HA5013IB

HA5013 Data Sheet September 1998 File Number 3654.4 Triple, 125MHz Video Amplifier The HA5013 is a low cost triple amplifier optimized for RGB video applications and gains between 1 and 10. It is a current feedback amplifier and thus yields less bandwidth degradation at high closed loop gains than voltage feedback amplifiers. The low differential gain and phase, 0.1dB gain flatness, and ability to drive two back terminated 75Ω cables, make this amplifier ideal for demanding video applications. The current feedback design allows the user to take advantage of the amplifier’s bandwidth dependency on the feedback resistor. The performance of the HA5013 is very similar to the popular Intersil HA-5020 single video amplifier. Features • Wide Unity Gain Bandwidth . . . . . . . . . . . . . . . . . 125MHz • Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 475V/µs • Input Offset Voltage . . . . . . . . . . . . . . . . . . . . . . . . 800µV • Differential Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.03% • Differential Phase . . . . . . . . . . . . . . . . . . . . 0.03 Degrees • Supply Current (Per Amplifier) . . . . . . . . . . . . . . . . 7.5mA • ESD Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4000V • Guaranteed Specifications at ±5V Supplies • Low Cost Applications • PC Add-On Multimedia Boards • Flash A/D Driver • Color Image Scanners • CCD Cameras and Systems Pinout HA5013 (PDIP, SOIC) TOP VIEW NC NC NC V+ +IN1 -IN1 OUT1 1 2 3 4 +- 14 OUT2 13 -IN2 12 +IN2 11 V- • RGB Cable Driver • RGB Video Preamp • PC Video Conferencing Ordering Information PART NUMBER HA5013IP HA5013IB HA5025EVAL TEMP. RANGE (oC) -40 to 85 -40 to 85 PACKAGE 14 Ld PDIP 14 Ld SOIC PKG. NO. E14.3 M14.15 6 7 1 - - + 5 10 +IN3 9 -IN3 8 OUT3 + High Speed Op Amp DIP Evaluation Board CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 HA5013 Absolute Maximum Ratings Voltage Between V+ and V- Terminals. . . . . . . . . . . . . . . . . . . . 36V DC Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±VSUPPLY Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10V Output Current (Note 2) . . . . . . . . . . . . . . . . Short Circuit Protected ESD Rating (Note 4) Human Body Model (Per MIL-STD-883 Method 3015.7) . . . . 2000V Thermal Information Thermal Resistance (Typical, Note 1) θJA (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 Maximum Junction Temperature (Die Only, Note 3) . . . . . . . . . 175oC Maximum Junction Temperature (Plastic Package, Note 3) . . . 150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC Supply Voltage Range (Typical) . . . . . . . . . . . . . . . . . ±4.5V to ±15V CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. θJA is measured with the component mounted on an evaluation PC board in free air. 2. Output is protected for short circuits to ground. Brief short circuits to ground will not degrade reliability, however, continuous (100% duty cycle) output current should not exceed 15mA for maximum reliability. 