ISL28190FHZ-T7

® ISL28190, ISL28290 Data Sheet August 11, 2008 FN6247.8 Single and Dual Single Supply Ultra-Low Noise, Ultra-Low Distortion, Rail-to-Rail Output, Op Amp The ISL28190 and ISL28290 are tiny single and dual ultra-low noise, ultra-low distortion operational amplifiers. Fully specified to operated down to +3V single supply. These amplifiers have outputs that swing rail-to-rail, and an input common mode voltage that extends below ground (ground sensing). The ISL28190 and ISL28290 are unity gain stable with an input referred voltage noise of 1nV/√Hz. Both parts feature 0.00017% THD+N @ 1kHz. The ISL28190 is available in the space-saving 6 Ld µTDFN (1.6mmx1.6mm) and 6 Ld SOT-23 packages. The ISL28290 is available in the 10 Ld µTQFN (1.8mmx1.4mm) and 10 Ld MSOP packages. All devices are guaranteed over -40°C to +125°C. Features • 1nV/√Hz input voltage noise • 1kHz THD+N typical 0.00017% at 2VP-P VOUT • Harmonic Distortion -87dBc, -90dBc, fo = 1MHz • 170MHz -3dB bandwidth • 50V/µs slew rate • 700µV maximum offset voltage • 10µA typical input bias current • 103dB typical CMRR • 3V to 5.5V single supply voltage range • Rail-to-rail output • Ground sensing • Enable pin (not available in the 8 Ld SOIC package option) • Pb-free (RoHS compliant) Ordering Information PART NUMBER PART MARKING PACKAGE (Pb-free) PKG. DWG. # Applications • Low noise signal processing • Low noise microphones/preamplifiers • ADC buffers • DAC output amplifiers • Digital scales • Strain gauges/sensor amplifiers • Radio systems • Portable equipment • Infrared detectors ISL28190FHZ-T7* (Note 1) GABH ISL28190FRUZ-T7* (Note 2) M7 ISL28290FUZ (Note 1) 8290Z 6 Ld SOT-23 MDP0038 6 Ld µTDFN L6.1.6x1.6A 10 Ld MSOP MDP0043 10 Ld MSOP MDP0043 10 Ld µTQFN L10.1.8x1.4A MDP0027 MDP0027 ISL28290FUZ-T7* (Note 1) 8290Z ISL28290FRUZ-T7* (Note 2) E ISL28290FBZ (Note 1) 28290 FBZ 8 Ld SOIC ISL28290FBZ-T7* (Note 1) 28290 FBZ 8 Ld SOIC ISL28290EVAL1Z Evaluation Board *Please refer to TB347 for details on reel specifications. NOTES: 1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pbfree requirements of IPC/JEDEC J STD-020. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2006-2008. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. ISL28190, ISL28290 Pinouts ISL28190 (6 LD SOT-23) TOP VIEW OUT 1 V- 2 IN+ 3 6 V+ 5 ENABLE 4 IN- ISL28190 (6 LD 1.6X1.6X0.5 µTDFN) TOP VIEW OUT 1 IN- 2 -+ IN+ 3 6 V+ 5 ENABLE 4 V- +- ISL28290 (10 LD MSOP) TOP VIEW OUT_A 1 IN-_A 2 IN+_A 3 V- 4 ENABLE_A 5 + + 10 V+ 9 OUT_B ISL28290 (10 LD µTQFN) TOP VIEW OUT_A OUT_B 8 7 + IN+_A 2 + 6 IN+_B IN-_B 5 ENABLE_B V+ 9 4 ENABLE_A 10 8 IN-_B 7 IN+_B 6 ENABLE_B IN-_A 1 3 V- ISL28290 (8 LD SOIC) TOP VIEW OUT_A 1 IN-_A 2 IN+_A 3 V- 4 + + 8 V+ 7 OUT_B 6 IN-_B 5 IN+_B 2 FN6247.8 August 11, 2008 ISL28190, ISL28290 Absolute Maximum Ratings (TA = +25°C) Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V Supply Turn On Voltage Slew Rate . . . . . . . . . . . . . . . . . . . . . 