IS314W

ISOCOM COMPONENTS IS314W DESCRIPTION 1 Anode The IS314W Photocoupler is ideally suited for driving power IGBTs and MOSFETs used in inverters of motor control and of power supply system. It contains an AlGaAs LED optically coupled to an integrated circuit with a power output stage. 2 NC 3 Cathode 4 GND (VEE) The device is in Stretched SO6 package. 5 VO 6 VCC FEATURES • • • • • • • • • • • • • 1.0A Maximum Peak Output Current 0.8A Minimum Peak Output Current Rail-to-Rail output voltage 20kV/μs Minimum Common Mode Rejection at VCM 1500V Maximum Propagation Delay 200ns Maximum Propagation Delay Difference 100ns Wide Operating Voltage Range VCC 10 to 30 V Maximum Supply Current ICC 3.0mA Under Voltage Lock Out (UVLO) Protection with Hysteresis Guaranteed Performance over Temperature Range - 40°C to +105°C MSL Level 1 Lead Free and RoHS Compliant Safety Approvals Pending A 0.1μF bypass Capacitor must be connected between Pins 6 and 4. ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. Input Forward Current Forward Peak Current (Pulse Width ≤ 1μs, 300pps) Reverse Voltage Forward Current Rise / Fall Time Power dissipation • • • • • IGBT/MOSFET Gate Drive UPS Inverters Switching Power Supplies AC Brushless and DC Motor Drives ORDER INFORMATION • Supplied in Tape & Reel ISOCOM COMPONENTS 2004 LTD Unit 25B, Park View Road West, Park View Industrial Estate Hartlepool, Cleveland, TS25 1PE, United Kingdom Tel: +44 (0)1429 863 609 Fax : +44 (0)1429 863 581 e-mail: sales@isocom.co.uk http://www.isocom.com 1 13/10/2016 5V 500ns 45mW Output High Level Peak Output Current APPLICATIONS 25mA 1.0A 1.0A Exponential waveform. Pulse width ≤ 0.3 µs, f ≤ 15 kHz Low Level Peak Output Current 1.0A Exponential waveform. Pulse width ≤ 0.3 µs, f ≤ 15 kHz Supply Voltage (VCC ̶ VEE) 35V Output Voltage VCC Power Dissipation 250mW Total Package Isolation Voltage Total Power Dissipation Operating Temperature Storage Temperature Lead Soldering Temperature (10s) 5000VRMS 295mW -40 to 105 °C -55 to 125 °C 260°C ISOCOM COMPONENTS ASIA LTD Hong Kong Office, Block A, 8/F, Wah Hing Industrial mansion, 36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong. Tel: +852 2995 9217 Fax : +852 8161 6292 e-mail sales@isocom.com.hk DC93194 ISOCOM COMPONENTS IS314W Truth Table LED High Side Low Side VO OFF OFF ON LOW ON ON OFF HIGH Recommended Operating Conditions Parameter Symbol Min Max Unit TA - 40 105 °C VCC ̶ VEE 10 30 V Input Current (ON) IF(ON) 7 16 mA Input Voltage (OFF) VF(OFF) -3.0 0.8 V Operating Temperature Supply Voltage 2 13/10/2016 DC93194 ISOCOM COMPONENTS IS314W ELECTRICAL CHARACTERISTICS (Typical Values at VCC ̶ VEE = 10V to 30V and TA = 25°C, Minimum and Maximum Values at Recommended Operating Conditions, unless otherwise specified) INPUT Parameter Symbol Test Condition Min Typ. Max Unit Forward Voltage VF IF = 10mA 1.2 1.37 1.8 V Forward Voltage Temperature Coefficient ΔVF/ΔT IF = 10mA Reverse Voltage VR IR = 10μA Input Threshold Current (Low to High) IFLH VO > 5V, IO = 0A Input Threshold Voltage (High to Low) VFHL VO < 5V, IO = 0A Input Capacitance CIN VF = 0V, f = 1MHz Symbol Test Condition High Level Supply Current ICCH Low Level Supply Current High Level Output Current OUTPUT Parameter Low Level Output Current ̶ 1.237 mV/°C 5 V 1.9 5 mA 0.8 V 33 Typ. Max Unit IF = 7 to 16mA VO = Open 1.9 3.0 mA ICCL VF = ̶ 3 to 0.8V VO = Open 2.1 3.0 mA IOH VO = VCC – 1.5V Pulse Width = 50μs ̶ 0.3 A VO = VCC – 3V Pulse