5962R0053801VXC

Radiation Hardened Power-Up/Down Microprocessor Reset Circuit IS-705RH The Radiation Hardened IS-705RH is a monolithic device that monitors the power supply voltage used by satellite control units and provides a reset output pulse during power-up and power-down. The reset threshold is 4.65V (Typ) and the reset pulse width is set at 200ms (Typ). A watchdog circuit is incorporated for easy interfacing with microprocessors and controllers. If the watchdog input has not been toggled within a preset 1.6s (Typ) time period, an output signal is generated, which can be used as an interrupt. The power function input (PFI) may be used to monitor other voltage levels. The circuit has a 1.25V (Typ) threshold and provides a PFO output when low voltage is detected. An active-low manual reset input is also provided for direct control of the reset function. TM IS-705RH Features • Electrically Screened to SMD #5962-00538 • QML Qualified per MIL-PRF-38535 Requirements • Radiation Hardness - Total Dose . . . . . . . . . . . . . 100 krad(Si) (Min) - Single Event Latch-up . . . . . . >90MeV/mg/cm2 • Precision 4.65V Voltage Monitor • Supply Voltage Range . . . . . . . . . 4.75V to 5.5V • RESET Valid at VCC = 1.2V • Low Supply Current . . . . . . . . . . . . .420µA (Typ) • 200ms (Typ) RESET Pulse Width Applications • Flight Computers • Controllers • Critical Microprocessor Power Monitoring • Reliable Replacement of Discrete Solutions Constructed with the Intersil UHF2X-CMOS process, these devices have been specifically designed to provide highly reliable performance in harsh radiation environments. This process has been tested for single event latch-up and has demonstrated an immunity to 90MeV/mg/cm2. Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed here must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-00538. A “hot-link” is provided on our homepage for downloading. http://www.dscc.dla.mil/downloads/milspec/s md/00538.pdf Pin Configuration IS-705RH (8 LD FLATPACK) TOP VIEW MR VCC GND PFI 1 2 3 4 8 WDO 7 RESET 6 WDI 5 PFO Ordering Information ORDERING NUMBER 5962R0053801V9A IS0-705RH/SAMPLE 5962R0053801QXC (Note) 5962R0053801VXC (Note) IS9-705RH/PROTO (Note) INTERNAL MKT. NUMBER IS0-705RH-Q IS0-705RH/SAMPLE IS9-705RH-8 IS9-705RH-Q IS9-705RH/PROTO Q 5962R00 53801QXC Q 5962R00 53801VXC IS9- 705RH /PROTO PART MARKING TEMP. RANGE (°C) -55 to +125 -55 to +125 -55 to +125 -55 to +125 -55 to +125 DIE DIE SAMPLE 8 Ld Flatpack, Solder SL 8 Ld Flatpack, Solder SL 8 Ld Flatpack, Solder SL PACKAGE (Pb-Free) NOTE: These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. March 23, 2010 FN4703.6 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2007, 2010. All Rights Reserved Star*Power™ is a trademark of Intersil Americas Inc. IS-705RH IS-705RH Die Characteristics DIE DIMENSIONS: 1500μmx1830µm (59milsx72mils) Thickness: 483µm ± 25.4μm (19mils ± 1mil) INTERFACE MATERIALS Glassivation Type: Nitride (Si3N4) over Silox (SiO2) Nitride Thickness: 4.0kÅ ± 1.0kÅ Silox Thickness: 12.0kÅ ± 4.0kÅ Top Metallization Top Metal 3: TiAlCu Thickness: 0.8µm ± 0.02µm Metal 1 and 2: TiAlCu Thickness: 0.4µm ± 0.01µm Process: UHF2X-CMOS, Junction Isolation Backside Finish: Silicon ASSEMBLY RELATED INFORMATION Substrate Potential: Unbiased (May be left floating or connected to GND.) ADDITIONAL INFORMATION Worst Case Current Density: