D36106-001US

Intel® Desktop Board D945GPM Technical Product Specification January 2006 Order Number: D36106-001US The Intel® Desktop Board D945GPM may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D945GPM Specification Update. Revision History Revision -001 Revision History First release of the Specification. Intel® Desktop Board D945GPM Technical Product Date January 2006 This product specification applies to only the standard Intel Desktop Board D945GPM with BIOS identifier NT94510J.86A. Changes to this specification will be published in the Intel Desktop Board D945GPM Specification Update before being incorporated into a revision of this document. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. All Intel® desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 5937 Denver, CO 80217-9808 or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333. Intel, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. Copyright © 2006, Intel Corporation. All rights reserved. Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel® Desktop Board D945GPM. It describes the standard product and available manufacturing options. Intended Audience The TPS is intended to provide detailed, technical information about the Desktop Board D945GPM and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences. What This Document Contains Chapter 1 2 3 4 Description A description of the hardware used on the Desktop Board D945GPM A map of the resources of the Desktop Board The features supported by the BIOS Setup program A description of the BIOS error messages, beep codes, and POST codes Typographical Conventions This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type. Notes, Cautions, and Warnings NOTE Notes call attention to important information. INTEGRATOR’S NOTES Integrator’s notes are used to call attention to information that may be useful to system integrators. CAUTION Cautions are included to help you avoid damaging hardware or losing data. WARNING Warnings indicate conditions, which if not observed, can cause personal injury. iii Intel Desktop Board D945GPM Technical Product Specification Other Common Notation # (NxnX) Used after a signal name to identify an active-low signal (such as USBP0#) When used in the description of a component, N indicates component type, xn are the relative coordinates of its location on the Desktop Board D945GPM, and X is the instance of the particular part at that general location. For example, J5J1 is a connector, located at 5J. It is the first connector in the 5J area. Gigabyte (1,073,741,824 bytes) Gigabytes per second Gigabits per second Kilobyte (1024 bytes) Kilobit (1024 bits) 1000 bits per second Megabyte (1,048,576 bytes) Megabytes per second Megabit (1,048,576 bits) Megabits per second An address or data value ending with a lowercase h indicates a hexadecimal value. Volts. Voltages are DC unless otherwise specified. This symbol is used to indicate third-party brands and names that are the property of their respective owners. GB GB/sec Gbits/sec KB Kbit kbits/sec MB MB/sec Mbit Mbit/sec xxh x.x V * iv Contents 1 Product Description 1.1 Overview ...................................................................................................................... 10 1.1.1 Feature Summary.......................................................................................... 10 1.1.2 Manufacturing Options .................................................................................. 11 1.1.3 Board Layout ................................................................................................. 12 1.1.4 Block Diagram ............................................................................................... 14 Online Support ............................................................................................................. 15 Processor ..................................................................................................................... 15 System Memory ........................................................................................................... 16 1.4.1 Memory Configurations ................................................................................. 17 Intel® 945G Chipset ..................................................................................................... 21 1.5.1 Intel 945G Graphics Subsystem.................................................................... 21 1.5.2 USB ............................................................................................................... 23 1.5.3 IDE Support ................................................................................................... 24 1.5.4 Real-Time Clock, CMOS SRAM, and Battery................................................ 25 PCI Express* Connectors ............................................................................................ 30 IEEE-1394a Connectors .............................................................................................. 30 Legacy I/O Controller ................................................................................................... 30 1.8.1 Serial Port...................................................................................................... 31 1.8.2 Parallel Port (Optional) .................................................................................. 31 1.8.3 Diskette Drive Controller................................................................................ 31 1.8.4 Keyboard and Mouse Interface ..................................................................... 31 Audio Subsystem ......................................................................................................... 32 1.9.1 Audio Subsystem Software ........................................................................... 32 1.9.2 Audio Connectors .......................................................................................... 32 1.9.3 8-Channel (7.1) Audio Subsystem................................................................. 32 LAN Subsystem ........................................................................................................... 34 1.10.1 LAN Subsystem Software.............................................................................. 34 1.10.2 10/100 Mbits/sec LAN Subsystem................................................................. 34 1.10.3 Gigabit LAN Subsystem ................................................................................ 35 Hardware Management Subsystem............................................................................. 36 1.11.1 Hardware Monitoring and Fan Control ASIC ................................................. 36 1.11.2 Chassis Intrusion and Detection.................................................................... 37 1.11.3 Fan Monitoring............................................................................................... 37 1.11.4 Thermal Monitoring........................................................................................ 38 Power Management ..................................................................................................... 39 1.12.1 ACPI .............................................................................................................. 39 1.12.2 Hardware Support ......................................................................................... 41 Trusted Platform Module (Optional) ............................................................................. 45 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 1.10 1.11 1.12 1.13 v Intel Desktop Board D945GPM Technical Product Specification 2 Technical Reference 2.1 Memory Resources ...................................................................................................... 47 2.1.1 Addressable Memory..................................................................................... 47 2.1.2 Memory Map.................................................................................................. 49 DMA Channels ............................................................................................................. 49 Fixed I/O Map............................................................................................................... 50 PCI Configuration Space Map...................................................................................... 51 Interrupts ...................................................................................................................... 52 PCI Conventional Interrupt Routing Map ..................................................................... 53 Connectors................................................................................................................... 54 2.7.1 Back Panel Connectors ................................................................................. 54 2.7.2 Component-side Connectors......................................................................... 56 Jumper Block ............................................................................................................... 64 Mechanical Considerations .......................................................................................... 65 2.9.1 Form Factor ................................................................................................... 65 2.9.2 I/O Shield....................................................................................................... 66 Electrical Considerations.............................................................................................. 68 2.10.1 DC Loading.................................................................................................... 68 2.10.2 Add-in Board Considerations......................................................................... 68 2.10.3 Fan Connector Current Capability ................................................................. 69 2.10.4 Power Supply Considerations ....................................................................... 69 Thermal Considerations ............................................................................................... 70 Reliability...................................................................................................................... 72 Environmental .............................................................................................................. 73 Regulatory Compliance................................................................................................ 74 2.14.1 Safety Regulations ........................................................................................ 74 2.14.2 European Union Declaration of Conformity Statement.................................. 74 2.14.3 Product Ecology Statements ......................................................................... 76 2.14.4 EMC Regulations........................................................................................... 79 2.14.5 Product Certification Markings (Board Level) ................................................ 80 Introduction .................................................................................................................. 81 BIOS Flash Memory Organization ............................................................................... 82 Resource Configuration ............................................................................................... 82 3.3.1 PCI Autoconfiguration.................................................................................... 82 3.3.2 PCI IDE Support ............................................................................................ 82 System Management BIOS (SMBIOS) ........................................................................ 