1V/µs Differential Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . V- - 0.5V to V+ + 0.5V ESD Tolerance Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3kV Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .300V Charged Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1200V Thermal Information Thermal Resistance (typical, Note 3) θJA (°C/W) 6 Ld SOT-23 Package . . . . . . . . . . . . . . . . . . . . . . . 230 6 Ld µTDFN Package . . . . . . . . . . . . . . . . . . . . . . . 125 10 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . 150 10 Ld µTQFN Package . . . . . . . . . . . . . . . . . . . . . . 180 8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . 125 Ambient Operating Temperature Range . . . . . . . . .-40°C to +125°C Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . +125°C Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTE: 3. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications V+ = 5.0V, V- = GND, RL = Open, RF = 1kΩ, AV = -1 unless otherwise specified. Parameters are per amplifier. Typical values are at V+ = 5V, TA = +25°C. Boldface limits apply over the operating temperature range, -40°C to +125°C, temperature data established by characterization. CONDITIONS MIN (Note 4) TYP MAX (Note 4) UNIT PARAMETER DC SPECIFICATIONS VOS Δ V OS --------------ΔT IIO IB VCM CMRR PSRR AVOL VOUT DESCRIPTION Input Offset Voltage Input Offset Drift vs Temperature Input Offset Current Input Bias Current Common-Mode Voltage Range Common-Mode Rejection Ratio Power Supply Rejection Ratio Large Signal Voltage Gain Maximum Output Voltage Swing VCM = 0V to 3.8V VS = 3V to 5V VO = 0.5V to 4V, RL = 1kΩ Output low, RL = 1kΩ Output high, RL = 1kΩ, V+ = 5V See Figure 21 -1100 240 1.9 40 10 700 900 µV µV/°C 500 900 16 18 3.8 nA µA V dB dB dB 0 78 74 94 90 103 80 102 20 4.95 4.92 4.97 8.5 26 RL = 10Ω RL = 10Ω V+ to VReferred to V95 90 95 90 3 2 144 135 50 80 mV V IS,ON IS,OFF IO+ IOVSUPPLY VENH Supply Current per Channel, Enabled Supply Current, Disabled Short-Circuit Output Current Short-Circuit Output Current Supply Operating Range EN High Level 11 13 35 52 mA µA mA mA 5.5 V V 3 FN6247.8 August 11, 2008 ISL28190, ISL28290 Electrical Specifications V+ = 5.0V, V- = GND, RL = Open, RF = 1kΩ, AV = -1 unless otherwise specified. Parameters are per amplifier. Typical values are at V+ = 5V, TA = +25°C. Boldface limits apply over the operating temperature range, -40°C to +125°C, temperature data established by characterization. (Continued) CONDITIONS Referred to VVEN = V+ VEN = V0.8 20 MIN (Note 4) TYP MAX (Note 4) 0.8 1.2 1.4 80 100 UNIT V µA nA PARAMETER VENL IENH IENL DESCRIPTION EN Low Level EN Pin Input High Current EN Pin Input Low Current AC SPECIFICATIONS GBW THD+N HD (1MHz) ISO X-TALK ISL28290 PSRR CMRR en in -3dB Unity Gain Bandwidth RF = 0Ω CL = 20pF, AV = 1, RL = 10kΩ 170 0.00017 -87 -90 AV = +1; VIN = 100mVP-P; RF = 0Ω, CL = 20pF, AV = 1, RL = 10kΩ VS = ±2.5V; AV = +1; VIN = 1VP-P, RF = 0Ω, CL = 20pF, AV = 1, RL = 10kΩ VS = ±2.5V; AV = +1; VSOURCE = 1VP-P, RF = 0Ω, CL = 20pF, AV = 1, RL = 10kΩ VS = ±2.5V; AV = +1; VCM = 