows 2000 Professional (SP4) or Microsoft Windows XP Professional (SP1) NTFS file system required Microsoft Internet Explorer* 5.5 or later Adobe* Acrobat* 5.0 or later 1.14.2 Warning of Potential Data Loss CAUTION Failure to follow the instructions below may cause you to lose data. Read and follow these instructions prior to Trusted Platform Module initialization. System integrators, owners, and end users must take precautions to mitigate the chance of data loss. Data encrypted by any program utilizing the Trusted Platform Module (TPM) may become inaccessible or unrecoverable if any of the following occurs: • Lost Password: Loss of any of the passwords associated with the TPM will render encrypted data inaccessible. No password recovery is available. Read the Security Precautions for Password Procedures. • Hard Drive Failure: In the event of a failure of a hard disk (or other storage media) that contains encrypted data, an image of the hard disk (or other storage media) must be restored from backup before access to encrypted data may become available. The owner/user should backup the system hard disk on a regular basis. Read the Security Precautions below for Hard Drive Backup Procedures. • Platform Failure: In the event of a platform failure and/or replacement of the motherboard, recovery procedures may allow migratable keys to be recovered and may restore access to encrypted data. All non-migratable keys and their associated data will be lost. Both the Infineon* Security Platform software and Wave Systems* EMBASSY* Trust Suite utilize migratable keys. Please check any other software that accesses the TPM for migratability. Read the Security Precautions for Emergency Recovery File Back Up Procedures. • Loss of Trusted Platform Module Ownership: Trusted Platform Module Ownership/contents may be cleared (via a BIOS switch) to allow for the transfer of a system to a new owner. If TPM ownership is cleared, either intentionally or in error, recovery procedures may allow the migratable keys to be recovered and may restore access to encrypted data. Read the Security Precautions for Emergency Recovery File Back Up Procedures. 48 Product Description 1.14.3 Security Precautions Security, like any other aspect of computer maintenance requires planning. What is unique about security has to do with understanding who "friends" and adversaries are. The TPM provides mechanisms to enable the owner/user to protect their information from adversaries. To provide this protection the TPM effectively puts "locks" around the data. Just like physical locks, if keys or combinations are lost, the assets (i.e., data) may be inaccessible not only to adversaries, but also to asset owner/user. The TPM provides two classes of keys: migratable and non-migratable. Migratable keys are designed to protect data that can be used (i.e., unencrypted) on more than one platform. This has the advantage of allowing the key data to be replicated (backed-up and restored) to another platform. This may be because of user convenience (someone uses more than one platform, or the data needs to be available to more than one person operating on different platforms). This type of key also has the advantage in that it can be backed-up and restored from a defective platform onto a new platform. However, migratable keys may not be the appropriate level of protection (e.g., the user wants the data restricted to a single platform) needed for the application. This requires a nonmigratable key. Non-migratable keys carry with them a usage deficit in that while the key may be backed-up and restored (i.e., protected from hard disk failure) they are not protected against system or TPM failure. The very nature of a non-migratable key is that they can be used on one and only one TPM. In the event of a system or TPM failure, all non-migratable keys and the data associated with them will be inaccessible and unrecoverable. CAUTION The following precautions and procedures may assist in recovering from any of the previously listed situations. Failure to implement these security precautions and procedures may result in unrecoverable data loss. 1.14.3.1 Password Procedures The Infineon Security Platform software allows users to configure passwords from 6 to 255 characters. A good password should consist of: • At least one upper case letter (A to Z) • At least one numerical character (0 to 9) • At least one symbol character (!, @, &, etc.) Example Passwords: “I wear a Brown hat 2 worK @ least once-a-month” or “uJGFak&%)adf35a9m” NOTE Avoid using names or dates that can be easily guessed such as: birthdays, anniversaries, family member names, pet names, etc. All passwords associated with the Infineon Security Platform software (Owner, Emergency Recovery Token, and User passwords) and the Wave Systems EMBASSY Trust Suite are NOT RECOVERABLE and cannot be reset without the original text. The system owner should document all passwords, store them in a secured location (vault, safe deposit box, off-site storage, etc.), and have them available for future use. These documents should be updated after any password changes. 49 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.14.3.2 Emergency Recovery File Back Up Procedures The Emergency Recovery Token (SPEmRecToken.xml) must be saved or moved to a removable media (floppy, USB drive, CDR, flash media, etc). Once this is done, the removable media should be stored in a secure location. DO NOT LEAVE ANY COPIES of the Emergency Recovery Token on the hard drive or within any hard drive image backups. If a copy of the Emergency Recovery Token remains on the system, it could be used to compromise the Trusted Platform Module and platform. After completing the Infineon Security Platform User Initialization Wizard, a copy of the Emergency Recovery Archive (SPEmRecArchive.xml) should be copied to a removable media and stored in a secure location. This procedure should be repeated after any password changes or the addition of a new user. 1.14.3.3 Hard Drive Image Backup Procedures To allow for emergency recovery from a hard drive failure, frequent images of the hard drive should be created and stored in a secure location. In the event of a hard drive failure, the latest image can be restored to a new hard drive and access to the encrypted data may be re-established. NOTE All encrypted and unencrypted data that was added after the last image was created will be lost. 1.14.3.4 Clear Text Backup (Optional) It is recommended that system owners follow the Hard Drive Image Backup Procedures. To backup select files without creating a drive image, files can be moved from secured programs or drive letters to an unencrypted directory. The unencrypted (clear text) files may then be backed up to a removable media and stored in a secure location. The advantage of the clear text backup is that no TPM key is required to restore the data. This option is not recommended because the data is exposed during backup and restore. 