IS61S6432-8PQI

IS61S6432 64K x 32 SYNCHRONOUS PIPELINE STATIC RAM FEATURES • Internal self-timed write cycle • Individual Byte Write Control and Global Write • Clock controlled, registered address, data and control • Pentium™ or linear burst sequence control using MODE input • Three chip enables for simple depth expansion and address pipelining • Common data inputs and data outputs • Power-down control by ZZ input • JEDEC 100-Pin TQFP and PQFP package • Single +3.3V power supply • Two Clock enables and one Clock disable to eliminate multiple bank bus contention • Control pins mode upon power-up: – MODE in interleave burst mode – ZZ in normal operation mode These control pins can be connected to GNDQ or VCCQ to alter their power-up state • Industrial temperature available ISSI DESCRIPTION ® JUNE 2001 The I SSI I S61S6432 is a high-speed, low-power synchronous static RAM designed to provide a burstable, high-performance, secondary cache for the Pentium™, 680X0™, and PowerPC™ microprocessors. It is organized as 65,536 words by 32 bits, fabricated with ISSI's advanced CMOS technology. The device integrates a 2-bit burst counter, high-speed SRAM core, and high-drive capability outputs into a single monolithic circuit. All synchronous inputs pass through registers controlled by a positive-edgetriggered single clock input. Write cycles are internally self-timed and are initiated by the rising edge of the clock input. Write cycles can be from one to four bytes wide as controlled by the write control inputs. Separate byte enables allow individual bytes to be written. BW1 controls DQ1-DQ8, BW2 controls DQ9-DQ16, BW3 controls DQ17-DQ24, B W4 c ontrols DQ25-DQ32, conditioned by BWE being LOW. A LOW on GW input would cause all bytes to be written. Bursts can be initiated with either ADSP (Address Status Processor) or ADSC (Address Status Cache Controller) input pins. Subsequent burst addresses can be generated internally by the IS61S6432 and controlled by the ADV (burst address advance) input pin. Asynchronous signals include output enable (OE), sleep mode input (ZZ), clock (CLK) and burst mode input (MODE). A HIGH input on the ZZ pin puts the SRAM in the powerdown state. When ZZ is pulled LOW (or no connect), the SRAM normally operates after three cycles of the wake-up period. A LOW input, i.e., GNDQ, on MODE pin selects LINEAR Burst. A VCCQ (or no connect) on MODE pin selects INTERLEAVED Burst. FAST ACCESS TIME Symbol tKQ tKC — Parameter CLK Access Time Cycle Time Frequency -200(1) 4 5 200 -166 5 6 166 -133 5 7.5 133 -117 5 8.5 117 -5 5 10 100 -6 6 12 83 -7 7 13 75 -8 8 15 66 Unit ns ns MHz Note: 1. ADVANCE INFORMATION ONLY. ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2001, Integrated Silicon Solution, Inc. Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 1 IS61S6432 BLOCK DIAGRAM MODE Q0 A0' ISSI CLK A0 ® CLK BINARY COUNTER ADV ADSC ADSP CE CLR Q1 A1' A1 64K x 32 MEMORY ARRAY 14 16 A15-A0 16 D Q ADDRESS REGISTER CE CLK 32 32 GW BWE BW4 D Q DQ32-DQ25 BYTE WRITE REGISTERS CLK D BW3 Q DQ24-DQ17 BYTE WRITE REGISTERS CLK D BW2 Q DQ16-DQ9 BYTE WRITE REGISTERS CLK D BW1 Q DQ8-DQ1 BYTE WRITE REGISTERS CLK CE1 CE2 CE3 D Q 4 ENABLE REGISTER CE CLK INPUT REGISTERS CLK OUTPUT REGISTERS CLK OE 32 DATA[32:1] D Q