1VP-P, RF = 0Ω, CL = 20pF, AV = 1, RL = 10kΩ fO = 1kHz fO = 10kHz -38 -105 -70 -65 1 2.1 MHz % dBc dBc dB dB dB dB nV/√Hz pA/√Hz Total Harmonic Distortion + Noise f = 1kHz, VOUT + 2VP-P, AV = +1, RL = 10kΩ 2nd Harmonic Distortion 3rd Harmonic Distortion Off-state Isolation fO = 100kHz Channel-to-Channel Crosstalk fO = 100kHz Power Supply Rejection Ratio fO = 100kHz Common Mode Rejection Ratio fO = 100kHz Input Referred Voltage Noise Input Referred Current Noise VOUT = 2VP-P, AV = 1 TRANSIENT RESPONSE SR tpd tr, tf, Small Signal tr, tf Large Signal Slew Rate Propagation Delay 10% VIN - 10% VOUT Rise Time, tr 10% to 90% Fall Time, tf 10% to 90% Rise Time, tr 10% to 90% Fall Time, tf 10% to 90% Rise Time, tr 10% to 90% Fall Time, tf 10% to 90% ts tEN Settling Time to 0.1% 90% VOUT to 0.1% VOUT AV = +2, VOUT = 1VP-P, RF = RG = 499Ω, RL = 10kΩ, CL = 1.2pF AV = +2, VOUT = 4.7VP-P, RF = RG = 499Ω, RL = 10kΩ, CL = 1.2pF AV = 1, VOUT = 1VP-P, RF = 0Ω, CL = 1.2pF AV = 1, VOUT = 100mVP-P, RF = 0Ω, CL = 1.2pF AV = +1, VOUT = 0.1VP-P, RF = 0Ω, CL = 1.2pF 30 25 50 1.0 3.3 6.3 44 51 190 187 45 330 50 V/µs ns ns ns ns ns ns ns ns ns ns ENABLE to Output Turn-on Delay AV = 1, VOUT = 1VDC, RL = 10kΩ, CL = 1.2pF Time; 10% EN - 10% VOUT ENABLE to Output Turn-off Delay AV = 1, VOUT = 0VDC, RL = 10kΩ, CL = 1.2pF Time; 10% EN - 10% VOUT NOTE: 4. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 4 FN6247.8 August 11, 2008 ISL28190, ISL28290 Typical Performance Curves 2 1 CLOSED LOOP GAIN (dB) 0 -1 -2 -3 -4 -5 V + = 5V -6 AV = +1 C = 10pF -7 V L OUT = 10mVP-P -8 100k 1M 10M FREQUENCY (Hz) 100M 1G RL = 1k RL = 10k RL = 100 RL = 100k CLOSED LOOP GAIN (dB) 10 8 6 4 2 0 -2 V+ = 5V -6 AV = +1 R = 10kΩ -8 V L OUT = 10mVP-P -10 10k 100k -4 CL = 20pF CL = 1pF CL = 110pF CL = 92pF CL = 57pF CL = 32pF 1M 10M 100M 1G FREQUENCY (Hz) FIGURE 1. GAIN vs FREQUENCY FOR VARIOUS RLOAD FIGURE 2. GAIN vs FREQUENCY FOR VARIOUS CLOAD 2 1 CLOSED LOOP GAIN (dB) 0 VOUT = 1mVP-P 70 60 AV = 1000, RF = 499k, RG = 499 V+ = 5V RL = 10k VOUT = 100mVP-P -2 -3 -4 -5 -6 -7 VOUT = 10mVP-P V + = 5V AV = +1 RL = 10kΩ CL = 10pF 100k 1M 10M 100M 1G VOUT = 100mVP-P GAIN (dB) -1 VOUT = 1VP-P 50 AV = 100, RF = 49.9k, RG = 499 40 30 20 10 0 AV = 1, RF = 0, RG = INF AV = 10, RF = 4.42k, RG = 499 -8 10k -10 10k 100k 1M FREQUENCY (Hz) 10M 100M FREQUENCY (Hz) FIGURE 3. -3dB BANDWIDTH vs VOUT FIGURE 4. FREQUENCY RESPONSE vs CLOSED LOOP GAIN 1M 1M OUTPUT IMPEDANCE (Ω) INPUT IMPEDANCE (Ω) 100k 100k 10k 10k 1k V+ = 5V, 3V ENABLED AND DISABLED VSOURCE = 1VP-P 1M 10M FREQUENCY (Hz) 100M 1G 1k 100 100 V+ = 5V, 3V VSOURCE = 1VP-P 10 100k 1M 10M FREQUENCY (Hz) 100M 1G 10 100k FIGURE 5. INPUT IMPEDANCE vs FREQUENCY FIGURE 6. DISABLED OUTPUT IMPEDANCE vs FREQUENCY 5 FN6247.8 August 11, 2008 ISL28190, ISL28290 Typical Performance Curves (Continued) 100 V+ = 5V, 3V OUTPUT IMPEDANCE (Ω) 0 -10 -20 10 CMRR (dB) -30 -40 -50 -60 -70 -80 -90 -100 0.01 100k 1M 10M FREQUENCY (Hz) 100M 1G -110 1k 10k 100k 1M V+ = 5V AV = +1 RL = 10kΩ CL = 10pF VCM = 100mVP-P 10M 100M 