ISL3155E

® ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Data Sheet January 18, 2008 FN6363.1 ±16.5kV ESD (IEC61000-4-2) Protected, Large Output Swing, 5V, Full Fail-Safe, 1/8 Unit Load, RS-485/RS-422 Transceivers The ISL315xE are BiCMOS, IEC61000 ESD protected, 5V powered, single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. Each driver output and receiver input is protected against ±16.5kV ESD strikes without latch-up. The ISL315xE transmitters all deliver exceptional differential output voltages (2.4V min), into the RS-485 required 54Ω load, for better noise immunity or to allow up to eight 120Ω terminations in “star” or other non-standard bus topologies. These devices have very low bus currents (+125µA/-75µA), so they present a true “1/8 unit load” to the RS-485 bus. This allows up to 256 transceivers on the network without violating the RS-485 specification’s 32 unit load maximum, and without using repeaters. Receiver (Rx) inputs feature a “Full Fail-Safe” design, which ensures a logic high Rx output if Rx inputs are floating, shorted, or on a terminated but undriven bus. Rx outputs feature high drive levels - typically 28mA @ VOL = 1V (to ease the design of optocoupled isolated interfaces). The ISL3150E, ISL3152E, ISL3153E, ISL3155E utilize slew rate limited drivers which reduce EMI, and minimize reflections from improperly terminated transmission lines, or unterminated stubs in multidrop and multipoint applications. Hot Plug circuitry ensures that the Tx and Rx outputs remain in a high impedance state until the power supply has stabilized, and the Tx outputs are fully short circuit protected. The ISL3150E, ISL3153E, ISL3156E are configured for full duplex applications. The half duplex versions multiplex the Rx inputs and Tx outputs to allow transceivers with output disable functions in 8 Ld packages. Features • High Driver VOD . . . . . . . . . . . . . . 2.4V (Min) @ RD = 54Ω Better Noise Immunity, or Drive Up to 8 Terminations • IEC61000 ESD Protection on RS-485 I/O Pins . . ±16.5kV - Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM • Tiny MSOP Packages Save 50% Board Space • Full Fail-safe (Open, Short, Terminated and Undriven) Receivers • High Rx IOL to Drive Opto-Couplers for Isolated Applications • Hot Plug Circuitry - Tx and Rx Outputs Remain Three-State During Power-up/Power-down • True 1/8 Unit Load Allows up to 256 Devices on the Bus • Specified for Single 5V, 10% Tolerance, Supplies • High Data Rates . . . . . . . . . . . . . . . . . . . . . up to 20Mbps • Low Quiescent Supply Current . . . . . . . . . . . . . . . 600µA Ultra Low Shutdown Supply Current . . . . . . . . . . . . 70nA • -7V to +12V Common Mode Input Voltage Range • Half and Full Duplex Pinouts • Pb-free (RoHS compliant) • Three-State Rx and Tx Outputs • Current Limiting and Thermal Shutdown for Driver Overload Protection Applications • Utility Meters and Automated Meter Reading Systems • High Node Count Systems • PROFIBUS® and Field Bus Networks, and Factory Automation • Security Camera Networks • Building Lighting and Environmental Control Systems • Industrial/Process Control Networks TABLE 1. SUMMARY OF FEATURES PART NUMBER ISL3150E ISL3152E ISL3153E ISL3155E ISL3156E ISL3158E HALF/FULL DATA RATE DUPLEX (Mbps) Full Half Full Half Full Half 0.115 0.115 1 1 20 20 SLEW-RATE # DEVICES LIMITED? HOT PLUG ON BUS Yes Yes Yes Yes No No Yes Yes Yes Yes Yes Yes 256 256 256 256 256 256 Rx/Tx ENABLE? Yes Yes Yes Yes Yes Yes QUIESCENT ICC (μA) 600 600 600 600 600 600 LOW POWER SHUTDOWN? Yes Yes Yes Yes Yes Yes PIN COUNT 10, 14 8 10, 14 8 10, 14 8 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2004-2006, 2008. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Pinouts ISL3152E, ISL3155E, ISL3158E (8 LD MSOP, 8 LD SOIC, 8 LD PDIP) TOP VIEW RO 1 RE 2 DE 3 DI 4 D 8 7 6 5 VCC B/Z A/Y GND ISL3150E, ISL3153E, ISL3156E (10 LD MSOP) TOP VIEW ISL3150E, ISL3153E, ISL3156E (14 LD SOIC) TOP VIEW NC 1 RO 2 R RE 3 DE 4 DI 5 GND 6 GND 7 D 12 A 11 B 10 Z 9Y 8 NC 14 VCC 13 NC R RO 1 R RE 2 DE 3 DI 4 GND 5 D 10 VCC 9A 8B 7Z 6Y Ordering Information PART NUMBER (Note) ISL3150EIBZ* ISL3150EIUZ* ISL3152EIBZ* ISL3152EIPZ ISL3152EIUZ* ISL3153EIBZ* ISL3153EIUZ* ISL3155EIBZ* ISL3155EIUZ* ISL3156EIBZ* ISL3156EIUZ* ISL3158EIBZ* ISL3158EIUZ* PART MARKING 3150EIBZ 3150Z 3152EIBZ ISL3152 EIPZ 3152Z 3153EIBZ 3153Z 3155EIBZ 3155Z 3156EIBZ 3156Z 3158EIBZ 3158Z TEMP. RANGE (°C) -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 PACKAGE (Pb-Free) 14 Ld SOIC 10 Ld MSOP 8 Ld SOIC 8 Ld PDIP** 8 Ld MSOP 14 Ld SOIC 10 Ld MSOP 8 Ld SOIC 8 Ld MSOP 14 Ld SOIC 10 Ld MSOP 8 Ld SOIC 8 Ld MSOP PKG. DWG. # M14.15 M10.118 M8.15 E8.3 M8.118 M14.15 M10.118 M8.15 M8.118 M14.15 M10.118 M8.15 M8.118 *Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications. **Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Truth Tables TRANSMITTING INPUTS RE X X 0 1 DE 1 1 0 0 DI 1 0 X X Z 0 1 High-Z High-Z* OUTPUTS Y 1 0 High-Z High-Z* 0 0 0 1 1 RE RECEIVING INPUTS DE DE Half Duplex Full Duplex 0 0 0 0 1 X X X 0 1 A-B ≥ -0.05V ≤ -0.2V Inputs Open/Shorted X X OUTPUT RO 1 0 1 High-Z* High-Z NOTE: *Shutdown Mode (See Note 7). NOTE: *Shutdown Mode (See Note 7). Pin Descriptions PIN RO RE DE DI GND A/Y FUNCTION Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted. Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. Ground connection. ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting receiver input and noninverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting receiver input. ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting receiver input. ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting driver output. ±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting driver output. System power supply input (4.5V to 5.5V). No Connection. B/Z A B Y Z VCC NC 3 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Typical Operating Circuit ISL3152E, ISL3155E, ISL3158E +5V + 8 VCC 1 RO 2 RE 3 DE 4 DI R B/Z A/Y 7 6 RT RT 7 6 B/Z A/Y 0.1µF 0.1µF + 8 VCC D DI 4 DE 3 RE 2 R GND 5 GND 5 RO 1 +5V D ISL3150E, ISL3153E, ISL3156E (SOIC PIN NUMBERS SHOWN) +5V + 14 VCC 2 RO 3 RE 4 DE Z 10 5 DI D GND 6, 7 Y9 RT 11 B 12 A GND 6, 7 R R A 12 B 11 0.1µF RT 0.1µF + 14 9Y 10 Z VCC D DI 5 DE 4 RE 3 RO 2 +5V 4 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Absolute Maximum Ratings VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V) Input/Output Voltages A/Y, B/Z, A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V A/Y, B/Z, A, B, Y, Z (Transient Pulse Through 100Ω) . . . . . . ±25V RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table Thermal Information Thermal Resistance (Typical, Note 1) θJA (°C/W) 8 Ld SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 8 Ld MSOP, PDIP* . . . . . . . . . . . . . . . . . . . . . . . . . . 140 10 Ld MSOP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 14 Ld SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 Maximum Junction Temperature (Plastic Package) . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTE: 1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 2). SYMBOL TEST CONDITIONS TEMP MIN (°C) (Note 10) TYP MAX (Note 10) UNITS PARAMETER DC CHARACTERISTICS Driver Differential VOUT (No load) Driver Differential VOUT (Loaded) VOD1 VOD2 RL = 100Ω (RS-422) (Figure 1A) RL = 54Ω (RS-485) (Figure 1A) RL = 15Ω (Eight 120Ω terminations) (Note 11) RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) Full Full Full 25 Full Full 2.8 2.4 2.4 - 3.6 3.1 1.65 3 0.01 VCC VCC 0.2 V V V V V V Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States Logic Input High Voltage Logic Input Low Voltage DI Input Hysteresis Voltage Logic Input Current Input Current (A, B, A/Y, B/Z) ΔVOD RL = 54Ω or 100Ω (Figure 1A) VOC ΔVOC RL = 54Ω or 100Ω (Figure 1A) RL = 54Ω or 100Ω (Figure 1A) Full Full - 0.01 3.15 0.2 V V VIH VIL VHYS IIN1 IIN2 DE, DI, RE DE, DI, RE Full Full 25 2 -2 -75 -40 -20 100 70 55 1 -9 1 -9 0.8 2 125 40 20 - V V mV µA µA µA µA µA µA µA DE, DI, RE DE = 0V, VCC = 0V or 5.5V VIN = 12V VIN = -7V Full Full Full Full Full Full Full Output