ENABLE DELAY REGISTER CLK OE PB Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 IS61S6432 PIN CONFIGURATION 100-Pin TQFP and PQFP (Top View) A6 A7 CE1 CE2 BW4 BW3 BW2 BW1 CE3 VCC GND CLK GW BWE OE ADSC ADSP ADV A8 A9 ISSI ® NC DQ17 DQ18 VCCQ GNDQ DQ19 DQ20 DQ21 DQ22 GNDQ VCCQ DQ23 DQ24 VCCQ VCC NC GND DQ25 DQ26 VCCQ GNDQ DQ27 DQ28 DQ29 DQ30 GNDQ VCCQ DQ31 DQ32 NC 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 1 79 2 78 3 77 4 76 5 75 6 74 7 73 8 72 9 71 10 70 11 69 12 68 13 67 14 66 15 65 16 64 17 63 18 62 19 61 20 60 21 59 22 58 23 57 24 56 25 55 26 54 27 53 28 52 29 51 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 NC DQ16 DQ15 VCCQ GNDQ DQ14 DQ13 DQ12 DQ11 GNDQ VCCQ DQ10 DQ9 GND NC VCC ZZ DQ8 DQ7 VCCQ GNDQ DQ6 DQ5 DQ4 DQ3 GNDQ VCCQ DQ2 DQ1 NC PIN DESCRIPTIONS A0-A15 CLK ADSP ADSC ADV BW1-BW4 BWE GW CE1, CE2, CE3 Address Inputs Clock Processor Address Status Controller Address Status Burst Address Advance Synchronous Byte Write Enable Byte Write Enable Global Write Enable Synchronous Chip Enable OE DQ1-DQ32 ZZ MODE VCC GND VCCQ GNDQ NC Output Enable Data Input/Output Sleep Mode Burst Sequence Mode +3.3V Power Supply Ground Isolated Output Buffer Supply: +3.3V Isolated Output Buffer Ground No Connect Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 MODE A5 A4 A3 A2 A1 A0 NC NC GND VCC NC NC A10 A11 A12 A13 A14 A15 NC 3 IS61S6432 TRUTH TABLE Operation Deselected, Power-down Deselected, Power-down Deselected, Power-down Deselected, Power-down Deselected, Power-down Read Cycle, Begin Burst Read Cycle, Begin Burst Write Cycle, Begin Burst Read Cycle, Begin Burst Read Cycle, Begin Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Write Cycle, Continue Burst Write Cycle, Continue Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Write Cycle, Suspend Burst Write Cycle, Suspend Burst Address Used None None None None None External External External External External Next Next Next Next Next Next Current Current Current Current Current Current CE1 H L L L L L L L L L X X H H X H X X H H X H CE2 X L X L X H H H H H X X X X X X X X X X X X CE3 X X H X H L L L L L X X X X X X X X X X X X ADSP ADSC X L L H H L L H H H H H X X H X H H X X H X L X X L L X X L L L H H H H H H H H H H H H ADV WRITE X X X X X X X X X X L L L L L L H H H H H H X X X X X X X L H H H H H H L L H H H H L L ISSI OE X X X X X L H X L H L H L H X X L H L H X X DQ High-Z High-Z High-Z High-Z High-Z Q High-Z D Q High-Z Q High-Z Q High-Z D D Q High-Z Q High-Z D D ® Notes: 1. All inputs except OE must meet setup and hold times for the Low-to-High transition of clock (CLK). 2. Wait states are inserted by suspending burst. 3. "X" means don't care. WRITE=L means any one or more byte write enable signals (BW1-BW4) and BWE are LOW or GW is LOW. WRITE=H means all byte write enable signals are HIGH. 4. For a Write operation following a Read operation, OE must be HIGH before the input data required setup time and held HIGH throughout the input data hold time. 5. ADSP LOW always initiates an internal READ at the Low-to-High edge of clock. A WRITE is performed by setting one or more byte write enable signals and BWE LOW or GW LOW for the subsequent L-H edge of clock. PARTIAL TRUTH TABLE Function READ READ WRITE Byte 1 WRITE All Bytes