Width = 10μs ̶ 0.8 IOL Min pF VO = VEE + 1.5V Pulse Width = 50μs 0.3 VO = VEE + 3V Pulse Width = 10μs 0.8 VCC ̶ 0.6 A High Level Output Voltage VOH IF = 10mA, IO = -100mA Low Level Output Voltage VOL IF = 0mA, IO = 100mA VUVLO+ VO > 5V, IF = 10mA 7.8 V VUVLO- VO < 5V, IF = 10mA 6.7 V 1.1 V UVLO Threshold UVLO Hysteresis 3 13/10/2016 UVLOHYS VCC ̶ 0.35 V VEE +0.25 VEE +0.4 V DC93194 ISOCOM COMPONENTS IS314W ELECTRICAL CHARACTERISTICS (Typical Values at VCC ̶ VEE = 10V to 30V and TA = 25°C, Minimum and Maximum Values at Recommended Operating Conditions, unless otherwise specified) SWITCHING Parameter Symbol Test Condition Min Typ. Max Unit Propagation Delay Time to High Output Level tPLH 50 120 200 ns Propagation Delay Time to Low Output Level tPHL 50 110 200 Pulse Width Distortion |tPHL - tPLH| for any given device PWD IF = 7 to 16mA, VCC = 15 to 30V, VEE = 0V Rg = 47Ω, Cg = 3nF, f = 10kHz, Duty Cycle = 50% 20 70 Propagation Delay Difference (tPHL - tPLH) between any two Devices PDD -100 100 Output Rise Time (10% to 90%) tr 35 Output Fall Time (90% to 10%) tf 35 Common Mode Transient Immunity at High Output Level CMH IF = 10 to 16mA, VCC = 30V VCM = 1500V, TA = 25°C 20 25 kV/μs Common Mode Transient Immunity at Low Output Level CML VF = 0V, VCC = 30V VCM = 1500V, TA = 25°C 20 25 kV/μs 4 13/10/2016 DC93194 ISOCOM COMPONENTS IS314W ELECTRICAL CHARACTERISTICS (Typical Values at VCC ̶ VEE = 10V to 30V and TA = 25°C, Minimum and Maximum Values at Recommended Operating Conditions, unless otherwise specified) ISOLATION Parameter Symbol Test Condition Min Typ. Max Unit Insulation Voltage VISO RH ≤ 40% to 60%, t = 1 min, TA = 25°C 5000 Input - Output Resistance RI-O VI-O = 500VDC 1012 Ω Input - Output Capacitance CI-O f = 1MHz, TA = 25°C 0.92 pF V Note : 1. A 0.1uF or bigger bypass capacitor must be connected across pin 6 and pin 4. 2. PDD is the difference of tPHL and tPLH between any two IS314W devices under same test conditions. 3. CMH, Common Mode Transient Immunity in High stage is the maximum tolerable positive dVCM/dt on the leading edge of the common mode impulse signal, VCM, to assure that the output will remain high (VO > 15V). 4. CML, Common Mode Transient Immunity in Low stage is the maximum tolerable negative dVCM/dt on the trailing edge of the common mode impulse signal, VCM, to assure that the output will remain low (VO < 1V). 5 13/10/2016 DC93194 ISOCOM COMPONENTS IS314W Fig 1 Forward Current vs Forward Voltage Fig 2 Supply Current vs Supply Voltage Fig 3 Supply Current vs Ambient Temperature Fig 4 Low Level Output Voltage vs Ambient temperature Fig 5 High Level Output Voltage vs Ambient Temperature Fig 6 High Output Voltage Drop vs Ambient Temperature 6 13/10/2016 DC93194 ISOCOM COMPONENTS IS314W Fig 7 IFLH Hysteresis Fig 8 Input Threshold Current vs Ambient Temperature Fig 9 Propagation Delay vs Supply Voltage Fig 10 Propagation Delay vs Forward Current Fig 11 Propagation Delay vs Series Load Resistance Fig 12 Propagation Delay vs Series Load Capacitance 7 13/10/2016 DC93194 ISOCOM COMPONENTS IS314W Fig 13 Propagation Delay vs Ambient Temperature VOH Test Circuit VOL Test Circuit 8 13/10/2016 DC93194 ISOCOM COMPONENTS IS314W IOH Test Circuit IOL Test Circuit IFLH Test Circuit 9 13/10/2016 DC93194 ISOCOM COMPONENTS IS314W UVLO Test Circuit tr, tf, tPLH and tPHL Test Circuit and Waveform 10 13/10/2016 DC93194 ISOCOM COMPONENTS IS314W CMR Test Circuit and Waveform 11 13/10/2016 