1 0.1 FREQUENCY (Hz) FIGURE 7. ENABLED OUTPUT IMPEDANCE vs FREQUENCY FIGURE 8. CMRR vs FREQUENCY 0 -10 -20 -30 PSRR (dB) -40 -50 -60 -70 -80 -90 1k 10k 100k 1M FREQUENCY (Hz) 10M 100M V+ = 5V AV = +1 RL = 10kΩ CL = 10pF VSOURCE = 100mVP-P -10 -20 OFF ISOLATION (dB) PSRR-30 -40 -50 -60 -70 -80 10k VP-P = 10mV 100k VP-P = 1V VP-P = 100mV PSRR+ V+ = 5V AV = +1 RL = 10kΩ CL = 10pF 100M 1G 1M 10M FREQUENCY (Hz) FIGURE 9. PSRR vs FREQUENCY FIGURE 10. OFF ISOLATION vs FREQUENCY -20 -30 THD + NOISE (%) -40 CROSSTALK (dB) -50 -60 -70 -80 -90 -100 -110 -120 10k 100k 1M 10M FREQUENCY (Hz) 100M 1G VP-P = 1V 0.1 V+ = 5V RL = 10k 0.01 RF = 0, AV = 1 VOUT = 2VP-P 400Hz TO 22kHz FILTER 0.001 0.0001 0 2k 4k 6k 8k 10k 12k 14k 16k 18k 20k FREQUENCY (Hz) FIGURE 11. CHANNEL-TO-CHANNEL CROSSTALK vs FREQUENCY FIGURE 12. THD+N vs FREQUENCY 6 FN6247.8 August 11, 2008 ISL28190, ISL28290 Typical Performance Curves (Continued) 10 V+ = 5V RL = 10k RF = 0, AV = 1 FREQUENCY= 1kHz 400Hz TO 22kHz FILTER INPUT VOLTAGE NOISE (nV/√Hz) 10 1 THD + NOISE (%) 0.1 1 0.01 0.001 0.0001 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.1 0.1 1 10 100 1k 10k 100k VOUT (VP-P) FREQUENCY (Hz) FIGURE 13. THD+N @ 1kHz vs VOUT FIGURE 14. INPUT REFERRED NOISE VOLTAGE vs FREQUENCY 1000 5 EN INPUT V+ = 5V AV = +1 RL = 10kΩ CL = 10pF VIN = 1VDC CURRENT NOISE (pA/√Hz) 4 100 VOLTS (V) 10 1 3 2 ENABLE DISABLE ENABLE OUTPUT 1 0.1 1 10 100 1k 10k 100k FREQUENCY (Hz) 0 -1 0 1 TIME (µs) 2 3 4 FIGURE 15. INPUT REFERRED NOISE CURRENT vs FREQUENCY FIGURE 16. ENABLE/DISABLE TIMING 0.08 0.06 LARGE SIGNAL (V) SMALL SIGNAL (V) 0.04 0.02 0 -0.02 -0.04 -0.06 -0.08 0 20 40 60 V+ = ±2.5V AV = +1 RL = 10kΩ VOUT = 100mVP-P 80 100 120 140 160 180 200 VIN VOUT 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 0 100 200 V+ = ±2.5V AV = +2 RF = RG = 499Ω RL = 10kΩ VOUT = 1VP-P 300 400 500 TIME (ns) 600 700 800 VOUT VIN TIME (ns) FIGURE 17. SMALL SIGNAL STEP RESPONSE FIGURE 18. LARGE SIGNAL (1V) STEP RESPONSE 7 FN6247.8 August 11, 2008 ISL28190, ISL28290 Typical Performance Curves (Continued) 3 2 LARGE SIGNAL (V) VIN 1 0 -1 -2 -3 V+ = ±2.5V AV = +2 RF = RG = 499Ω RL = 10kΩ VOUT = 4.7VP-P 0 400 800 1200 1600 2000 CURRENT (mA) VOUT 6.0 5.5 5.0 MEDIAN 4.5 4.0 3.5 3.0 2.5 -40 MIN n = 50 MAX -20 0 TIME (ns) 20 40 60 80 TEMPERATURE (°C) 100 120 FIGURE 19. LARGE SIGNAL (4.7V) STEP RESPONSE FIGURE 20. SUPPLY CURRENT vs TEMPERATURE, VS = ±2.5V ENABLED, RL = INF 600 500 400 300 n = 50 MAX -9 n = 50 -10 MAX IBIAS+ (µA) MEDIAN -11 -12 -13 MIN -14 -15 -40 MEDIAN MIN VOS (µV) 200 100 0 -100 -200 -300 -400 -500 -40 -20 0 20 40 60 80 100 120 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 21. VOS vs TEMPERATURE VS = ±2.5V FIGURE 22. IBIAS+ vs TEMPERATURE VS = ±2.5V -9 -10 n = 50 MAX 800 n = 50 600 400 MEDIAN IIO (nA) MAX 200 0 MEDIAN -200 MIN -400 -40 -11 IBIAS- (µA) -12 -13 -14 -15 -40 MIN -20 0 20 40 60 80 TEMPERATURE (°C) 100 120 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) FIGURE 23. IBIAS- vs TEMPERATURE VS = ±2.5V FIGURE 24. IIO vs TEMPERATURE