ISL3172E

® ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Data Sheet August 28, 2006 FN6307.2 ±15kV ESD Protected, 3.3V, Full Fail-safe, Low Power, High Speed or Slew Rate Limited, RS-485/RS-422 Transceivers The Intersil ISL317XE are ±15kV IEC61000 ESD Protected, 3.3V powered, single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. These devices have very low bus currents (+125μA/-100μA), so they present a true “1/8 unit load” to the RS-485 bus. This allows up to 256 transceivers on the network without violating the RS-485 specification’s 32 unit load maximum, and without using repeaters. For example, in a remote utility meter reading system, individual meter readings are routed to a concentrator via an RS-485 network, so the high allowed node count minimizes the number of repeaters required. Receiver (Rx) inputs feature a “Full Fail-Safe” design, which ensures a logic high Rx output if Rx inputs are floating, shorted, or terminated but undriven. Hot Plug circuitry ensures that the Tx and Rx outputs remain in a high impedance state while the power supply stabilizes. The ISL3170E through ISL3175E utilize slew rate limited drivers which reduce EMI, and minimize reflections from improperly terminated transmission lines, or unterminated stubs in multidrop and multipoint applications. Slew rate limited versions also include receiver input filtering to enhance noise immunity in the presence of slow input signals. The ISL3170E, ISL3171E, ISL3173E, ISL3174E, ISL3176E, ISL3177E are configured for full duplex (separate Rx input and Tx output pins) applications. The half duplex versions multiplex the Rx inputs and Tx outputs to allow transceivers with output disable functions in 8 lead packages. Features • IEC61000 ESD Protection on RS-485 I/O Pins . . . . . ±15kV - Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM • Pb-Free Plus Anneal Available (RoHS Compliant) • Full Fail-safe (Open, Short, Terminated/Floating) Receivers • Hot Plug - Tx and Rx Outputs Remain Three-state During Power-up • True 1/8 Unit Load Allows up to 256 Devices on the Bus • Single 3.3V Supply • High Data Rates . . . . . . . . . . . . . . . . . . . . . . up to 20Mbps • Low Quiescent Supply Current . . . . . . . . . . .800μA (Max) - Ultra Low Shutdown Supply Current . . . . . . . . . . .10nA • -7V to +12V Common Mode Input/Output Voltage Range • Half and Full Duplex Pinouts • Three State Rx and Tx Outputs Available • Current Limiting and Thermal Shutdown for driver Overload Protection • Tiny MSOP Packages Consume 50% Less Board Space Applications • Automated Utility Meter Reading Systems • High Node Count Systems • Field Bus Networks • Security Camera Networks • Building Environmental Control/ Lighting Systems • Industrial/Process Control Networks TABLE 1. SUMMARY OF FEATURES PART NUMBER ISL3170E ISL3171E ISL3172E ISL3173E ISL3174E ISL3175E ISL3176E ISL3177E ISL3178E HALF/FULL DATA RATE SLEW-RATE DUPLEX (Mbps) LIMITED? FULL FULL HALF FULL FULL HALF FULL FULL HALF 0.25 0.25 0.25 0.5 0.5 0.5 20 20 20 YES YES YES YES YES YES NO NO NO HOT PLUG? YES YES YES YES YES YES YES YES YES # DEVICES ON BUS 256 256 256 256 256 256 256 256 256 RX/TX ENABLE? YES NO YES YES NO YES YES NO YES QUIESCENT ICC (μA) 510 510 510 510 510 510 510 510 510 LOW POWER SHUTDOWN? YES NO YES YES NO YES YES NO YES PIN COUNT 10, 14 8 8 10, 14 8 8 10, 14 8 8 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2006. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Pinouts ISL3172E, ISL3175E, ISL3178E (MSOP, SOIC) TOP VIEW RO 1 RE 2 DE 3 DI 4 D 8 7 6 5 VCC B/Z A/Y GND ISL3171E, ISL3174E, ISL3177E (MSOP, SOIC) TOP VIEW VCC 1 RO 2 DI 3 GND 4 D 8 7 6 5 A B Z Y R R ISL3170E, ISL3173E, ISL3176E (MSOP) TOP VIEW RO 1 R RE 2 DE 3 DI 4 GND 5 D 10 VCC 9A 8B 7Z 6Y ISL3170E, ISL3173E, ISL3176E (SOIC) TOP VIEW NC 1 RO 2 RE 3 DE 4 DI 5 GND 6 GND 7 D R 14 VCC 13 NC 12 A 11 B 10 Z 9Y 8 NC Ordering Information (Notes 1, 2) PART NUMBER ISL3170EIBZ ISL3170EIUZ ISL3171EIBZ ISL3171EIUZ ISL3172EIBZ ISL3172EIUZ ISL3173EIBZ ISL3173EIUZ ISL3174EIBZ ISL3174EIUZ ISL3175EIBZ ISL3175EIUZ ISL3176EIBZ ISL3176EIUZ ISL3177EIBZ ISL3177EIUZ ISL3178EIBZ ISL3178EIUZ NOTES: 1. Units also available in Tape and Reel; Add “-T” to suffix. 2. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. PART MARKING 3170EIBZ 3170Z 3171EIBZ 3171Z 3172EIBZ 3172Z 3173EIBZ 3173Z 3174EIBZ 3174Z 3175EIBZ 3175Z 3176EIBZ 3176Z 3177EIBZ 3177Z 3178EIBZ 3178Z TEMP. RANGE (°C) -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +85 PACKAGE (Pb-Free) 14 Ld SOIC 10 Ld MSOP 8 Ld SOIC 8 Ld MSOP 8 Ld SOIC 8 Ld MSOP 14 Ld SOIC 10 Ld MSOP 8 Ld SOIC 8 Ld MSOP 8 Ld SOIC 8 Ld MSOP 14 Ld SOIC 10 Ld MSOP 8 Ld SOIC 8 Ld MSOP 8 Ld SOIC 8 Ld MSOP PKG. DWG. # M14.15 M10.118 M8.15 M8.118 M8.15 M8.118 M14.15 M10.118 M8.15 M8.118 M8.15 M8.118 M14.15 M10.118 M8.15 M8.118 M8.15 M8.118 2 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Truth Tables TRANSMITTING INPUTS RE X X 0 1 DE 1 1 0 0 DI 1 0 X X Z 0 1 High-Z High-Z * OUTPUTS Y 1 0 High-Z High-Z * 1 1 0 1 0 1 RE 0 0 0 RECEIVING INPUTS DE DE Half Duplex Full Duplex 0 0 0 X X X A-B ≥ -0.05V ≤ -0.2V Inputs Open/Shorted X X OUTPUT RO 1 0 1 High-Z * High-Z NOTE: *Shutdown Mode (See Note 9), except for ISL3171E, ISL3174E, ISL3177E NOTE: *Shutdown Mode (See Note 9), except for ISL3171E, ISL3174E, ISL3177E Pin Descriptions PIN RO RE FUNCTION Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted. Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. If the Rx enable function isn’t used, connect RE directly to GND or through a 1kΩ to 3kΩ resistor to GND. Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the Tx enable function isn’t used, connect DE to VCC through a 1kΩ to 3kΩ resistor. Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. Ground connection. ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. ±15kV IEC61000 ESD Protected RS-485/422 level, Inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input. ±15kV IEC61000 ESD Protected RS-485/422 level, inverting receiver input. ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting driver output. ±15kV IEC61000 ESD Protected RS-485/422 level, inverting driver output. System power supply input (3.0V to 3.6V). No Connection. DE DI GND A/Y B/Z A B Y Z VCC NC 3 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Typical Operating Circuits ISL3172E, ISL3175E, ISL3178E +3.3V + 8 VCC 1 RO 2 RE 3 DE 4 DI D GND 5 GND 5 R B/Z A/Y 7 6 RT RT 7 6 B/Z A/Y R 0.1μF 0.1μF + 8 VCC D DI 4 DE 3 RE 2 RO 1 +3.3V ISL3171E, ISL3174E, ISL3177E +3.3V + 1 VCC A8 2 RO R B7 RT 5 6 Y Z D DI 3 0.1μF 0.1μF + 1 VCC +3.3V Z6 3 DI D GND 4 Y5 RT 7B 8A GND 4 R RO 2 ISL3170E, ISL3173E, ISL3176E +3.3V + 14 VCC 2 RO 3 RE 4 DE Z 10 5 DI D GND 6, 7 Y9 RT 11 B 12 A GND 6, 7 R R A 12 B 11 0.1μF RT (PIN NUMBERS FOR SOIC) 0.1μF + 14 9Y 10 Z VCC D DI 5 DE 4 RE 3 RO 2 +3.3V3 4 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Absolute Maximum Ratings VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input/Output Voltages A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table Thermal Information Thermal Resistance (Typical, Note 3) θJA (°C/W) 8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . +105 8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . . +140 10 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . +190 14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . +128 Maximum Junction Temperature (Plastic Package) . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C (Lead Tips Only) Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 3. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, Note 4 SYMBOL TEST CONDITIONS TEMP (°C) MIN TYP MAX UNITS PARAMETER DC CHARACTERISTICS Driver Differential VOUT VOD RL = 100Ω (RS-422) (Figure 1A, Note 15) RL = 54Ω (RS-485) (Figure 1A) No Load RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) Full Full 2 1.5 - 2.3 2 2.2 0.01 VCC VCC 0.2 V V Full Full 1.5 - V V Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States Logic Input High Voltage Logic Input Low Voltage Logic Input Hysteresis Logic Input Current Input Current (A, B, A/Y, B/Z) ΔVOD RL = 54Ω or 100Ω (Figure 1A) VOC ΔVOC RL = 54Ω or 100Ω (Figure 1A) RL = 54Ω or 100Ω (Figure 1A) Full Full - 2 0.01 3 0.2 V V VIH VIL VHYS IIN1 IIN2 DI, DE, RE DI, DE, RE DE, RE (Note 14) DI = DE = RE = 0V or VCC (Note 17) DE = 0V, VCC = 0V or 3.6V RE = 0V, DE = 0V, VCC = 0V or 3.6V RE = VCC, DE = 0V, VCC = 0V or 3.6V VIN = 12V VIN = -7V VIN = 12V VIN = -7V VIN = 12V VIN = -7V Full Full 25 Full Full Full Full Full Full Full Full Full 25 Full 2 -2 -100 -40 -40 -200 VCC - 0.6 100 80 -50 10 -10 10 -10 -125 15 - 0.8 2 125 40 40 ±250 -50 - V V mV μA μA μA μA μA μA μA mA mV mV V Output Leakage Current (Y, Z) (Full Duplex Versions Only, Note 12) Output Leakage Current (Y, Z) in Shutdown Mode (Full Duplex, Note 12) Driver Short-Circuit Current, VO = High or Low Receiver Differential Threshold Voltage Receiver Input Hysteresis Receiver Output High Voltage IIN3 IIN4 IOSD1 VTH ΔVTH VOH DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 6) -7V ≤ VCM ≤ 12V VCM = 0V IO = -4mA, VID = -50mV 5 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, Note 4 (Continued) SYMBOL VOL IOZR RIN IOSR TSD TEST CONDITIONS IO = -4mA, VID = -200mV 0.4V ≤ VO ≤ 2.4V -7V ≤ VCM ≤ 12V 0V ≤ VO ≤ VCC TEMP (°C) Full Full Full Full Full MIN -1 96 ±7 TYP 0.17 0.015 150 30 150 MAX 0.4 1 ±60 UNITS V μA kΩ mA °C PARAMETER Receiver Output Low Voltage Three-State (high impedance) Receiver Output Current (Note 12) Receiver Input Resistance Receiver Short-Circuit Current Thermal Shutdown Threshold SUPPLY CURRENT No-Load Supply Current (Note 5) ICC DI = 0V or VCC DE = VCC, RE = 0V or VCC DE = 0V, RE = 0V Full Full Full - 510 480 0.01 800 700 12 μA μA μA Shutdown Supply Current (Note 12) ESD PERFORMANCE RS-485 Pins (A, Y, B, Z, A/Y, B/Z) ISHDN DE = 0V, RE = VCC, DI = 0V or VCC IEC61000-4-2, Air-Gap Discharge Method IEC61000-4-2, Contact Discharge Method Human Body Model, From Bus Pins to GND 25 25 25 25 25 - ±15 ±8 ±15 ±7 200 - kV kV kV kV V All Pins HBM, per MIL-STD-883 Method 3015 MM DRIVER SWITCHING CHARACTERISTICS (ISL3170E, ISL3171E, ISL3172E, 250kbps) Maximum Data Rate Driver Differential Output Delay Driver Differential Output Skew Driver Differential Rise or Fall Time Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output High Driver Disable from Output Low Time to Shutdown Driver Enable from Shutdown to Output High Driver Enable from Shutdown to Output Low fMAX tDD tSKEW tR, tF tZH tZL tHZ tLZ tSHDN VOD = ±1.5V, CD = 820pF (Figure 4, Note 16) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 7, 12) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 7, 12) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Note 12) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Note 12) (Notes 9, 12) Full Full Full Full Full Full Full Full Full Full Full 250 250 350 50 800 1100 6 960 26 200 28 30 200 180 100 1500 100 1600 600 600 55 55 600 700 700 kbps ns ns ns ns ns ns ns ns ns ns tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 9, 10, 12) tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 9, 10, 12) DRIVER SWITCHING CHARACTERISTICS (ISL3173E, ISL3174E, ISL3175E, 500kbps) Maximum Data Rate Driver Differential Output Delay Driver Differential Output Skew Driver Differential Rise or Fall Time Driver Enable to Output High fMAX tDD tSKEW tR, tF tZH VOD = ±1.5V, CD = 820pF (Figure 4, Note 16) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 7, 12) Full Full Full Full Full 500 180 200 1600 350 1 380 26 800 30 800 350 kbps ns ns ns ns 6 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, Note 4 (Continued) SYMBOL tZL tHZ tLZ tSHDN TEST CONDITIONS RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 7, 12) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Note 12) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Note 