CA-QFE64RB-L-Z-T-01

63.5mm 2.500" 1 Substrate: 1.59mm ±0.18m m [0.0625" ±0.007"] FR4/G10 or equivale nt high temp material. 17µm [1/2 oz.] Cu clad. SnPb plating. Pins: material- Brass Alloy 360 1/2 hard; finish- 0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Test points: ma terial- Phosphor Bronz e; plating- Sn ove r 1.27µm [ 50µ"] Ni. Gold flash on contact end. 2 3 48.26mm 1.900" Y 1mm Top View 1 X Leadless foot dimensions 2 19.68mm 0.775" B MGA socket 3 1mm 7.24mm [0.285"] Assembled Leadless foot A Side View QFP package dimensions * Part Number CA-QFE64RA-L-Z-T-01 CA-QFE64RB-L-Z-T-01 CA-QFE64RC-L-Z-T-01 CA-QFE64RD-L-Z-T-01 Footprint QFE64RA QFE64RB QFE64RC QFE64RD Dim "A" 19.6mm [0.772"] 17.2mm [0.677"] 17.9mm [0.705"] 18.8mm [0.740"] Dim "B" Dim "X" Dim "Y" 25.5 mm [1.004"] 17.65mm [0.695"] 23.62mm [0.930"] 23.2mm [0.913"] 23.9mm [0.941"] 24.8mm [0.976"] 16.13mm [0.635"] 22.10mm [0.870"] 16.89mm [0.665"] 22.86mm [0.900"] 17.65mm [0.695"] 23.62mm [0.930"] Descr iption: Carrier Adaptor (CA) 64 position (1.00mm pitch) QFP zero insertion force (ZIF) socket with test points to 64 position surface mountable QFP emulator foot. The 2 piece adaptor interconnects via a gold plated (1.27mm [0.05"] center) Mini-grid socket interface. Emulator foot is leadless and design to attached to gull-wing QFP pattern. T olera nce s: diameters ± 0.0 3mm [±0.001”], P CB pe rimete rs ±0.13mm [±0 .0 05”], PCB th icknesses ±0 .18 mm [±0.007"], p itches (from true position) ±0.08mm [±0 .0 03"], all other toleran ce s ±0.13mm [±0 .00 5”] un less stated otherwise. CA-QFE64R(x)-L-Z-T-01* Drawing © 1995 IRO NWO OD ELECTRO NICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Drawing: G. Nelson Scale 3:2 Rev: G Date: 3/23/95 Modified: 1/28/05, MT File: CA-QFE064RA-L-Z-T-01 Dwg