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PS2501-2SM

PS2501-2SM

  • 厂商:

    ISOCOM

  • 封装:

    OC_9.68X6.5MM_SM

  • 描述:

    单向光耦 Viso=5300Vrms VF(typ)=1.2V IF=50mA Vo=80V CTR=80~600% DIP/SMD8

  • 数据手册
  • 价格&库存
PS2501-2SM 数据手册
ISOCOM COMPONENTS PS2501-1, PS2501-2, PS2501-4 DESCRIPTION The PS2501-1, PS2501-2 and PS2501-4 series of optically coupled isolator consist of an infrared light emitting diode and an NPN silicon photo transistor in a space efficient Dual In Line Plastic Package. PS2501-1 FEATURES • • • • • • AC Isolation Voltage 5300VRMS CTR Selections Available Wide Operating Temperature Range -30°C to +100°C Lead Free and RoHS Compliant UL File E91231 Package Code “EE” VDE Approval Certificate No. 40028086 PS2501-2 PS2501-4 APPLICATIONS • • • • Computer Terminals Industrial System Controllers Measuring Instruments Signal Transmission between Systems of Different Potentials and Impedances ABSOLUTE MAXIMUM RATINGS Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. Input ORDER INFORMATION • • • • Add X after PN for VDE Approval Add G after PN for 10mm lead spacing Add SM after PN for Surface Mount Add SMT&R after PN for Surface Mount Tape & Reel (Available for PS2501-1SM and PS2501-2SM) Forward Current Reverse Voltage Power dissipation 50mA 6V 70mW Output Collector to Emitter Voltage BVCEO Emitter to Collector Voltage BVECO Collector Current Power Dissipation 80V 6V 50mA 150mW Total Package Operating Temperature Storage Temperature Total Power Dissipation (derate linearly 2.67mW/°C at >25°C) Lead Soldering Temperature (10s) ISOCOM COMPONENTS 2004 LTD Unit 25B, Park View Road West, Park View Industrial Estate Hartlepool, Cleveland, TS25 1PE, United Kingdom Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581 e-mail : sales@isocom.co.uk http://www.isocom.com 1 15/12/2016 -30 to +100 °C -55 to +125 °C 200mW 260°C ISOCOM COMPONENTS ASIA LTD Hong Kong Office Block A, 8/F, Wah Hing Industrial Mansion 36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong Tel : +852 2995 9217 Fax : +852 8161 6292 e-mail : sales@isocom.com.hk DD93204 ISOCOM COMPONENTS PS2501-1, PS2501-2, PS2501-4 ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25°C unless otherwise specified) INPUT Parameter Symbol Test Condition Min Typ. Max Unit Forward Voltage VF IF = 20mA 1.2 1.4 V Reverse Voltage VR IR = 10μA Reverse Leakage IR VR = 4V Terminal Capacitance Ct V = 0V, f = 1KHz Symbol Test Condition Min Collector—Emitter Breakdown Voltage BVCEO IC = 1mA, IF = 0mA 80 V Emitter—Collector Breakdown Voltage BVECO IE = 100µA, IF = 0mA 6 V ICEO VCE = 20V, IF = 0mA Symbol Test Condition 6.0 V 10 µA 30 250 pF Typ. Max Unit OUTPUT Parameter Collector-Emitter Dark Current 100 nA Max Unit % COUPLED Parameter Current transfer ratio CTR Min Typ. IF = 5mA, VCE = 5V 80 600 Optional CTR Grades GR L (PS2501-1 only) 100 200 300 400 VCE(sat) IF = 10mA, IC = 2mA Input to Output Isolation Voltage VISO AC 1 minute, RH = 40 to 60% Note 1 5300 VRMS Input to Output Isolation Resistance RISO VIO= 500V Note 1 5x1010 Ω Output Rise Time tr VCE = 2V, Ic = 2mA, RL = 100Ω 4 18 µs Output Fall Time tf VCE = 2V, Ic = 2mA, RL = 100Ω 3 18 µs Collector—Emitter Saturation Voltage 0.3 V Note 1 : Measure with input leads shorted together and output leads shorted together. 