WRITE All Bytes GW H H H X L BWE H X L L X BW1 X H L L X BW2 X H H L X BW3 X H H L X BW4 X H H L X PB Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 IS61S6432 INTERLEAVED BURST ADDRESS TABLE (MODE = VCCQ or No Connect) External Address A1 A0 00 01 10 11 1st Burst Address A1 A0 01 00 11 10 2nd Burst Address A1 A0 10 11 00 01 3rd Burst Address A1 A0 11 10 01 00 ISSI ® LINEAR BURST ADDRESS TABLE (MODE = GNDQ) 0,0 A1', A0' = 1,1 0,1 1,0 ABSOLUTE MAXIMUM RATINGS(1,2,3) Symbol TBIAS TSTG PD IOUT VIN, VOUT VIN Parameter Temperature Under Bias Storage Temperature Power Dissipation Output Current (per I/O) Voltage Relative to GND for I/O Pins Voltage Relative to GND for for Address and Control Inputs Value –40 to +85 –55 to +150 1.8 100 –0.5 to VCCQ + 0.3 –0.5 to 5.5 Unit °C °C W mA V V Notes: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. This device contains circuity to protect the inputs against damage due to high static voltages or electric fields; however, precautions may be taken to avoid application of any voltage higher than maximum rated voltages to this high-impedance circuit. 3. This device contains circuitry that will ensure the output devices are in High-Z at power up. OPERATING RANGE Range Commercial Industrial Ambient Temperature 0°C to +70°C –40°C to +85°C VCC 3.3V +10%, –5% 3.3V +10%, –5% Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 5 IS61S6432 DC ELECTRICAL CHARACTERISTICS(1,2) (Over Operating Range) Symbol Parameter VOH VOL VIH VIL ILI ILO Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage Input Leakage Current Output Leakage Current GND - VIN - VCCQ(2) GND - VOUT - VCCQ, OE = VIH Com. Ind. Com. Ind. Test Conditions IOH = –5.0 mA IOL = 5.0 mA Min. 2.4 — 2.0 –0.3 –5 –10 –5 –10 ISSI Max. — 0.4 VCCQ + 0.3 0.8 5 10 5 10 Unit V V V V µA µA ® Notes: 1. MODE pin have an internal pull-up. ZZ pin has an internal pull-down. These pins may be a No Connect, tied to GND,or tied to VCCQ. 2. MODE pin should be tied to Vcc or GND. They exhibit ±30 µA maximum leakage current when tied to - GND + 0.2V or • Vcc – 0.2V. POWER SUPPLY CHARACTERISTICS (Operating Range) Symbol Parameter ICC AC Operating Supply Current Test Conditions Device Selected, Com. All Inputs = VIL or VIH Ind. OE = VIH, Cycle Time • tKC min. Com. Ind. Com. Ind. -200(1) Min. Max. — — — — — — 400 — 100 — 5 — -166 Min. Max. — — — — — — 215 — 70 — 5 — -133 Min. Max. — — — — — — 205 — 60 — 5 — -117 Min. Max. Unit — — — — — — 195 205 50 60 5 10 mA ISB Standby Current Device Deselected, VCC = Max., CLK Cycle Time • tKC min. Power-Down Mode Current ZZ = VCCQ, CLK Running All Inputs - GND + 0.2V or • VCC – 0.2V mA IZZ mA Note: 1. ADVANCE INFORMATION ONLY. Symbol Parameter ICC AC Operating Supply Current Test Conditions Device Selected, Com. All Inputs = VIL or VIH Ind. OE = VIH, Cycle Time • tKC min. Com. Ind. Com. Ind. -5 Min. Max. — — — — — — 175 185 25 35 5 10 -6 Min. Max. — — — — — — 165 175 25 35 5 10 -7 Min. Max. — — — — — — 150 160 25 35 5 10 -8 Min. Max. Unit — — — — — — 140 150 25 35 5 10 mA ISB Standby Current Device Deselected, VCC = Max., CLK Cycle Time • tKC min. Power-Down Mode Current ZZ = VCCQ, CLK Running All Inputs - GND + 0.2V or • VCC – 0.2V mA IZZ mA PB Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 IS61S6432 CAPACITANCE(1,2) Symbol CIN COUT Parameter Input Capacitance Input/Output Capacitance Conditions VIN = 0V VOUT = 0V Max. 6 8 Unit pF pF ISSI ® Notes: 1. Tested initially and after any design or process changes that may affect these parameters. 