12) (Notes 9, 12) TEMP (°C) Full Full Full Full Full Full MIN 50 TYP 100 28 30 200 180 100 MAX 350 55 55 600 700 700 UNITS ns ns ns ns ns ns PARAMETER Driver Enable to Output Low Driver Disable from Output High Driver Disable from Output Low Time to Shutdown Driver Enable from Shutdown to Output High Driver Enable from Shutdown to Output Low tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 9, 10, 12) tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 9, 10, 12) DRIVER SWITCHING CHARACTERISTICS (ISL3176E, ISL3177E, ISL3178E, 20Mbps) Maximum Data Rate Driver Differential Output Delay Driver Differential Output Skew Driver Output Skew, Part-to-Part Driver Differential Rise or Fall Time Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output High Driver Disable from Output Low Time to Shutdown Driver Enable from Shutdown to Output High Driver Enable from Shutdown to Output Low fMAX tDD tSKEW ΔtDSKEW tR, tF tZH tZL tHZ tLZ tSHDN VOD = ±1.5V, CD = 350pF (Figure 4, Note 16) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2, Note 13) RDIFF = 54Ω, CD = 50pF (Figure 2) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 7, 12) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 7, 12) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Note 12) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Note 12) (Notes 9, 12) Full Full Full Full Full Full Full Full Full Full Full Full 20 50 28 27 1 9 17 16 25 28 200 180 90 40 3 11 15 50 40 40 50 600 700 700 Mbps ns ns ns ns ns ns ns ns ns ns ns tZH(SHDN) RL = 500Ω, CL = 50pF, SW = GND (Figure 3), (Notes 9, 10, 12) tZL(SHDN) RL = 500Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 9, 10, 12) RECEIVER SWITCHING CHARACTERISTICS (All Versions) Maximum Data Rate fMAX VID = ±1.5V (Note 16) ISL3170E-75E ISL3176E-78E Receiver Input to Output Delay tPLH, tPHL (Figure 5) ISL3170E-75E ISL3176E-78E Receiver Skew | tPLH - tPHL | Receiver Skew, Part-to-Part Receiver Enable to Output High tSKD ΔtRSKEW tZH (Figure 5) (Figure 5, Note 13) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Notes 8, 12) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 8, 12) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Note 12) ISL3170E-75E ISL3176E-78E ISL3170E-75E ISL3176E-78E ISL3170E-75E ISL3176E-78E Full Full Full Full Full Full Full Full Full Full Full Full 12 20 25 25 5 5 5 5 5 4 20 35 70 33 1.5 15 11 15 11 12 7 120 60 4 15 20 17 20 17 20 15 Mbps Mbps ns ns ns ns ns ns ns ns ns ns Receiver Enable to Output Low tZL Receiver Disable from Output High tHZ 7 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C, Note 4 (Continued) SYMBOL tLZ TEST CONDITIONS RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Note 12) (Notes 9, 12) ISL3170E-75E ISL3176E-78E TEMP (°C) Full Full Full Full Full MIN 5 4 50 TYP 13 7 180 240 240 MAX 20 15 600 500 500 UNITS ns ns ns ns ns PARAMETER Receiver Disable from Output Low Time to Shutdown Receiver Enable from Shutdown to Output High Receiver Enable from Shutdown to Output Low NOTES: tSHDN tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 6), (Notes 9, 11, 12) tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6), (Notes 9, 11, 12) 4. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 5. Supply current specification is valid for loaded drivers when DE = 0V. 6. Applies to peak current. See “Typical Performance Curves” for more information. 7. When testing devices with the shutdown feature, keep RE = 0 to prevent the device from entering SHDN. 8. When testing devices with the shutdown feature, the RE signal high time must be short enough (typically 600ns to ensure that the device enters SHDN. 11. Set the RE signal high time >600ns to ensure that the device enters SHDN. 12. Does not apply to the ISL3171E, ISL3174E and ISL3177E. 13. ΔtSKEW is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC, temperature, etc.). Only applies to the ISL3176E - 78E. 14. ISL3170E - ISL3175E only. 15. VCC ≥ 3.15V 16. Guaranteed by design and characterization, but not production tested. 