DATASHEET
X60003
FN8137
Rev 5.00
September 1, 2015
Precision SOT-23 FGA™ Voltage References
The X60003 FGA™ voltage references is a very high precision
analog voltage reference fabricated in Intersil’s proprietary
Floating Gate Analog technology, which achieves superior
levels of performance when compared to conventional band
gap, buried zener, or XFET™ technologies.
Features
FGA™ voltage references feature very high initial accuracy,
very low temperature coefficient, excellent long term stability,
low noise and excellent line and load regulation, at the lowest
power consumption currently available. These voltage
references enable advanced applications for precision
industrial and portable systems operating at significantly
higher accuracy and lower power levels than can be achieved
with conventional technologies.
• Low temperature coefficient (B grade) . . . . . . . . . 10ppm/°C
Applications
• 5kV ESD (human body model)
• Reference output voltage . . . . . . . . . . . . . . . . 4.096V, 5.000V
• Initial accuracy . . . . . . . . . . . . . . . . . . . . . . . ±1.0mV (B grade)
• Ultra low power supply current . . . . . . . . . . . . . . . . . . . . 500nA
• 10mA source and sink current capability
• Very low dropout voltage. . . . . . . . . . . . . . 100mV at No Load
• Input voltage range
- X60003-41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5V to 9.0V
- X60003-50 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1V to 9.0V
• Standard package . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ld SOT-23
• High resolution A/Ds and D/As
• Temp range . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
• Digital meters
Related Literature
• Calibration systems
• V-F converters
• Precision current sources
• See AN1494, “Reflow and PC Board Assembly Effects on
Intersil FGA References”
• Precision regulators
• See AN1533, “X-Ray Effects on Intersil FGA References”
• Precision oscillators
• Smart sensors
• Strain gage bridges
• Threshold detectors
• Battery management systems
• Servo systems
800
HIGH
700
IN (nA)
600
TYP
500
400
LOW
300
200
4.0
5.0
6.0
7.0
8.0
9.0
VIN (V)
FIGURE 1. IIN vs VIN (3 UNITS)
FN8137 Rev 5.00
September 1, 2015
Page 1 of 17
X60003
Available Options
Pin Configuration
VOUT
OPTION
(V)
INITIAL
ACCURACY
(mV)
TEMPCO.
(ppm/°C)
X60003BIG3Z-41T1
4.096
±1.0
10
X60003CIG3Z-41T1
4.096
±2.5
20
X60003DIG3Z-41T1
(No longer available or
supported)
4.096
±5.0
20
X60003BIG3Z-50T1
5.000
±1.0
10
X60003CIG3Z-50T1
5.000
±2.5
20
X60003DIG3Z-50T1
5.000
±5.0
20
PART NUMBER
X60003
(3 LD SOT-23)
TOP VIEW
VIN 1
3 GND
VOUT 2
Pin Descriptions
PIN NUMBER
PIN NAME
DESCRIPTION
1
VIN
2
VOUT
Voltage Reference Output Connection
3
GND
Ground Connection
Power Supply Input Connection
Typical Application Circuit
VIN = +5.0V
0.1µF
VIN
10µF
VOUT
0.001µF
X60003
GND
REF IN
SERIAL
BUS
ENABLE
SCK
SDAT
16 TO 24-BIT
A/D CONVERTER
FIGURE 2. TYPICAL APPLICATION PRECISION 16 TO 24-BIT A/D CONVERTER
FN8137 Rev 5.00
September 1, 2015
Page 2 of 17
X60003
Ordering Information
PART NUMBER
(Notes 2, 3)
PART MARKING
(Note 4)
VOUT
(V)
GRADE
(°C)
TEMP. RANGE
(°C)
4.096
±1.0mV, 10ppm
-40 to +85
3 Ld SOT-23
P3.064
PACKAGE
(RoHS Compliant)
PKG.