Leakage Current (Y, Z) (Full Duplex Versions Only) Output Leakage Current (Y, Z) in Shutdown Mode (Full Duplex) IIN3 RE = 0V, DE = 0V, VCC = 0V or 5.5V VIN = 12V VIN = -7V IIN4 RE = VCC, DE = 0V, VCC = VIN = 12V 0V or 5.5V VIN = -7V 5 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 2). (Continued) SYMBOL IOSD1 VTH ΔVTH VOH VOL IOL IOZR RIN IOSR TEST CONDITIONS DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 4) -7V ≤ VCM ≤ 12V VCM = 0V IO = -8mA, VID = -50mV IO = -8mA, VID = -200mV VO = 1V, VID = -200mV 0.4V ≤ VO ≤ 2.4V -7V ≤ VCM ≤ 12V 0V ≤ VO ≤ VCC TEMP MIN (°C) (Note 10) Full Full 25 Full Full Full Full Full Full -200 VCC - 1.2 20 -1 96 ±7 TYP -90 20 4.3 0.25 28 0.03 160 65 MAX (Note 10) UNITS ±250 -50 0.4 1 ±85 mA mV mV V V mA µA kΩ mA PARAMETER Driver Short-Circuit Current, VO = High or Low Receiver Differential Threshold Voltage Receiver Input Hysteresis Receiver Output High Voltage Receiver Output Low Voltage Receiver Output Low Current Three-State (High Impedance) Receiver Output Current Receiver Input Resistance Receiver Short-Circuit Current SUPPLY CURRENT No-Load Supply Current (Note 3) ICC Half Duplex Versions, DE = VCC, RE = X, DI = 0V or VCC All Versions, DE = 0V, RE = 0V, or Full Duplex Versions, DE = VCC, RE = X. DI = 0V or VCC Full Full Full - 650 550 0.07 800 700 3 µA µA µA Shutdown Supply Current ESD PERFORMANCE RS-485 Pins (A, Y, B, Z, A/Y, B/Z) ISHDN DE = 0V, RE = VCC, DI = 0V or VCC IEC61000-4-2, Air-Gap Discharge Method 1/2 Duplex Full Duplex 25 25 25 25 25 25 - ±16.5 ±10 ±9 ±16.5 ±7 400 - kV kV kV kV kV V IEC61000-4-2, Contact Discharge Method Human Body Model, From Bus Pins to GND All Pins Human Body Model, per MIL-STD-883 Method 3015 Machine Model DRIVER SWITCHING CHARACTERISTICS (115kbps Versions; ISL3150E, ISL3152E) Driver Differential Output Delay Driver Differential Output Skew Driver Differential Rise or Fall Time Maximum Data Rate Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output Low Driver Disable from Output High Time to Shutdown Driver Enable from Shutdown to Output High Driver Enable from Shutdown to Output Low tPLH, tPHL tSKEW tR, tF fMAX tZH tZL tLZ tHZ tSHDN RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) CD = 820pF (Figure 4) RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Note 5) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Note 5) RL = 500Ω, CL = 15pF, SW = VCC (Figure 3) RL = 500Ω, CL = 15pF, SW = GND (Figure 3) (Note 7) Full Full Full Full Full Full Full Full Full Full Full 500 700 115 60 - 970 12 1100 2000 300 130 50 35 160 - 1300 50 1600 600 500 65 60 600 250 250 ns ns ns kbps ns ns ns ns ns ns ns tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Notes 7, 8) tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Notes 7, 8) 6 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 2). (Continued) SYMBOL TEST CONDITIONS TEMP MIN (°C) (Note 10) TYP MAX (Note 10) UNITS PARAMETER DRIVER SWITCHING CHARACTERISTICS (1Mbps Versions; ISL3153E, ISL3155E) Driver Differential Output Delay Driver Differential Output Skew Driver Differential Rise or Fall Time Maximum Data Rate Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output Low Driver Disable from Output High Time to Shutdown Driver Enable from Shutdown to Output High Driver Enable from Shutdown to Output Low tPLH, tPHL tSKEW tR, tF fMAX tZH tZL tLZ tHZ tSHDN RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) CD = 820pF (Figure 4) RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Note 5) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Note 5) RL = 500Ω, CL = 15pF, SW = VCC (Figure 3) RL = 500Ω, CL = 15pF, SW = GND (Figure 3) (Note 7) Full Full Full Full Full Full Full Full Full Full Full 150 150 1 60 270 3 325 8 110 60 50 35 160 400 10 450 200 200 65 60 600 250 250 ns ns ns Mbps ns ns ns ns ns ns ns tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Notes 7, 8) tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Notes 7, 8) DRIVER SWITCHING CHARACTERISTICS (20Mbps Versions; ISL3156E, ISL3158E) Driver Differential Output Delay