3. Maximum power dissipation, including output load, must be designed to maintain junction temperature below 175oC for die, and below 150oC for plastic packages. See Application Information section for safe operating area information. 4. The non-inverting input of unused amplifiers must be connected to GND. Electrical Specifications VSUPPLY = ±5V, RF = 1kΩ, AV = +1, RL = 400Ω, CL ≤10pF, Unless Otherwise Specified (NOTE 9) TEST LEVEL TEMP. (oC) PARAMETER INPUT CHARACTERISTICS Input Offset Voltage (VIO) TEST CONDITIONS MIN TYP MAX UNITS A A 25 Full Full Full 25 Full 25 Full Full 25 Full 25 Full 25 Full 25, 85 -40 25, 85 -40 53 50 60 55 ±2.5 - 0.8 1.2 5 3 4 10 6 10 3 5 3.5 8 20 0.15 0.5 0.1 0.3 12 30 15 30 mV mV mV µV/oC dB dB dB dB V µA µA µA/V µA/V µA/V µA/V µA µA µA µA Delta VIO Between Channels Average Input Offset Voltage Drift VIO Common Mode Rejection Ratio VCM = ±2.5V (Note 5) A B A A VIO Power Supply Rejection Ratio ±3.5V ≤ VS ≤ ±6.5V A A Input Common Mode Range Non-Inverting Input (+IN) Current VCM = ±2.5V (Note 5) A A A +IN Common Mode Rejection (+IBCMR = 1 +RIN ) VCM = ±2.5V (Note 5) A A +IN Power Supply Rejection ±3.5V ≤ VS ≤ ±6.5V A A Inverting Input (-IN) Current A A Delta - IN BIAS Current Between Channels A A 2 HA5013 Electrical Specifications VSUPPLY = ±5V, RF = 1kΩ, AV = +1, RL = 400Ω, CL ≤10pF, Unless Otherwise Specified (Continued) (NOTE 9) TEST LEVEL A A -IN Power Supply Rejection ±3.5V ≤ VS ≤ ±6.5V A A Input Noise Voltage +Input Noise Current -Input Noise Current TRANSFER CHARACTERISTICS Transimpedence VOUT = ±2.5V (Note 11) A A Open Loop DC Voltage Gain RL = 400Ω, VOUT = ±2.5V A A Open Loop DC Voltage Gain RL = 100Ω, VOUT = ±2.5V A A OUTPUT CHARACTERISTICS Output Voltage Swing RL = 150Ω A A Output Current Short Circuit Output Current POWER SUPPLY CHARACTERISTICS Supply Voltage Range Quiescent Supply Current AC CHARACTERISTICS AV = +1 Slew Rate Full Power Bandwidth (Note 7) Rise Time (Note 8) Fall Time (Note 8) Propagation Delay (Note 8) Overshoot -3dB Bandwidth Settling Time Settling Time AC CHARACTERISTICS AV = +2, RF = 681Ω Slew Rate Note 6 B 25 475 V/µs VOUT = 100mV To 1%, 2V Output Step To 0.25%, 2V Output Step VOUT = 1V, RL = 100Ω VOUT = 1V, RL = 100Ω VOUT = 1V, RL = 100Ω Note 6 B B B B B B B B B 25 25 25 25 25 25 25 25 25 275 22 350 28 6 6 6 4.5 125 50 75 V/µs MHz ns ns ns % MHz ns ns A A 25 Full 5 7.5 15 10 V mA/Op Amp RL = 150Ω VIN = ±2.5V, VOUT = 0V B A 25 Full Full Full ±2.5 ±2.5 ±16.6 ±40 ±3.0 ±3.0 ±20.0 ±60 V V mA mA 25 Full 25 Full 25 Full 1.0 0.85 70 65 50 45 MΩ MΩ dB dB dB dB f = 1kHz f = 1kHz f = 1kHz B B B TEMP. (oC) 25 Full 25 Full 25 25 25 PARAMETER -IN Common Mode Rejection