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SFN06VD10CBQLF7

SFN06VD10CBQLF7

  • 厂商:

    IRCTT(TT电子)

  • 封装:

    DFN6_EP

  • 描述:

    排阻/电阻网络 DFN6_EP 10KΩ ±0.25% ±25ppm/℃

  • 数据手册
  • 价格&库存
SFN06VD10CBQLF7 数据手册
MODELS SS103VD, SFN06VD Voltage divider circuit Thin film resistor network RoHS compliant available FEATURES Precision Nichrome Resistors on Silicon Passivation coating provides protection in humid environments 6 pad SON1 2mm square with 0.65 mm pitch (JEDEC MO-229D) 3 lead SOT23 (JEDEC TO-239) Industry Standard Packaging Ratio Tolerances < ± 0.05% TCR Tracking Tolerances < ± 5 ppm/°C CIRCUIT SCHEMATIC ELECTRICAL2 Standard Resistance Range 1K ohms to 100K ohms Resistor Tolerances ± 0.25% Ratio Tolerances ± 0.05% TCR Reference TCR table Operating Temperature Range -55°C to +125°C Interlead Capacitance < 2 pF Insulation Resistance = 10,000 Megohms Maximum Operating Voltage 100 Vdc or v PR Noise, Maximum (MIL-STD-2002, Method 308) -25 dB 0.2 Watts Maximum Package Power @ 70°C RESISTANCE TOLERANCES Accuracy Code at 25°C CA CB D FA F G J Absolute Resistance Tolerances (%) ± 0.25 ± 0.25 ± 0.5 ± 1.0 ± 1.0 ± 2.0 ± 5.0 Ratio Tolerances (R1 Ref) (%) ± 0.05 ± 0.1 ± 0.1 ± 0.05 ± 1.0 N/A N/A 1 Small outline no lead (SON) package is also referred to as quad flat no lead (QFN) or dual flat no lead (DFN) packages. 2 Specifications subject to change without notice. BI Technologies Corporation 4200 Bonita Place Fullerton, CA 92835 USA Website: www.bitechnologies.com May 6, 2009 page 1 of 3 BI technologies SS103VD TEMPERATURE COEFFICIENT OF RESISTANCE (TCR) TCR Code (-55°C to 125°C) Absolute (ppm/°C) Tracking (R1 Ref) (ppm/°C) Q P S L ± 25 ± 50 ± 100 ± 200 ±5 ±5 N/A N/A POWER DERATING CURVE ENVIRONMENTAL (MIL-R-83401) ∆R 0.25% Thermal Shock plus Power Conditioning Short Time Overload ∆R 0.1% Moisture Resistance ∆R 0.2% Mechanical Shock ∆R 0.25% Vibration ∆R 0.25% Low Temperature Operation ∆R 0.1% High Temperature Exposure ∆R 0.1% ∆R 0.05% Resistance to Solder Heat Marking Permanency Per MIL-STD-202, Method 215 Storage Temperature Range -55°C to +125°C MECHANICAL Lead Plating 80/20 Tin Lead (Standard) 100 matte Tin (RoHS) Lead Material Copper Alloy Lead Configurations (SLP/SS1) No lead, Gull Wing Lead Coplanarity (SS1 only) 0.003” (0.102 mm) Substrate Material Silicon Resistor Material Passivated Nichrome Body Material Molded Epoxy Package Types 6 pad SON 2mm square, 3 lead SOT23 BI Technologies Corporation 4200 Bonita Place Fullerton, CA 92835 USA Website: www.bitechnologies.com May 6, 2009 page 2 of 3 BI technologies SS103VD DIVIDER RATIO Resistance Code Ratio (R2/R1) R1 (ohms) R2 (ohms) 01 1.613 12.4K 20K 02 10 10K 100K 03 4 5K 20K 05 1 20K 20K 06 9 11.3K 101.7K 07 2 10K 20K 08 3 3.333K 10K 09 2 5K 10K 10 1 10K 10K 11 2 1K 2K 12 2 50K 100K ORDERING INFORMATION3 S S1 03 VD 05 F S LF 13 Model Series: S = Passivated Nichrome on Silicon Packaging Option (Qty/reel) 7=7” Tape & Reel (1000 pcs) 13 = 13" Tape & Reel (3000 pcs) Package Type: S1 = SOT-23 FN = SON 2mm sq Lead Finish: No Code=SnPb LF=Lead Free (RoHS) Pin Count: Circuit Type: VD=Voltage Divider TCR Code: TCR table Resistance Code: Divider ratio table Tolerance Code: Resistance tolerance table TYPICAL MARKING 3 Contact our customer service for custom designs and features. BI Technologies Corporation 4200 Bonita Place Fullerton, CA 92835 USA Website: www.bitechnologies.com May 6, 2009 page 3 of 3 BI technologies
SFN06VD10CBQLF7 价格&库存

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