83 Legacy USB Support.................................................................................................... 83 BIOS Updates .............................................................................................................. 84 3.6.1 Language Support ......................................................................................... 84 3.6.2 Custom Splash Screen.................................................................................. 84 Boot Options ................................................................................................................ 85 3.7.1 CD-ROM Boot ............................................................................................... 85 3.7.2 Network Boot ................................................................................................. 85 3.7.3 Booting Without Attached Devices ................................................................ 85 3.7.4 Changing the Default Boot Device During POST .......................................... 85 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 2.11 2.12 2.13 2.14 3 Overview of BIOS Features 3.1 3.2 3.3 3.4 3.5 3.6 3.7 vi Contents 3.8 3.9 4.1 4.2 4.3 4.4 Adjusting Boot Speed................................................................................................... 86 3.8.1 Peripheral Selection and Configuration ......................................................... 86 3.8.2 BIOS Boot Optimizations............................................................................... 86 BIOS Security Features ............................................................................................... 87 Speaker........................................................................................................................ 89 BIOS Beep Codes........................................................................................................ 89 BIOS Error Messages .................................................................................................. 89 Port 80h POST Codes ................................................................................................. 90 4 Error Messages and Beep Codes Figures 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. Board Components ...................................................................................................... 12 Block Diagram.............................................................................................................. 14 Memory Channel and DIMM Configuration .................................................................. 17 Dual Channel (Interleaved) Mode Configuration with Two DIMMs .............................. 18 Dual Channel (Interleaved) Mode Configuration with Three DIMMs............................ 18 Dual Channel (Interleaved) Mode Configuration with Four DIMMs.............................. 19 Single Channel (Asymmetric) Mode Configuration with One DIMM............................. 20 Single Channel (Asymmetric) Mode Configuration with Three DIMMs ........................ 20 Front/Back Panel Audio Connectors ............................................................................ 33 8-channel (7.1) Audio Subsystem Block Diagram........................................................ 33 LAN Connector LED Locations .................................................................................... 35 LAN Connector LED Locations .................................................................................... 36 Thermal Sensors and Fan Connectors ........................................................................ 38 Location of the Standby Power Indicator LED ............................................................. 45 Detailed System Memory Address Map ....................................................................... 48 Back Panel Connectors................................................................................................ 54 Component-side Connectors ....................................................................................... 56 Connection Diagram for Front Panel Connector .......................................................... 61 Connection Diagram for Front Panel USB Connectors................................................ 63 Connection Diagram for IEEE 1394a Connectors........................................................ 63 Location of the Jumper Block....................................................................................... 64 Board Dimensions........................................................................................................ 65 I/O Shield Dimensions for Boards with the Optional Parallel Port Connector .............. 66 I/O Shield Dimensions for Boards without the Optional Parallel Port Connector ......... 67 Processor Heatsink for Omni-directional Airflow.......................................................... 70 Localized High Temperature Zones ............................................................................. 71 Tables 1. 2. 3. 4. 5. 6. 7. 8. Feature Summary ........................................................................................................ 10 Manufacturing Options ................................................................................................. 11 Board Components Shown in Figure 1 ........................................................................ 13 Supported Memory Configurations .............................................................................. 16 LAN Connector LED States ......................................................................................... 35 LAN Connector LED States ......................................................................................... 36 Effects of Pressing the Power Switch .......................................................................... 39 Power States and Targeted System Power ................................................................. 40 vii Intel Desktop Board D945GPM Technical Product Specification 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 41. 42. 43. 44. 45. 46. Wake-up Devices and Events ...................................................................................... 41 System Memory Map ................................................................................................... 49 DMA Channels ............................................................................................................. 49 I/O Map ........................................................................................................................ 50 PCI Configuration Space Map...................................................................................... 51 Interrupts ...................................................................................................................... 52 PCI Interrupt Routing Map ........................................................................................... 53 Back Panel Connectors Shown in Figure 16................................................................ 55 Component-side Connectors Shown in Figure 17 ....................................................... 57 Front Panel Audio Connector....................................................................................... 57 Chassis Intrusion Connector ........................................................................................ 58 Serial ATA Connectors................................................................................................. 58 Processor Fan Connector ............................................................................................ 58 Front and Rear Chassis Fan Connectors..................................................................... 58 Main Power Connector................................................................................................. 59 ATX12V Power Connector ........................................................................................... 59 Auxiliary Front Panel Power/Sleep LED Connector ..................................................... 60 Front Panel Connector ................................................................................................. 61 States for a One-Color Power LED .............................................................................. 62 States for a Two-Color Power LED .............................................................................. 62 BIOS Setup Configuration Jumper Settings................................................................. 64 DC Loading Characteristics ......................................................................................... 68 Fan Connector Current Capability................................................................................ 69 Thermal Considerations for Components .................................................................... 72 Environmental Specifications ....................................................................................... 73 Safety Regulations ....................................................................................................... 74 Lead Free Desktop Board ............................................................................................ 78 EMC Regulations ......................................................................................................... 79 Product Certification Markings ..................................................................................... 80 BIOS Setup Program Menu Bar................................................................................... 82 BIOS Setup Program Function Keys............................................................................ 82 Boot Device Menu Options .......................................................................................... 85 Supervisor and User Password Functions ................................................................... 87 Beep Codes ................................................................................................................. 89 BIOS Error Messages .................................................................................................. 89 Port 80h POST Code Ranges...................................................................................... 90 Port 80h POST Codes ................................................................................................. 91 Typical Port 80h POST Sequence ............................................................................... 94 viii 1 Product Description What This Chapter Contains 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 1.10 1.11 1.12 1.13 Overview ...................................................................................................................... 10 Online Support ............................................................................................................. 15 Processor ..................................................................................................................... 15 System Memory ........................................................................................................... 16 Intel® 945G Chipset ..................................................................................................... 21 PCI Express* Connectors ............................................................................................ 30 IEEE-1394a Connectors .............................................................................................. 30 Legacy I/O Controller ................................................................................................... 30 Audio Subsystem ......................................................................................................... 32 LAN Subsystem ........................................................................................................... 34 Hardware Management Subsystem............................................................................. 36 Power Management ..................................................................................................... 39 Trusted Platform Module (Optional) ............................................................................. 45 9 Intel Desktop Board D945GPM Technical Product Specification 1.1 Overview 1.1.1 Feature Summary Feature Summary microATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]) Support for an Intel® Pentium® D processor in an LGA775 socket with a 1066 or 800 MHz system bus • Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets • Support for DDR2 667 or DDR2 533 MHz DIMMs • Support for up to 4 GB of system memory Chipset Intel® 945G Chipset, consisting of: • Intel® 82945G Graphics Memory Controller Hub (GMCH) • Intel® 82801GH I/O Controller Hub (ICH7DH) Video Audio Legacy I/O Control USB Peripheral Interfaces Intel® GMA950 onboard graphics subsystem 8-channel (7.1) audio subsystem with five analog audio outputs and one S/PDIF digital audio output (optical) using the Sigmatel* 9220/9223 audio codec Legacy I/O controller for diskette drive, serial, parallel, and PS/2* ports Support for USB 2.0 devices • Eight USB ports • One serial port • Four Serial ATA interfaces • One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support • One diskette drive interface • PS/2 keyboard and mouse ports SATA RAID IEEE-1394a Interface LAN Support BIOS RAID support (levels 0,1, 0+1, and 5) on the SATA interface IEEE-1394a controller and three IEEE-1394a connectors (one back panel connector, two front-panel connectors) Refer to Table 2 on page 11 for a description of LAN subsystem options. • Intel® BIOS (resident in the SPI Flash device) • Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS Expansion Capabilities • Two PCI Conventional* bus connectors • One PCI Express* x1 bus add-in card connector • One PCI Express x16 bus add-in card connector Instantly Available PC Technology • Support for PCI Local Bus Specification Revision 2.3 • Support for PCI Express Revision 1.0a • Suspend to RAM support • Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports • Support for Intel® Quick Resume Technology Drivers (Intel® QRTD) continued Table 1 summarizes the major features of the board. Table 1. Processor Memory Form Factor 10 Product Description Table 1. Feature Summary (continued) • Hardware monitoring and fan control ASIC • Voltage sense to detect out of range power supply voltages • Thermal sense to detect out of range thermal values • Three fan connectors • Three fan sense inputs used to monitor fan activity • Fan speed control Hardware Monitor Subsystem 1.1.2 Manufacturing Options Table 2 describes the manufacturing options. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you. Table 2. Manufacturing Options The board provides one of the following: • Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel® 82573L Gigabit Ethernet Controller • 10/100 Mbits/sec LAN subsystem using the Intel® 82562GZ Platform LAN Connect (PLC) device Parallel Port Trusted Platform Module (TPM), revision 1.2 One 25-pin D-Sub parallel port connector on the back panel. A component that enhances platform security LAN Subsystem For information about Available configurations for the board Refer to Section 1.2, page 15 11 Intel Desktop Board D945GPM Technical Product Specification 1.1.3 Board Layout Figure 1 shows the location of the major components. A B C D E F G H EE DD I CC BB J AA Z Y L X M K W U V T S R Q P O N OM18268 Figure 1. Board Components Table 3 lists the components identified in Figure 1. 12 Product Description Table 3. Board Components Shown in Figure 1 Description Audio codec Front panel audio connector Ethernet device PCI Conventional bus add-in card connectors [2] PCI Express x16 bus add-in card connector Back panel connectors +12V power connector (ATX12V) Rear chassis fan connector LGA775 processor socket Intel 82945G GMCH Processor fan connector DIMM Channel A sockets [2] DIMM Channel B sockets [2] Legacy I/O controller Power connector Diskette drive connector Parallel ATE IDE connector Battery Front chassis fan connector BIOS Setup configuration jumper block Serial ATA connectors [4] Auxiliary front panel power LED connector Front panel connector Front panel USB connectors [2] Chassis intrusion connector Intel 82801GH I/O Controller Hub (ICH7DH) SPI flash device IEEE-1394a controller Front panel IEEE-1394a connectors [2] Speaker PCI Express x1 bus add-in card connector Item/callout from Figure 1 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA BB CC DD EE 13 Intel Desktop Board D945GPM Technical Product Specification 1.1.4 Block Diagram Figure 2 is a block diagram of the major functional areas. PCI Express x1 Interface PCI Express x1 Slot 1 USB Gigabit Ethernet Controller (Optional) LAN Connector Back Panel/Front Panel USB Ports Serial Port Parallel ATA IDE Connector Parallel ATA IDE Interface Legacy I/O Controller Parallel Port (Optional) PS/2 Mouse PS/2 Keyboard LGA775 Processor Socket System Bus (1066/800 MHz) LPC Bus Diskette Drive Connector PCI Express x16 Connector VGA Port Intel 82945G Graphics and Memory Controller Hub (GMCH) DMI Interconnect PCI Express x16 Interface Intel 945G Chipset Intel 82801GH I/O Controller Hub (ICH7DH) Serial Peripheral Interface (SPI) Flash Device LAN Connect Interface Display Interface Dual-Channel Memory Bus High Definition Audio Link SMBus LPC Bus TPM Component (Optional) Channel A DIMMs (2) Channel B DIMMs (2) 10/100 LAN PLC (Optional) LAN Connector IEEE-1394a Connectors IEEE-1394a Controller PCI Bus Serial ATA IDE Interface Serial ATA IDE Connectors (4) Line Out Mic In PCI Bus PCI Slot 1 PCI Slot 2 SMBus Audio Codec Hardware Monitoring and Fan Control ASIC Line In/Retasking Jack Line Out/Retasking Jack Mic In/Retasking Jack Center and LFE/ Retasking Jack (optional) Surround L-R/ Retasking Jack (optional) S/PDIF (optional) OM18263 = connector or socket Figure 2. Block Diagram 14 Product Description 1.2 Online Support To find information about… Intel Desktop Board D945GPM under “Desktop Board Products” or “Desktop Board Support” Available configurations for the Desktop Board D945GPM Processor data sheets ICH7DH addressing Custom splash screens Audio software and utilities LAN software and drivers Supported video modes Visit this World Wide Web site: http://www.intel.com/design/motherbd http://support.intel.com/support/motherboards/desktop http://developer.intel.com/design/motherbd/pm/pm_available.htm http://www.intel.com/design/litcentr http://developer.intel.com/products/chipsets http://intel.com/design/motherbd/gen_indx.htm http://www.intel.com/design/motherbd http://www.intel.com/design/motherbd http://www.intel.com/design/motherbd/pm/pm_documentation.htm 1.3 Processor The board is designed to support an Intel Pentium D processor in an LGA775 processor socket with a 1066 or 800 MHz system bus. See the Intel web site listed below for the most up-to-date list of supported processors. For information about… Supported processors Refer to: http://www.intel.com/design/motherbd/pm/pm_proc.htm CAUTION Use only the processors listed on web site above. Use of unsupported processors can damage the board, the processor, and the power supply. INTEGRATOR’S NOTE Use only ATX12V-compliant power supplies. For information about Power supply connectors Refer to Section 2.7.2.1, page 59 15 Intel Desktop Board D945GPM Technical Product Specification 1.4 System Memory The board has four DIMM sockets and support the following memory features: • • • • • • • 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMS with x16 organization are not supported. 4 GB maximum total system memory. Refer to Section 2.1.1 on page 47 for information on the total amount of addressable memory. Minimum total system memory: 128 MB Non-ECC DIMMs Serial Presence Detect DDR2 667 or DDR2 533 MHz SDRAM DIMMs NOTES • • Remove the PCI Express x16 video card before installing or upgrading memory to avoid interference with the memory retention mechanism. To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency. Table 4 lists the supported DIMM configurations. Table 4. DIMM Capacity 128 MB 256 MB 256 MB 512 MB 512 MB 512 MB 1024 MB 1024 MB 2048 MB Supported Memory Configurations Configuration SS SS SS DS SS SS DS SS DS SDRAM Density 256 Mbit 256 Mbit 512 Mbit 256 Mbit 512 Mbit 1 Gbit 512 Mbit 1 Gbit 1 Gbit SDRAM Organization Front-side/Back-side 16 M x 16/empty 32 M x 8/empty 32 M x 16/empty 32 M x 8/32 M x 8 64 M x 8/empty 64 M x 16/empty 64 M x 8/64 M x 8 128 M x 8/empty 128 M x 8/128 M x 8 Number of SDRAM Devices 4 8 4 16 8 4 16 8 16 Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to single-sided memory modules (containing one row of SDRAM). INTEGRATOR’S NOTE Refer to Section 2.1.1, on page 47 for additional information on available memory. 16 Product Description 1.4.1 • Memory Configurations Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used. Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used. The Intel 82945G GMCH supports two types of memory organization: • Figure 3 illustrates the memory channel and DIMM configuration. NOTE The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels are black. Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1 OM17739 Figure 3. Memory Channel and DIMM Configuration 17 Intel Desktop Board D945GPM Technical Product Specification 1.4.1.1 Dual Channel (Interleaved) Mode Configurations Figure 4 shows a dual channel configuration using two DIMMs. In this example, the DIMM0 (blue) sockets of both channels are populated with identical DIMMs. 1 GB Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1 1 GB OM17123 Figure 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs Figure 5 shows a dual channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B. 256 MB 256 MB 512 MB Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1 OM17122 Figure 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs 18 Product Description Figure 6 shows a dual channel configuration using four DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels. 256 MB 512 MB 256 MB 512 MB Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1 OM17124 Figure 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs 19 Intel Desktop Board D945GPM Technical Product Specification 1.4.1.2 Single Channel (Asymmetric) Mode Configurations NOTE Dual channel (Interleaved) mode configurations provide the highest memory throughput. Figure 7 shows a single channel configuration using one DIMM. In this example, only the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated. 256 MB Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1 OM17125 Figure 7. Single Channel (Asymmetric) Mode Configuration with One DIMM Figure 8 shows a single channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A does not equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B. 256 MB 512 MB 512 MB Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1 OM17126 Figure 8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs 20 Product Description 1.5 Intel® 945G Chipset The Intel 945G chipset consists of the following devices: • • Intel 82945G Graphics Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect Intel 82801GH I/O Controller Hub (ICH7DH) with DMI interconnect The GMCH component provides interfaces to the CPU, memory, PCI Express, and the DMI interconnect. The component also provides integrated graphics capabilities supporting 3D, 2D and display capabilities. The ICH7DH is a centralized controller for the board’s I/O paths. For information about The Intel 945G chipset Resources used by the chipset Refer to http://developer.intel.com/ Chapter 2 1.5.1 Intel 945G Graphics Subsystem The Intel 945G chipset contains two separate, mutually exclusive graphics options. Either the GMA950 graphics controller (contained within the 82945G GMCH) is used, or a PCI Express x16 add-in card can be used. When a PCI Express x16 add-in card is installed, the GMA950 graphics controller is disabled. 