TEST CONDITIONS VCM = ±2.5V (Note 5) MIN - TYP 4.5 2.5 25.0 MAX 0.4 1.0 0.2 0.5 - UNITS µA/V µA/V µA/V µA/V nV/√Hz pA/√Hz pA/√Hz 3 HA5013 Electrical Specifications VSUPPLY = ±5V, RF = 1kΩ, AV = +1, RL = 400Ω, CL ≤10pF, Unless Otherwise Specified (Continued) (NOTE 9) TEST LEVEL B VOUT = 1V, RL = 100Ω VOUT = 1V, RL = 100Ω VOUT = 1V, RL = 100Ω B B B B VOUT = 100mV To 1%, 2V Output Step To 0.25%, 2V Output Step 5MHz 20MHz AC CHARACTERISTICS AV = +10, RF = 383Ω Slew Rate Full Power Bandwidth (Note 7) Rise Time (Note 8) Fall Time (Note 8) Propagation Delay (Note 8) Overshoot -3dB Bandwidth Settling Time VOUT = 100mV To 1%, 2V Output Step To 0.1%, 2V Output Step VIDEO CHARACTERISTICS Differential Gain Differential Phase NOTES: 5. At -40oC Product is tested at VCM = ±2.25V because Short Test Duration does not allow self heating. 6. VOUT switches from -2V to +2V, or from +2V to -2V. Specification is from the 25% to 75% points. Slew Rate 7. FPBW = ---------------------------- ; V = 2V . 2 π V PEAK PEAK 8. Measured from 10% to 90% points for rise/fall times; from 50% points of input and output for propagation delay. 9. A. Production Tested; B. Typical or Guaranteed Limit based on characterization; C. Design Typical for information only. 10. Measured with a VM700A video tester using an NTC-7 composite VITS. 11. At -40oC Product is tested at VOUT = ±2.25V because Short Test Duration does not allow self heating. RL = 150Ω, (Note 10) RL = 150Ω, (Note 10) B B 25 25 0.03 0.03 % Degrees VOUT = 1V, RL = 100Ω VOUT = 1V, RL = 100Ω VOUT = 1V, RL = 100Ω Note 6 B B B B B B B B B 25 25 25 25 25 25 25 25 25 350 28 475 38 8 9 9 1.8 65 75 130 V/µs MHz ns ns ns % MHz ns ns B B B B B TEMP. (oC) 25 25 25 25 25 25 25 25 25 25 PARAMETER Full Power Bandwidth (Note 7) Rise Time (Note 8) Fall Time (Note 8) Propagation Delay (Note 8) Overshoot -3dB Bandwidth Settling Time Settling Time Gain Flatness TEST CONDITIONS MIN - TYP 26 6 6 6 12 95 50 100 0.02 0.07 MAX - UNITS MHz ns ns ns % MHz ns ns dB dB 4 HA5013 Test Circuits and Waveforms + DUT 50Ω HP4195 NETWORK ANALYZER 50Ω FIGURE 1. TEST CIRCUIT FOR TRANSIMPEDANCE MEASUREMENTS (NOTE 12) 100Ω VIN 50Ω RF, 1kΩ + (NOTE 12) 100Ω DUT VOUT RL 100Ω VIN 50Ω RI 681Ω + DUT VOUT RL 400Ω - - RF, 681Ω FIGURE 2. SMALL SIGNAL PULSE RESPONSE CIRCUIT NOTE: FIGURE 3. LARGE SIGNAL PULSE RESPONSE CIRCUIT 12. A series input resistor of ≥100Ω is recommended to limit input currents in case input signals are present before the HA5013 is powered up. Vertical Scale: VIN = 100mV/Div., VOUT = 100mV/Div. Horizontal Scale: 20ns/Div. FIGURE 4. SMALL SIGNAL RESPONSE Vertical Scale: VIN = 1V/Div., VOUT = 1V/Div. Horizontal Scale: 50ns/Div. FIGURE 5. LARGE SIGNAL RESPONSE 5 Schematic V+ (One Amplifier of Three) R2 800 R5 2.5K R10 820 QP8 QP9 QP11 R15 400 R19 400 QP14 R17 280 R18 280 R27 