1.14.4 Trusted Platform Module Ownership The Trusted Platform Module is disabled by default when shipped and the owner/end customer of the system assumes “ownership” of the TPM. This permits the owner of the system to control initialization of the TPM and create all the passwords associated with the TPM that is used to protect their keys and data. System builders/integrators may install both the Infineon Security Platform software and the Wave System EMBASSY Trust Suite, but SHOULD NOT attempt to use or activate the TPM or either software package. 50 Product Description 1.14.5 Enabling the Trusted Platform Module The Trusted Platform Module is disabled by default when shipped to insure that the owner/end customer of the system initializes the TPM and configures all security passwords. The owner/end customer should use the following steps to enable the TPM. 1. While the PC is displaying the splash screen (or POST screen), press the key to enter BIOS. 2. Use the arrow keys to go to the Advanced Menu, select Peripheral Configuration, and then press the key. 3. Select the Trusted Platform Module, press , and select Enabled and press again (display should show: Trusted Platform Module [Enabled]). 4. Press the key, select Ok and press . 5. System should reboot and start Microsoft Windows. 1.14.6 Assuming Trusted Platform Module Ownership Once the TPM has been enabled, ownership must be assumed by using the Infineon Security Platform Software. The owner/end user should follow the steps listed below to take ownership of the TPM: 1. Start the system. 2. Launch the Infineon Security Platform Initialization Wizard. 3. Create Owner password (before creating any password, review the Password Recommendations made earlier in this document). 4. Create a new Recovery Archive (note the file name and location). 5. Specify a Security Platform Emergency Recovery Token password and location. (this password should not match the Owner password or any other password). 6. Define where to save the Emergency Recovery Token (note the file location and name). 7. The software will then create recovery archive files and finalize ownership of the TPM. 8. After completing the Infineon Security Platform Initialization Wizard, the Emergency Recovery Token (SPEmRecToken.xml) must be moved to a removable media (floppy, CDR, flash media, etc) if the file was not saved to a removable media during installation. Once this is done, the removable media should be stored in a secure location. No copies of this Emergency Recovery Token file should remain on the system. If a copy remains on the system, it could be used to compromise the security of the platform. 9. Launch the Infineon Security Platform User Initialization Wizard. 10. Create a Basic User password (this password is the most frequently used and should not match any other password). 11. Select and configure Security Platform features for this user. 12. After completing the Infineon Security Platform User Initialization Wizard, a copy of the Emergency Recovery Archive (SPEmRecArchive.xml) should be copied to a removable media and stored in a secure location. This procedure should be repeated after any password changes or the addition of new users. 13. Restart the system. 14. To backup the keys for the EMBASSY Trust Suite, the Key Transfer Manager software must be configured. Launch the Key Transfer Manager from the program menu. 51 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 15. Follow the instructions and create and document the locations for both the archive and restoration key files. The key archive should be located on a removable media and stored in a secure location when not in use. 16. Create and document the password to protect the key archive. 17. Provide the TPM Owner password to allow the Key Transfer Manager to create the archive and restoration key files. 18. Upon completing the configuration of the Key Transfer Manager, it will place an icon in the task bar and automatically back up all new and updated keys associated with the EMBASSY Trust Suite. If the removable media that contains the archive file is not present when a new key is generated, then keys will have to be manually backed up using the Key Transfer Manager when the removable media is available. 19. All passwords associated with the Infineon Security Platform Software (Owner, Emergency Recovery Token, and User passwords) and Wave Systems EMBASSY Trust Suite and Key Transfer Manager are not recoverable and cannot be reset without the original text. These passwords should be documented and stored in a secured location (vault, safe deposit box, offsite storage, etc.) in case they are needed in the future. These documents and files should be updated after any password changes. 1.14.7 1.14.7.1 Recovery Procedures Recovering from Hard Disk Failure Restore the latest hard drive image from backup to the new hard drive – no TPM specific recovery is necessary. 1.14.7.2 Recovering from Desktop Board or TPM Failure This procedure may restore the migratable keys from the Emergency Recovery Archive, and does not restore any previous keys or content to the TPM. This recovery procedure may restore access to the Infineon Security Platform software and Wave Systems EMBASSY Trust Suite that are secured with migratable keys. Requirements: • Emergency Recovery Archive (created with the Infineon Security Platform Initiation Wizard) • Emergency Recovery Token (created with the Infineon Security Platform Initiation Wizard) • Emergency Recovery Token Security Password (created with the Infineon Security Platform Initiation Wizard) • Working original operating system (OS) installation, or a restored image of the hard drive • Wave Systems Key Transfer Manager archive password • TPM Ownership password This recovery procedure only restores the migratable keys from the previously created Recovery Archives. 1. Replace the desktop board with the same model as the failed board. 2. Start the original operating system or restore the original hard drive image. 3. Start the Infineon Security Platform Initialization Wizard and check the “I want to restore the existing Security Platform” box. 52 Product Description 4. Follow the instructions during the Security Platform Initialization, and append the Emergency Recovery Archive to the existing archive. 5. Provide all the necessary passwords, files, and file locations as requested. It may take up to 20 minutes for Security Platform Initialization Wizard to restore the security platform settings. 6. Start User Initialization Wizard. Select “Recover Your Basic User Key” when prompted. Specify the original Basic User Key password and proceed with the wizard. 7. When re-configuring the Personal Secure Drive, select “I want to change my Personal Secure Drive setting”, confirm the drive letter and name are correct, and then proceed through the rest of the wizard. 8. Restart the system when requested. 9. To restore access to the EMBASSY Trust Suite, right mouse click on the Key Transfer Manager icon located in the taskbar in the lower right corner of the screen, and select Restore TPM Keys. 10. Provide all the necessary passwords, files, and file locations as requested by the Key Transfer Manager. 11. Upon successful completion of all steps, you should be able to access previously encrypted files. 1.14.8 Clearing Trusted Platform Module Ownership WARNING Disconnect the desktop board's power supply from its AC power source before you connect or disconnect cables, or install or remove any board components. Failure to do this can result in personal injury or equipment damage. Some circuitry on the desktop board can continue to operate even though the front panel power switch is off. CAUTION DATA ENCRYPTED BY ANY PROGRAM UTILIZING THE TPM WILL BECOME INACCESSIBLE IF TPM OWNERSHIP IS CLEARED. Recovery procedures may allow the migratable keys to be recovered and might restore access to encrypted data. (Review the Recovery Procedures for detailed instructions). The TPM may be cleared to transfer ownership of the platform to a new owner. 1. Observe precautions in the above WARNING then open the system case. 2. Move the configuration jumper on the board to pins 2-3. 3. Restore power to the PC and power on. 4. System should automatically enter BIOS setup. 5. Use the arrow keys to select Clear Trusted Platform Module, press . 6. If you agree to the warning message select Ok and press . 7. Press the key to save and exit, select Ok and press . 8. Power off the system. 9. Review precautions in the WARNING above. 10. Restore the configuration jumper on the board to pins 1-2. When cleared, the TPM module is disabled by default. 53 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 1.14.9 • • • Software Support For assistance with the Infineon Security Platform Software, visit the web at: http://www.infineon.com For assistance with the Wave System EMBASSY Trust Suite, visit the web at: http://www.wave.com/support/ets.html For additional information about TPM and enhancing PC security, visit: https://www.trustedcomputinggroup.org/home 54 2 Technical Reference What This Chapter Contains 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2.15 Introduction .................................................................................................................. 55 Memory Resources ...................................................................................................... 55 DMA Channels ............................................................................................................. 57 Fixed I/O Map............................................................................................................... 58 PCI Configuration Space Map...................................................................................... 59 Interrupts ...................................................................................................................... 60 PCI Conventional Interrupt Routing Map ..................................................................... 61 Connectors................................................................................................................... 63 Jumper Block ............................................................................................................... 77 Mechanical Considerations .......................................................................................... 78 Electrical Considerations.............................................................................................. 81 Thermal Considerations ............................................................................................... 83 Reliability...................................................................................................................... 85 Environmental .............................................................................................................. 86 Regulatory Compliance................................................................................................ 87 2.1 Introduction Sections 2.2 - 2.6 contain several standalone tables. Table 13 describes the system memory map, Table 14 lists the DMA channels, Table 15 shows the I/O map, Table 16 defines the PCI Conventional bus configuration space map, and Table 17 describes the interrupts. The remaining sections in this chapter are introduced by text found with their respective section headings. 