1.5.1.1 • • • Intel® GMA950 Graphics Controller 400 MHz core frequency High performance 3-D setup and render engine High quality texture engine ⎯ DX9* Compliant Hardware Pixel Shader 2.0 ⎯ Alpha and luminance maps ⎯ Texture color-keying/chroma-keying ⎯ Cubic environment reflection mapping ⎯ Enhanced texture blending functions 3D Graphics Rendering enhancements ⎯ 1.3 Dual Texture GigaPixel/Sec Fill Rate ⎯ 16 and 32 bit color ⎯ Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz ⎯ Vertex cache ⎯ Anti-aliased lines ⎯ OpenGL* version 1.4 support with vertex buffer and EXT_Shadow extensions 2D Graphics enhancements ⎯ 8, 16,and 32 bit color ⎯ Optimized 256-bit BLT engine ⎯ Color space conversion ⎯ Anti-aliased lines The Intel GMA950 graphics controller features the following: • • 21 Intel Desktop Board D945GPM Technical Product Specification • Video ⎯ Hardware motion compensation for MPEG2 ⎯ Software DVD at 30 fps full screen Display ⎯ Integrated 24-bit 400 MHz RAMDAC ⎯ Up to 2048 x 1536 at 75 Hz refresh (QXGA) ⎯ DDC2B compliant interface ⎯ With Advanced Digital Display 2 or 2+ (ADD2/ADD2+) cards, support for TV-out / TV-in and DVI digital display connections ⎯ Supports flat panels up to 2048 x 1536 at 60Hz or digital CRT/HDTV at 1920 x 1080 at 85 Hz (with ADD2/ADD2+) ⎯ Two multiplexed DVO port interfaces with 200 MHz pixel clocks using an ADD2/ADD2+ card Dynamic Video Memory Technology (DVMT) support up to 224 MB Intel® Zoom Utility Refer to Section 1.5.1.2, page 22 Section 1.2, page 15 • • • For information about DVMT Obtaining graphics software and utilities 1.5.1.2 Dynamic Video Memory Technology (DVMT) DVMT enables enhanced graphics and memory performance through Direct AGP, and highly efficient memory utilization. DVMT ensures the most efficient use of available system memory for maximum 2-D/3-D graphics performance. Up to 224 MB of system memory can be allocated to DVMT on systems that have 512 MB or more of total system memory installed. Up to 128 MB can be allocated to DVMT on systems that have 256 MB but less than 512 MB of total installed system memory. Up to 64 MB can be allocated to DVMT when less than 256 MB of system memory is installed. DVMT returns system memory back to the operating system when the additional system memory is no longer required by the graphics subsystem. DVMT will always use a minimal fixed portion of system physical memory (as set in the BIOS Setup program) for compatibility with legacy applications. An example of this would be when using VGA graphics under DOS. Once loaded, the operating system and graphics drivers allocate additional system memory to the graphics buffer as needed for performing graphics functions. NOTE The use of DVMT requires operating system driver support. 22 Product Description 1.5.1.3 Advanced Digital Display (ADD2/ADD2+) Card Support The GMCH routes two multiplexed DVO ports that are each capable of driving up to a 200 MHz pixel clock to the PCI Express x16 connector. The DVO ports can be paired for a dual channel configuration to support up to a 400 MHz pixel clock. When an ADD2/ADD2+ card is detected, the Intel GMA950 graphics controller is enabled and the PCI Express x16 connector is configured for DVO mode. DVO mode enables the DVO ports to be accessed by the ADD2/ADD2+ card. An ADD2/ADD2+ card can either be configured to support simultaneous display with the primary VGA display or can be configured to support dual independent display as an extended desktop configuration with different color depths and resolutions. ADD2/ADD2+ cards can be designed to support the following configurations: • • • • • • TV-Out (composite video) Transition Minimized Differential Signaling (TMDS) for DVI 1.0 Low Voltage Differential Signaling (LVDS) Single device operating in dual channel mode VGA output HDTV output 1.5.1.4 Configuration Modes A list of supported modes for the Intel GMA950 graphics controller is available as a downloadable document. For information about Supported video modes for the board Refer to Section 1.2, page 15 1.5.2 USB The board supports up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers. The ICH7DH provides the USB controller for all ports. The port arrangement is as follows: • • Four ports are implemented with dual stacked back panel connectors adjacent to the audio connectors Four ports are routed to two separate front panel USB connectors NOTE Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices. For information about The location of the USB connectors on the back panel The location of the front panel USB connectors Refer to Figure 16, page 54 Figure 17, page 56 23 Intel Desktop Board D945GPM Technical Product Specification 1.5.3 • • IDE Support One parallel ATA IDE connector that supports two devices Four serial ATA IDE connectors that support one device per connector The board provides five IDE interface connectors: 1.5.3.1 Parallel ATE IDE Interface The ICH7DH’s Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes: • • • • • Programmed I/O (PIO): processor controls data transfer. 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec. Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 33 MB/sec. ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible. ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH7DH’s ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec. NOTE ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling. The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA devices using the transfer modes. The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS. For information about The location of the Parallel ATA IDE connector Refer to Figure 17, page 56 1.5.3.2 Serial ATA Interfaces The ICH7DH’s Serial ATA controller offers four independent Serial ATA ports with a theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed on each port for a maximum of four Serial ATA devices. A point-to-point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel. For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP and Windows 2000 operating systems. 24 Product Description NOTE Many Serial ATA drives use new low-voltage power connectors and require adaptors or power supplies equipped with low-voltage power connectors. For more information, see: http://www.serialata.org/ For information about The location of the Serial ATA IDE connectors Refer to Figure 17, page 56 1.5.3.3 • Serial ATA RAID RAID 0 - data striping. Multiple physical drives can be teamed together to create one logical drive. As data is written or retrieved from the logical drive, both drives operate in parallel, thus increasing the throughput. The ICH7DH allows for more than two drives to be used in a RAID 0 configuration. RAID 1 - data mirroring. Multiple physical drives maintain duplicate sets of all data on separate disk drives. Level 1 provides the highest data reliability because two complete copies of all information are maintained. The ICH7DH allows for two or four drives to be used in a RAID 1 configuration. RAID 0+1 (or RAID 10) - data striping and mirroring. RAID 0+1 combines multiple mirrored drives (RAID 1) with data striping (RAID 0) into a single array. This provides the highest performance with data protection. Data is striped across all mirrored sets. RAID 0+1 utilizes several drives to stripe data (increased performance) and then makes a copy of the striped drives to provide redundancy. The mirrored disks eliminate the overhead and delay of parity. RAID 5 - distributed parity. RAID Level 5 stripes data at a block level across several drives and distributes parity among the drives; no single disk is devoted to parity. Because parity data is distributed on each drive, read performance tends to be lower than other RAID types. RAID 5 requires the use of three or four drives. The ICH7DH supports the following RAID (Redundant Array of Independent Drives) levels: • • • 1.5.4 Real-Time Clock, CMOS SRAM, and Battery A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied. NOTE If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on. When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 12 shows the location of the battery. 25 Intel Desktop Board D945GPM Technical Product Specification CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement. FORHOLDSREGEL Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning. OBS! Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning. VIKTIGT! Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbestämmelserna. VARO Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti. VORSICHT Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend. AVVERTIMENTO Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore. PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante. 26 Product Description WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving. ATENÇÃO Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região. AŚCIAROŽZNAŚĆ Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі. UPOZORNÌNÍ V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí. Προσοχή Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η µπαταρία αντικατασταθεί από µία λανθασµένου τύπου. Οι µπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των χρησιµοποιηµένων µπαταριών πρέπει να γίνεται σύµφωνα µε τους κατά τόπο περιβαλλοντικούς κανονισµούς. VIGYAZAT Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni. AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. 27 Intel Desktop Board D945GPM Technical Product Specification OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska. PRECAUŢIE Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului. ВНИМАНИЕ При использовании батареи несоответствующего типа существует риск ее взрыва. Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям. UPOZORNENIE Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia. POZOR Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo. Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi. . UYARI Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır. OСТОРОГА Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху. Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля. 28 Product Description 29 Intel Desktop Board D945GPM Technical Product Specification 1.6 PCI Express* Connectors The board provides the following PCI Express connectors: • • One PCI Express x16 connector supporting simultaneous transfer speeds up to 8 GBytes/sec One PCI Express x1 connector. The x1 interface supports simultaneous transfer speeds up to 500 MBytes/sec The PCI Express interface supports the PCI Conventional bus configuration mechanism so that the underlying PCI Express architecture is compatible with PCI Conventional compliant operating systems. Additional features of the PCI Express interface include the following: • • • • • • Support for the PCI Express enhanced configuration mechanism Automatic discovery, link training, and initialization Support for Active State Power Management (ASPM) SMBus 2.0 support Wake# signal supporting wake events from ACPI S1, S3, S4, or S5 Software compatible with the PCI Power Management Event (PME) mechanism defined in the PCI Power Management Specification Rev. 1.1 1.7 IEEE-1394a Connectors The IEEE-1394a interface addresses interconnection of both computer peripherals and consumer electronics. The IEEE-1394a interface provides a throughput ranging from 100 Mbits/sec to 400 Mbits/sec. The board includes three IEEE-1394a connectors as follows: • • One IEEE-1394a connector located on the back panel. Two IEEE-1394a front-panel connectors located on the component side. Refer to Figure 16, page 54 Figure 17, page 56 Section 2.7.2.6, page 63 For information about The location of the back panel IEEE-1394a connector The location of the front panel IEEE-1394a connectors The signal names of the front panel IEEE-1394a connectors 1.8 Legacy I/O Controller The legacy I/O controller provides the following features: • • • • • • • One serial port One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems PS/2-style mouse and keyboard interfaces Interface for one 1.44 MB or 2.88 MB diskette drive Intelligent power management, including a programmable wake-up event interface PCI Conventional bus power management support The BIOS Setup program provides configuration options for the legacy I/O controller. 