2 15/12/2016 DD93204 ISOCOM COMPONENTS PS2501-1, PS2501-2, PS2501-4 Fig 1 Forward Current vs TA Fig 2 Collector Power Dissipation vs TA Fig 3 Collector-emitter Saturation Voltage vs Forward Current Fig 4 Collector Current vs Collector-emitter Voltage Fig 5 Current Transfer Ratio vs Forward Current Fig 6 Forward Current vs Forward Voltage 3 15/12/2016 DD93204 ISOCOM COMPONENTS PS2501-1, PS2501-2, PS2501-4 Fig 7 Relative CTR vs TA Fig 8 Frequency Response Fig 9 Response Time vs Load Resistance Response Time Test Circuit 4 15/12/2016 DD93204 ISOCOM COMPONENTS PS2501-1, PS2501-2, PS2501-4 ORDER INFORMATION PS2501-1 (UL Approval) After PN Description PN Packing quantity None PS2501-1, PS2501-1GR, PS2501-1L Standard DIP4 100 pcs per tube G PS2501-1G, PS2501-1GRG, PS2501-1LG 10mm Lead Spacing 100 pcs per tube SM PS2501-1SM, PS2501-1GRSM, PS2501-1LSM Surface Mount 100 pcs per tube SMT&R PS2501-1SMT&R, PS2501-1GRSMT&R, PS2501-1LSMT&R Surface Mount Tape & Reel 1000 pcs per reel PS2501-2 (UL Approval) After PN Description PN Packing quantity None PS2501-2, PS2501-2GR Standard DIP8 50 pcs per tube G PS2501-2G, PS2501-2GRG 10mm Lead Spacing 50 pcs per tube SM PS2501-2SM, PS2501-2GRSM Surface Mount 50 pcs per tube SMT&R PS2501-2SMT&R, PS2501-2GRSMT&R, Surface Mount Tape & Reel 1000 pcs per reel PS2501-4 (UL Approval) After PN PN Description Packing quantity None PS2501-4, PS2501-4GR Standard DIP16 25 pcs per tube G PS2501-4G, PS2501-4GRG 10mm Lead Spacing 25 pcs per tube SM PS2501-4SM, PS2501-4GRSM Surface Mount 25 pcs per tube CTR grade “L” available only for PS2501-1. 5 15/12/2016 DD93204 ISOCOM COMPONENTS PS2501-1, PS2501-2, PS2501-4 ORDER INFORMATION PS2501-1X (UL and VDE Approvals) After PN Description PN Packing quantity None PS2501-1X, PS2501-1XGR, PS2501-1XL Standard DIP4 100 pcs per tube G PS2501-1XG, PS2501-1XGRG, PS2501-1XLG 10mm Lead Spacing 100 pcs per tube SM PS2501-1XSM, PS2501-1XGRSM, PS2501-1XLSM Surface Mount 100 pcs per tube SMT&R PS2501-1XSMT&R, PS2501-1XGRSMT&R, PS2501-1XLSMT&R Surface Mount Tape & Reel 1000 pcs per reel PS2501-2X (UL and VDE Approvals) After PN Description PN Packing quantity None PS2501-2X, PS2501-2XGR Standard DIP8 50 pcs per tube G PS2501-2XG, PS2501-2XGRG 10mm Lead Spacing 50 pcs per tube SM PS2501-2XSM, PS2501-2XGRSM, Surface Mount 50 pcs per tube SMT&R PS2501-2XSMT&R, PS2501-2XGRSMT&R Surface Mount Tape & Reel 1000 pcs per reel PS2501-4X (UL and VDE Approvals) After PN PN Description Packing quantity None PS2501-4X, PS2501-4XGR, Standard DIP16 25 pcs per tube G PS2501-4XG, PS2501-4XGRG 10mm Lead Spacing 25 pcs per tube SM PS2501-4XSM, PS2501-4XGRSM Surface Mount 25 pcs per tube CTR grade “L” available only for PS2501-1. 