DWG #
X60003BIG3Z-41T1 (Note 1)
APF
X60003CIG3Z-41T1 (Note 1)
APH
±2.5mV, 20ppm
-40 to +85
3 Ld SOT-23
P3.064
X60003DIG3Z-41
(No longer available,
recommended replacement:
X60003BIG3Z-41T1)
APJ
±5.0mV, 20ppm
-40 to +85
3 Ld SOT-23
P3.064
X60003DIG3Z-41T1 (Note 1)
(No longer available,
recommended replacement:
X60003BIG3Z-41T1)
APJ
±5.0mV, 20ppm
-40 to +85
3 Ld SOT-23
P3.064
X60003BIG3Z-50T1 (Note 1)
APG
±1.0mV, 10ppm
-40 to +85
3 Ld SOT-23
P3.064
X60003CIG3Z-50T1 (Note 1)
API
±2.5mV, 20ppm
-40 to +85
3 Ld SOT-23
P3.064
X60003DIG3Z-50T1 (Note 1)
APK
±5.0mV, 20ppm
-40 to +85
3 Ld SOT-23
P3.064
X60003-EVALZ
Evaluation Board
5.00
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for X60003. For more information on MSL please see techbrief TB363.
4. The part marking is located on the bottom of the part
FN8137 Rev 5.00
September 1, 2015
Page 3 of 17
X60003
Absolute Voltage Ratings
Thermal Information
Max Voltage Applied
VIN to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +10V
VOUT to GND (10s). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +5.1V
ESD Ratings
Human Body Model (Tested to JESD22-A114) . . . . . . . . . . . . . . . . . . 5kV
Machine Model (Tested to JESD22-A115) . . . . . . . . . . . . . . . . . . . . . 500V
Latch Up (Tested per JESD-78B; Class 2, Level A) . . . . . . . . . . . . . . 100mA
JC (°C/W)
Thermal Resistance (Typical)
JA (°C/W)
3 Lead SOT-23 (Notes 6, 7) . . . . . . . . . . . . . .
275
110
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .+107°C
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +125°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
Environmental Operating Conditions
Temperature Range (Industrial) . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Recommended Operating Conditions
X-Ray Exposure (Note 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mRem
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted,
all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
NOTES:
5. Measured with no filtering, distance of 10” from source, intensity set to 55kV and 70mA current, 30s duration. Other exposure levels should be
analyzed for Output Voltage drift effects. See “Applications Information” on page 12.
6. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
7. For JC, the “case temp” location is taken at the package top center.
8. Post-reflow drift for the X60003 devices will range from 100µV to 1.0mV based on experimental results with devices on FR4 double sided boards.
The design engineer must take this into account when considering the reference voltage after assembly.
Electrical Specifications Operating Conditions: IOUT = 0mA, COUT = 0.001µF, TA = -40 to +85°C. Boldface limits apply over
the operating temperature range, -40°C to +85°C.
SYMBOL
VOA
IIN
TC VOUT
PARAMETER
CONDITIONS
VOUT Accuracy @ TA = +25°C
MIN
(Note 12)
TYP
-1.0
+1.0
mV
X60003C
-2.5
+2.5
mV
X60003D
-5.0
+5.0
mV
900
nA
X60003B
10
ppm/°C
X60003C
20
ppm/°C
X60003D
20
ppm/°C
500
VN
Output Voltage Noise
0.1Hz to 10Hz
30
ISC
Short Circuit Current
TA = +25°C
50
Electrical Specifications (X60003-41)
the operating temperature range, -40°C to +85°C.
SYMBOL
VIN
UNITS
X60003B
Supply Current
Output Voltage Temperature Coefficient
(Note 9)
MAX
(Note 12)
µVP-P
80
mA
VIN = 5.0, TA = -40°C to +85°C, unless otherwise specified. Boldface limits apply over
PARAMETER
CONDITIONS
Input Voltage Range
MIN
(Note 12)
TYP
4.5
VOUT
Output Voltage
VOUT/VIN
Line Regulation
+4.5V VIN +8.0V
VOUT/IOUT
Load Regulation
Sourcing: 0mA ISOURCE 10mA
MAX
(Note 12)
UNITS
9.0
V
4.096
V
150
µV/V
10
50
µV/mA
Sinking: -10mA ISINK 0mA
20
100
µV/mA
VOUT/TA
Thermal Hysteresis (Note 10)
T = -40°C to +85°C
150
ppm
VOUT/t
Long Term Stability (Note 11)
TA = +25°C
50
ppm
FN8137 Rev 5.00
September 1, 2015
Page 4 of 17
X60003
Electrical Specifications (X60003-50)
the operating temperature range, -40°C to +85°C.