30 Product Description 1.8.1 Serial Port The Serial port A connector is located on the back panel. The serial port supports data transfers at speeds up to 115.2 kbits/sec with BIOS support. For information about The location of the serial port A connector Refer to Figure 16, page 54 1.8.2 Parallel Port (Optional) The optional 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup program to set the parallel port mode. For information about The location of the optional parallel port connector Refer to Figure 16, page 54 1.8.3 Diskette Drive Controller The legacy I/O controller supports one diskette drive. Use the BIOS Setup program to configure the diskette drive interface. For information about The location of the diskette drive connector Refer to Figure 17, page 56 1.8.4 Keyboard and Mouse Interface PS/2 keyboard and mouse connectors are located on the back panel. NOTE The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected. For information about The location of the keyboard and mouse connectors Refer to Figure 16, page 54 31 Intel Desktop Board D945GPM Technical Product Specification 1.9 Audio Subsystem The board supports the Intel® High Definition audio subsystem based on the Sigmatel 9220/9223 audio codec. The audio subsystem supports the following features: • Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to user’s definition, or can be automatically switched depending on the recognized device type. Stereo input and output for all back panel jacks Line out and Mic in functions for front panel audio jacks A signal-to-noise (S/N) ratio of 95 dB • • • 1.9.1 Audio Subsystem Software Refer to Section 1.2, page 15 Audio software and drivers are available from Intel’s World Wide Web site. For information about Obtaining audio software and drivers 1.9.2 Audio Connectors The board contains audio connectors on both the back panel and the component side of the board. The front panel audio connector provides mic in and line out signals for the front panel. For information about The location of the front panel audio connector The signal names of the front panel audio connector The back panel audio connectors Refer to Figure 17, page 56 Table 18, page 57 Section 2.7.1, page 54 1.9.3 • • • 8-Channel (7.1) Audio Subsystem Intel 82801GH I/O Controller Hub (ICH7DH) Sigmatel 9220/9223 audio codec Microphone input that supports a single dynamic, condenser, or electret microphone The 8-channel (7.1) audio subsystem includes the following: The back panel audio connectors are configurable through the audio device drivers. The available configurable audio ports are shown in Figure 9. For information about The back panel audio connectors Refer to Section 2.7.1, page 54 32 Product Description Front Panel Audio Connectors Line Out Mic In Surround Left and Right/Retasking Jack [Black] Center channel and LFE (Subwoofer)/ Retasking Jack [Orange] Side Surround Left and Right/ Line In/Retasking Jack [Blue] S/PDIF Digital Audio Out Optical Mic In/Retasking Jack [Pink] Line Out/Retasking Jack [Lime Green] OM17816 Figure 9. Front/Back Panel Audio Connectors Figure 10 is a block diagram of the 8-channel (7.1) audio subsystem. Line Out Mic In 82801GH I/O Controller Hub (ICH7DH) Line In/Side Surround L-R/Retasking Jack Intel High Definition Audio Link Sigmatel 9220/9223 Audio Codec Line Out/Retasking Jack Mic In/Retasking Jack Center and LFE/Retasking Jack Surround Left-Right/Retasking Jack S/PDIF Back Panel Front Panel OM18264 Figure 10. 8-channel (7.1) Audio Subsystem Block Diagram 33 Intel Desktop Board D945GPM Technical Product Specification 1.10 LAN Subsystem The LAN subsystem consists of the following: • Physical layer interface device. As a manufacturing option, the board includes one of the following LAN devices: ⎯ Intel 82562GZ PLC for 10/100 Mbits/sec Ethernet LAN connectivity • • • • ⎯ Intel 82573L for Gigabit (10/100/1000 Mbits/sec) Ethernet LAN connectivity RJ-45 LAN connector with integrated status LEDs CSMA/CD protocol engine LAN connect interface that supports the 82562GZ PCI Conventional bus power management ⎯ Supports ACPI technology ⎯ Supports LAN wake capabilities Additional features of the LAN subsystem include: 1.10.1 LAN Subsystem Software Refer to Section 1.2, page 15 LAN software and drivers are available from Intel’s World Wide Web site. For information about Obtaining LAN software and drivers 1.10.2 • • • 10/100 Mbits/sec LAN Subsystem Intel 82801GH ICH7DH Intel 82562GZ PLC RJ-45 LAN connector with integrated status LEDs. The 10/100 Mbits/sec LAN subsystem consists of the following: 1.10.2.1 • • • • Intel® 82562GZ Physical Layer Interface Device 10/100 Ethernet LAN connectivity Full device driver compatibility Programmable transit threshold Configuration EEPROM that contains the MAC address The Intel 82562GZ provides the following functions: 34 Product Description 1.10.2.2 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 11). Green LED Yellow LED OM15076 Figure 11. LAN Connector LED Locations Table 5 describes the LED states when the board is powered up and the 10/100 Mbits/sec LAN subsystem is operating. Table 5. LED Color Green LAN Connector LED States LED State Off On Blinking Condition LAN link is not established. LAN link is established. LAN activity is occurring. 10 Mbits/sec data rate is selected. 100 Mbits/sec data rate is selected. Yellow Off On 1.10.3 Gigabit LAN Subsystem The Gigabit (10/100/1000 Mbits/sec) LAN subsystem includes the Intel 82573L controller and an RJ-45 LAN connector with integrated status LEDs. 1.10.3.1 • • • • • • • • • Intel® 82573L Gigabit Ethernet Controller PCI Express link 10/100/1000 IEEE 802.3 compliant Compliant to IEEE 802.3x flow control support Jumbo frame support TCP, IP, UDP checksum offload Transmit TCP segmentation Advanced packet filtering Full device driver compatibility PCI Express Power Management Support The Intel 82573L Gigabit Ethernet Controller supports the following features: 35 Intel Desktop Board D945GPM Technical Product Specification 1.10.3.2 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (as shown in Figure 12). Table 6 describes the LED states when the board is powered up and the Gigabit LAN subsystem is operating. Green LED Green/Yellow LED OM16513 Figure 12. LAN Connector LED Locations Table 6. LED Left LAN Connector LED States Color Green LED State Off On Blinking N/A Off On On Condition LAN link is not established. LAN link is established. LAN activity is occurring. 10 Mbits/sec data rate is selected. 100 Mbits/sec data rate is selected. 1000 Mbits/sec data rate is selected. Right Green Yellow 1.11 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: • • • Chassis intrusion detection Fan monitoring and control (through the hardware monitoring and fan control ASIC) Thermal and voltage monitoring 1.11.1 • • • • • Hardware Monitoring and Fan Control ASIC Internal ambient temperature sensor Two remote thermal diode sensors for direct monitoring of processor temperature and ambient temperature sensing Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.5 V, and +VCCP) to detect levels above or below acceptable values Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or switch the fans on or off as needed SMBus interface Refer to Figure 13, page 38 The features of the hardware monitoring and fan control ASIC include: For information about The location of the fan connectors and sensors for thermal monitoring 36 Product Description 1.11.2 Chassis Intrusion and Detection The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion connector. When the chassis cover is removed, the mechanical switch is in the closed position. For information about The location of the chassis intrusion connector Refer to Figure 17, page 56 1.11.3 Fan Monitoring Fan monitoring can be implemented using Intel® Desktop Utilities or third-party software. The level of monitoring and control is dependent on the hardware monitoring ASIC used with the board. For information about The functions of the fan connectors Refer to Section 1.12.2.2, page 42 37 Intel Desktop Board D945GPM Technical Product Specification 1.11.4 Thermal Monitoring Figure 13 shows the location of the sensors and fan connectors. 1 3 A B 4 1 D C 1 3 F Item A B C D E F Description Remote ambient temperature sensor E OM17837 Thermal diode, located on processor die Ambient temperature sensor, internal to hardware monitoring and fan control ASIC Processor fan Rear chassis fan Front chassis fan Figure 13. Thermal Sensors and Fan Connectors 38 Product Description 1.12 Power Management Power management is implemented at several levels, including: • • Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: ⎯ Power connector ⎯ Fan connectors ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Resume on Ring ⎯ Wake from USB ⎯ Wake from PS/2 devices ⎯ Power Management Event signal (PME#) wake-up support ⎯ Intel Quick Resume Technology Drivers (Intel QRTD) 1.12.1 ACPI ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires an operating system that provides full ACPI support. ACPI features include: • • • • • • Plug and Play (including bus and device enumeration) Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state A Soft-off feature that enables the operating system to power-off the computer Support for multiple wake-up events (see Table 9 on page 41) Support for a front panel power and sleep mode switch Table 7 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system. Table 7. Effects of Pressing the Power Switch …and the power switch is pressed for Less than four seconds Less than four seconds More than four seconds Less than four seconds More than four seconds …the system enters this state Power-on (ACPI G0 – working state) Soft-off/Standby (ACPI G1 – sleeping state) Fail safe power-off (ACPI G2/G5 – Soft off) Wake-up (ACPI G0 – working state) Power-off (ACPI G2/G5 – Soft off) If the system is in this state… Off (ACPI G2/G5 – Soft off) On (ACPI G0 – working state) On (ACPI G0 – working state) Sleep (ACPI G1 – sleeping state) Sleep (ACPI G1 – sleeping state) 39 Intel Desktop Board D945GPM Technical Product Specification 1.12.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state. Table 8 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states. Table 8. Power States and Targeted System Power Sleeping States S0 – working S1 – Processor stopped S3 – Suspend to RAM. Context saved to RAM. S4 – Suspend to disk. Context saved to disk. S5 – Soft off. Context not saved. Cold boot is required. No power to the system. Processor States C0 – working C1 – stop grant No power Device States D0 – working state. D1, D2, D3 – device specification specific. D3 – no power except for wake-up logic. D3 – no power except for wake-up logic. D3 – no power except for wake-up logic. D3 – no power for wake-up logic, except when provided by battery or external source. Targeted System Power (Note 1) Full power > 30 W 5 W < power < 52.5 W Global States G0 – working state G1 – sleeping state G1 – sleeping state G1 – sleeping state G2/S5 Power < 5 W (Note 2) No power Power < 5 W (Note 2) No power Power < 5 W (Note 2) G3 – mechanical off AC power is disconnected from the computer. Notes: 1. 