17. If the Tx or Rx enable function isn’t needed, connect the enable pin to the appropriate supply (see “Pin Descriptions” table) through a 1kΩ to 3kΩ resistor. Test Circuits and Waveforms VCC DE DI D Y Z VOD RL/2 VCC 375Ω DE DI D Y Z VOD RL = 60Ω VCM -7V to +12V 375Ω RL/2 VOC FIGURE 1A. VOD AND VOC FIGURE 1B. VOD WITH COMMON MODE LOAD FIGURE 1. DC DRIVER TEST CIRCUITS 8 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Test Circuits and Waveforms (Continued) 3V DI 1.5V 1.5V 0V tPLH Z D Y SIGNAL GENERATOR DIFF OUT (Y - Z) tR SKEW = |tPLH - tPHL| RDIFF CD OUT (Y) VOL OUT (Z) tPHL VOH VCC DE DI 90% 10% 90% 10% tF +VOD -VOD FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE DI D SIGNAL GENERATOR Y 50pF Z 500Ω SW VCC GND 3V DE NOTE 9 1.5V 1.5V 0V tHZ VOH - 0.25V VOH 0V tZL, tZL(SHDN) NOTE 9 OUT (Y, Z) 50% OUTPUT LOW VOL + 0.25V V OL tZH, tZH(SHDN) NOTE 9 OUTPUT HIGH 50% PARAMETER tHZ tLZ tZH tZL tZH(SHDN) tZL(SHDN) OUTPUT Y/Z Y/Z Y/Z Y/Z Y/Z Y/Z RE X X 0 (Note 7) 0 (Note 7) 1 (Note 10) 1 (Note 10) DI 1/0 0/1 1/0 0/1 1/0 0/1 SW GND VCC GND VCC GND VCC OUT (Y, Z) tLZ VCC FIGURE 3A. TEST CIRCUIT FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER ENABLE AND DISABLE TIMES (EXCEPT ISL3171E, ISL3174E, ISL3177E) VCC DE + 3V DI 0V Z D Y 54Ω CD VOD - DI SIGNAL GENERATOR DIFF OUT (Y - Z) -VOD +VOD 0V FIGURE 4A. TEST CIRCUIT FIGURE 4. DRIVER DATA RATE FIGURE 4B. MEASUREMENT POINTS 9 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Test Circuits and Waveforms (Continued) RE GND B A R 15pF RO tPLH SIGNAL GENERATOR RO 1.5V tPHL VCC 1.5V 0V +1.5V A 0V 0V -1.5V FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS FIGURE 5. RECEIVER PROPAGATION DELAY RE GND SIGNAL GENERATOR B A R RO 1kΩ SW 15pF tZH, tZH(SHDN) NOTE 9 OUTPUT HIGH 1.5V tHZ V VOH - 0.25V OH 0V tZL, tZL(SHDN) NOTE 9 RO 1.5V OUTPUT LOW VOL + 0.25V V OL VCC GND RE NOTE 9 1.5V 1.5V 3V 0V PARAMETER tHZ tLZ tZH (Note 8) tZL (Note 8) tZH(SHDN) (Note 11) tZL(SHDN) (Note 11) DE X X 0 0 0 0 A +1.5V -1.5V +1.5V -1.5V +1.5V -1.5V SW GND VCC GND VCC GND VCC RO tLZ VCC FIGURE 6A. TEST CIRCUIT FIGURE 6B. MEASUREMENT POINTS FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES (EXCEPT ISL3171E, ISL3174E, ISL3177E) Application Information RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a pointto-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 spec requires that drivers must handle bus contention without sustaining any damage. Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for runs as long as 4000’, so the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. Receiver Features These devices utilize a differential input receiver for maximum noise immunity and common mode rejection. Input sensitivity is better than ±200mV, as required by the RS-422 and RS-485 specifications. Receiver input resistance of 96kΩ surpasses the RS-422 spec of 4kΩ, and is eight times the RS-485 “Unit Load (UL)” requirement of 12kΩ minimum. Thus, these products are known as “one-eighth UL” transceivers, and there can be up to 256 of these devices on a network while still complying with the RS-485 loading spec. Receiver inputs function with common mode voltages as great as +9V/-7V outside the power supplies (i.e., +12V and -7V), making them ideal for long networks where induced voltages, and ground potential differences, are realistic concerns. All the receivers include a “full fail-safe” function that guarantees a high level receiver output if the receiver inputs are unconnected (floating) or shorted. Fail-safe with shorted inputs is achieved by setting the Rx upper switching point to -50mV, thereby ensuring that the Rx sees 0V differential as a high input level. 