2. Test conditions: TA = 25°C, f = 1 MHz, Vcc = 3.3V. AC TEST CONDITIONS Parameter Input Pulse Level Input Rise and Fall Times Input and Output Timing and Reference Level Output Load Unit 0V to 3.0V 1.5 ns 1.5V See Figures 1 and 2 AC TEST LOADS 317 Ω ZO = 50Ω Output Buffer 50Ω 3.3V OUTPUT 5 pF Including jig and scope 351 Ω 30 pF 1.5V Figure 1 Figure 2 Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 7 IS61S6432 READ CYCLE SWITCHING CHARACTERISTICS (Over Operating Range) Symbol tKC tKH tKL tKQ tKQX(2) tKQLZ tOEQ tOEQX(2) tOELZ tAS tSS tWS tCES tAVS tAH tSH tWH tCEH tAVH tCFG (4) (2,3) (2,3) (2,3) (2,3) ISSI Parameter Cycle Time Clock High Time Clock Low Time Clock Access Time Clock High to Output Invalid Clock High to Output Low-Z Clock High to Output High-Z Output Enable to Output Valid Output Disable to Output Invalid Output Enable to Output Low-Z Output Disable to Output High-Z Address Setup Time Address Status Setup Time Write Setup Time Chip Enable Setup Time Address Advance Setup Time Address Hold Time Address Status Hold Time Write Hold Time Chip Enable Hold Time Address Advance Hold Time Configuration Setup -200(1) Min. Max. 5 1.6 1.6 — 1 0 1 — 0 0 — 2 2 2 2 2 0.5 0.5 0.5 0.5 0.5 25 — — — 4 — — 3.5 3.5 — — 3 — — — — — — — — — — — -166 Min. Max. 6 2.4 2.4 — 1.5 0 1.5 — 0 0 — 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 25 — — — 5 — — 5 5 — — 3 — — — — — — — — — — — -133 Min. Max. 7.5 2.8 2.8 — 1.5 0 1.5 — 0 0 — 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 30 — — — 5 — — 5 5 — — 3 — — — — — — — — — — — -117 Min. Max 8.5 3 3 — 1.5 0 1.5 — 0 0 — 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 35 — — — 5 — — 6 5 — — 4 — — — — — — — — — — — Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ® tKQHZ tOEHZ Notes: 1. ADVANCE INFORMATION ONLY. 2. Guaranteed but not 100% tested. This parameter is periodically sampled. 3. Tested with load in Figure 2. 4. Configuration signal MODE is static and must not change during normal operation. PB Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 IS61S6432 ISSI -5 -6 Max. — — — 5 — — 6 5 — — 4 — — — — — — — — — — — Min. 12 4 4 — 1.5 0 1.5 — 0 0 — 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 45 Max. — — — 6 — — 6 6 — — 5 — — — — — — — — — — — Min. 13 6 6 — 2 0 2 — 0 0 — 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 66.7 -7 Max. — — — 7 — — 6 6 — — 6 — — — — — — — — — — — Min. 15 6 6 — 2 0 2 — 0 0 — 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 80 -8 Max — — — 8 — — 6 6 — — 6 — — — — — — — — — — — Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Parameter Cycle Time Clock High Time Clock Low Time Clock Access Time Clock High to Output Invalid Clock High to Output Low-Z Clock High to Output High-Z Output Enable to Output Valid Output Disable to Output Invalid Output Enable to Output Low-Z Output Disable to Output High-Z Address Setup Time Address Status Setup Time Write Setup Time Chip Enable Setup Time Address Advance Setup Time Address Hold Time Address Status Hold Time Write Hold Time Chip Enable Hold Time Address Advance Hold Time Configuration Setup Min. 10 3.5 3.5 — 1.5 0 1.5 — 0 0 — 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 35 ® READ CYCLE SWITCHING CHARACTERISTICS (Over Operating Range) (Continued) Symbol tKC tKH tKL tKQ tKQX(1) tKQLZ tOEQ tOEQX(1) tOELZ tAS tSS tWS tCES tAVS tAH tSH tWH tCEH tAVH tCFG (3) (1,2) (1,2) (1,2) (1,2) tKQHZ tOEHZ Notes: 1. Guaranteed but not 100% tested. This parameter is periodically sampled. 