VS = ±2.5V 8 FN6247.8 August 11, 2008 ISL28190, ISL28290 Typical Performance Curves (Continued) 140 130 MEDIAN 120 CMRR (dB) 110 100 MIN 90 80 70 PSRR (dB) n = 50 MAX 83 82 81 80 79 78 77 MIN 76 -40 -20 0 20 40 60 80 100 120 75 -40 -20 0 20 40 60 80 100 120 MEDIAN MAX n = 50 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 25. CMRR vs TEMPERATURE, VCM = 3.8V, VS = ±2.5V FIGURE 26. PSRR vs TEMPERATURE ±1.5V TO ±2.5V 4.982 4.980 4.978 4.976 VOUT (V) 4.974 4.972 4.970 4.968 4.966 4.964 4.962 -40 -20 0 20 40 60 80 100 120 MIN MEDIAN VOUT (mV) MAX n = 50 50 n = 50 45 40 35 30 25 20 15 10 -40 -20 0 20 40 60 80 100 120 MIN MEDIAN MAX TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 27. POSITIVE VOUT vs TEMPERATURE RL = 1k, VS = ±2.5V FIGURE 28. NEGATIVE VOUT vs TEMPERATURE RL = 1k, VS = ±2.5V Pin Descriptions ISL28190 ISL28190 ISL28290 ISL28290 ISL28290 (6 Ld SOT-23) (6 Ld µTDFN) (10 Ld MSOP) (10 Ld µTQFN) (8 Ld SOIC) 4 2 2 (A) 8 (B) 1 (A) 7 (B) 2 (A) 6 (B) PIN NAME ININ-_A IN-_B FUNCTION Inverting input EQUIVALENT CIRCUIT V+ IN- IN+ VCircuit 1 3 3 3 (A) 7 (B) 2 (A) 6 (B) 3 3 (A) 5 (B) 4 IN+ IN+_A IN+_B V- Non-inverting input Negative supply (See Circuit 1) 2 4 4 9 FN6247.8 August 11, 2008 ISL28190, ISL28290 Pin Descriptions (Continued) ISL28190 ISL28190 ISL28290 ISL28290 ISL28290 (6 Ld SOT-23) (6 Ld µTDFN) (10 Ld MSOP) (10 Ld µTQFN) (8 Ld SOIC) 1 1 1 (A) 9 (B) 10 (A) 8 (B) 1 (A) 7 (B) PIN NAME FUNCTION EQUIVALENT CIRCUIT V+ Output OUT OUT_A OUT_B OUT VCircuit 2 6 5 6 5 10 5 (A) 6 (B) 9 4 (A) 5 (B) 8 N/A V+ EN EN_A EN_B Positive supply Enable BAR pin internal pull-down; Logic “1” selects the disabled state; Logic “0” selects the enabled state. V+ EN VCircuit 3 Applications Information Product Description The ISL28190 and ISL28290 are voltage feedback operational amplifiers designed for communication and imaging applications requiring low distortion, very low voltage and current noise. Both parts feature high bandwidth while drawing moderately low supply current. The ISL28190 and ISL28290 use a classical voltage-feedback topology, which allows them to be used in a variety of applications where current-feedback amplifiers are not appropriate because of restrictions placed upon the feedback element used with the amplifier. external series resistor may be used to limit the current, as shown in Figure 29. R + FIGURE 29. LIMITING THE INPUT CURRENT TO LESS THAN 5mA Using Only One Channel The ISL28290 is a Dual channel op amp. If the application only requires one channel when using the ISL28290, the user must configure the unused channel to prevent it from oscillating. Oscillation can occur if the input and output pins are floating. This will result in higher than expected supply currents and possible noise injection into the channel being used. The proper way to prevent this oscillation is to short the output to the negative input and ground the positive input (as shown in Figure 30). + Enable/Power-Down The ISL28190 and ISL28290 amplifiers are disabled by applying a voltage