2.2 Memory Resources 2.2.1 Addressable Memory The board utilizes 4 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (firmware hub), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 4 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following: • BIOS/firmware hub (2 MB) • Local APIC (19 MB) • Digital Media Interface (40 MB) • Front side bus interrupts (17 MB) • PCI Express configuration space (256 MB) 55 Intel Desktop Board D915GAV/D915GAG Technical Product Specification • • MCH base address registers, internal graphics ranges, PCI Express ports (up to 512 MB) Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI Express addin cards The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 17 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses. 4 GB Top of System Address Space FLASH APIC Reserved PCI Memory Range contains PCI, chipsets, Direct Media Interface (DMI), and ICH ranges (approximately 750 MB) Top of usable DRAM (memory visible to the operating system) ~20 MB 0FFFFFH 0F0000H 0EFFFFH 1 MB Upper BIOS area (64 KB) 960 KB Lower BIOS area (64 KB; 16 KB x 4) Add-in Card BIOS and Buffer area (128 KB; 16 KB x 8) Standard PCI/ ISA Video Memory (SMM Memory) 128 KB DOS area (640 KB) 0 KB OM17140 0E0000H 0DFFFFH 896 KB DRAM Range 1 MB DOS Compatibility Memory 640 KB 0C0000H 0BFFFFH 768 KB 0A0000H 09FFFFH 00000H 640 KB 0 MB Figure 17. Detailed System Memory Address Map 56 Technical Reference 2.2.2 Memory Map System Memory Map Address Range (hex) 100000 - FFFFFFFF F0000 - FFFFF E0000 - EFFFF C8000 - DFFFF Size 4095 MB 64 KB 64 KB 96 KB Description Extended memory Runtime BIOS Reserved Potential available high DOS memory (open to the PCI Conventional bus). Dependent on video adapter used. Video memory and BIOS Extended BIOS data (movable by memory manager software) Extended conventional memory Conventional memory Table 13 lists the system memory map. Table 13. Address Range (decimal) 1024 K - 4194304 K 960 K - 1024 K 896 K - 960 K 800 K - 896 K 640 K - 800 K 639 K - 640 K 512 K - 639 K 0 K - 512 K A0000 - C7FFF 9FC00 - 9FFFF 80000 - 9FBFF 00000 - 7FFFF 160 KB 1 KB 127 KB 512 KB 2.3 DMA Channels Table 14. 0 1 2 3 4 5 6 7 DMA Channels Data Width 8 or 16 bits 8 or 16 bits 8 or 16 bits 8 or 16 bits 8 or 16 bits 16 bits 16 bits 16 bits System Resource Open Parallel port Diskette drive Parallel port (for ECP or EPP) DMA controller Open Open Open DMA Channel Number 57 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 2.4 Fixed I/O Map Table 15. 0000 - 00FF 0170 - 0177 01F0 - 01F7 0228 - 022F (Note 1) 0278 - 027F (Note 1) 02E8 - 02EF (Note 1) 02F8 - 02FF (Note 1) 0374 - 0377 0377, bits 6:0 0378 - 037F 03E8 - 03EF 03F0 - 03F5 03F4 – 03F7 03F8 - 03FF 04D0 - 04D1 LPTn + 400 0CF8 - 0CFB (Note 2) 0CF9 (Note 3) 0CFC - 0CFF FFA0 - FFA7 FFA8 - FFAF Notes: 1. 2. 3. Default, but can be changed to another address range Dword access only Byte access only I/O Map Size 256 bytes 8 bytes 8 bytes 8 bytes 8 bytes 8 bytes 8 bytes 4 bytes 7 bits 8 bytes 8 bytes 6 bytes 1 byte 8 bytes 2 bytes 8 bytes 4 bytes 1 byte 4 bytes 8 bytes 8 bytes Description Used by the Desktop Board D915GAV/D915GAG. Refer to the ICH6 data sheet for dynamic addressing information. Secondary Parallel ATA IDE channel command block Primary Parallel ATA IDE channel command block LPT3 LPT2 COM4 COM2 Secondary Parallel ATA IDE channel control block Secondary IDE channel status port LPT1 COM3 Diskette channel Primary Parallel ATA IDE channel control block COM1 Edge/level triggered PIC ECP port, LPTn base address + 400h PCI Conventional bus configuration address register Reset control register PCI Conventional bus configuration data register Primary Parallel ATA IDE bus master registers Secondary Parallel ATA IDE bus master registers Address (hex) NOTE Some additional I/O addresses are not available due to ICH6 address aliassing. The ICH6 data sheet provides more information on address aliassing. For information about Obtaining the ICH6 data sheet Refer to Section 1.4, page 19 58 Technical Reference 2.5 PCI Configuration Space Map Table 16. PCI Configuration Space Map Device Number (hex) 00 01 02 02 1B 1C 1C 1C 1C 1D 1D 1D 1D 1D 1E 1F 1F 1F 1F 00 01 02 03 08 Function Number (hex) 00 00 00 01 00 00 01 02 03 00 01 02 03 07 00 00 01 02 03 00 00 00 00 00 Description Memory controller of Intel 82915G component PCI Express x16 graphics port (Note 1) Integrated graphics controller Integrated graphics controller Intel High Definition Audio Controller PCI Express port 1 (PCI Express x1 bus connector 1) PCI Express port 2 (Gigabit LAN controller, if present) PCI Express port 3 (PCI Express x1 bus connector 2) (Note 2) Bus Number (hex) 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 (Note 3) (Note 3) (Note 3) (Note 3) (Note 3) PCI Express port 4 (not used) USB UHCI controller 1 USB UHCI controller 2 USB UHCI controller 3 USB UHCI controller 4 EHCI controller PCI bridge PCI controller Parallel ATA IDE controller Serial ATA controller SMBus controller PCI Conventional bus connector 1 PCI Conventional bus connector 2 PCI Conventional bus connector 3 (Note 2) PCI Conventional bus connector 4 (Note 2) Intel 82562EZ 10/100 Mbits/sec LAN PLC (if present) Notes: 1. 2. 3. Present only when a PCI Express x16 graphics card is installed. Not present on the D915GAG board. Bus number is dynamic and can change based on add-in cards used. 59 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 2.6 Interrupts The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the Advanced Programmable Interrupt Controller (APIC) portion of the ICH6 component. The PIC is supported in Windows 98 SE and Windows ME and uses the first 16 interrupts. The APIC is supported in Windows 2000 and Windows XP and supports a total of 24 interrupts. Table 17. IRQ NMI 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 (Note 2) 17 19 20 22 23 1. 