SYMBOL
VIN
VIN = 6.5V, TA = -40°C to +85°C, unless otherwise specified. Boldface limits apply over
PARAMETER
CONDITIONS
Input Voltage Range
MIN
(Note 12)
TYP
5.1
MAX
(Note 12)
UNITS
9.0
V
VOUT
Output Voltage
5.000
V
VOUT/VIN
Line Regulation
+5.5V VIN +8.0V
VOUT/IOUT
Load Regulation
Sourcing: 0mA ISOURCE 10mA
Sinking: -10mA ISINK 0mA
VDO
Dropout Voltage
IOUT = 5mA, VOUT = -0.01%
VOUT/TA
Thermal Hysteresis (Note 10)
T = -40°C to +85°C
100
ppm
VOUT/t
Long Term Stability (Note 11)
TA = +25°C
45
ppm
150
µV/V
50
µV/mA
20
100
µV/mA
150
300
mV
10
NOTES:
9. Over the specified temperature range. Temperature coefficient is measured by the box method whereby the change in VOUT is divided by the
temperature range; in this case, -40°C to +85°C = +125°C.
10. Thermal Hysteresis is the change of VOUT measured at TA = +25°C after temperature cycling over a specified range, TA. VOUT is read initially at
TA = +25°C for the device under test. The device is temperature cycled and a second VOUT measurement is taken at +25°C. The difference between
the initial VOUT reading and the second VOUT reading is then expressed in ppm. For TA = +125°C, the device under test is cycled from +25°C to
+85°C to -40°C to +85°C.
11. Long term drift is logarithmic in nature and diminishes over time. Drift after the first 1000 hours will be approximately 10ppm/sqrt(1kHrs).
12. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
FN8137 Rev 5.00
September 1, 2015
Page 5 of 17
X60003
Typical Performance Curves (X60003-41)
VIN = 5.0V, IOUT = 0mA, TA = +25°C unless otherwise specified.
800
600
HIGH
700
550
TYP
IN (nA)
IN (nA)
600
500
500
+85°C
450
+25°C
400
LOW
200
4.0
5.0
6.0
7.0
8.0
-40°C
400
300
350
9.0
4.0
5.0
6.0
VIN (V)
VOUT (V)
(NORMALIZED TO 4.096V AT VOUT)
LOW
4.0970
VOUT (V)
4.0965
4.0960
4.0955
HIGH
4.0950
4.0945
4.0940
-40
TYP
-15
8.0
9.0
FIGURE 4. IIN vs VIN
FIGURE 3. IIN vs VIN (3 UNITS)
4.0975
7.0
VIN (V)
10
35
TEMPERATURE (°C)
4.0967
UNIT 2
4.0965
UNIT 1
4.0963
4.0961
UNIT 3
4.0959
4.0957
4.0955
4.5
85
60
4.0969
FIGURE 5. VOUT vs TEMPERATURE NORMALIZED TO +25°C
(3 UNITS)
5.0
5.5
6.0
6.5
7.0
VIN (V)
7.5
8.0
8.5
FIGURE 6. LINE REGULATION (3 UNITS)
VOUT (µV)
(NORMALIZED TO VIN = 5.0V)
350
300
-40°C
250
+25°C
200
150
100
+85°C
50
0
-50
-100
4.5
5.0
5.5
6.0
6.5
7.0
VIN (V)
7.5
8.0
8.5
9.0
FIGURE 7. LINE REGULATION OVER-TEMPERATURE
FN8137 Rev 5.00
September 1, 2015
Page 6 of 17
9.0
X60003
Typical Performance Curves (X60003-41)
VIN = 5.0V, IOUT = 0mA, TA = +25°C unless otherwise specified. (Continued)
CL = 0nF
200mV/DIV
200mV/DIV
CL = 1nF
VIN = -500mV
VIN = 500mV
VIN = -500mV
500µsec/DIV
500µsec/DIV
FIGURE 8. LINE TRANSIENT RESPONSE, NO CAPACITIVE LOAD
FIGURE 9. LINE TRANSIENT RESPONSE, 0.001µF LOAD
CAPACITANCE
0
0.30
+85°C
NO LOAD
-10
0.20
-20
-40°C
1nF LOAD
-40
10nF LOAD
-50
-60
VOUT (mV)
-30
PSRR (dB)
VIN = 500mV
-70
-80
100nF LOAD
0.10
0.00
+25°C
-0.10
-0.20
-90
-100
1
10
100
1k
10k
100k
-0.30
-20
1M
-15
FIGURE 10. PSRR vs CAP LOAD
0
5
10
15
CL = 1nF
IL = -50µA
IL = 50µA
100µsec/DIV
FIGURE 12. LOAD TRANSIENT RESPONSE
200mV/DIV
50mV/DIV
-5
FIGURE 11. LOAD REGULATION
CL = 1nF
FN8137 Rev 5.00
September 1, 2015
-10
OUTPUT CURRENT (mA)
SINKING
SOURCING
FREQUENCY (Hz)
IL = -10mA
IL = 10mA
500µsec/DIV
FIGURE 13. LOAD TRANSIENT RESPONSE
Page 7 of 17
20
X60003
Typical Performance Curves (X60003-41)
VIN = 5.0V, IOUT = 0mA, TA = +25°C unless otherwise specified. (Continued)
200
6
5
4
1nF LOAD
150
VOUT
ZOUT ()
VIN AND VOUT (V)
NO LOAD
VIN
3
10nF LOAD
100
2
50
100nF LOAD
1
0
-1
1
3
5
TIME (ms)
7
9
0
11
1
10
100
1k
10k
100k
FREQUENCY (Hz)
FIGURE 15. ZOUT vs FREQUENCY
FIGURE 14. TURN-ON TIME (+25°C)
10µV/DIV
0.1Hz TO 10Hz VOUT NOISE
10s/DIV
FIGURE 16. BAND PASS FILTER WITH ZERO AT 0.1Hz AND 2 POLES AT 10Hz
FN8137 Rev 5.00
September 1, 2015
Page 8 of 17
X60003
Typical Performance Curves (X60003-50)
(VIN = 6.5V, IOUT = 0mA, TA = +25°C unless otherwise specified)
5.0003
125
100
50
+85°C
+25°C
25
DVOUT (V)
75
0
-40°C
-25
-50
6
5
7
VIN (V)
8
(NORMAILIZED TO 5V AT VIN = 6.5V
VOUT (V)
(NORMAILIZED TO VIN = 6.5V)
150
5.0002
5.0001
UNIT 1
5.0000
UNIT 2
4.9999
4.9998
4.9997
9
UNIT 3
5.0
5.5
6.0
6.5
7.0
VIN (V)
7.5
8.0
8.5
9.0
FIGURE 18. LINE REGULATION (3 UNITS)
FIGURE 17. LINE REGULATION
0.1Hz TO 10Hz VOUT NOISE
1.40
1.20
+85°C
0.80
0.60
0.40
+25°C
10µV/DIV
VOUT (mV)
1.00
-40°C
0.20
0.00
-0.20
-0.40
-20
-15
SINKING
-10
-5
0
5
10
15
20
OUTPUT CURRENT (mA) SOURCING
FIGURE 19. LOAD REGULATION OVER TEMPERATURE
1s/DIV
FIGURE 20. BAND PASS FILTER WITH ZERO AT 0.1Hz AND 2
POLES AT 10Hz
0
5.0025
UNIT 1
5.0020
5.0015
-20
UNIT 3
PSRR (dB)
VOUT (V)
UNIT 2
5.0000
4.9995
-40
10nF LOAD
-50
-60
-70
4.9990
-80
4.9985
-90
4.9980
1nF LOAD
-30
5.0010
5.0005
NO LOAD
-10
-40
-15
10
35
60
TEMPERATURE (°C)
FIGURE 21. VOUT vs TEMPERATURE (3 UNITS)
FN8137 Rev 5.00
September 1, 2015
85
-100
100nF LOAD
1
10
100
1k
10k
10k
FREQUENCY (Hz)
FIGURE 22. PSSR vs CAP LOAD
Page 9 of 17
1M
X60003
Typical Performance Curves (X60003-50)
(VIN = 6.5V, IOUT = 0mA, TA = +25°C unless otherwise specified) (Continued)
CL = 0.001µF
IIN = -10mA