greater than 2V to the EN pin, with respect to the V- pin. In this condition, the output(s) will be in a high impedance state and the amplifier(s) current will be reduced to 13µA/Amp. By disabling the part, multiple parts can be connected together as a MUX. The outputs are tied together in parallel and a channel can be selected by the EN pin. The EN pin also has an internal pull-down. If left open, the EN pin will pull to the negative rail and the device will be enabled by default. Input Protection All input terminals have internal ESD protection diodes to both positive and negative supply rails, limiting the input voltage to within one diode beyond the supply rails. Both parts have additional back-to-back diodes across the input terminals (as shown in Figure 29). In pulse applications where the input Slew Rate exceeds the Slew Rate of the amplifier, the possibility exists for the input protection diodes to become forward biased. This can cause excessive input current and distortion at the outputs. If overdriving the inputs is necessary, the external input current must never exceed 5mA. An FIGURE 30. PREVENTING OSCILLATIONS IN UNUSED CHANNELS Power Supply Bypassing and Printed Circuit Board Layout As with any high frequency device, good printed circuit board layout is necessary for optimum performance. Low impedance ground plane construction is essential. Surface mount components are recommended, but if leaded components are used, lead lengths should be as short as possible. The power supply pins must be well bypassed to 10 FN6247.8 August 11, 2008 ISL28190, ISL28290 reduce the risk of oscillation. The combination of a 4.7µF tantalum capacitor in parallel with a 0.01µF capacitor has been shown to work well when placed at each supply pin. For good AC performance, parasitic capacitance should be kept to a minimum, especially at the inverting input. When ground plane construction is used, it should be removed from the area near the inverting input to minimize any stray capacitance at that node. Carbon or Metal-Film resistors are acceptable with the Metal-Film resistors giving slightly less peaking and bandwidth because of additional series inductance. Use of sockets, particularly for the SO package, should be avoided if possible. Sockets add parasitic inductance and capacitance, which will result in additional peaking and overshoot. where: • PDMAXTOTAL is the sum of the maximum power dissipation of each amplifier in the package (PDMAX) • PDMAX for each amplifier can be calculated as follows: V OUTMAX PD MAX = 2*V S × I SMAX + ( V S - V OUTMAX ) × --------------------------RL (EQ. 2) where TMAX = Maximum ambient temperature • θJA = Thermal resistance of the package • PDMAX = Maximum power dissipation of 1 amplifier • VS = Supply voltage • IMAX = Maximum supply current of 1 amplifier • VOUTMAX = Maximum output voltage swing of the application • RL = Load resistance Current Limiting The ISL28190 and ISL28290 have no internal currentlimiting circuitry. If the output is shorted, it