2. (Note 2) Interrupts System Resource I/O channel check Reserved, interval timer Reserved, keyboard buffer full Reserved, cascade interrupt from slave PIC COM2 (Note 1) COM1 (Note 1) LPT2 (Plug and Play option)/User available Diskette drive LPT1 (Note 1) Real-time clock User available User available User available Onboard mouse port (if present, else user available) Reserved, math coprocessor Primary IDE/Serial ATA (if present, else user available) Secondary IDE/Serial ATA (if present, else user available) User available (through PIRQA) User available (through PIRQB) User available (through PIRQC) User available (through PIRQD) User available (through PIRQE) User available (through PIRQF) User available (through PIRQG) User available (through PIRQH) 18 (Note 2) (Note 2) (Note 2) 21 (Note 2) (Note 2) (Note 2) Notes: Default, but can be changed to another IRQ. Available in APIC mode only. 60 Technical Reference 2.7 PCI Conventional Interrupt Routing Map This section describes interrupt sharing and how the interrupt signals are connected between the PCI Conventional bus connectors and onboard PCI Conventional devices. The PCI Conventional specification describes how interrupts can be shared between devices attached to the PCI Conventional bus. In most cases, the small amount of latency added by interrupt sharing does not affect the operation or throughput of the devices. In some special cases where maximum performance is needed from a device, a PCI Conventional device should not share an interrupt with other PCI Conventional devices. Use the following information to avoid sharing an interrupt with a PCI Conventional add-in card. PCI Conventional devices are categorized as follows to specify their interrupt grouping: • INTA: By default, all add-in cards that require only one interrupt are in this category. For almost all cards that require more than one interrupt, the first interrupt on the card is also classified as INTA. • INTB: Generally, the second interrupt on add-in cards that require two or more interrupts is classified as INTB. (This is not an absolute requirement.) • INTC and INTD: Generally, a third interrupt on add-in cards is classified as INTC and a fourth interrupt is classified as INTD. The ICH6 has eight Programmable Interrupt Request (PIRQ) input signals. All PCI Conventional interrupt sources either onboard or from a PCI Conventional add-in card connect to one of these PIRQ signals. Some PCI Conventional interrupt sources are electrically tied together on the board and therefore share the same interrupt. Table 18 shows an example of how the PIRQ signals are routed. For example, using Table 18 as a reference, assume an add-in card using INTA is plugged into PCI Conventional bus connector 3. In PCI bus connector 3, INTA is connected to PIRQB, which is already connected to the ICH6 audio controller. The add-in card in PCI Conventional bus connector 3 now shares an interrupt with the onboard interrupt source. 61 Intel Desktop Board D915GAV/D915GAG Technical Product Specification Table 18. PCI Interrupt Routing Map ICH6 PIRQ Signal Name PIRQA PIRQB PIRQC PIRQD PIRQE INTA INTD INTC (Note) (Note) PCI Interrupt Source ICH6 LAN PCI bus connector 1 PCI bus connector 2 PCI bus connector 3 PCI bus connector 4 PIRQF INTA INTB INTC PIRQG INTB INTA INTD PIRQH INTC INTD INTD INTC INTA INTB INTB INTA Note: Not present on the D915GAG board. NOTE In PIC mode, the ICH6 can connect each PIRQ line internally to one of the IRQ signals (3, 4, 5, 6, 7, 9, 10, 11, 12, 14, and 15). Typically, a device that does not share a PIRQ line will have a unique interrupt. However, in certain interrupt-constrained situations, it is possible for two or more of the PIRQ lines to be connected to the same IRQ signal. Refer to Table 17 for the allocation of PIRQ lines to IRQ signals in APIC mode. PCI interrupt assignments to the USB ports, Serial ATA ports, and PCI Express ports are dynamic. 62 Technical Reference 2.8 Connectors CAUTION Only the following connectors have overcurrent protection: back panel USB, front panel USB, and PS/2. The other internal connectors are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves. This section describes the board’s connectors. The connectors can be divided into these groups: • Back panel I/O connectors (see page 64) • Component-side I/O connectors (see page 65) 63 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 2.8.1 Back Panel Connectors Figure 18 shows the location of the back panel connectors. The back panel connectors are color-coded. The figure legend (Table 19) lists the colors used (when applicable). C F I K A B D E G HJ L OM16670 Figure 18. Back Panel Connectors Table 19 lists the back panel connectors identified in Figure 18. NOTE The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output. 64 Technical Reference Table 19. Back Panel Connectors Shown in Figure 18 Description PS/2 mouse port (Green) PS/2 keyboard port (Purple) Parallel port (Burgundy) Serial port A (Teal) VGA port Audio line in/Retasking Port C (Light blue) Audio line out/Retasking Port D (Lime Green) Mic in/Retasking Port B (Pink) IEEE-1394a (optional) USB ports (two) LAN USB ports (two) Item/callout from Figure 18 A B C D E F G H I J K L NOTE The D915GAG board supports a manufacturing option for no LAN subsystem. On D915GAG boards with no LAN subsystem, the back panel LAN connector is not present. 65 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 2.8.2 Component-side Connectors Figure 19 shows the locations of the component-side connectors on the D915GAV board. B A C D E FH J L GI K M N O P 1 3 1 9 3 4 1 1 2 10 3 1 13 1 4 4 1 2 1 10 1 1 2 1 10 1 2 10 3 9 1 1 1 2 1 1 3 4 1 1 2 10 1 9 1 24 23 40 2 2 1 34 33 39 1 1 2 2 1 GG EE CC AA Y W FF DD BB Z X V U T SR Q OM16671 Figure 19. D915GAV Board Component-side Connectors 66 Technical Reference Table 20 lists the component-side connectors identified in Figure 19. Table 20. Component-side Connectors Shown in Figure 19 Description PCI Conventional bus add-in card connector 4 Rear chassis fan connector 2 PCI Conventional bus add-in card connector 3 PCI Express x1 bus add-in card connector 2 ATAPI CD-ROM connector (optional) PCI Express x1 bus add-in card connector 1 S/PDIF connector (optional) Front panel audio connector PCI Conventional bus add-in card connector 2 Front panel IEEE-1394a connector (optional) PCI Conventional bus add-in card connector 1 Front panel IEEE-1394a connector (optional) PCI Express x16 bus add-in card connector Rear chassis fan connector 1 Alternate power connector +12V power connector (ATX12V) SCSI LED (optional) Serial port B (optional) Processor fan connector Power connector Diskette drive connector Parallel ATA IDE connector Chassis intrusion connector Front chassis fan connector Serial