IIN = -50µA
100mV/DIV
500mV/DIV
CL = 0.001µF
IIN = +10mA
IIN = +50µA
2ms/DIV
500µs/DIV
FIGURE 23. 10mA LOAD TRANSIENT RESPONSE
FIGURE 24. 50µA LOAD TRANSIENT RESPONSE
CL = 0
200mV/DIV
200mV/DIV
CL = 0.001µF
VIN = -500mV
VIN = 500mV
VIN = -500mV
500µsec/DIV
500µsec/DIV
FIGURE 26. LINE TRANSIENT RESPONSE
FIGURE 25. LINE TRANSIENT RESPONSE
0.45
VIN TO VOUT DIFFERENTIAL (V)
VIN = 500mV
+85°C
0.40
0.35
+25°C
0.30
0.25
0.20
-40°C
0.15
0.10
0.05
0
0
2
4
6
8
10
OUTPUT CURRENT (SOURCING mA)
FIGURE 27. MINIMUM VIN TO VOUT DIFFERENTIAL vs OUTPUT CURRENT
FN8137 Rev 5.00
September 1, 2015
Page 10 of 17
X60003
Typical Performance Curves (X60003-50)
(VIN = 6.5V, IOUT = 0mA, TA = +25°C unless otherwise specified) (Continued)
180
1nF LOAD
160
800
NO LOAD
140
10nF LOAD
100
80
600
+25°C
+85°C
400
300
60
40
200
100nF LOAD
100
20
0
-40°C
500
IIN (nA)
ZOUT (Ω)
120
700
1
10
100
1k
10k
0
100k
5.0
5.5
6.0
6.5
FREQUENCY (Hz)
900
8.5
9.0
9.5
6
LOW
800
VOUT = 5.0V
5
700
600
4
TYP
VOUT (V)
IIN (nA)
8.0
FIGURE 29. IIN vs VIN
FIGURE 28. ZOUT vs FREQUENCY
500
HIGH
400
300
3
2
200
1
100
0
7.0
7.5
VIN (V)
5
6
7
8
9
0
0
10
4
2
VIN (V)
6
8
10
TIME (ms)
FIGURE 30. IIN vs VIN (3 UNITS)
FIGURE 31. TURN-ON TIME
7
6
UNIT 2
VOUT (V)
5
UNIT 3
4
UNIT 1
3
2
1
0
0
2
4
6
TIME (ms)
8
10
12
FIGURE 32. X60003 TURN-ON TIME (+25°C), 3 UNITS
FN8137 Rev 5.00
September 1, 2015
Page 11 of 17
12
X60003
Applications Information
FGA Technology
The X60003 voltage references use the floating gate technology to
create references with very low drift and supply current. Essentially
the charge stored on a floating gate cell is set precisely in
manufacturing. The reference voltage output itself is a buffered
version of the floating gate voltage. The resulting reference device
has excellent characteristics which are unique in the industry: very
low temperature drift, high initial accuracy, and almost zero supply
current. Also, the reference voltage itself is not limited by voltage
bandgaps or zener settings, so a wide range of reference voltages
can be programmed (standard voltage settings are provided, but
customer-specific voltages are available).
The process used for these reference devices is a floating gate
CMOS process, and the amplifier circuitry uses CMOS transistors
for amplifier and output transistor circuitry. While providing
excellent accuracy, there are limitations in output noise level and
load regulation due to the MOS device characteristics. These
limitations are addressed with circuit techniques discussed in
other sections.