10 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs - except on the ISL3171E, ISL3174E and ISL3177E- are tri-statable via the active low RE input. current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-485 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-485 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. The ISL317XE RS-485 pins withstand ±15kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±8kV. The ISL317XE survive ±8kV contact discharges on the RS-485 pins. Driver Features The RS-485/422 driver is a differential output device that delivers at least 1.5V across a 54Ω load (RS-485), and at least 2V across a 100Ω load (RS-422). The drivers feature low propagation delay skew to maximize bit width, and to minimize EMI. All drivers are tri-statable via the active high DE input, except on the ISL3171E, ISL3174E and ISL3177E. The 250kbps and 500kbps driver outputs are slew rate limited to minimize EMI, and to reduce reflections in unterminated or improperly terminated networks. Outputs of the ISL3176E - ISL3178E drivers are not limited, so faster output transition times allow data rates of at least 20Mbps. Hot Plug Function When a piece of equipment powers up, there is a period of time where the processor or ASIC driving the RS-485 control lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power up may crash the bus. To avoid this scenario, the ISL317XE family incorporates a “Hot Plug” function. During power up, circuitry monitoring VCC ensures that the Tx and Rx outputs remain disabled for a period of time, regardless of the state of DE and RE. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. Data Rate, Cables, and Terminations RS-485/422 are intended for network lengths up to 4000’, but the maximum system data rate decreases as the transmission length increases. Devices operating at 20Mbps are limited to lengths less than 100’, while the 250kbps versions can operate at full data rates with lengths of several thousand feet. Twisted pair is the cable of choice for RS-485/422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. Proper termination is imperative, when using the 20Mbps devices, to minimize reflections. Short networks using the 250kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. ESD Protection All pins on these devices include class 3 (>7kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of ±15kV HBM and ±15kV IEC61000. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the RS-485 common mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. IEC61000-4-2 Testing The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-485 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The lower 11 Built-In Driver Overload Protection As stated previously, the RS-485 spec requires that drivers survive worst case bus contentions undamaged. These devices meet this requirement via driver output short circuit current limits, and on-chip thermal shutdown circuitry. FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E The driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the RS-485 spec, even at the common mode voltage range extremes. Additionally, these devices utilize a foldback circuit which reduces the short circuit current, and thus the power dissipation, whenever the contending voltage exceeds either supply. In the event of a major short circuit condition, devices also include a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically re-enable after the die temperature drops about 15 degrees. If the contention persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown. Low Power Shutdown Mode These CMOS transceivers all use a fraction of the power required by their bipolar counterparts, but some also include a shutdown feature that reduces the already low quiescent ICC to a 10nA trickle. These devices enter shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 600ns. Disabling both the driver and the receiver for less than 50ns guarantees that the transceiver will not enter shutdown. Note that receiver and driver enable times increase when the transceiver enables from shutdown. Refer to Notes 7-11, at the end of the Electrical Specification table, for more information. Typical Performance Curves 120 DRIVER OUTPUT CURRENT (mA) 100 80 60 40 20 0 0 VCC = 3.3V, TA = +25°C; Unless Otherwise Specified 2.35 DIFFERENTIAL OUTPUT VOLTAGE (V) 2.3 2.25 2.2 2.15 2.1 2.05 2 1.95 1.9 1.85 -40 -25 0 25 50 75 85 RDIFF = 54Ω RDIFF = 100Ω 0.5 1 1.5 2 2.5 DIFFERENTIAL OUTPUT VOLTAGE (V) 3 3.5 TEMPERATURE (°C) FIGURE 7. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE FIGURE 8. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 200 ISL3176E/77/78E 150 Y OR Z = LOW OUTPUT CURRENT (mA) 100 ISL3170E thru ISL3175E 0.52 ISL3172/5/8E, DE = VCC, RE = X 0.51 0.5 ICC (mA) 50 0 -50 Y OR Z = HIGH ISL317XE -7 -6 -4 -2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 12 0.46 -40 -25 0 25 50 75 85 0.47 ISL3172/5/8E, DE = 0V, RE = 0V ISL3170/3/6E, DE = X, RE = 0V; ISL3171/4/7E 0.49 0.48 -100 -150 TEMPERATURE (°C) FIGURE 9. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE FIGURE 10. SUPPLY CURRENT vs TEMPERATURE 12 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Typical Performance Curves 1220 1200 PROPAGATION DELAY (ns) 7.5 1180 1160 1140 1120 1100 tPLH 1080 -40 -25 0 25 TEMPERATURE (°C) 50 75 85 5.5 -40 SKEW (ns) tPHL 6 |CROSS PT. OF Y↑ & Z↓ - CROSS PT. OF Y↓ & Z↑| -25 0 25 TEMPERATURE (°C) 50 75 85 SKEW (ns) tPHL tPLH -40 -25 0 25 TEMPERATURE (°C) 50 75 85 7 VCC = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) 8 6.5 FIGURE 11. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3170E, 71E, 72E) 370 FIGURE 12. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3170E, 71E, 72E) 1.4 365 PROPAGATION DELAY (ns) 1.2 360 1 355 0.8 350 0.6 345 0.4 |CROSS PT. OF Y↑ & Z↓ - CROSS PT. OF Y↓ & Z↑| 0.2 -40 -25 0 25 TEMPERATURE (°C) 50 75 85 340 FIGURE 13. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3173E, 74E, 75E) 32 31 FIGURE 14. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3173E, 74E, 75E) 0.95 0.9 PROPAGATION DELAY (ns) 30 29 SKEW (ns) tPLH 28 27 26 25 24 0.65 23 22 -40 -25 0 25 TEMPERATURE (°C) 50 75 85 0.6 -40 |CROSS PT. OF Y↑ & Z↓ - CROSS PT. OF Y↓ & Z↑| -25 0 25 TEMPERATURE (°C) 50 75 85 tPHL 0.85 0.8 0.75 0.7 FIGURE 15. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3176E, 77E, 78E) FIGURE 16. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3176E, 77E, 78E) 13 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Typical Performance Curves RECEIVER OUTPUT (V) VCC = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) DRIVER INPUT (V) RECEIVER OUTPUT (V) RDIFF = 54Ω, CD = 50pF DI 5 0 5 0 RO DRIVER INPUT (V) DRIVER INPUT (V) DRIVER INPUT (V) RDIFF = 54Ω, CD = 50pF DI 5 0 5 RO 0 DRIVER OUTPUT (V) DRIVER OUTPUT (V) 3 2.5 2 1.5 1 0.5 0 TIME (400ns/DIV) A/Y B/Z 3 2.5 2 1.5 1 0.5 0 TIME (400ns/DIV) B/Z A/Y FIGURE 17. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (ISL3170E, 71E, 72E) DRIVER INPUT (V) RECEIVER OUTPUT (V) RDIFF = 54Ω, CD = 50pF DI 5 0 5 RO 0 FIGURE 18. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (ISL3170E, 71E, 72E) RECEIVER OUTPUT (V) RDIFF = 54Ω, CD = 50pF DI 5 0 5 0 RO DRIVER OUTPUT (V) DRIVER OUTPUT (V) 3 2.5 2 1.5 1 0.5 0 TIME (200ns/DIV) A/Y B/Z 3 2.5 2 1.5 1 0.5 0 TIME (200ns/DIV) B/Z A/Y FIGURE 19. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (ISL3173E, 74E, 75E) FIGURE 20. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (ISL3173E, 74E, 75E) DRIVER INPUT (V) RECEIVER OUTPUT (V) RECEIVER OUTPUT (V) RDIFF = 54Ω, CD = 50pF DI 5 0 5 RO 0 RDIFF = 54Ω, CD = 50pF DI 5 0 5 0 RO DRIVER OUTPUT (V) DRIVER OUTPUT (V) 3 2.5 2 1.5 1 0.5 0 TIME (10ns/DIV) A/Y B/Z 3 2.5 2 1.5 1 0.5 0 TIME (10ns/DIV) B/Z A/Y FIGURE 21. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (ISL3176E, 77E, 78E) FIGURE 22. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (ISL3176E, 77E, 78E) 14 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Typical Performance Curves 35 RECEIVER OUTPUT CURRENT (mA) 30 25 VOL, +85°C 20 15 VOH, +85°C 10 5 0 0.5 1.5 2.5 VOH, +25°C VOL, +25°C VCC = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 535 PROCESS: Si Gate BiCMOS 0 1 2 3 3.5 RECEIVER OUTPUT VOLTAGE (V) FIGURE 23. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE 15 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Mini Small Outline Plastic Packages (MSOP) N M8.118 (JEDEC MO-187AA) 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE E1 E INCHES SYMBOL MIN 0.037 0.002 0.030 0.010 0.004 0.116 0.116 0.187 0.016 MAX 0.043 0.006 0.037 0.014 0.008 0.120 0.120 0.199 0.028 MILLIMETERS MIN 0.94 0.05 0.75 0.25 0.09 2.95 2.95 4.75 0.40 MAX 1.10 0.15 0.95 0.36 0.20 3.05 3.05 5.05 0.70 NOTES 9 3 4 6 7 15o 6o Rev. 2 01/03 INDEX AREA -B12 TOP VIEW 0.25 (0.010) GAUGE PLANE SEATING PLANE -C4X θ R1 R 0.20 (0.008) ABC A A1 A2 b c D E1 4X θ L L1 e E L 0.026 BSC 0.65 BSC A A2 A1 -He D b 0.10 (0.004) -A0.20 (0.008) C SEATING PLANE L1 N R 0.037 REF 8 0.003 0.003 5o 0o 15o 6o 0.95 REF 8 0.07 0.07 5o 0o C a C L E1 C R1 0 SIDE VIEW α -B- 0.20 (0.008) CD END VIEW NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension “D” does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (0.004) at seating Plane. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A -H- . and - B - to be determined at Datum plane 11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only. 16 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Small Outline Plastic Packages (SOIC) N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45° H 0.25(0.010) M BM M8.15 (JEDEC MS-012-AA ISSUE C) 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 L MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 5.80 0.25 0.40 8 8° 0° 8° MAX 1.75 0.25 0.51 0.25 5.00 4.00 6.20 0.50 1.27 NOTES 9 3 4 5 6 7 Rev. 1 6/05 MIN 0.0532 0.0040 0.013 0.0075 0.1890 0.1497 0.2284 0.0099 0.016 8 0° MAX 0.0688 0.0098 0.020 0.0098 0.1968 0.1574 0.2440 0.0196 0.050 B C D E e H C α A1 0.10(0.004) 0.050 BSC 1.27 BSC e B 0.25(0.010) M C AM BS h L N NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. α 17 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Mini Small Outline Plastic Packages (MSOP) N M10.118 (JEDEC MO-187BA) 10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE E1 -B12 TOP VIEW 0.25 (0.010) GAUGE PLANE SEATING PLANE -CL L1 4X θ R1 R 0.20 (0.008) ABC E INCHES SYMBOL A A1 A2 b c D 4X θ MILLIMETERS MIN 0.94 0.05 0.75 0.18 0.09 2.95 2.95 4.75 0.40 10 0.07 0.07 5o 0o 15o 6o MAX 1.10 0.15 0.95 0.27 0.20 3.05 3.05 5.05 0.70 NOTES 9 3 4 6 7 Rev. 0 12/02 MIN 0.037 0.002 0.030 0.007 0.004 0.116 0.116 0.187 0.016 10 0.003 0.003 5o 0o MAX 0.043 0.006 0.037 0.011 0.008 0.120 0.120 0.199 0.028 INDEX AREA E1 e E L L1 N R R1 θ -B- A A2 0.020 BSC 0.50 BSC A1 -He D b 0.10 (0.004) -A0.20 (0.008) C SEATING PLANE 0.037 REF 0.95 REF C a C L E1 C SIDE VIEW 15o 6o α 0.20 (0.008) CD END VIEW NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension “D” does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (.004) at seating Plane. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A -H- . and - B to be determined at Datum plane 11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only 18 FN6307.2 August 28, 2006 ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E Small Outline Plastic Packages (SOIC) N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA h x 45o 0.25(0.010) M BM M14.15 (JEDEC MS-012-AB ISSUE C) 14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A L MILLIMETERS MIN 1.35 0.10 0.33 0.19 8.55 3.80 5.80 0.25 0.40 14 0o MAX 1.75 0.25 0.51 0.25 8.75 4.00 6.20 0.50 1.27 8o NOTES 9 3 4 5 6 7 Rev. 0 12/93 MIN 0.0532 0.0040 0.013 0.0075 0.3367 0.1497 0.2284 0.0099 0.016 14 0o MAX 0.0688 0.0098 0.020 0.0098 0.3444 0.1574 0.2440 0.0196 0.050 8o A1 B C D E e C α A1 0.10(0.004) e B 0.25(0.010) M C AM BS 0.050 BSC 1.27 BSC H h L N NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. α All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 19 FN6307.2 August 28, 2006