ATA connector 1 Serial ATA connector 3 Serial ATA connector 2 Serial ATA connector 0 Auxiliary front panel power LED connector Front panel connector ATX fan connector (optional) Front panel USB connector Front panel USB connector Item/callout from Figure 19 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA BB CC DD EE FF GG 67 Intel Desktop Board D915GAV/D915GAG Technical Product Specification Figure 20 shows the locations of the component-side connectors on the D915GAG board. B A C D E F G H I 1 9 3 4 2 10 3 1 13 1 4 4 BB AA 1 1 1 2 1 10 1 2 1 10 1 2 10 9 1 1 1 2 1 1 3 4 1 Z 1 2 10 J Y 1 9 2 K X W 1 24 23 40 2 2 1 34 33 39 1 1 L 2 1 V U T S R Q P O N M OM16661 Figure 20. D915GAG Board Component-side Connectors 68 Technical Reference Table 21 lists the component-side connectors identified in Figure 20. Table 21. Component-side Connectors Shown in Figure 20 Description S/PDIF connector (optional) Front panel audio connector PCI Conventional bus add-in card connector 2 Front panel IEEE-1394a connector (optional) PCI Conventional bus add-in card connector 1 PCI Express x16 bus add-in card connector Rear chassis fan connector Alternate power connector +12V power connector (ATX12V) Processor fan connector Serial port B (optional) SCSI LED (optional) Power connector Diskette drive connector Parallel ATA IDE connector Chassis intrusion connector Front chassis fan connector Serial ATA connector 1 Serial ATA connector 3 Serial ATA connector 2 Serial ATA connector 0 Auxiliary front panel power LED connector Front panel connector Front panel USB connector Front panel USB connector Front panel IEEE-1394a connector (optional) PCI Express x1 bus add-in card connector 1 ATAPI CD-ROM connector (optional) Item/callout from Figure 20 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA BB 69 Intel Desktop Board D915GAV/D915GAG Technical Product Specification Table 22. Pin 1 2 3 S/PDIF Connector (Optional) Signal Name +5 V S/PDIF Output Ground Table 23. Pin 1 2 3 4 ATAPI CD-ROM Connector (Optional) Signal Name Left audio input from CD-ROM CD audio differential ground CD audio differential ground Right audio input from CD-ROM Table 24. Pin 1 3 5 7 9 Front Panel Audio Connector Pin 2 4 6 8 10 Signal Name Ground Presence# (dongle present) Port E [Port 1] Sense return (jack detection) Key Port F [Port 2] Sense return (jack detection) Signal Name Port E [Port 1] Left Channel Port E [Port 1] Right Channel Port F [Port 2] Right Channel Port E [Port 1] and Port F [Port 2] Sense send (jack detection) Port F [Port 2] Left Channel INTEGRATOR’S NOTE The front panel audio connector is colored yellow. Table 25. Pin 1 3 5 7 9 Serial Port B Connector (optional) Signal Name DCD TXD Ground RTS RI Pin 2 4 6 8 10 Signal Name RXD DTR DSR CTS Not connected Table 26. Pin 1 2 Chassis Intrusion Connector Signal Name Intruder Ground 70 Technical Reference Table 27. Pin 1 2 SCSI Hard Drive Activity LED Connector (Optional) Signal Name SCSI_ACT# No connect Table 28. Pin 1 2 3 4 5 6 7 Serial ATA Connectors Signal Name Ground TXP TXN Ground RXN RXP Ground Table 29. Pin 1 2 3 4 Processor Fan Connector Signal Name Ground +12 V FAN_TACH FAN_CONTROL 2.8.2.1 Chassis Fan Connectors The D915GAV board has three standard and one optional chassis fan connectors: • Front chassis fan • Rear chassis fan 1 • Rear chassis fan 2 • ATX fan connector (optional) The D915GAG board has two chassis fan connectors: • Front chassis fan • Rear chassis fan Table 30 lists the signal names for the chassis fan connectors. These signal names apply to all chassis fan connectors for both boards. Table 30. Pin 1 2 3 Chassis Fan Connectors Signal Name Control +12 V Tach 71 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 2.8.2.2 Power Supply Connectors The board has three power supply connectors: • Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, attach that cable on the rightmost pins of the main power connector, leaving pins 11, 12, 23, and 24 unconnected. • ATX12V power – a 2 x 2 connector. This connector provides power directly to the processor voltage regulator and must always be used. Failure to do so will prevent the board from booting. • Alternate power – a 1 x 4 connector. This connector provides additional power when using high wattage PCI Express x16 graphics cards. INTEGRATOR’S NOTE When using high wattage PCI Express x16 graphics cards, use one of the following power supply configurations to avoid system instability: • The preferred method of power delivery is to use a power supply with a 2 x 12 main power cable. In this configuration, use two connectors to provide power to the board: ⎯ The main power connector ⎯ The ATX12V connector In this configuration, the alternate power connector is not required. The 2 x 12 main power cable can provide up to 144 W of power from the +12 V rail. An alternate method of power delivery is to use a power supply has a 2 x 10 main power cable. In this configuration, use three connectors to provide power to the board: ⎯ The main power connector ⎯ The ATX12V connector ⎯ The alternate power connector Main Power Connector Signal Name +3.3 V +3.3 V Ground +5 V Ground +5 V Ground PWRGD (Power Good) +5 V (Standby) +12 V +12 V (Note) (Note) • Table 31. Pin 1 2 3 4 5 6 7 8 9 10 11 12 Pin 13 14 15 16 17 18 19 20 21 22 23 24 Signal Name +3.3 V -12 V Ground PS-ON# (power supply remote on/off) Ground Ground Ground No connect +5 V +5 V +5 V (Note) (Note) 2 x 12 connector detect Ground Note: When using a 2 x 10 power supply cable, this pin will be unconnected. 