DC93194 ISOCOM COMPONENTS IS314W ORDER INFORMATION IS314W After PN None PN Description Packing quantity IS314W Stretched SO6 1000 pcs per reel DEVICE MARKING IYYWW IS314W IS314W denotes Device Part Number I denotes Isocom YY denotes 2 digit Year code WW denotes 2 digit Week code 12 13/10/2016 DC93194 ISOCOM COMPONENTS IS314W PACKAGE DIMENSIONS and Recommended PCB Pad Layout in mm (inch) 13 13/10/2016 DC93194 ISOCOM COMPONENTS IS314W TAPE AND REEL PACKAGING Description Symbol Dimension mm (inch) Tape Width W 16 ± 0.3 (0.63) Pitch of Sprocket Holes P0 4 ± 0.1 (0.16) F 7.5 ± 0.1 (0.3) P2 2 ± 0.1 (0.079) P1 16 ± 0.1 (0.63) Distance of Compartment to Sprocket Holes Distance of Compartment to Compartment 14 13/10/2016 DC93194 ISOCOM COMPONENTS IS314W IR REFLOW SOLDERING TEMPERATURE PROFILE (One Time Reflow Soldering is Recommended) TP 260°C TP - 5°C Max Ramp Up Rate 3°C/s TEMP (°C) TL Tsmax Tsmin tP Max Ramp Down Rate 6°C/s 217°C TL 200°C 150°C ts Preheat 60s – 120s 25°C TIME (s) Time 25°C to Peak Temperature Profile Details Conditions Preheat - Min Temperature (TSMIN) - Max Temperature (TSMAX) - Time TSMIN to TSMAX (ts) 150°C 200°C 60s - 120s Soldering Zone - Peak Temperature (TP) - Time at Peak Temperature - Liquidous Temperature (TL) - Time within 5°C of Actual Peak Temperature (TP ̶ 5°C) - Time maintained above TL (tL) - Ramp Up Rate (TL to TP) - Ramp Down Rate (TP to TL) 260°C 10s max 217°C 30s max 60s - 100s 3°C/s max 6°C/s max Average Ramp Up Rate (Tsmax to TP) 3°C/s max Time 25°C to Peak Temperature 8 minutes max 15 13/10/2016 DC93194 ISOCOM COMPONENTS IS314W NOTES : - Isocom is continually improving the quality, reliability, function or design and Isocom reserves the right to make changes without further notices. - The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical application and instrumentation. - For equipment/application where high reliability or safety is required, such as space applications, nuclear power control equipment, medical equipment, etc., please contact our sales representatives. - When requiring a device for any ”specific” application, please contact our sales for advice. - The contents described herein are subject to change without prior notice. - Do not immerse device body in solder paste. 16 13/10/2016 DC93194 ISOCOM COMPONENTS DISCLAIMER ISOCOM is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing ISOCOM products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such ISOCOM products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that ISOCOM products are used within specified operating ranges as set forth in the most recent ISOCOM products specifications. __ The ISOCOM products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These ISOCOM products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation Instruments, traffic signal instruments, combustion control instruments, medical Instruments, all types of safety devices, etc.. Unintended Usage of ISOCOM products listed in this document shall be made at the customer’s own risk. __ Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. __ The products described in this document are subject to the foreign exchange and foreign trade laws. __ The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by ISOCOM Components for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of ISOCOM Components or others. __ The information contained herein is subject to change without notice. 17 13/10/2016 Dxxxxxx