200 R29 9.5 QP19 R31 5 QP1 QN5 QP5 R11 1K QP10 QN12 R24 140 R20 140 QP16 QP20 6 QN8 QP2 R1 60K QN1 QN6 QP4 QP6 R12 280 +IN R3 6K QN2 QN10 D1 QN4 QN3 QP7 R13 1K QN7 R4 800 VR33 800 R9 820 QN9 QN11 QP15 C1 1.4pF QP12 -IN QN13 QP13 R28 20 QP17 QN17 HA5013 C2 1.4pF QN15 R21 140 R25 20 QN21 R32 5 QN19 R30 7 OUT R14 280 QN14 R22 280 R25 140 QN16 QN18 R23 400 R26 200 R16 400 HA5013 Application Information Optimum Feedback Resistor The plots of inverting and non-inverting frequency response, see Figure 8 and Figure 9 in the typical performance section, illustrate the performance of the HA5013 in various closed loop gain configurations. Although the bandwidth dependency on closed loop gain isn’t as severe as that of a voltage feedback amplifier, there can be an appreciable decrease in bandwidth at higher gains. This decrease may be minimized by taking advantage of the current feedback amplifier’s unique relationship between bandwidth and RF. All current feedback amplifiers require a feedback resistor, even for unity gain applications, and RF, in conjunction with the internal compensation capacitor, sets the dominant pole of the frequency response. Thus, the amplifier’s bandwidth is inversely proportional to RF. The HA5013 design is optimized for a 1000Ω RF at a gain of +1. Decreasing RF in a unity gain application decreases stability, resulting in excessive peaking and overshoot. At higher gains the amplifier is more stable, so RF can be decreased in a trade-off of stability for bandwidth. The table below lists recommended RF values for various gains, and the expected bandwidth. GAIN (ACL) -1 +1 +2 +5 +10 -10 RF (Ω) 750 1000 68f1 1000 383 750 BANDWIDTH (MHz) 100 125 95 52 65 22 as short as possible to minimize the capacitance from this node to ground. Driving Capacitive Loads Capacitive loads will degrade the amplifier’s phase margin resulting in frequency response peaking and possible oscillations. In most cases the oscillation can be avoided by placing an isolation resistor (R) in series with the output as shown in Figure 6. 100Ω VIN RT RI RF + R VOUT CL - FIGURE 6. PLACEMENT OF THE OUTPUT ISOLATION RESISTOR, R The selection criteria for the isolation resistor is highly dependent on the load, but 27Ω has been determined to be a good starting value. Power Dissipation Considerations Due to the high supply current inherent in triple amplifiers, care must be taken to insure that the maximum junction temperature (TJ , see Absolute Maximum Ratings) is not exceeded. Figure 7 shows the maximum ambient temperature versus supply voltage for the available package styles (PDIP, SOIC). At VS = ±5V quiescent operation both package styles may be operated over the full industrial range of -40oC to 85oC. It is recommended that thermal calculations, which take into account output power, be performed