2. No power No power to the system. Service can be performed safely. Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis’ power supply. Dependent on the standby power consumption of wake-up devices used in the system. 1.12.1.2 One-Watt Standby In 2001, the U.S. government issued an executive order requiring a reduction in power for appliances and personal computers. This board meets that requirement by operating at 1 W (or less) in S5 (Standby) mode. One-Watt operation applies only to the S5 state when the computer is turned off, but still connected to AC power. One-Watt operation does not apply to the S3 (Suspend to RAM) or S4 (Suspend to disk) states. Newer energy-efficient power supplies using less than 0.5 W (in Standby mode) may also be needed to achieve this goal. 40 Product Description 1.12.1.3 Wake-up Devices and Events Table 9 lists the devices or specific events that can wake the computer from specific states. Table 9. LAN Modem (back panel Serial Port A) PME# signal Power switch PS/2 devices RTC alarm USB WAKE# signal Note: Wake-up Devices and Events …from this state S1, S3, S4, S5 (Note) S1, S3 S1, S3, S4, S5 (Note) S1, S3, S4, S5 S1, S3, Visual off S1, S3, S4, S5 S1, S3, Visual off S1, S3, S4, S5 These devices/events can wake up the computer… For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to Power On will enable a wake-up event from LAN in the S5 state. NOTE The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events. 1.12.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. The board provides several power management hardware features, including: • • • • • • • • • • Power connector Fan connectors LAN wake capabilities Instantly Available PC technology Resume on Ring Wake from USB Wake from PS/2 keyboard PME# signal wake-up support WAKE# signal wake-up support Intel Quick Resume Technology Drivers (Intel QRTD) LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line. 41 Intel Desktop Board D945GPM Technical Product Specification Resume on Ring enables telephony devices to access the computer when it is in a power-managed state. The method used depends on the type of telephony device (external or internal). NOTE The use of Resume on Ring and Wake from USB technologies from an ACPI state requires an operating system that provides full ACPI support. 1.12.2.1 Power Connector ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages. When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu. For information about The location of the main power connector The signal names of the main power connector Refer to Figure 17, page 56 Table 23, page 59 1.12.2.2 • • • • • Fan Connectors The fans are on when the board is in the S0 or S1 state. The fans are off when the board is off or in the S3, S4, or S5 state. Each fan connector is wired to a fan tachometer input of the hardware monitoring and fan control ASIC. All fan connectors support closed-loop fan control that can adjust the fan speed or switch the fan on or off as needed. All fan connectors have a +12 V DC connection. Refer to Figure 17, page 56 Figure 13, page 38 Table 21, page 58 Table 22, page 58 The function/operation of the fan connectors is as follows: For information about The location of the fan connectors The location of the fan connectors and sensors for thermal monitoring The signal names of the processor fan connector The signal names of the chassis fan connectors 42 Product Description 1.12.2.3 LAN Wake Capabilities CAUTION For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply. LAN wake capabilities enable remote wake-up of the computer through a network. The LAN network adapter monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer. Depending on the LAN implementation, the board supports LAN wake capabilities with ACPI in the following ways: • • • The PCI Express WAKE# signal The PCI Conventional bus PME# signal for PCI 2.3 compliant LAN designs The onboard LAN subsystem 1.12.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 9 on page 41 lists the devices and events that can wake the computer from the S3 state. The board supports the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer. The use of Instantly Available PC technology requires operating system support and PCI 2.3 compliant add-in cards, PCI Express add-in cards, and drivers. 1.12.2.5 Intel® Quick Resume Technology Drivers (Intel® QRTD) The Intel Quick Resume Technology Drivers (Intel QRTD) manage the on and off functions for Intel® Viiv™ platforms and have the following features: • • • Instantly turns the Intel Viiv platform off by pressing the power button on the PC or remote control. Instantly turns the Intel Viiv platform on by moving the mouse, pressing a key on the keyboard, or pressing the on/off button on the remote control or computer. In the Intel QRTD off state, the: ⎯ Video output stops sending data to the display ⎯ Audio is muted 43 Intel Desktop Board D945GPM Technical Product Specification • • • ⎯ Power continues to the vital components on the system (CPU, memory, and fans, for example). The Intel QRTD off state allows tasks that do not require user input to continue in the background. Works with the Microsoft Away mode to offer a complete power management offering for ACPI and system standby and hibernate. Target resume time is zero to five seconds (about equal to the time it takes for the display to warm up). CAUTION Do not open the computer chassis when it is in the Intel QRTD off state. Opening the chassis in this state can cause hardware damage. 1.12.2.6 • • • Resume on Ring Resumes operation from ACPI S1 or S3 states Detects incoming call similarly for external and internal modems Requires modem interrupt be unmasked for correct operation The operation of Resume on Ring can be summarized as follows: 1.12.2.7 Wake from USB USB bus activity wakes the computer from ACPI S1 or S3 states. NOTE Wake from USB requires the use of a USB peripheral that supports Wake from USB. 1.12.2.8 Wake from PS/2 Devices PS/2 device activity wakes the computer from an ACPI S1 or S3 state. 1.12.2.9 PME# Signal Wake-up Support When the PME# signal on the PCI Conventional bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS). 1.12.2.10 WAKE# Signal Wake-up Support When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state. 44 Product Description 1.12.2.11 +5 V Standby Power Indicator LED The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 14 shows the location of the standby power indicator LED. CAUTION If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices. CR3J1 OM17838 Figure 14. Location of the Standby Power Indicator LED 1.13 Trusted Platform Module (Optional) The optional Trusted Platform Module (TPM) is a component on the desktop board that is specifically designed to enhance platform security above-and-beyond the capabilities of today’s software by providing a protected space for key operations and other security critical tasks. Using both hardware and software, the TPM protects encryption and signature keys at their most vulnerable stages—operations when the keys are being used unencrypted in plain-text form. The TPM is specifically designed to shield unencrypted keys and platform authentication information from software-based attacks. For information about TPM Refer to http://www.intel.com/design/motherbd/pm 45 Intel Desktop Board D945GPM Technical Product Specification 46 2 Technical Reference What This Chapter Contains 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 2.11 2.12 2.13 2.14 Memory Resources ...................................................................................................... 47 DMA Channels ............................................................................................................. 49 Fixed I/O Map............................................................................................................... 50 PCI Configuration Space Map...................................................................................... 51 Interrupts ...................................................................................................................... 52 PCI Conventional Interrupt Routing Map ..................................................................... 53 Connectors................................................................................................................... 54 Jumper Block ............................................................................................................... 64 Mechanical Considerations .......................................................................................... 65 Electrical Considerations.............................................................................................. 68 Thermal Considerations ............................................................................................... 70 Reliability...................................................................................................................... 72 Environmental .............................................................................................................. 73 Regulatory Compliance................................................................................................ 74 2.1 Memory Resources 2.1.1 Addressable Memory The board utilizes 4 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 4 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following: • • • • • • • BIOS/ SPI Flash (2 MB) Local APIC (19 MB) Digital Media Interface (40 MB) Front side bus interrupts (17 MB) PCI Express configuration space (256 MB) MCH base address registers, internal graphics ranges, PCI Express ports (up to 512 MB) Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI Express addin cards 47 Intel Desktop Board D945GPM Technical Product Specification The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 15 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses. 4 GB Top of System Address Space FLASH APIC Reserved PCI Memory Range contains PCI, chipsets, Direct Media Interface (DMI), and ICH ranges (approximately 750 MB) Top of usable DRAM (memory visible to the operating system) ~20 MB 0FFFFFH 0F0000H 0EFFFFH 1 MB Upper BIOS area (64 KB) 960 KB Lower BIOS area (64 KB; 16 KB x 4) 896 KB Add-in Card BIOS and Buffer area (128 KB; 16 KB x 8) 768 KB Standard PCI/ ISA Video Memory (SMM Memory) 128 KB DOS area (640 KB) 0E0000H 0DFFFFH DRAM Range 1 MB DOS Compatibility Memory 640 KB 0C0000H 0BFFFFH 0A0000H 09FFFFH 00000H 640 KB 0 MB 0 KB OM17140 Figure 15. Detailed System Memory Address Map 48 Technical Reference 2.1.2 Memory Map System Memory Map Address Range (hex) 100000 - FFFFFFFF F0000 - FFFFF E0000 - EFFFF C8000 - DFFFF Size 4095 MB 64 KB 64 KB 96 KB Description Extended memory Runtime BIOS Reserved Potential available high DOS memory (open to the PCI Conventional bus). Dependent on video adapter used. Video memory and BIOS Extended BIOS data (movable by memory manager software) Extended conventional memory Conventional memory Table 10 lists the system memory map. Table 10. Address Range (decimal) 1024 K - 4194304 K 960 K - 1024 K 896 K - 960 K 800 K - 896 K 640 K - 800 K 639 K - 640 K 512 K - 639 K 0 K - 512 K A0000 - C7FFF 9FC00 - 9FFFF 80000 - 9FBFF 00000 - 7FFFF 160 KB 1 KB 127 KB 512 KB 2.2 DMA Channels Table 11. 0 1 2 3 4 5 6 7 DMA Channels Data Width 8 or 16 bits 8 or 16 bits 8 or 16 bits 8 or 16 bits 8 or 16 bits 16 bits 16 bits 16 bits System Resource Open Parallel port Diskette drive Parallel port (for ECP or EPP) DMA controller Open Open Open DMA Channel Number 49 Intel Desktop Board D945GPM Technical Product Specification 2.3 Fixed I/O Map Table 12. 0000 - 00FF 0170 - 0177 01F0 - 01F7 0228 - 022F (Note 1) 0278 - 027F (Note 1) 02E8 - 02EF (Note 1) 02F8 - 02FF (Note 1) 0374 - 0377 0377, bits 6:0 0378 - 037F 03E8 - 03EF 03F0 - 03F5 03F4 – 03F7 03F8 - 03FF 04D0 - 04D1 LPTn + 400 0CF8 - 0CFB (Note 2) 0CF9 (Note 3) 0CFC - 0CFF FFA0 - FFA7 FFA8 - FFAF Notes: 1. 2. 3. Default, but can be changed to another address range Dword access only Byte access only I/O Map Size 256 bytes 8 bytes 8 bytes 8 bytes 8 bytes 8 bytes 8 bytes 4 bytes 7 bits 8 bytes 8 bytes 6 bytes 1 byte 8 bytes 2 bytes 8 bytes 4 bytes 1 byte 4 bytes 8 bytes 8 bytes Description Used by the Desktop Board D945GPM. Refer to the ICH7DH data sheet for dynamic addressing information. Secondary Parallel ATA IDE channel command block Primary Parallel ATA IDE channel command block LPT3 LPT2 COM4 COM2 Secondary Parallel ATA IDE channel control block Secondary IDE channel status port LPT1 COM3 Diskette channel Primary Parallel ATA IDE channel control block COM1 Edge/level triggered PIC ECP port, LPTn base address + 400h PCI Conventional bus configuration address register Reset control register PCI Conventional bus configuration data register Primary Parallel ATA IDE bus master registers Secondary Parallel ATA IDE bus master registers Address (hex) NOTE Some additional I/O addresses are not available due to ICH7DH address aliasing. The ICH7DH data sheet provides more information on address aliasing. For information about Obtaining the ICH7DH data sheet Refer to Section 1.2, page 15 50 Technical Reference 2.4 PCI Configuration Space Map Table 13. PCI Configuration Space Map Device Number (hex) 00 01 02 1B 1C 1C 1C 1C 1D 1D 1D 1D 1D 1E 1F 1F 1F 1F 00 00 01 05 08 00 Function Number (hex) 00 00 00 00 00 01 02 03 00 01 02 03 07 00 00 01 02 03 00 00 00 00 00 00 Description Memory controller of Intel 82945G component PCI Express x16 graphics port (Note 1) Integrated graphics controller Intel High Definition Audio Controller PCI Express port 1 PCI Express port 2 PCI Express port 3 PCI Express port 4 USB UHCI controller 1 USB UHCI controller 2 USB UHCI controller 3 USB UHCI controller 4 EHCI controller PCI bridge PCI controller Parallel ATA IDE controller Serial ATA controller SMBus controller Gigabit LAN controller (if present) PCI Conventional bus connector 1 PCI Conventional bus connector 2 IEEE-1394a controller Intel 82562 10/100 Mbits/sec LAN PLC (if present) PCI Express video controller (if present) Bus Number (hex) 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 (Note 2) (Note 2) (Note 2) (Note 2) (Note 2) 01 Notes: 1. 2. Present only when a PCI Express x16 graphics card is installed. Bus number is dynamic and can change based on add-in cards used. 51 Intel Desktop Board D945GPM Technical Product Specification 2.5 Interrupts The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the Advanced Programmable Interrupt Controller (APIC) portion of the ICH7DH component. The PIC is supported in Windows 98 SE and Windows ME and uses the first 16 interrupts. The APIC is supported in Windows 2000 and Windows XP and supports a total of 24 interrupts. Table 14. IRQ NMI 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 (Note 2) 17 (Note 2) 18 19 21 22 (Note 2) (Note 2) Interrupts System Resource I/O channel check Reserved, interval timer Reserved, keyboard buffer full Reserved, cascade interrupt from slave PIC User available COM1 (Note 1) User available Diskette drive LPT1 (Note 1) Real-time clock User available User available User available Onboard mouse port (if present, else user available) Reserved, math coprocessor Primary Parallel ATA/Serial ATA – Legacy Mode (if present, else user available) Secondary Parallel ATA/Serial ATA – Legacy Mode (if present, else user available) User available (through PIRQA) User available (through PIRQB) User available (through PIRQC) User available (through PIRQD) User available (through PIRQE) User available (through PIRQF) User available (through PIRQG) User available (through PIRQH) 20 (Note 2) (Note 2) (Note 2) 23 (Note 2) Notes: 1. 2. Default, but can be changed to another IRQ. Available in APIC mode only. 52 Technical Reference 2.6 PCI Conventional Interrupt Routing Map This section describes interrupt sharing and how the interrupt signals are connected between the PCI Conventional bus connectors and onboard PCI Conventional devices. The PCI Conventional specification describes how interrupts can be shared between devices attached to the PCI Conventional bus. In most cases, the small amount of latency added by interrupt sharing does not affect the operation or throughput of the devices. In some special cases where maximum performance is needed from a device, a PCI Conventional device should not share an interrupt with other PCI Conventional devices. Use the following information to avoid sharing an interrupt with a PCI Conventional add-in card. PCI Conventional devices are categorized as follows to specify their interrupt grouping: • • • INTA: By default, all add-in cards that require only one interrupt are in this category. For almost all cards that require more than one interrupt, the first interrupt on the card is also classified as INTA. INTB: Generally, the second interrupt on add-in cards that require two or more interrupts is classified as INTB. (This is not an absolute requirement.) INTC and INTD: Generally, a third interrupt on add-in cards is classified as INTC and a fourth interrupt is classified as INTD. The ICH7DH has eight Programmable Interrupt Request (PIRQ) input signals. All PCI Conventional interrupt sources either onboard or from a PCI Conventional add-in card connect to one of these PIRQ signals. Some PCI Conventional interrupt sources are electrically tied together on the board and therefore share the same interrupt. Table 15 shows an example of how the PIRQ signals are routed. Table 15. PCI Interrupt Routing Map ICH7DH PIRQ Signal Name PCI Interrupt Source IEEE-1394a controller PCI bus connector 1 PCI bus connector 2 ICH7DH LAN INTA PIRQA PIRQB INTA INTD INTC INTA INTB INTB INTA INTC INTD PIRQC PIRQD PIRQE PIRQF PIRQG PIRQH NOTE In PIC mode, the ICH7DH can connect each PIRQ line internally to one of the IRQ signals (3, 4, 5, 6, 7, 9, 10, 11, 12, 14, and 15). Typically, a device that does not share a PIRQ line will have a unique interrupt. However, in certain interrupt-constrained situations, it is possible for two or more of the PIRQ lines to be connected to the same IRQ signal. Refer to Table 14 for the allocation of PIRQ lines to IRQ signals in APIC mode. PCI interrupt assignments to the USB ports, Serial ATA ports, and PCI Express ports are dynamic. 53 Intel Desktop Board D945GPM Technical Product Specification 2.7 Connectors CAUTION Only the following connectors have overcurrent protection: back panel USB, front panel USB, and PS/2. The other internal connectors are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves. This section describes the board’s connectors. The connectors can be divided into these groups: • • Back panel I/O connectors Component-side I/O connectors (see page 54) 2.7.1 Back Panel Connectors Figure 16 shows the location of the back panel connectors. The back panel connectors are color-coded. The figure legend (Table 16) lists the colors used (when applicable). J K L A C D F H B E G I M N O OM17558 Figure 16. Back Panel Connectors 54 Technical Reference Table 16 lists the back panel connectors identified in Figure 16. NOTE The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output. Table 16. Back Panel Connectors Shown in Figure 16 Description PS/2 mouse port [Green] PS/2 keyboard port [Purple] Serial port A [Teal] Parallel port [Burgundy] (optional) VGA port IEEE-1394a connector USB ports (two) LAN USB ports (two) Center channel and LFE (subwoofer) audio out/ Retasking Jack [Orange] Surround left/right channel audio out/Retasking Jack [Black] Audio line in/Retasking Jack [Blue] Digital audio out optical Mic in/Retasking Jack [Pink] Front left/right channel audio out/Two channel audio line out/Retasking Jack [Lime green] Item/callout from Figure 16 A B C D E F G H I J K L M N O 55 Intel Desktop Board D945GPM Technical Product Specification 2.7.2 Component-side Connectors Figure 17 shows the locations of the component-side connectors. A B CD E F 1 9 2 1 10 3 1 3 4 2 G W V 10 2 10 2 1 1 4 1 H U T S 1 2 10 24 23 40 2 39 1 2 1 34 33 2 1 R Q PON ML K 1 1 10 1 9 1 1 1 1 J I 1 2 2 1 3 OM18269 Figure 17. Component-side Connectors 56 Technical Reference Table 17 lists the component-side connectors identified in Figure 17. Table 17. Component-side Connectors Shown in Figure 17 Description PCI Express x1 bus add-in card connector Front panel audio connector PCI Conventional bus add-in card connector 2 PCI Conventional bus add-in card connector 1 PCI Express x16 bus add-in card connector Rear chassis fan connector +12V power connector (ATX12V) Processor fan connector Power connector Diskette drive connector Parallel ATA IDE connector Serial ATA connector 3 Front chassis fan connector Serial ATA connector 2 Serial ATA connector 0 Auxiliary front panel power LED connector Front panel connector Serial ATA connector 1 Front panel USB connector Chassis intrusion connector Front panel USB connector Front panel IEEE-1394a connector Front panel IEEE-1394a connector Item/callout from Figure 17 A B C D E F G H I J K L M N O P Q R S T U V W Table 18. Pin 1 3 5 7 9 Front Panel Audio Connector Pin 2 4 6 8 10 Signal Name Ground Presence# (dongle present) Port E [Port 1] Sense return (jack detection) Key Port F [Port 2] Sense return (jack detection) Signal Name Port E [Port 1] Left Channel Port E [Port 1] Right Channel Port F [Port 2] Right Channel Port E [Port 1] and Port F [Port 2] Sense send (jack detection) Port F [Port 2] Left Channel INTEGRATOR’S NOTE The front panel audio connector is colored yellow. 57 Intel Desktop Board D945GPM Technical Product Specification Table 19. Pin 1 2 Chassis Intrusion Connector Signal Name Intruder Ground Table 20. Pin 1 2 3 4 5 6 7 Serial ATA Connectors Signal Name Ground TXP TXN Ground RXN RXP Ground Table 21. Pin 1 2 3 4 Processor Fan Connector Signal Name Ground +12 V FAN_TACH FAN_CONTROL Table 22. Pin 1 2 3 Front and Rear Chassis Fan Connectors Signal Name FAN_CONTROL +12 V FAN_TACH 58 Technical Reference 2.7.2.1 • Power Supply Connectors Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, attach that cable on the rightmost pins of the main power connector, leaving pins 11, 12, 23, and 24 unconnected. ATX12V power – a 2 x 2 connector. This connector provides power directly to the processor voltage regulator and must always be used. Failure to do so will prevent the board from booting. The board has power supply connectors: • INTEGRATOR’S NOTE When using high wattage PCI Express x16 graphics cards, use a power supply with a 2 x 12 main power cable. The 2 x 12 main power cable can provide up to 144 W of power from the +12 V rail. Table 23. Pin 1 2 3 4 5 6 7 8 9 10 11 12 Main Power Connector Signal Name +3.3 V +3.3 V Ground +5 V Ground +5 V Ground PWRGD (Power Good) +5 V (Standby) +12 V +12 V (Note) (Note) Pin 13 14 15 16 17 18 19 20 21 22 23 24 Signal Name +3.3 V -12 V Ground PS-ON# (power supply remote on/off) Ground Ground Ground No connect +5 V +5 V +5 V (Note) (Note) 2 x 12 connector detect Ground Note: When using a 2 x 10 power supply cable, this pin will be unconnected. Table 24. Pin 1 3 ATX12V Power Connector Signal Name Ground +12 V Pin 2 4 Signal Name Ground +12 V 59 Intel Desktop Board D945GPM Technical Product Specification 2.7.2.2 • • • Add-in Card Connectors PCI Express x16: one connector supporting simultaneous transfer speeds up to 8 GBytes/sec. PCI Express x1: one PCI Express x1 connector. The x1 interface supports simultaneous transfer speeds up to 500 MBytes/sec. PCI Conventional (rev 2.3 compliant) bus: two PCI Conventional bus add-in card connectors. The SMBus is routed to PCI Conventional bus connector 2 only (ATX expansion slot 6). PCI Conventional bus add-in cards with SMBus support can access sensor data and other information residing on the board. All of the PCI Conventional bus connectors are bus master capable. SMBus signals are routed to PCI Conventional bus connector 2. This enables PCI Conventional bus add-in boards with SMBus support to access sensor data on the boards. The specific SMBus signals are as follows: ⎯ The SMBus clock line is connected to pin A40. ⎯ The SMBus data line is connected to pin A41. The board has the following add-in card connectors: Note the following considerations for the PCI Conventional bus connectors: • • NOTE The PCI Express x16 connector is configured to support only a PCI Express x1 link when the Intel GMA950 graphics controller is enabled. 2.7.2.3 Auxiliary Front Panel Power/Sleep LED Connector Pins 1 and 3 of this connector duplicate the signals on pins 2 and 4 of the front panel connector. Table 25. Pin 1 2 3 Auxiliary Front Panel Power/Sleep LED Connector Signal Name HDR_BLNK_GRN Not connected HDR_BLNK_YEL Out Front panel yellow LED In/Out Out Description Front panel green LED 60 Technical Reference 2.7.2.4 Front Panel Connector This section describes the functions of the front panel connector. Table 26 lists the signal names of the front panel connector. Figure 18 is a connection diagram for the front panel connector. Table 26. Pin Front Panel Connector In/Out Description Pin Signal In/Out Power LED [Green] 2 4 HDR_BLNK_ GRN HDR_BLNK_ YEL Out Out Front panel green LED Front panel yellow LED Description Hard Drive Activity LED [Yellow] Signal 1 3 HD_PWR HAD# Out Out Hard disk LED pull-up (750 Ω) to +5 V Hard disk active LED Reset Switch [Purple] 5 7 Ground FP_RESET# In Power 9 +5 V Power 10 N/C Ground Reset switch 6 8 FPBUT_IN Ground On/Off Switch [Red] In Power switch Ground Not Connected Not connected N/C 8 6 Dual-colored Power LED Single-colored Power LED 9 7 5 3 1 +5 V DC Purple Yellow Power Switch Reset Switch Red Green 4 2 − + Hard Drive Activity LED + − − + OM17000 Figure 18. Connection Diagram for Front Panel Connector 2.7.2.4.1 Hard Drive Activity LED Connector [Yellow] Pins 1 and 3 [Yellow] can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires one of the following: • • A Serial ATA hard drive connected to an onboard Serial ATA connector An IDE hard drive connected to an onboard IDE connector 61 Intel Desktop Board D945GPM Technical Product Specification 2.7.2.4.2 Reset Switch Connector [Purple] Pins 5 and 7 [Purple] can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.7.2.4.3 Power/Sleep LED Connector [Green] Pins 2 and 4 [Green] can be connected to a one- or two-color LED. Table 27 shows the possible states for a one-color LED. Table 28 shows the possible states for a two-color LED. Table 27. LED State States for a One-Color Power LED Description Off Steady Green Power off/sleeping Running Table 28. LED State States for a Two-Color Power LED Description Off Steady Green Steady Yellow Power off Running Sleeping NOTE The colors listed in Table 27 and Table 28 are suggested colors only. Actual LED colors are product- or customer-specific. 2.7.2.4.4 Power Switch Connector [Red] Pins 6 and 8 [Red] can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal. 62 Technical Reference 2.7.2.5 Front Panel USB Connectors Figure 19 is a connection diagram for the front panel USB connectors. INTEGRATOR’S NOTES • • • • The +5 V DC power on the USB connector is fused. Pins 1, 3, 5, and 7 comprise one USB port. Pins 2, 4, 6, and 8 comprise one USB port. Use only a front panel USB connector that conforms to the USB 2.0 specification for highspeed USB devices. Power (+5 V DC) One USB Port 1 2 Power (+5 V DC) D− D+ Ground No Connect OM15963 D− D+ Ground Key (no pin) 3 5 7 4 6 8 One USB Port 10 Figure 19. Connection Diagram for Front Panel USB Connectors 2.7.2.6 Front Panel IEEE 1394a Connectors Figure 20 is a connection diagram for the IEEE 1394a connectors. Ground +12 V DC TPB− Ground TPA− 10 Key (no pin) 7 5 3 8 6 4 +12 V DC TPB+ Ground TPA+ OM17834 2 1 Figure 20. Connection Diagram for IEEE 1394a Connectors INTEGRATOR’S NOTES • • • The IEEE 1394a connectors are colored blue. The +12 V DC power on the IEEE 1394a connectors is fused. Each IEEE 1394a connector provides one IEEE 1394a port. 63 Intel Desktop Board D945GPM Technical Product Specification 2.8 Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 21 shows the location of the jumper block. The jumper block determines the BIOS Setup program’s mode. Table 29 describes the jumper settings for the three modes: normal, configure, and recovery. When the jumper is set to configure mode and the computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match. 3 1 J7J3 OM17840 Figure 21. Location of the Jumper Block Table 29. Normal BIOS Setup Configuration Jumper Settings Jumper Setting Configuration 1 Function/Mode 1-2 3 The BIOS uses current configuration information and passwords for booting. Configure 2-3 3 1 After the POST runs, Setup runs automatically. The maintenance menu is displayed. Recovery None 3 1 The BIOS attempts to recover the BIOS configuration. A recovery diskette is required. 64 Technical Reference 2.9 Mechanical Considerations 2.9.1 Form Factor The board is designed to fit into an ATX- or microATX-form-factor chassis. Figure 22 illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification. 1.800 [45.72] 6.500 [165.10] 6.100 [154.94] 5.200 [132.08] 0.00 2.850 [72.39] 3.100 [78.74] 3.150 [80.01] 0.00 2.600 [66.04] 6.450 6.200 [163.83] [157.48] OM17841 Figure 22. Board Dimensions 65 Intel Desktop Board D945GPM Technical Product Specification 2.9.2 I/O Shield The back panel I/O shield for the board must meet specific dimension and material requirements. Systems based on this board need the back panel I/O shield to pass certification testing. Figure 23 shows the I/O shield for boards with the optional parallel port connector. Figure 24 shows the I/O shield for boards without the optional parallel port connector. Dimensions are given in millimeters [inches]. The figures also indicate the position of each cutout. Additional design considerations for I/O shields relative to chassis requirements are described in the ATX specification. NOTE The I/O shield drawings in this document are for reference only. 162.3 REF [6.390] 1.6 ± 0.12 [0.063 ± 0.005] 20 ± 0.254 TYP [0.787 ± 0.10] 1.55 REF [0.061] 159.2 ± 0.12 [6.268 ± 0.005] 22.45 [0.884] 7.01 [0.276] Ø 1.00 [0.039] 0.00 [0.00] 11.81 [0.465] 12.04 [0.474] 8x R 0.5 MIN A A 11.81 [0.465] 14.17 [0.558] 26.91 [1.059] 113.63 [4.473] 0.00 [0.00] 8.81 [0.347] Pictorial View 146.88 [5.783] 20.28 [0.799] 56.31 [2.217] 93.74 [3.690] OM17932 Figure 23. I/O Shield Dimensions for Boards with the Optional Parallel Port Connector 66 Technical Reference 162.3 REF [6.390] 1.6 ± 0.12 [0.063 ± 0.005] 20 ± 0.254 TYP [0.787 ± 0.10] 1.55 REF [0.061] 159.2 ± 0.12 [6.268 ± 0.005] 22.45 [0.884] 8x R 0.5 MIN Ø 1.00 [0.039] 0.00 [0.00] 11.81 [0.465] 12.04 [0.474] A 11.81 [0.465] 14.17 [0.558] 0.00 [0.00] 8.81 [0.347] 20.28 [0.799] 56.31 [2.217] 93.74 [3.690] 113.63 [4.473] Pictorial View 146.88 [5.783] OM18265 Figure 24. I/O Shield Dimensions for Boards without the Optional Parallel Port Connector 67 Intel Desktop Board D945GPM Technical Product Specification 2.10 Electrical Considerations 2.10.1 DC Loading Table 30 lists the DC loading characteristics of the boards. This data is based on a DC analysis of all active components within the board that impact its power delivery subsystems. The analysis does not include PCI add-in cards. Minimum values assume a light load placed on the board that is similar to an environment with no applications running and no USB current draw. Maximum values assume a load placed on the board that is similar to a heavy gaming environment with a 500 mA current draw per USB port. These calculations are not based on specific processor values or memory configurations but are based on the minimum and maximum current draw possible from the board’s power delivery subsystems to the processor, memory, and USB ports. Use the datasheets for add-in cards, such as PCI, to determine the overall system power requirements. The selection of a power supply at the system level is dependent on the system’s usage model and not necessarily tied to a particular processor speed. Table 30. Mode DC Loading Characteristics DC Current at: DC Power +3.3 V +5 V +12 V -12 V +5 VSB Minimum loading Maximum loading 275 W 500 W 3.5 A 16 A 12 A 23 A 17 A 29 A 0A 0.20 A 0.34 A (S0) 1.00 A (S3) 0.34 A (S0) 1.10 A (S3) 2.10.2 Add-in Board Considerations The boards are designed to provide 2 A (average) of +5 V current for each add-in board. The total +5 V current draw for both boards is as follows: a fully loaded D945GPM board (all three expansion slots and the PCI Express x16 slot filled) must not exceed 8 A. 68 Technical Reference 2.10.3 Fan Connector Current Capability CAUTION The processor fan must be connected to the processor fan connector, not to a chassis fan connector. Connecting the processor fan to a chassis fan connector may result in onboard component damage that will halt fan operation. Table 31 lists the current capability of the fan connectors. Table 31. Fan Connector Current Capability Maximum Available Current Fan Connector Processor fan Front chassis fan Rear chassis fan 3.0 A 1.5 A 1.5 A 2.10.4 Power Supply Considerations CAUTION The +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. System integrators should refer to the power usage values listed in Table 30 when selecting a power supply for use with the board. Additional power required will depend on configurations chosen by the integrator. The power supply must comply with the following recommendations found in the indicated sections of the ATX form factor specification. • The potential relation between 3.3 VDC and +5 VDC power rails (Section 4.2) • The current capability of the +5 VSB line (Section 4.2.1.2) • All timing parameters (Section 4.2.1.3) • All voltage tolerances (Section 4.2.2) 69 Intel Desktop Board D945GPM Technical Product Specification 2.11 Thermal Considerations CAUTION A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement. Use a processor heatsink that provides omni-directional airflow (similar to the type shown in Figure 25) to maintain required airflow across the processor voltage regulator area. OM16996 Figure 25. Processor Heatsink for Omni-directional Airflow CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.13. 70 Technical Reference CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (item A in Figure 26) can reach a temperature of up to 85 oC in an open chassis. Figure 26 shows the locations of the localized high temperature zones. A B D Item A B C D C OM17842 Description Processor voltage regulator area Processor Intel 82945G GMCH Intel 82801GH ICH7DH Figure 26. Localized High Temperature Zones 71 Intel Desktop Board D945GPM Technical Product Specification Table 32 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 32. Thermal Considerations for Components Maximum Case Temperature Component Intel Pentium 4 processor Intel 82945G GMCH Intel 82801GH ICH7DH For processor case temperature, see processor datasheets and processor specification updates 99 oC (under bias) 110 oC (under bias, without heatsink) 99 oC (under bias, with heatsink) For information about Intel Pentium 4 processor datasheets and specification updates Refer to Section 1.2, page 15 2.12 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the D945GPM board is 113,375 hours. 72 Technical Reference 2.13 Environmental Table 33 lists the environmental specifications for the board. Table 33. Parameter Temperature Environmental Specifications Specification Non-Operating Operating Shock -40 °C to +70 °C 0 °C to +55 °C 50 g trapezoidal waveform Velocity change of 170 inches/second² Half sine 2 millisecond Product weight (pounds)