2. Tested with load in Figure 2. 3. Configuration signal MODE is static and must not change during normal operation. Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 9 IS61S6432 READ CYCLE TIMING: PIPELINE tKC ISSI tSS tSH tKH tKL ® CLK ADSP is blocked by CE1 inactive ADSP tSS tSH ADSC initiate read ADSC tAVS tAVH Suspend Burst ADV tAS tAH A15-A0 RD1 tWS tWH RD2 RD3 GW tWS tWH BWE BW4-BW1 tCES tCEH CE1 Masks ADSP CE1 tCES tCEH CE2 and CE3 only sampled with ADSP or ADSC Unselected with CE2 CE2 tCES tCEH CE3 tOEQ tOEHZ OE tOELZ tOEQX tKQX DATAOUT High-Z tKQLZ tKQ 1a 2a 2b 2c 2d 3a tKQHZ DATAIN High-Z Pipelined Read Single Read Burst Read Unselected PB Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 IS61S6432 WRITE CYCLE SWITCHING CHARACTERISTICS (Over Operating Range) Symbol tKC tKH tKL tAS tSS tWS tDS tCES tAVS tAH tSH tDH tWH tCEH tAVH tCFG(2) Parameter Cycle Time Clock High Time Clock Low Time Address Setup Time Address Status Setup Time Write Setup Time Data In Setup Time Chip Enable Setup Time Address Advance Setup Time Address Hold Time Address Status Hold Time Data In Hold Time Write Hold Time Chip Enable Hold Time Address Advance Hold Time Configuration Setup -200(1) Min. Max. 5 1.6 1.6 2 2 2 2 2 2 0.5 0.5 0.5 0.5 0.5 0.5 25 — — — — — — — — — — — — — — — — -166 Min. Max. 6 2.4 2.4 2.5 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 0.5 25 — — — — — — — — — — — — — — — — ISSI -133 -117 Min. Max. Min. Max. 7.5 2.8 2.8 2.5 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 0.5 30 — — — — — — — — — — — — — — — — 8.5 3 3 2.5 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 0.5 35 — — — — — — — — — — — — — — — — Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ® Symbol tKC tKH tKL tAS tSS tWS tDS tCES tAVS tAH tSH tDH tWH tCEH tAVH tCFG (2) Parameter Cycle Time Clock High Time Clock Low Time Address Setup Time Address Status Setup Time Write Setup Time Data In Setup Time Chip Enable Setup Time Address Advance Setup Time Address Hold Time Address Status Hold Time Data In Hold Time Write Hold Time Chip Enable Hold Time Address Advance Hold Time Configuration Setup -5 Min. Max. 10 3.5 3.5 2.5 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 0.5 35 — — — — — — — — — — — — — — — — -6 Min. Max. 12 4 4 2.5 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 0.5 45 — — — — — — — — — — — — — — — — -7 -8 Min. Max. Min. Max. 13 6 6 2.5 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 0.5 52 — — — — — — — — — — — — — — — — 15 6 6 2.5 2.5 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 0.5 0.5 60 — — — — — — — — — — — — — — — — Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Note: 1. ADVANCE INFORMATION ONLY. 2. Configuration signal MODE is static and must not change during normal operation. Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 11 IS61S6432 WRITE CYCLE TIMING tKC ISSI tSS tSH tKH tKL ® CLK ADSP is blocked by CE1 inactive ADSP ADSC initiate Write ADSC ADV must be inactive for ADSP Write tAVS ADV tAS tAH tAVH A15-A0 WR1 tWS tWH WR2 WR3 GW tWS tWH BWE tWS tWH tWS tWH BW4-BW1 tCES tCEH WR1 WR2 CE1 Masks ADSP WR3 CE1 tCES tCEH CE2 and CE3 only sampled with ADSP or ADSC Unselected with CE2 CE2 tCES tCEH CE3 OE DATAOUT High-Z tDS tDH BW4-BW1 only are applied to first cycle of WR2 2a 2b 2c 2d 3a DATAIN High-Z 1a Single Write Burst Write Write Unselected PB Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 IS61S6432 READ/WRITE CYCLE SWITCHING CHARACTERISTICS (Over Operating Range) Symbol tKC tKH tKL tKQ tKQX (2) (2,3) ISSI Parameter Cycle Time Clock High Time Clock Low Time Clock Access Time Clock High to Output Invalid Clock High to Output Low-Z Clock High to Output High-Z Output Enable to Output Valid Output Disable to Output Invalid Output Enable to Output Low-Z Output Disable to Output High-Z Address Setup Time Address Status Setup Time Write Setup Time Chip Enable Setup Time Address Hold Time Address Status Hold Time Write Hold Time Chip Enable Hold Time 1 — 0 0 — 2 2 2 2 0.5 0.5 0.5 0.5 25 -200(1) Min. Max. 5 1.6 1.6 — 1 — — — 4 — — 3.5 3.5 — — 3 — — — — — — — — — -166 Min. Max. 6 2.4 2.4 — 1.5 0 1.5 — 0 0 — 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 25 — — — 5 — — 5 5 — — 3 — — — — — — — — — -133 -117 Min. Max. Min. Max. 7.5 2.8 2.8 — 1.5 0 1.5 — 0 0 — 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 30 — — — 5 — — 5 5 — — 3 — — — — — — — — — 8.5 3 3 — 1.5 0 1.5 — 0 0 — 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 35 — — — 5 — — 6 5 — — 4 — — — — — — — — — Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ® tKQLZ tOEQ tKQHZ(2,3) tOEQX tOELZ tAS tSS tWS tCES tAH tSH tWH tCEH tCFG (4) (2) (2,3) tOEHZ(2,3) Configuration Setup Notes: 1. ADVANCE INFORMATION ONLY. 2. Guaranteed but not 100% tested. This parameter is periodically sampled. 3. Tested with load in Figure 2. 4. Configuration signal MODE is static and must not change during normal operation. Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 13 IS61S6432 ISSI Parameter Cycle Time Clock High Time Clock Low Time Clock Access Time Clock High to Output Invalid Clock High to Output Low-Z Clock High to Output High-Z Output Enable to Output Valid Output Disable to Output Invalid Output Enable to Output Low-Z Output Disable to Output High-Z Address Setup Time Address Status Setup Time Write Setup Time Chip Enable Setup Time Address Hold Time Address Status Hold Time Write Hold Time Chip Enable Hold Time -5 Min. Max. 10 3.5 3.5 — 1.5 0 1.5 — 0 0 — 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 35 — — — 5 — — 6 5 — — 4 — — — — — — — — — -6 Min. Max. 12 4 4 — 1.5 0 1.5 — 0 0 — 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 45 — — — 6 — — 6 6 — — 5 — — — — — — — — — -7 -8 Min. Max. Min. Max. 13 6 6 — 2 0 2 — 0 0 — 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 52 — — — 7 — — 6 6 — — 6 — — — — — — — — — 15 6 6 — 2 0 2 — 0 0 — 2.5 2.5 2.5 2.5 0.5 0.5 0.5 0.5 60 — — — 8 — — 6 6 — — 6 — — — — — — — — — ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ® READ/WRITE CYCLE SWITCHING CHARACTERISTICS (Over Operating Range) (Continued) Symbol tKC tKH tKL tKQ tKQX(1) tKQLZ tOEQ tOEQX(1) tOELZ(1,2) tOEHZ tAS tSS tWS tCES tAH tSH tWH tCEH tCFG (3) (1,2) (1,2) (1,2) Unit tKQHZ Configuration Setup Notes: 1. Guaranteed but not 100% tested. This parameter is periodically sampled. 