by the designer. PC Board Layout MAX. AMBIENT TEMPERATURE (oC) The frequency response of this amplifier depends greatly on the amount of care taken in designing the PC board. The use of low inductance components such as chip resistors and chip capacitors is strongly recommended. If leaded components are used the leads must be kept short especially for the power supply decoupling components and those components connected to the inverting input. Attention must be given to decoupling the power supplies. A large value (10µF) tantalum or electrolytic capacitor in parallel with a small value (0.1µF) chip capacitor works well in most cases. A ground plane is strongly recommended to control noise. Care must also be taken to minimize the capacitance to ground seen by the amplifier’s inverting input (-IN). The larger this capacitance, the worse the gain peaking, resulting in pulse overshoot and possible instability. It is recommended that the ground plane be removed under traces connected to -IN, and that connections to -IN be kept 130 120 110 100 90 80 70 60 50 40 30 20 10 5 7 9 11 13 15 SOIC PDIP SUPPLY VOLTAGE (±V) FIGURE 7. MAXIMUM OPERATING AMBIENT TEMPERATURE vs SUPPLY VOLTAGE 7 HA5013 Typical Performance Curves VSUPPLY = ±5V, AV = +1, RF = 1kΩ, RL = 400Ω, TA = 25oC, Unless Otherwise Specified 5 4 NORMALIZED GAIN (dB) 3 2 1 0 -1 -2 -3 -4 -5 2 10 FREQUENCY (MHz) 100 200 AV = 10, RF = 383Ω VOUT = 0.2VP-P CL = 10pF AV = 2, RF = 681Ω AV = 5, RF = 1kΩ AV = +1, RF = 1kΩ NORMALIZED GAIN (dB) 5 4 3 2 1 0 -1 -2 -3 -4 -5 2 10 FREQUENCY (MHz) 100 200 AV = -10 AV = -5 VOUT = 0.2VP-P CL = 10pF RF = 750Ω AV = -1 AV = -2 FIGURE 8. NON-INVERTING FREQUENCY RESPONSE FIGURE 9. INVERTING FREQUENCY RESPONSE 140 VOUT = 0.2VP-P CL = 10pF AV = +1 NON-INVERTING PHASE (DEGREES) -45 -90 -135 -100 -225 -270 -315 -360 2 VOUT = 0.2VP-P CL = 10pF 10 FREQUENCY (MHz) 100 AV = -10, RF = 750Ω AV = -1, RF = 750Ω AV = +10, RF = 383Ω +135 +90 +45 0 -45 -90 -135 -180 200 INVERTING PHASE (DEGREES) 0 AV = +1, RF = 1kΩ +180 -3dB BANDWIDTH (MHz) 130 5 GAIN PEAKING 500 700 900 1100 1300 0 1500 FEEDBACK RESISTOR (Ω) FIGURE 10. PHASE RESPONSE AS A FUNCTION OF FREQUENCY -3dB BANDWIDTH (MHz) FIGURE 11. BANDWIDTH AND GAIN PEAKING vs FEEDBACK RESISTANCE 130 100 VOUT = 0.2VP-P CL = 10pF AV = +2 95 -3dB BANDWIDTH (MHz) 120 -3dB BANDWIDTH 110 6 GAIN PEAKING (dB) -3dB BANDWIDTH GAIN PEAKING (dB) 90 10 100 4 5 GAIN PEAKING 350 500 650 800 950 FEEDBACK RESISTOR (Ω) 0 1100 90 GAIN PEAKING VOUT = 0.2VP-P CL = 10pF AV = +1 800 2 80 0 200 400 600 LOAD RESISTOR (Ω) 0 1000 FIGURE 12. BANDWIDTH AND GAIN PEAKING vs FEEDBACK RESISTANCE FIGURE 13. BANDWIDTH AND GAIN PEAKING vs LOAD RESISTANCE 8 GAIN PEAKING (dB) 120 -3dB BANDWIDTH 10 HA5013 Typical Performance Curves 80 VOUT = 0.2VP-P CL = 10pF AV = +10 OVERSHOOT (%) 60 12 VSUPPLY = ±5V, AV = +1, RF = 1kΩ, RL = 400Ω, TA = 25oC, Unless Otherwise Specified (Continued) 16 VOUT = 0.1VP-P CL = 10pF VSUPPLY = ±5V, AV = +2 -3dB BANDWIDTH (MHz) 40 6 VSUPPLY = ±15V, AV = +2 VSUPPLY = ±5V, AV = +1 VSUPPLY = ±15V, AV = +1 20 0 200 0 350 500 650 FEEDBACK RESISTOR (Ω) 800 950 0 200 400 600 800 1000 LOAD RESISTANCE (Ω) FIGURE 14. BANDWIDTH vs FEEDBACK RESISTANCE FIGURE 15. SMALL SIGNAL OVERSHOOT vs LOAD RESISTANCE 0.10 FREQUENCY = 3.58MHz DIFFERENTIAL GAIN (%) 0.08 RL = 75Ω DIFFERENTIAL PHASE (DEGREES) 0.08 FREQUENCY = 3.58MHz 0.06 0.06 RL = 150Ω 0.04 0.04 RL = 150Ω RL = 75Ω 0.02 RL = 1kΩ 0.00 3 5 7 9 11 13 15 0.02 RL = 1kΩ 0.00 3 5 7 9 11 SUPPLY VOLTAGE (±V) 13 15 SUPPLY VOLTAGE (±V) FIGURE 16. DIFFERENTIAL GAIN vs SUPPLY VOLTAGE FIGURE 17. DIFFERENTIAL PHASE vs SUPPLY VOLTAGE -40 VOUT = 2.0VP-P CL = 30pF REJECTION RATIO (dB) -50 DISTORTION (dBc) HD2 -60 3RD ORDER IMD -70 HD2 HD3 -80 HD3 -90 0.3 1 FREQUENCY (MHz) 10 0.001 0 -10 -20 -30 -40 -50 -60 -70 -80 AV = +1 CMRR NEGATIVE PSRR POSITIVE PSRR 0.01 0.1 1 FREQUENCY (MHz) 10 30 FIGURE 18. DISTORTION vs FREQUENCY FIGURE 19. REJECTION RATIOS vs FREQUENCY 9 HA5013 Typical Performance Curves 8.0 VSUPPLY = ±5V, AV = +1, RF = 1kΩ, RL = 400Ω, TA = 25oC, Unless Otherwise Specified (Continued) 12 RLOAD = 100Ω VOUT = 1.0VP-P PROPAGATION DELAY (ns) 10 AV = +10, RF = 383Ω PROPAGATION DELAY (ns) RL = 100Ω VOUT = 1.0VP-P AV = +1 7.5 7.0 8 AV = +2, RF = 681Ω 6 AV = +1, RF = 1kΩ 4 6.5 6.0 -50 -25 0 25 50 75 TEMPERATURE (oC) 100 125 3 5 7 9 11 SUPPLY VOLTAGE (±V) 13 15 FIGURE 20. PROPAGATION DELAY vs TEMPERATURE FIGURE 21. PROPAGATION DELAY vs SUPPLY VOLTAGE 0.8 500 VOUT = 2VP-P 450 SLEW RATE (V/µs) 400 350 300 250 200 150 100 -50 -25 0 25 50 75 100 125 TEMPERATURE (oC) - SLEW RATE + SLEW RATE NORMALIZED GAIN (dB) 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1.0 -1.2 5 VOUT = 0.2VP-P CL = 10pF AV = +2, RF = 681Ω AV = +5, RF = 1kΩ AV = +1, RF = 1kΩ AV = +10, RF = 383Ω 10 15 20 FREQUENCY (MHz) 25 30 FIGURE 22. SLEW RATE vs TEMPERATURE FIGURE 23. NON-INVERTING GAIN FLATNESS vs FREQUENCY 0.8 0.6 NORMALIZED GAIN (dB) 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1.0 -1.2 5 10 15 20 25 30 FREQUENCY (MHz) AV = -10 AV = -2 0 0.01 0 100 AV = -5 AV = -1 VOUT = 0.2VP-P CL = 10pF RF = 750Ω VOLTAGE NOISE (nV/√Hz) 100 AV = +10, RF = 383Ω CURRENT NOISE (pA/√Hz) 80 -INPUT NOISE CURRENT 800 1000 60 +INPUT NOISE CURRENT 40 INPUT NOISE VOLTAGE 20 600 400 200 0.1 1 FREQUENCY (kHz) 10 FIGURE 24. INVERTING GAIN FLATNESS vs FREQUENCY FIGURE 25. INPUT NOISE CHARACTERISTICS 10 HA5013 Typical Performance Curves 1.5 VSUPPLY = ±5V, AV = +1, RF = 1kΩ, RL = 400Ω, TA = 25oC, Unless Otherwise Specified (Continued) 2 1.0 VIO (mV) BIAS CURRENT (µA) 0 0.5 -2 0.0 -60 -4 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (oC) TEMPERATURE (oC) FIGURE 