Driver Differential Output Skew Driver Differential Rise or Fall Time Maximum Data Rate Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output Low Driver Disable from Output High Time to Shutdown Driver Enable from Shutdown to Output High Driver Enable from Shutdown to Output Low tPLH, tPHL tSKEW tR, tF fMAX tZH tZL tLZ tHZ tSHDN RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) RDIFF = 54Ω, CL = 100pF (Figure 2) CD = 470pF (Figure 4) RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Note 5) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Note 5) RL = 500Ω, CL = 15pF, SW = VCC (Figure 3) RL = 500Ω, CL = 15pF, SW = GND (Figure 3) (Note 7) Full Full Full Full Full Full Full Full Full Full Full 20 60 21 0.2 12 55 30 28 50 38 160 30 3 16 45 45 65 60 600 200 200 ns ns ns Mbps ns ns ns ns ns ns ns tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND (Figure 3), (Notes 7, 8) tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3), (Notes 7, 8) RECEIVER SWITCHING CHARACTERISTICS (115kbps and 1Mbps Versions; ISL3150E through ISL3155E) Maximum Data Rate Receiver Input to Output Delay Receiver Skew | tPLH - tPHL | Receiver Enable to Output Low Receiver Enable to Output High Receiver Disable from Output Low Receiver Disable from Output High fMAX (Figure 5) Full Full Full Full Full Full Full 1 12 100 4 9 7 8 8 150 10 20 20 15 15 Mbps ns ns ns ns ns ns tPLH, tPHL (Figure 5) tSKD tZL tZH tLZ tHZ (Figure 5) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Note 6) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Note 6) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6) 7 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C (Note 2). (Continued) SYMBOL tSHDN (Note 7) TEST CONDITIONS TEMP MIN (°C) (Note 10) Full Full Full 60 TYP 160 MAX (Note 10) UNITS 600 200 200 ns ns ns PARAMETER Time to Shutdown Receiver Enable from Shutdown to Output High Receiver Enable from Shutdown to Output Low tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Notes 7, 9) tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 7, 9) RECEIVER SWITCHING CHARACTERISTICS (20Mbps Versions; ISL3156E, ISL3158E) Maximum Data Rate Receiver Input to Output Delay Receiver Skew | tPLH - tPHL | Receiver Enable to Output Low Receiver Enable to Output High Receiver Disable from Output Low Receiver Disable from Output High Time to Shutdown Receiver Enable from Shutdown to Output High Receiver Enable from Shutdown to Output Low NOTES: 2. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 3. Supply current specification is valid for loaded drivers when DE = 0V. 4. Applies to peak current. See “Typical Performance Curves” beginning on page 13 for more information. 5. Keep RE = 0 to prevent the device from entering SHDN. 6. The RE signal high time must be short enough (typically 600ns to ensure that the device enters SHDN. 9. Set the RE signal high time >600ns to ensure that the device enters SHDN. 10. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested. 11. See Figure 8 for more information, and for performance over-temperature. fMAX (Figure 5) Full Full Full Full Full Full Full Full Full Full 20 60 30 33 2.5 8 7 8 8 160 45 5 15 15 15 15 600 200 200 Mbps ns ns ns ns ns ns ns ns ns tPLH, tPHL (Figure 5) tSKD tZL tZH tLZ tHZ tSHDN (Figure 5) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Note 6) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Note 6) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6) (Note 7) tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Notes 7, 9) tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 7, 9) 8 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Test Circuits and Waveforms VCC DE DI D Y Z VOD RL/2 VCC 375Ω DE DI D Y Z VOD RL = 60Ω VCM -7V TO +12V 375Ω RL/2 VOC FIGURE 1A. VOD AND VOC FIGURE 1B. VOD WITH COMMON MODE LOAD FIGURE 1. DC DRIVER TEST CIRCUITS 3V DI 1.5V 1.5V 0V tPLH OUT (Z) DE DI D Y SIGNAL GENERATOR Z RDIFF CL = 100pF DIFF OUT (Y - Z) tR 90% 10% CL = 100pF OUT (Y) tPHL VOH VOL VCC 90% 10% tF +VOD -VOD SKEW = |tPLH - tPHL| FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE DI D SIGNAL GENERATOR Y CL SW Z 500Ω VCC GND DE NOTE 7 tZH, tZH(SHDN) tHZ VOH - 0.5V OUT (Y, Z) 2.3V 0V tZL, tZL(SHDN) NOTE 7 OUT (Y, Z) tLZ VCC 2.3V OUTPUT LOW VOL + 0.5V V OL VOH 1.5V 1.5V 0V 3V PARAMETER OUTPUT tHZ tLZ tZH tZL tZH(SHDN) tZL(SHDN) Y/Z Y/Z Y/Z Y/Z Y/Z Y/Z RE X X 0 (Note 5) 0 (Note 5) 1 (Note 8) 1 (Note 8) DI 1/0 0/1 1/0 0/1 1/0 0/1 SW GND VCC GND VCC GND VCC CL (pF) 15 15 100 100 100 100 NOTE 7 OUTPUT HIGH FIGURE 3A. TEST CIRCUIT FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER ENABLE AND DISABLE TIMES 9 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Test Circuits and Waveforms (Continued) 3V VCC DE + DI 0V DI D Z 60Ω Y CD VOD - SIGNAL GENERATOR DIFF OUT (Y - Z) -VOD +VOD 0V FIGURE 4A. TEST CIRCUIT FIGURE 4. DRIVER DATA RATE FIGURE 4B. MEASUREMENT POINTS +1.5V A RE 0V B A R 15pF RO tPLH 1.5V tPHL VCC RO SIGNAL GENERATOR 1.5V 0V 0V 0V -1.5V FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS FIGURE 5. RECEIVER PROPAGATION DELAY AND DATA RATE RE GND SIGNAL GENERATOR B A R RO 1kΩ SW 15pF RE 1.5V 1.5V 0V VCC GND NOTE 7 3V PARAMETER tHZ tLZ tZH (Note 6) tZL (Note 6) tZH(SHDN) (Note 9) tZL(SHDN) (Note 9) DE 0 0 0 0 0 0 A +1.5V -1.5V +1.5V -1.5V +1.5V -1.5V SW GND VCC GND VCC GND VCC tZH, tZH(SHDN) NOTE 7 RO OUTPUT HIGH tHZ VOH - 0.5V 1.5V 0V VOH tZL, tZL(SHDN) NOTE 7 RO 1.5V tLZ VCC VOL + 0.5V V OL OUTPUT LOW FIGURE 6A. TEST CIRCUIT FIGURE 6B. MEASUREMENT POINTS FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES 10 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Application Information RS-485 and RS-422 are differential (balanced) data transmission standards used for long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 specification requires that drivers must handle bus contention without sustaining any damage. Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for runs as long as 4000’, so the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. The 115kbps and 1Mbps driver outputs are slew rate limited to minimize EMI, and to minimize reflections in unterminated or improperly terminated networks. Outputs of the ISL3156Eand ISL3158E drivers are not limited, so faster output transition times allow data rates of at least 20Mbps High VOD Improves Noise Immunity and Flexibility The ISL315xE driver design delivers larger differential output voltages (VOD) than the RS-485 standard requires, or than most RS-485 transmitters can deliver. The minimum ±2.4V VOD guarantees at least ±900mV more noise immunity than networks built using standard 1.5V VOD transmitters. Another advantage of the large VOD is the ability to drive more than two bus terminations, which allows for utilizing the ISL315xE in “star” and other multi-terminated, “non-standard” network topologies. Figure 8, details the transmitter’s VOD vs IOUT characteristic, and includes load lines for six (20Ω) and eight (15Ω) 120Ω terminations. The figure shows that the driver typically delivers 1.65/1.5V into 6/8 terminations, even at the worst case temperature of +85°C.The RS-485 standard requires a minimum 1.5V VOD into two terminations, but the ISL315xE delivers RS-485 voltage levels with 3x to 4x the number of terminations. Receiver (Rx) Features These devices utilize a differential input receiver for maximum noise immunity and common mode rejection. Input sensitivity is better than ±200mV, as required by the RS-422 and RS-485 specifications. Rx outputs feature high drive levels (typically 28mA @ VOL = 1V to ease the design of optically coupled isolated interfaces). Receiver input resistance of 96kΩ surpasses the RS-422 specification of 4kΩ, and is eight times the RS-485 “Unit Load (UL)” requirement of 12kΩ minimum. Thus, these products are known as “one-eighth UL” transceivers, and there can be up to 256 of these devices on a network while still complying with the RS-485 loading specification. Rx inputs function with common mode voltages as great as ±7V outside the power supplies (i.e., +12V and -7V), making them ideal for long networks where induced voltages are a realistic concern. All the receivers include a “full fail-safe” function that guarantees a high level receiver output if the receiver inputs are unconnected (floating), shorted together, or connected to a terminated bus with all the transmitters disabled. Receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs are three-statable via the active low RE input. Hot Plug Function When a piece of equipment powers up, there is a period of time where the processor or ASIC driving the RS-485 control lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. To avoid this scenario, the ISL315xE devices incorporate a “Hot Plug” function. Circuitry monitoring VCC ensures that, during power-up and power-down, the Tx and Rx outputs remain disabled, regardless of the state of DE and RE, if VCC is less than ~3.4V. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. DE, DI = VCC RE = GND 5.0 3.5V VCC DRIVER Y OUTPUT (V) 0 5.0 2.5 0 RL = 1kΩ RO ISL315xE 0 5.0 2.5 RECEIVER OUTPUT (V) A /Y ISL315xE RL = 1kΩ 3.3V 2.5 Driver (Tx) Features The RS-485/RS-422 driver is a differential output device that delivers at least 2.4V across a 54Ω load (RS-485), and at least 2.8V across a 100Ω load (RS-422). The drivers feature low propagation delay skew to maximize bit width, and to minimize EMI, and all drivers are three-statable via the active high DE input. 11 TIME (40µs/DIV) FIGURE 7. HOT PLUG PERFORMANCE (ISL315xE) vs ISL83088E WITHOUT HOT PLUG CIRCUITRY FN6363.1 January 18, 2008 VCC (V) ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E ESD Protection All pins on these devices include class 3 (>7kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of ±16.5kV HBM and ±16.5kV (1/2 duplex) IEC61000-4-2. The RS-485 pins are particularly vulnerable to ESD strikes because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the RS-485 common mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. Twisted pair is the cable of choice for RS-485/RS-422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. Proper termination is imperative, when using the 20Mbps devices, to minimize reflections. Short networks using the 115kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. IEC61000-4-2 Testing The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-485 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The IEC61000 standard’s lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-485 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-485 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. The ISL315xE 1/2 duplex RS-485 pins withstand ±16.5kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±9kV. The RS-485 pins of all the ISL315xE versions survive ±9kV contact discharges. Built-In Driver Overload Protection As stated previously, the RS-485 specification requires that drivers survive worst case bus contentions undamaged. These devices meet this requirement via driver output short circuit current limits, and on-chip thermal shutdown circuitry. The driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the RS-485 specification, even at the common mode voltage range extremes. In the event of a major short circuit condition, devices also include a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically re-enable after the die temperature drops about 15°. If the contention persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown. Low Power Shutdown Mode These CMOS transceivers all use a fraction of the power required by their bipolar counterparts, but they also include a shutdown feature that reduces the already low quiescent ICC to a 70nA trickle. These devices enter shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 600ns. Disabling both the driver and the receiver for less than 60ns guarantees that the transceiver will not enter shutdown. Note that receiver and driver enable times increase when the transceiver enables from shutdown. Refer to Notes 5, 6, 7, 8 and 9, at the end of the “Electrical Specification” table on page 8, for more information. Data Rate, Cables, and Terminations RS-485/RS-422 are intended for network lengths up to 4000’, but the maximum system data rate decreases as the transmission length increases. Devices operating at 20Mbps are limited to lengths less than 100’, while the 115kbps versions can operate at full data rates with lengths of several 1000’. 