6 15/12/2016 DD93204 ISOCOM COMPONENTS PS2501-1, PS2501-2, PS2501-4 PACKAGE DIMENSIONS in mm (inch) DIP PS2501-1 PS2501-2 PS2501-4 7 15/12/2016 DD93204 ISOCOM COMPONENTS PS2501-1, PS2501-2, PS2501-4 PACKAGE DIMENSIONS in mm (inch) G Form PS2501-1G PS2501-2G PS2501-4G 8 15/12/2016 DD93204 ISOCOM COMPONENTS PS2501-1, PS2501-2, PS2501-4 PACKAGE DIMENSIONS in mm (inch) SMD PS2501-1SM PS2501-2SM PS2501-4SM 9 15/12/2016 DD93204 ISOCOM COMPONENTS PS2501-1, PS2501-2, PS2501-4 RECOMMENDED PAD LAYOUT FOR SMD (mm) PS2501-1SM PS2501-2SM PS2501-4SM 10 15/12/2016 DD93204 ISOCOM COMPONENTS PS2501-1, PS2501-2, PS2501-4 TAPE AND REEL PACKAGING PS2501-1SMT&R PS2501-2SMT&R 11 15/12/2016 DD93204 ISOCOM COMPONENTS PS2501-1, PS2501-2, PS2501-4 IR REFLOW SOLDERING TEMPERATURE PROFILE FOR SMD (One Time Reflow Soldering is Recommended) TP 260°C TP - 5°C Max Ramp Up Rate 3°C/s TEMP (°C) TL Tsmax Tsmin tP Max Ramp Down Rate 6°C/s 217°C TL 200°C 150°C ts Preheat 60s – 120s 25°C TIME (s) Time 25°C to Peak Temperature Profile Details Conditions Preheat - Min Temperature (TSMIN) - Max Temperature (TSMAX) - Time TSMIN to TSMAX (ts) 150°C 200°C 60s - 120s Soldering Zone - Peak Temperature (TP) - Time at Peak Temperature - Liquidous Temperature (TL) - Time within 5°C of Actual Peak Temperature (TP ̶ 5°C) - Time maintained above TL (tL) - Ramp Up Rate (TL to TP) - Ramp Down Rate (TP to TL) 260°C 10s max 217°C 30s max 60s - 100s 3°C/s max 6°C/s max Average Ramp Up Rate (Tsmax to TP) 3°C/s max Time 25°C to Peak Temperature 8 minutes max 12 15/12/2016 DD93204 ISOCOM COMPONENTS PS2501-1, PS2501-2, PS2501-4 NOTES : - Isocom is continually improving the quality, reliability, function or design and Isocom reserves the right to make changes without further notices. - The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical application and instrumentation. - For equipment/application where high reliability or safety is required, such as space applications, nuclear power control equipment, medical equipment, etc., please contact our sales representatives. - When requiring a device for any ”specific” application, please contact our sales for advice. - The contents described herein are subject to change without prior notice. - Do not immerse device body in solder paste. 13 15/12/2016 DD93204 ISOCOM COMPONENTS DISCLAIMER __ ISOCOM is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing ISOCOM products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such ISOCOM products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that ISOCOM products are used within specified operating ranges as set forth in the most recent ISOCOM products specifications. __ The ISOCOM products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These ISOCOM products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation Instruments, traffic signal instruments, combustion control instruments, medical Instruments, all types of safety devices, etc.. Unintended Usage of ISOCOM products listed in this document shall be made at the customer’s own risk. __ Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. __ The products described in this document are subject to the foreign exchange and foreign trade laws. __ The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by ISOCOM Components for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of ISOCOM Components or others. __ The information contained herein is subject to change without notice. 14 15/12/2016 DD93204