26. INPUT OFFSET VOLTAGE vs TEMPERATURE 22 FIGURE 27. +INPUT BIAS CURRENT vs TEMPERATURE 4000 TRANSIMPEDANCE (kΩ) -40 -20 0 20 40 60 80 100 120 140 BIAS CURRENT (µA) 20 3000 18 2000 16 -60 1000 -60 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (oC) TEMPERATURE (oC) FIGURE 28. -INPUT BIAS CURRENT vs TEMPERATURE FIGURE 29. TRANSIMPEDANCE vs TEMPERATURE 25 125oC REJECTION RATIO (dB) 20 55oC 74 72 70 68 66 64 62 60 58 -100 CMRR -PSRR +PSRR ICC (mA) 15 10 25oC 5 3 4 5 6 7 8 9 10 11 12 13 14 15 -50 0 50 100 150 200 250 SUPPLY VOLTAGE (±V) TEMPERATURE (oC) FIGURE 30. SUPPLY CURRENT vs SUPPLY VOLTAGE FIGURE 31. REJECTION RATIO vs TEMPERATURE 11 HA5013 Typical Performance Curves 40 VSUPPLY = ±5V, AV = +1, RF = 1kΩ, RL = 400Ω, TA = 25oC, Unless Otherwise Specified (Continued) 4.0 SUPPLY CURRENT (mA) OUTPUT SWING (V) 30 +10V +5V +15V 20 3.8 10 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 DISABLE INPUT VOLTAGE (V) 3.6 -60 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (oC) FIGURE 32. SUPPLY CURRENT vs DISABLE INPUT VOLTAGE 30 FIGURE 33. OUTPUT SWING vs TEMPERATURE 1.2 VS = ±15V 1.1 20 VOUT (VP-P) VIO (mV) 10.00 VS = ±10V 10 1.0 0.9 VS = ±4.5V 0 0.01 0.10 1.00 LOAD RESISTANCE (kΩ) 0.8 -60 -40 -20 0 40 60 80 20 TEMPERATURE (oC) 100 120 140 FIGURE 34. OUTPUT SWING vs LOAD RESISTANCE FIGURE 35. INPUT OFFSET VOLTAGE CHANGE BETWEEN CHANNELS vs TEMPERATURE 1.5 -30 AV = +1 VOUT = 2VP-P ∆BIAS CURRENT (µA) -40 1.0 SEPARATION (dB) -40 -20 0 20 40 60 80 TEMPERATURE (oC) 100 120 140 -50 0.5 -60 -70 0.0 -60 -80 0.1 1 FREQUENCY (MHz) 10 30 FIGURE 36. INPUT BIAS CURRENT CHANGE BETWEEN CHANNELS vs TEMPERATURE FIGURE 37. CHANNEL SEPARATION vs FREQUENCY 12 HA5013 Typical Performance Curves VSUPPLY = ±5V, AV = +1, RF = 1kΩ, RL = 400Ω, TA = 25oC, Unless Otherwise Specified (Continued) 0 -10 FEEDTHROUGH (dB) -20 -30 -40 -50 -60 -70 -80 0.1 DISABLE = 0V VIN = 5VP-P RF = 750Ω TRANSIMPEDANCE (MΩ) 10 1 0.1 0.01 0.001 180 135 90 45 0 -45 -90 PHASE ANGLE (DEGREES) RL = 100Ω 1 FREQUENCY (MHz) 10 20 0.001 0.01 0.1 1 10 -135 100 FREQUENCY (MHz) FIGURE 38. DISABLE FEEDTHROUGH vs FREQUENCY TRANSIMPEDANCE (MΩ) 10 1 0.1 0.01 0.001 FIGURE 39. TRANSIMPEDANCE vs FREQUENCY RL = 400Ω 180 135 90 45 0 -45 -90 -135 PHASE ANGLE (DEGREES) 0.001 0.01 0.1 1 10 100 FREQUENCY (MHz) FIGURE 40. TRANSIMPEDENCE vs FREQUENCY 13 HA5013 Die Characteristics DIE DIMENSIONS: 2010µm x 3130µm x 483µm METALLIZATION: Type: Metal 1: AlCu (1%) Thickness: Metal 1: 8kÅ ±0.4kÅ Type: Metal 2: AlCu (1%) Thickness: Metal 2: 16kÅ ±0.8kÅ SUBSTRATE POTENTIAL Unbiased PASSIVATION: Type: Nitride Thickness: 4kÅ ±0.4kÅ TRANSISTOR COUNT: 248 PROCESS: High Frequency Bipolar Dielectric Isolation Metallization Mask Layout HA5013 NC NC OUT2 -IN2 NC +IN2 V+ V- +IN1 +IN3 -IN1 OUT1 OUT3 -IN3 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com 14