Handling and Board Mounting
FGA references provide excellent initial accuracy and low
temperature drift at the expense of very little power drain. There
are some precautions to take to insure this accuracy is not
compromised. Excessive heat during solder reflow can cause
excessive initial accuracy drift, so the recommended +260°C
max temperature profile should not be exceeded. Expect up to
1mV drift from the solder reflow process.
FGA references are susceptible to excessive X-radiation like that
used in PC board manufacturing. Initial accuracy can change
10mV or more under extreme radiation. If an assembled board
needs to be X-rayed, care should be taken to shield the FGA
reference device.
Nanopower Operation
Reference devices achieve their highest accuracy when powered
up continuously, and after initial stabilization has taken place.
The X60003 is the first high precision voltage reference with ultra
low power consumption that makes it practical to leave power-on
continuously in battery operated circuits. The X60003 consume
extremely low supply current due to the proprietary FGA
technology. Supply current at room temperature is typically
500nA which is 1 to 2 orders of magnitude lower than
competitive devices. Application circuits using battery power will
benefit greatly from having an accurate, stable reference which
essentially presents no load to the battery.
capacity. Absolute accuracy will suffer as the device is biased
and requires time to settle to its final value, or, may not actually
settle to a final value as power-on time may be short.
VIN = +6V TO 9V
10µF
VIN
0.01µF
VOUT
X60003
GND
0.001µF
REF IN
ENABLE
SERIAL
BUS
SCK
SDAT
12 TO 24-bit
A/D CONVERTER
FIGURE 33. BATTERY-POWERED DATA CONVERTER CIRCUITS
Board Mounting Considerations
For applications requiring the highest accuracy, board mounting
location should be reviewed. Placing the device in areas subject
to slight twisting can cause degradation of the accuracy of the
reference voltage due to die stresses. It is normally best to place
the device near the edge of a board, or the shortest side, as the
axis of bending is most limited at that location. Obviously
mounting the device on flexprint or extremely thin PC material
will likewise cause loss of reference accuracy.
Board Assembly Considerations
FGA references provide high accuracy and low temperature drift
but some PC board assembly precautions are necessary. Normal
Output voltage shifts of 100µV to 1mV can be expected with
Pb-free reflow profiles or wave solder on multi-layer FR4 PC
boards. Precautions should be taken to avoid excessive heat or
extended exposure to high reflow or wave solder temperatures,
this may reduce device initial accuracy.
Post-assembly x-ray inspection may also lead to permanent
changes in device output voltage and should be minimized or
avoided. If x-ray inspection is required, it is advisable to monitor
the reference output voltage to verify excessive shift has not
occurred. If large amounts of shift are observed, it is best to add
an X-ray shield consisting of thin zinc (300µm) sheeting to allow
clear imaging, yet block x-ray energy that affects the FGA
reference.
In particular, battery-powered data converter circuits that would
normally require the entire circuit to be disabled when not in use
can remain powered-up between conversions as shown in Figure
33. Data acquisition circuits providing 12 to 24-bits of accuracy
can operate with the reference device continuously biased with
no power penalty, providing the highest accuracy and lowest
possible long term drift.
Other reference devices consuming higher supply currents will
need to be disabled in between conversions to conserve battery
FN8137 Rev 5.00
September 1, 2015
Page 12 of 17
X60003
Special Applications Considerations
If a device is expected to pass through luggage X-ray machines
numerous times, it is advised to mount a 2-layer (minimum) PC
board on the top, and along with a ground plane underneath will
effectively shield it from 50 to 100 passes through the machine.
Since these machines vary in X-ray dose delivered, it is difficult to
produce an accurate maximum pass recommendation.