is possible to exceed the Absolute Maximum Rating for output current or power dissipation, potentially resulting in the destruction of the device. This is why output short circuit current is specified and tested with RL = 10Ω. Power Dissipation It is possible to exceed the +125°C maximum junction temperatures under certain load and power-supply conditions. It is therefore important to calculate the maximum junction temperature (TJMAX) for all applications to determine if power supply voltages, load conditions, or package type need to be modified to remain in the safe operating area. These parameters are related as follows: T JMAX = T MAX + ( θ JA xPD MAXTOTAL ) (EQ. 1) 11 FN6247.8 August 11, 2008 ISL28190, ISL28290 SOT-23 Package Family e1 A N 6 4 D MDP0038 SOT-23 PACKAGE FAMILY MILLIMETERS SYMBOL A A1 A2 SOT23-5 1.45 0.10 1.14 0.40 0.14 2.90 2.80 1.60 0.95 1.90 0.45 0.60 5 SOT23-6 1.45 0.10 1.14 0.40 0.14 2.90 2.80 1.60 0.95 1.90 0.45 0.60 6 TOLERANCE MAX ±0.05 ±0.15 ±0.05 ±0.06 Basic Basic Basic Basic Basic ±0.10 Reference Reference Rev. F 2/07 NOTES: 1. Plastic or metal protrusions of 0.25mm maximum per side are not included. A2 E1 2 3 E b c D 0.20 C 0.15 C D 2X 5 e B b NX 1 2 3 2X 0.20 M C A-B D E E1 e e1 L L1 N 0.15 C A-B 2X C SEATING PLANE 0.10 C NX D 1 3 2. Plastic interlead protrusions of 0.25mm maximum per side are not included. 3. This dimension is measured at Datum Plane “H”. 4. Dimensioning and tolerancing per ASME Y14.5M-1994. 5. Index area - Pin #1 I.D. will be located within the indicated zone (SOT23-6 only). 6. SOT23-5 version has no center lead (shown as a dashed line). A1 (L1) H A GAUGE PLANE c L 0° +3° -0° 0.25 12 FN6247.8 August 11, 2008 ISL28190, ISL28290 Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN) E 6 4 A A B L6.1.6x1.6A 6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS SYMBOL MIN 0.45 NOMINAL 0.50 0.127 REF 0.15 1.55 0.40 1.55 0.95 0.20 1.60 0.45 1.60 1.00 0.50 BSC 0.25 0.30 0.35 0.25 1.65 0.50 1.65 1.05 MAX 0.55 0.05 NOTES 4 4 Rev. 1 6/06 NOTES: 1. Dimensions are in mm. Angles in degrees. 2. Coplanarity applies to the exposed pad as well as the terminals. Coplanarity shall not exceed 0.08mm. PIN 1 REFERENCE 2X 0.15 C 1 2X 0.15 C TOP VIEW e 1.00 REF 4 6 3 D A A1 A3 A1 b D D2 L D2 CO.2 DAP SIZE 1.30 x 0.76 E E2 e L 3 E2 1 b 6X 0.10 M C A B BOTTOM VIEW DETAIL A 0.10 C 6X 0.08 C A3 SIDE VIEW C SEATING PLANE 3. Warpage shall not exceed 0.10mm. 4. Package length/package width are considered as special characteristics. 5. JEDEC Reference MO-229. 6. For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389. 0.127±0.008 0.127 +0.058 -0.008 TERMINAL THICKNESS A1 DETAIL A 0.25 0.50 1.00 0.45 1.00 2.00 0.30 1.25 LAND PATTERN 6 13 FN6247.8 August 11, 2008 ISL28190, ISL28290 Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN) D A B L10.1.8x1.4A 10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS SYMBOL MIN 0.45 NOMINAL 0.50 0.127 REF 0.15 1.75 1.35 0.20 1.80 1.40 0.40 BSC 0.35 0.45 0.40 0.50 10 2 3 0 12 0.45 0.55 0.25 1.85 1.45 MAX 0.55 0.05 NOTES 5 2 3 3 4 Rev. 3 6/06 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd and Ne refer to the number of terminals on D and E side, respectively. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Maximum package warpage is 0.05mm. 8. Maximum allowable burrs is 0.076mm in all directions. 6 INDEX AREA 2X 2X 0.10 C N E 1 0.10 C 2 A A1 TOP VIEW A3 b 0.10 C 0.05 C SEATING PLANE A1 SIDE VIEW A D C E e L L1 N (DATUM A) PIN #1 ID L1 NX L 1 2 NX b 5 10X 0.10 M C A B 0.05 M C 5 7 e BOTTOM VIEW (DATUM B) Nd Ne θ NX (b) 5 (A1) C L L SECTION "C-C" CC e TERMINAL TIP 9. JEDEC Reference MO-255. 10. For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389. 1.00 2.20 1.00 0.60 0.50 1.80 0.40 0.20 0.40 10 LAND PATTERN 0.20 14 FN6247.8 August 11, 2008 ISL28190, ISL28290 Small Outline Package Family (SO) A D N (N/2)+1 h X 45° A E E1 PIN #1 I.D. MARK c SEE DETAIL “X” 1 B (N/2) L1 0.010 M C A B e C H A2 GAUGE PLANE A1 0.004 C 0.010 M C A B b DETAIL X SEATING PLANE L 4° ±4° 0.010 MDP0027 SMALL OUTLINE PACKAGE FAMILY (SO) INCHES SYMBOL A A1 A2 b c D E E1 e L L1 h N NOTES: 1. Plastic or metal protrusions of 0.006” maximum per side are not included. 2. Plastic interlead protrusions of 0.010” maximum per side are not included. 3. Dimensions “D” and “E1” are measured at Datum Plane “H”. 4. Dimensioning and tolerancing per ASME Y14.5M-1994 SO-8 0.068 0.006 0.057 0.017 0.009 0.193 0.236 0.154 0.050 0.025 0.041 0.013 8 SO-14 0.068 0.006 0.057 0.017 0.009 0.341 0.236 0.154 0.050 0.025 0.041 0.013 14 SO16 (0.150”) 0.068 0.006 0.057 0.017 0.009 0.390 0.236 0.154 0.050 0.025 0.041 0.013 16 SO16 (0.300”) (SOL-16) 0.104 0.007 0.092 0.017 0.011 0.406 0.406 0.295 0.050 0.030 0.056 0.020 16 SO20 (SOL-20) 0.104 0.007 0.092 0.017 0.011 0.504 0.406 0.295 0.050 0.030 0.056 0.020 20 SO24 (SOL-24) 0.104 0.007 0.092 0.017 0.011 0.606 0.406 0.295 0.050 0.030 0.056 0.020 24 SO28 (SOL-28) 0.104 0.007 0.092 0.017 0.011 0.704 0.406 0.295 0.050 0.030 0.056 0.020 28 TOLERANCE MAX ±0.003 ±0.002 ±0.003 ±0.001 ±0.004 ±0.008 ±0.004 Basic ±0.009 Basic Reference Reference NOTES 1, 3 2, 3 Rev. M 2/07 15 FN6247.8 August 11, 2008 ISL28190, ISL28290 Mini SO Package Family (MSOP) 0.25 M C A B D N A (N/2)+1 MDP0043 MINI SO PACKAGE FAMILY MILLIMETERS SYMBOL A A1 MSOP8 1.10 0.10 0.86 0.33 0.18 3.00 4.90 3.00 0.65 0.55 0.95 8 MSOP10 1.10 0.10 0.86 0.23 0.18 3.00 4.90 3.00 0.50 0.55 0.95 10 TOLERANCE Max. ±0.05 ±0.09 +0.07/-0.08 ±0.05 ±0.10 ±0.15 ±0.10 Basic ±0.15 Basic Reference NOTES 1, 3 2, 3 Rev. D 2/07 NOTES: 1. Plastic or metal protrusions of 0.15mm maximum per side are not included. E E1 PIN #1 I.D. A2 b c B 1 (N/2) D E E1 e C SEATING PLANE 0.10 C N LEADS b H e L L1 N 0.08 M C A B L1 A c SEE DETAIL "X" 2. Plastic interlead protrusions of 0.25mm maximum per side are not included. 3. Dimensions “D” and “E1” are measured at Datum Plane “H”. 4. Dimensioning and tolerancing per ASME Y14.5M-1994. A2 GAUGE PLANE L DETAIL X 0.25 A1 3° ±3° All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 16 FN6247.8 August 11, 2008