72 Technical Reference Table 32. Pin 1 3 ATX12V Power Connector Signal Name Ground +12 V Pin 2 4 Signal Name Ground +12 V Table 33. Pin 1 2 3 4 Alternate Power Connector Signal Name +12 V Ground Ground +5 V 2.8.2.3 Add-in Card Connectors The board has the following add-in card connectors: • PCI Express x16: one connector supporting simultaneous transfer speeds up to 8 GBytes/sec. • PCI Express x1: the D915GAV board has two PCI Express x1 connectors; the D915GAG board has one PCI Express x1 connector. The x1 interfaces support simultaneous transfer speeds up to 500 MBytes/sec. • PCI Conventional (rev 2.2 compliant) bus: the D915GAV board has four PCI Conventional bus add-in card connectors; the D915GAG board has two PCI Conventional add-in card connectors. The SMBus is routed to PCI Conventional bus connector 2 only (ATX expansion slot 6). PCI Conventional bus add-in cards with SMBus support can access sensor data and other information residing on the Desktop Board. Note the following considerations for the PCI Conventional bus connectors: • All of the PCI Conventional bus connectors are bus master capable. • SMBus signals are routed to PCI Conventional bus connector 2. This enables PCI Conventional bus add-in boards with SMBus support to access sensor data on the boards. The specific SMBus signals are as follows: ⎯ The SMBus clock line is connected to pin A40. ⎯ The SMBus data line is connected to pin A41. NOTE The PCI Express x16 connector is configured to support only a PCI Express x1 link when the Intel GMA900 graphics controller is enabled. 73 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 2.8.2.4 Auxiliary Front Panel Power/Sleep LED Connector Pins 1 and 3 of this connector duplicate the signals on pins 2 and 4 of the front panel connector. Table 34. Pin 1 2 3 Auxiliary Front Panel Power/Sleep LED Connector Signal Name HDR_BLNK_GRN Not connected HDR_BLNK_YEL Out Front panel yellow LED In/Out Out Description Front panel green LED 2.8.2.5 Front Panel Connector This section describes the functions of the front panel connector. Table 35 lists the signal names of the front panel connector. Figure 21 is a connection diagram for the front panel connector. Table 35. Pin Front Panel Connector In/Out Description Pin Signal In/Out Power LED [Green] 2 4 HDR_BLNK_ GRN HDR_BLNK_ YEL Out Out Front panel green LED Front panel yellow LED Description Hard Drive Activity LED [Yellow] Signal 1 3 HD_PWR HAD# Out Out Hard disk LED pull-up (750 Ω) to +5 V Hard disk active LED Reset Switch [Purple] 5 7 Ground FP_RESET# In Power 9 +5 V Power 10 N/C Ground Reset switch 6 8 FPBUT_IN Ground On/Off Switch [Red] In Power switch Ground Not Connected Not connected N/C 8 6 4 2 9 7 5 3 1 +5 V DC Power Switch Purple Yellow Reset Switch Red Green + − Dual-colored Power LED − + Single-colored Power LED − + Hard Drive Activity LED OM17000 Figure 21. Connection Diagram for Front Panel Connector 74 Technical Reference 2.8.2.5.1 Hard Drive Activity LED Connector [Yellow] Pins 1 and 3 [Yellow] can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires one of the following: • A Serial ATA hard drive connected to an onboard Serial ATA connector • An IDE hard drive connected to an onboard IDE connector 2.8.2.5.2 Reset Switch Connector [Purple] Pins 5 and 7 [Purple] can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.8.2.5.3 Power/Sleep LED Connector [Green] Pins 2 and 4 [Green] can be connected to a one- or two-color LED. Table 36 shows the possible states for a one-color LED. Table 37 shows the possible states for a two-color LED. Table 36. LED State Off Steady Green States for a One-Color Power LED Description Power off/sleeping Running Table 37. LED State Off States for a Two-Color Power LED Description Power off Running Sleeping Steady Green Steady Yellow NOTE The colors listed in Table 36 and Table 37 are suggested colors only. Actual LED colors are product- or customer-specific. 2.8.2.5.4 Power Switch Connector [Red] Pins 6 and 8 [Red] can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal. 75 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 2.8.2.6 Front Panel USB Connectors Figure 22 is a connection diagram for the front panel USB connectors. INTEGRATOR’S NOTES • • • • The +5 V DC power on the USB connector is fused. Pins 1, 3, 5, and 7 comprise one USB port. Pins 2, 4, 6, and 8 comprise one USB port. Use only a front panel USB connector that conforms to the USB 2.0 specification for highspeed USB devices. Power (+5 V DC) One USB Port 1 2 Power (+5 V DC) D− D+ Ground No Connect OM15963 D− D+ Ground Key (no pin) 3 5 7 4 6 8 One USB Port 10 Figure 22. Connection Diagram for Front Panel USB Connectors 2.8.2.7 Front Panel IEEE 1394a Connectors (Optional) Figure 23 is a connection diagram for the optional IEEE 1394a connectors. TPA+ Ground TPB+ +12 V DC Key (no pin) 1 2 TPA− Ground TPB− +12 V DC Ground OM16107 3 5 7 4 6 8 10 Figure 23. Connection Diagram for IEEE 1394a Connectors INTEGRATOR’S NOTES • • • The IEEE 1394a connectors are colored blue. The +12 V DC power on the IEEE 1394a connectors is fused. Each IEEE 1394a connector provides one IEEE 1394a port. 76 Technical Reference 2.9 Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 24 shows the location of the jumper block on the D915GAV board. (The jumper is in the same location on the D915GAG board.) The jumper block determines the BIOS Setup program’s mode. Table 38 describes the jumper settings for the three modes: normal, configure, and recovery. When the jumper is set to configure mode and the computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match. 1 3 J8J4 OM16672 Figure 24. Location of the Jumper Block Table 38. Normal BIOS Setup Configuration Jumper Settings Jumper Setting Configuration 3 Function/Mode 1-2 Configure 2-3 Recovery None 1 The BIOS uses current configuration information and passwords for booting. After the POST runs, Setup runs automatically. The maintenance menu is displayed. The BIOS attempts to recover the BIOS configuration. A recovery diskette is required. 1 3 1 3 77 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 2.10 Mechanical Considerations 2.10.1 D915GAV Board Form Factor The D915GAV board is designed to fit into an ATX-form-factor chassis. Figure 25 illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The outer dimensions are 12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification. 1.800 [45.72] 6.500 [165.10] 6.100 [154.94] 5.200 [132.08] 0.00 2.850 [72.39] 3.100 [78.74] 5.550 [140.97] 4.900 [124.46] 2.600 [66.04] 6.450 [163.83] 0.00 6.200 [157.48] OM16674 Figure 25. D915GAV Board Dimensions 78 Technical Reference 2.10.2 D915GAG Board Form Factor The D915GAG board is designed to fit into either a microATX or an ATX-form-factor chassis. Figure 26 illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification. 