CA-QFE32SA-M-Z-T-02F

58.42mm [2.300"] 1.27mm [0.050"] 32 31 26 25 7.00mm [0.276"] 1.27mm [0.050"] 21 Pin 1 23 24 TOP VIEW 45.72mm [1.800"] 87 17 18 32.51mm [1.280"] 9 10 15 16 1 6.50mm [0.256"] 43.94mm [1.730"] 4 SIDE VIEW 21.26mm [0.837"] 3 2 3.19mm [0.126"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] per IPC 4101/21, gold surface finish. Substrate: 3.18mm ±0.18mm [0.125" ±0.007"] FR4/G10 or equivalent high temp material. Non-clad. Pins: shellmaterial- Brass Alloy 360 1/2 hard; finish- 0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Contact material- BeCu; finish 0.25µm [10µ"] Au over 2.54µm [100µ"] Ni (min. ). Test points: material- Phosphor Bronze; platingSn over 1.27µm [50µ"] Ni. Gold flash on contact end. 2 RoHS COMPLIANT 3 4 Description: Carrier Adaptor (CA) 32 position QFP ZIF socket (mini-grid on 0.040" centers) to 32 position mini grid socket with test points. Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice. CA-QFE32SA-M-Z-T-02F Drawing © 2008 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Drawing: E Smolentseva Scale: 1.5:1 Rev: A Date: 02/11/08 Modified: File: CA-QFE032SA-M-Z-T-02F Dwg