Noise Performance and Reduction
The output noise voltage in a 0.1Hz to 10Hz bandwidth is typically
30µVP-P. This is shown in the plot in the “Typical Performance Curves”
on page 8 and 9. The noise measurement is made with a bandpass
filter made of a 1-pole high-pass filter with a corner frequency at 0.1Hz
and a 2-pole low-pass filter with a corner frequency at 12.6Hz to
create a filter with a 9.9Hz bandwidth. Noise in the 10kHz to 1MHz
bandwidth is approximately 400µVP-P with no capacitance on the
output, as shown in Figure 34. These noise measurements are made
with a 2 decade bandpass filter made of a 1-pole high-pass filter with
a corner frequency at 1/10 of the center frequency and
1-pole low-pass filter with a corner frequency at 10x the center
frequency. Figure 34 also shows the noise in the 10kHz to 1MHz band
can be reduced to about 50µVP-P using a 0.001µF capacitor on the
output. Noise in the 1kHz to 100kHz band can be further reduced
using a 0.1µF capacitor on the output, but noise in the 1Hz to 100Hz
band increases due to instability of the very low power amplifier with a
0.1µF capacitance load. For load capacitances above 0.001µF, the
noise reduction network shown in Figure 35 is recommended. This
network reduces noise significantly over the full bandwidth. Figure 35
shows that noise is reduced to less than 40µVP-P from 1Hz to 1MHz
using this network with a 0.01µF capacitor and a 2k resistor in
series with a 10µF capacitor.
FN8137 Rev 5.00
September 1, 2015
400
350
NOISE VOLTAGE (µVP-P)
In addition to post-assembly examination, there are also other Xray sources that may affect the FGA reference long term
accuracy. Airport screening machines contain X-rays and will
have a cumulative effect on the voltage reference output
accuracy. Carry-on luggage screening uses low level X-rays and is
not a major source of output voltage shift, although if a product
is expected to pass through that type of screening over 100 times
it may need to consider shielding with copper or aluminum.
Checked luggage X-rays are higher intensity and can cause
output voltage shift in much fewer passes, so devices expected to
go through those machines should definitely consider shielding.
Note that just two layers of 1/2 ounce copper planes will reduce
the received dose by over 90%. The leadframe for the device
which is on the bottom also provides similar shielding.
CL = 0
300
250
200
150
CL = 0.001µF
100
CL = 0.1µF
50
0
CL = 0.01µF AND 10µF + 2k
1
10
100
1k
10k
100k
FIGURE 34. X60003 NOISE REDUCTION
VIN = 6.5V
10µF
VIN
VO
X60003
0.1µF
GND
2k
0.01µF
10µF
FIGURE 35. NOISE REDUCTION NETWORK
Turn-On Time
The X60003 device has ultra-low supply current and thus the
time to bias-up internal circuitry to final values will be longer than
with higher power references. Normal turn-on time is typically
7ms. This is shown in the graph, Figure 32. Since devices can
vary in supply current down to 300nA, turn-on time can last up to
about 12ms. Care should be taken in system design to include
this delay before measurements or conversions are started.
Temperature Coefficient
The limits stated for temperature coefficient (tempco) are governed
by the method of measurement. The overwhelming standard for
specifying the temperature drift of a reference is to measure the
reference voltage at two temperatures, take the total variation
(VHIGH- VLOW), and divide by the temperature extremes of
measurement (THIGH - TLOW). The result is divided by the nominal
reference voltage (at T = +25°C) and multiplied by 106 to yield
ppm/°C. This is the “Box” method for determining temperature
coefficient.
Page 13 of 17
X60003
Typical Application Circuits
6.0V TO 9.0V
R = 200
2N2905
VIN
VOUT
5.0V/50mA
X60003
0.001µF
GND
FIGURE 36. PRECISION 5V, 50mA REFERENCE
5.5V TO 9.0V
0.1µF
VIN
5.0V
VOUT
X60003
0.001µF
GND
VIN
R1 =
5.0V - | VIN |
VOUT
-(IOUT)
; IOUT £ 10mA
X60003-41
0.001µF
GND
VIN = -5.5V TO -9.0V
-5.0V
R1
FIGURE 37. ±5.0V DUAL OUTPUT, HIGH ACCURACY REFERENCE
5.5V TO 9.0V
0.1µF
VIN
VOUT
X60003
+
VOUT SENSE
–
LOAD
GND
FIGURE 38. KELVIN SENSED LOAD
FN8137 Rev 5.00
September 1, 2015
Page 14 of 17
X60003
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest Rev.