12 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Typical Performance Curves 140 +25°C +85°C DIFFERENTIAL OUTPUT VOLTAGE (V) DRIVER OUTPUT CURRENT (mA) 130 120 110 100 90 80 70 60 50 40 30 20 10 0 0 1 2 3 4 DIFFERENTIAL OUTPUT VOLTAGE (V) 5 R D = 1 5Ω RD = 20 Ω RD = 100Ω RD = 54Ω VCC = 5V, TA = +25°C; Unless Otherwise Specified. 3.7 3.6 RDIFF = 100Ω 3.5 3.4 3.3 3.2 3.1 3.0 2.9 -40 RDIFF = 54Ω -25 0 25 TEMPERATURE (°C) 50 75 85 FIGURE 8. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE FIGURE 9. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 200 150 Y OR Z = LOW OUTPUT CURRENT (mA) 100 50 ICC (µA) 0 -50 660 640 DE = VCC, RE = X 620 600 580 560 540 Y OR Z = HIGH 520 500 -40 DE = GND, RE = GND -100 -150 -200 -7 -6 -4 -2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 12 -25 0 25 50 75 85 TEMPERATURE (°C) FIGURE 10. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE 1010 1005 PROPAGATION DELAY (ns) 1000 FIGURE 11. SUPPLY CURRENT vs TEMPERATURE 4 |CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑| 5 6 995 990 985 tPLH 980 975 970 965 960 -40 -25 0 25 50 75 85 tPHL 10 11 12 -40 SKEW (ns) 7 8 9 -25 0 25 50 75 85 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 12. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3150E, ISL3152E) FIGURE 13. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3150E, ISL3152E) 13 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Typical Performance Curves 290 288 PROPAGATION DELAY (ns) 286 284 282 280 278 276 274 272 270 -40 -25 0 25 50 75 85 3.5 -40 3.0 |CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑| -25 0 25 50 75 85 SKEW (ns) TEMPERATURE (°C) 2.0 1.5 VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued) 1.0 2.5 TEMPERATURE (°C) FIGURE 14. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3153E, ISL3155E) FIGURE 15. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3153E, ISL3155E) 24 23 PROPAGATION DELAY (ns) 0.10 0.12 0.14 22 21 20 19 SKEW (ns) 0.16 0.18 0.20 0.22 0.24 18 17 -40 0.26 |CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑| -25 0 25 50 75 85 0.28 -40 -25 0 25 50 75 85 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 16. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3156E, ISL3158E) FIGURE 17. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3156E, ISL3158E) DRIVER INPUT (V) RECEIVER OUTPUT (V) RECEIVER OUTPUT (V) RDIFF = 54Ω, CL = 100pF DI 5 0 5 RO 0 RDIFF = 54Ω, CL = 100pF DI 5 0 5 RO 0 DRIVER OUTPUT (V) 4 3 2 1 B /Z DRIVER OUTPUT (V) 5 5 4 3 2 1 TIME (400ns /DIV) A /Y B /Z A /Y TIME (1μs /DIV) FIGURE 18. DRIVER AND RECEIVER WAVEFORMS, (ISL3150E, ISL3152E) FIGURE 19. DRIVER AND RECEIVER WAVEFORMS, (ISL3153E, ISL3155E) 14 FN6363.1 January 18, 2008 DRIVER INPUT (V) ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Typical Performance Curves RECEIVER OUTPUT (V) DI VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued) DRIVER INPUT (V) RECEIVER OUTPUT CURRENT (mA) RDIFF = 54Ω, CL = 100pF 5 0 5 RO 0 60 VOL, +25°C 50 VOL, +85°C 40 30 VOH, +25°C 20 10 0 VOH, +85°C DRIVER OUTPUT (V) 5 4 3 2 1 TIME (20ns /DIV) A /Y B /Z 0 1 2 3 4 5 FIGURE 20. DRIVER AND RECEIVER WAVEFORMS, (ISL3156E, ISL3158E) RECEIVER OUTPUT VOLTAGE (V) FIGURE 21. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 530 PROCESS: Si Gate BiCMOS 15 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Mini Small Outline Plastic Packages (MSOP) N M8.118 (JEDEC MO-187AA) 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE E1 E INCHES SYMBOL MIN 0.037 0.002 0.030 0.010 0.004 0.116 0.116 0.187 0.016 MAX 0.043 0.006 0.037 0.014 0.008 0.120 0.120 0.199 0.028 MILLIMETERS MIN 0.94 0.05 0.75 0.25 0.09 2.95 2.95 4.75 0.40 MAX 1.10 0.15 0.95 0.36 0.20 3.05 3.05 5.05 0.70 NOTES 9 3 4 6 7 15o 6o Rev. 2 01/03 INDEX AREA -B12 TOP VIEW 0.25 (0.010) GAUGE PLANE SEATING PLANE -C4X θ R1 R 0.20 (0.008) ABC A A1 A2 b c D E1 4X θ L L1 e E L 0.026 BSC 0.65 BSC A A2 A1 -He D b 0.10 (0.004) -A0.20 (0.008) C SEATING PLANE L1 N R 0.037 REF 8 0.003 0.003 5o 0o 15o 6o 0.95 REF 8 0.07 0.07 5o 0o C a C L E1 C R1 0 SIDE VIEW α -B- 0.20 (0.008) CD END VIEW NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension “D” does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (0.004) at seating Plane. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A -H- . and - B - to be determined at Datum plane 11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only. 16 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Mini Small Outline Plastic Packages (MSOP) N M10.118 (JEDEC MO-187BA) 10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE E1 E INCHES SYMBOL MIN 0.037 0.002 0.030 0.007 0.004 0.116 0.116 0.187 0.016 MAX 0.043 0.006 0.037 0.011 0.008 0.120 0.120 0.199 0.028 MILLIMETERS MIN 0.94 0.05 0.75 0.18 0.09 2.95 2.95 4.75 0.40 MAX 1.10 0.15 0.95 0.27 0.20 3.05 3.05 5.05 0.70 NOTES 9 3 4 6 7 15o 6o Rev. 0 12/02 INDEX AREA -B12 TOP VIEW 0.25 (0.010) GAUGE PLANE SEATING PLANE -C4X θ R1 R 0.20 (0.008) ABC A A1 A2 b c D E1 4X θ L L1 e E L 0.020 BSC 0.50 BSC A A2 A1 -He D b 0.10 (0.004) -A0.20 (0.008) C SEATING PLANE L1 N R 0.037 REF 10 0.003 0.003 5o 0o 15o 6o 0.95 REF 10 0.07 0.07 5o 0o C a C L E1 C R1 θ SIDE VIEW α -B- 0.20 (0.008) CD END VIEW NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension “D” does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (.004) at seating Plane. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A -H- . and - B to be determined at Datum plane 11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only 17 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Small Outline Plastic Packages (SOIC) N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA h x 45o 0.25(0.010) M BM M14.15 (JEDEC MS-012-AB ISSUE C) 14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A L MILLIMETERS MIN 1.35 0.10 0.33 0.19 8.55 3.80 5.80 0.25 0.40 14 0o MAX 1.75 0.25 0.51 0.25 8.75 4.00 6.20 0.50 1.27 8o NOTES 9 3 4 5 6 7 Rev. 0 12/93 MIN 0.0532 0.0040 0.013 0.0075 0.3367 0.1497 0.2284 0.0099 0.016 14 0o MAX 0.0688 0.0098 0.020 0.0098 0.3444 0.1574 0.2440 0.0196 0.050 8o A1 B C D E e C α A1 0.10(0.004) e B 0.25(0.010) M C AM BS 0.050 BSC 1.27 BSC H h L N NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. α 18 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Dual-In-Line Plastic Packages (PDIP) N INDEX AREA E1 12 3 N/2 -B-AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 -CA2 L A C L E E8.3 (JEDEC MS-001-BA ISSUE D) 8 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 B B1 C D D1 E E1 e eA eB L N eA eC C A BS C MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 9.01 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 10.16 8.25 7.11 NOTES 4 4 8, 10 5 5 6 5 6 7 4 9 Rev. 0 12/93 MIN 0.015 0.115 0.014 0.045 0.008 0.355 0.005 0.300 0.240 MAX 0.210 0.195 0.022 0.070 0.014 0.400 0.325 0.280 e A1 eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 0.100 BSC 0.300 BSC 0.115 8 0.430 0.150 - 2.54 BSC 7.62 BSC 10.92 3.81 8 2.93 19 FN6363.1 January 18, 2008 ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E Small Outline Plastic Packages (SOIC) N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45° H 0.25(0.010) M BM M8.15 (JEDEC MS-012-AA ISSUE C) 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 L MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 5.80 0.25 0.40 8 8° 0° 8° MAX 1.75 0.25 0.51 0.25 5.00 4.00 6.20 0.50 1.27 NOTES 9 3 4 5 6 7 Rev. 1 6/05 MIN 0.0532 0.0040 0.013 0.0075 0.1890 0.1497 0.2284 0.0099 0.016 8 0° MAX 0.0688 0.0098 0.020 0.0098 0.1968 0.1574 0.2440 0.0196 0.050 B C D E e H C α A1 0.10(0.004) 0.050 BSC 1.27 BSC e B 0.25(0.010) M C AM BS h L N NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. α All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 20 FN6363.1 January 18, 2008