1.800 [45.72] 6.500 [165.10] 6.100 [154.94] 5.200 [132.08] 0.00 2.850 [72.39] 3.100 [78.74] 3.150 [80.01] 6.450 [163.83] 2.600 [66.04] 0.00 6.200 [157.48] OM16664 Figure 26. D915GAG Board Dimensions 79 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 2.10.3 I/O Shield The back panel I/O shield for the boards must meet specific dimension and material requirements. Systems based on these boards need the back panel I/O shield to pass certification testing. Figure 27 shows the I/O shield. Dimensions are given in inches to a tolerance of ±0.02 inches. The figure also indicates the position of each cutout. Additional design considerations for I/O shields relative to chassis requirements are described in the ATX specification. NOTE The I/O shield drawing in this document is for reference only. An I/O shield compliant with the ATX chassis specification 2.03 is available from Intel. 162.3 REF [6.390] 1.6 ± 0.12 [0.063 ± 0.005] 20. ± 0.254 TYP [0.787 ± 0.10] 1.55 REF [0.061] 159.2 ± 0.12 [6.268 ± 0.005] 22.45 [0.884] 7.012 [0.276] Ø 1.00 [0.039] A 0.00 [0.00] 11.811 [0.465] 12.00 [0.472] 8x R 0.5 MIN A 11.81 [0.465] 14.4 [0.567] 0.00 [0.00] 9.44 [0.372] 21.13 [0.832] 27.876 [1.097] 57.206 [2.252] 102.84 [4.049] 120.81 [4.756] Pictorial View 142.12 [5.595] OM17166 Figure 27. I/O Shield Dimensions 80 Technical Reference 2.11 Electrical Considerations 2.11.1 DC Loading Table 39 lists the DC loading characteristics of the boards. This data is based on a DC analysis of all active components within the board that impact its power delivery subsystems. The analysis does not include PCI add-in cards. Minimum values assume a light load placed on the board that is similar to an environment with no applications running and no USB current draw. Maximum values assume a load placed on the board that is similar to a heavy gaming environment with a 500 mA current draw per USB port. These calculations are not based on specific processor values or memory configurations but are based on the minimum and maximum current draw possible from the board’s power delivery subsystems to the processor, memory, and USB ports. Use the datasheets for add-in cards, such as PCI, to determine the overall system power requirements. The selection of a power supply at the system level is dependent on the system’s usage model and not necessarily tied to a particular processor speed. Table 39. Mode DC Loading Characteristics DC Current at: DC Power +3.3 V +5 V +12 V -12 V +5 VSB Minimum loading Maximum loading 200.00 W 300.00 W 3.30 A 6.00 A 10.00 A 14.00 A 900 A 16.00 A 0.03 A 0.10 A 0.80 A 1.40 A 2.11.2 Add-in Board Considerations The boards are designed to provide 2 A (average) of +5 V current for each add-in board. The total +5 V current draw for both boards is as follows: • A fully loaded D915GAV board (all six expansion slots and the PCI Express x16 slot filled) must not exceed 14 A. • A fully loaded D915GAG board (all three expansion slots and the PCI Express x16 slot filled) must not exceed 8 A. 81 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 2.11.3 Fan Connector Current Capability CAUTION The processor fan must be connected to the processor fan connector, not to a chassis fan connector. Connecting the processor fan to a chassis fan connector may result in onboard component damage that will halt fan operation. Table 40 lists the current capability of the fan connectors. Table 40. Fan Connector Current Capability Maximum Available Current Fan Connector Processor fan Front chassis fan Rear chassis fan Rear chassis fan 2 1000 mA 600 mA 600 mA 600 mA NOTE The rear chassis fan 2 is available only on the D915GAV board. It is not available on the D915GAG board. 2.11.4 Power Supply Considerations CAUTION The +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. System integrators should refer to the power usage values listed in Table 39 when selecting a power supply for use with the board. Additional power required will depend on configurations chosen by the integrator. The power supply must comply with the following recommendations found in the indicated sections of the ATX form factor specification. • The potential relation between 3.3 VDC and +5 VDC power rails (Section 4.2) • The current capability of the +5 VSB line (Section 4.2.1.2) • All timing parameters (Section 4.2.1.3) • All voltage tolerances (Section 4.2.2) 82 Technical Reference 2.12 Thermal Considerations CAUTION A chassis with a maximum internal ambient temperature of 38 C at the processor fan inlet is a requirement. Use a processor heatsink that provides omni-directional airflow (as shown in Figure 28) to maintain required airflow across the processor voltage regulator area. o OM16996 Figure 28. Processor Heatsink for Omni-directional Airflow CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.14. 83 Intel Desktop Board D915GAV/D915GAG Technical Product Specification CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area o (item A in Figure 29) can reach a temperature of up to 85 C in an open chassis. Figure 29 shows the locations of the localized high temperature zones. A B D Item Description C OM16673 A B C D Processor voltage regulator area Processor Intel 82915G GMCH Intel 82801FB ICH6 Figure 29. Localized High Temperature Zones 84 Technical Reference Table 41 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 41. Thermal Considerations for Components Maximum Case Temperature Component Intel Pentium 4 processor For processor case temperature, see processor datasheets and processor specification updates 99 oC (under bias) 110 oC (under bias) Intel 82915G GMCH Intel 82801FB ICH6 For information about Intel Pentium 4 processor datasheets and specification updates Refer to Section 1.4, page 19 2.13 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the D915GAV and D915GAG boards is 102,038 hours. 85 Intel Desktop Board D915GAV/D915GAG Technical Product Specification 2.14 Environmental Table 42 lists the environmental specifications for the board. Table 42. Parameter Temperature Environmental Specifications Specification Non-Operating Operating Shock -40 °C to +70 °C 0 °C to +55 °C 50 g trapezoidal waveform Velocity change of 170 inches/second Half sine 2 millisecond Product Weight (pounds)
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