DATE
REVISION
CHANGE
September 1, 2015 FN8137.5 Updated Ordering Information table on page 3.
June 23, 2014
FN8137.4 Updated POD with following changes:
In Detail A, changed lead width dimension from 0.13+/-0.05 to 0.085-0.19
Changed dimension of foot of lead from 0.31+/-0.10 to 0.38+/-0.10
In Land Pattern, added 0.4 Rad Typ dimension
In Side View, changed height of package from 0.91+/-0.03 to 0.95+/-0.07
March 31, 2010
FN8137.3 Throughout- Converted to new format. Changes made as follows:
Moved “Available Options”, “Pin Configuration” and “Pin Descriptions” to page 2
Added “Related Literature” on page 1
Added key selling feature graphic Figure 1 to page 1
Added MSL note to “Ordering Information” table on page 3
Added "Boldface limits apply..." note to common conditions of Electrical Specifications tables on page 4 and page 5.
Bolded applicable specs. Added Note 12 to MIN MAX columns of all Electrical Specifications tables.
Added Latch Up to “Absolute Voltage Ratings” on page 4
Added Junction Temperature to “Thermal Information” on page 4
Added JEDEC standards used at the time of testing for “ESD Ratings” on page 4
Added “Revision History” on page 15 and “About Intersil” on page 16
Updated package outline drawing on page 17 to new format by adding land pattern and moving dimensions from
table onto drawing
Removed retired devices from “Ordering Information” table on page 3 and “Available Options” on page 2 as follows:
X60003BIG3-41T1
X60003CIG3-41T1
X60003DIG3-41T1
X60003BIG3-50T1
X60003CIG3-50T1
X60003DIG3-50T1
Added the following to page 4:
"Environmental Operating Conditions
X-Ray Exposure (Note 4)..........10mRem
Note 4. Measured with no filtering, distance of 10” from source, intensity set to 55kV and 70mA current, 30s duration.
Other exposure levels should be analyzed for Output Voltage drift effects. See “Applications Information” on page 10.
“Thermal Information” on page 4: Changed Theta JA from 202.70 to 375. Added Theta JC of 110 and applicable note
(measured at top of package).
In Figures 1, 3, 5 and 30, changed the color to Dark Blue (Unit 3), Black (Unit 2), and Dark Green (Unit 1). Changed
name of Unit 3 to High, Unit 2 to Typ and Unit 1 to Low.
Figure 4. Changed the colors to Dark Blue (85), Black (25), and Dark Green (-40).
Figure 29. Increased the Y-axis to 800nA.
Added “Handling and Board Mounting” on page 12
FN8137 Rev 5.00
September 1, 2015
Page 15 of 17
X60003
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support.
© Copyright Intersil Americas LLC 2005-2017. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8137 Rev 5.00
September 1, 2015
Page 16 of 17
X60003
Package Outline Drawing
P3.064
3 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE (SOT23-3)
Rev 3, 3/12
2.92±0.12
4
DETAIL "A"
C
L
0.085 - 0.19
2.37±0.27
1.30±0.10
4
C
L
0.950
0.435±0.065
0 - 8 deg.
0.20 M C
TOP VIEW
10° TYP
(2 plcs)
0.25
0.95±0.07
GAUGE PLANE
1.00±0.12
SEATING PLANE
C
SEATING PLANE
0.10 C
0.38±0.10 5
0.013(MIN)
0.100(MAX)
SIDE VIEW
DETAIL "A"
(0.60)
NOTES:
(2.15)
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3.
Reference JEDEC TO-236.
4.
Dimension does not include interlead flash or protrusions.
Interlead flash or protrusions shall not exceed 0.25mm per side.
5.
Footlength is measured at reference to gauge plane.
(1.25)
(0.4 RAD TYP.)
(0.95 typ.)
TYPICAL RECOMMENDED LAND PATTERN
FN8137 Rev 5.00
September 1, 2015
Page 17 of 17
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