2. Tested with load in Figure 2. 3. Configuration signal MODE is static and must not change during normal operation. PB Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 IS61S6432 READ/WRITE CYCLE TIMING: PIPELINE tKC ISSI tSS tSH tKH tKL ® CLK ADSP is blocked by CE1 inactive ADSP tSS tSH ADSC ADV tAS tAH A15-A0 RD1 tWS tWH WR1 RD2 RD3 GW tWS tWH BWE tWS tWH BW4-BW1 tCES tCEH WR1 CE1 Masks ADSP CE1 tCES tCEH CE2 and CE3 only sampled with ADSP or ADSC CE2 tCES tCEH Unselected with CE3 CE3 tOEQ tOEHZ OE tOELZ tOEQX tKQX DATAOUT High-Z tKQLZ tKQ 1a tKQX tKQHZ 2a 2b 2c 2d tKQHZ DATAIN High-Z tDS 1a tDH Single Read Single Write Burst Read Unselected Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 15 IS61S6432 ISSI Parameter Cycle Time Clock High Time Clock Low Time Clock Access Time Clock High to Output Invalid Clock High to Output Low-Z Clock High to Output High-Z Output Enable to Output Valid Output Disable to Output Invalid Output Enable to Output Low-Z Output Disable to Output High-Z Address Setup Time Address Status Setup Time Chip Enable Setup Time Address Hold Time Address Status Hold Time Chip Enable Hold Time ZZ Standby -200(2) Min. Max. 5 1.6 1.6 — 1 0 1 — 0 0 — 2 2 2 2 2 2 — 8 — — — 4 — — 3.5 3.5 — — 3 — — — — — — 8 — -166 Min. Max 6 2.4 2.4 — 1.5 0 1.5 — 0 0 — 2.5 2.5 2.5 2.5 2.5 2.5 2 2 — — — 5 — — 5 5 — — 3 — — — — — — — — -133 -117 Min. Max. Min. Max. 7.5 2.8 2.8 — 1.5 0 1.5 — 0 0 — 2.5 2.5 2.5 2.5 2.5 2.5 2 2 — — — 5 — — 5 5 — — 3 — — — — — — — — 8.5 3 3 — 1.5 0 1.5 — 0 0 — 2.5 2.5 2.5 2.5 2.5 2.5 2 2 — — — 5 — — 6 5 — — 4 — — — — — — — — Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns cyc cyc ® SNOOZE AND RECOVERY CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range) Symbol tKC tKH tKL tKQ tKQX(3) tKQLZ(3,4) tKQHZ tOEQ tOEQX(3) tOELZ(3,4) tOEHZ tAS tSS tCES tAH tSH tCEH tZZS(5) tZZREC (6) (3,4) (3,4) ZZ Recovery Notes: 1. Configuration signal MODE is static and must not change during normal operation. 2. ADVANCE INFORMATION ONLY. 3. Guaranteed but not 100% tested. This parameter is periodically sampled. 4. Tested with load in Figure 2. 5. The assertion of ZZ allows the SRAM to enter a lower power state than when deselected within the time specified. Data retention is guaranteed when ZZ is asserted and clock remains active. 6. ADSC and ADSP must not be asserted for at least two cycles after leaving ZZ state. PB Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 IS61S6432 ISSI Parameter Cycle Time Clock High Time Clock Low Time Clock Access Time -5 Min. Max. 10 3.5 3.5 — 1.5 0 1.5 — 0 0 — 2.5 2.5 2.5 2.5 2.5 2.5 2 2 — — — 5 — — 6 5 — — 4 — — — — — — — — -6 Min. Max. 12 4 4 — 1.5 0 1.5 — 0 0 — 2.5 2.5 2.5 2.5 2.5 2.5 2 2 — — — 6 — — 6 6 — — 5 — — — — — — — — -7 -8 Min. Max. Min. Max. 13 6 6 — 2 0 2 — 0 0 — 2.5 2.5 2.5 2.5 2.5 2.5 2 2 — — — 7 — — 6 6 — — 6 — — — — — — — — 15 6 6 — 2 0 2 — 0 0 — 2.5 2.5 2.5 2.5 2.5 2.5 2 2 — — — 8 — — 6 6 — — 6 — — — — — — — — Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns cyc cyc ® SNOOZE AND RECOVERY CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range) (Continued) Symbol tKC tKH tKL tKQ tKQX (2) (2,3) (2,3) Clock High to Output Invalid Clock High to Output Low-Z Clock High to Output High-Z Output Enable to Output Valid Output Disable to Output Invalid Output Enable to Output Low-Z Output Disable to Output High-Z Address Setup Time Address Status Setup Time Chip Enable Setup Time Address Hold Time Address Status Hold Time Chip Enable Hold Time ZZ Standby (5) tKQLZ tOEQ tKQHZ tOEQX(2) tOELZ tAS tSS tCES tAH tSH tCEH tZZS (4) (2,3) (2,3) tOEHZ tZZREC ZZ Recovery Notes: 1. Configuration signal MODE is static and must not change during normal operation. 2. Guaranteed but not 100% tested. This parameter is periodically sampled. 3. Tested with load in Figure 2. 4. The assertion of ZZ allows the SRAM to enter a lower power state than when deselected within the time specified. Data retention is guaranteed when ZZ is asserted and clock remains active. 5. ADSC and ADSP must not be asserted for at least two cycles after leaving ZZ state. Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 17 IS61S6432 SNOOZE AND RECOVERY CYCLE TIMING tKC ISSI tSS tSH tKH tKL ® CLK ADSP ADSC ADV tAS tAH A15-A0 RD1 RD2 GW BWE BW4-BW1 tCES tCEH CE1 tCES tCEH CE2 tCES tCEH CE3 tOEQ tOEHZ OE tOELZ tOEQX DATAOUT High-Z tKQLZ tKQ 1a tKQX tKQHZ DATAIN High-Z tZZS tZZREC ZZ Single Read Snooze with Data Retention Read PB Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 IS61S6432 ORDERING INFORMATION Commercial Range: 0°C to +70°C Frequency (MHz) Order Part Number 200 166 133 117 100 83 75 66 IS61S6432-200TQ IS61S6432-200PQ IS61S6432-166TQ IS61S6432-166PQ IS61S6432-133TQ IS61S6432-133PQ IS61S6432-117TQ IS61S6432-117PQ IS61S6432-5TQ IS61S6432-5PQ IS61S6432-6TQ IS61S6432-6PQ IS61S6432-7TQ IS61S6432-7PQ IS61S6432-8TQ IS61S6432-8PQ Package TQFP PQFP TQFP PQFP TQFP PQFP TQFP PQFP TQFP PQFP TQFP PQFP TQFP PQFP TQFP PQFP NOTICE ISSI ORDERING INFORMATION Industrial Range: –40°C to +85°C Frequency (MHz) 117 100 83 75 66 Order Part Number Package IS61S6432-117TQI IS61S6432-117PQI IS61S6432-5TQI IS61S6432-5PQI IS61S6432-6TQI IS61S6432-6PQI IS61S6432-7TQI IS61S6432-7PQI IS61S6432-8TQI IS61S6432-8PQI TQFP PQFP TQFP PQFP TQFP PQFP TQFP PQFP TQFP PQFP ® Integrated Silicon Solution, Inc., reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. Integrated Silicon Solution, Inc. assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained herein reflect representative operating parameters, and may vary depending upon a user's specific application. While the information in this publication has been carefully checked, Integrated Silicon Solution, Inc. shall not be liable for any damages arising as a result of any error or omission. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurances, to its satisfaction, that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and (c) potential liability of Integrated Silicon Solution, Inc. is adequately protected under the circumstances. Copyright 1998 Integrated Silicon Solution, Inc. Reproduction in whole or in part, without the prior written consent of Integrated Silicon Solution, Inc., is prohibited. ISSI ® Integrated Silicon Solution, Inc. 2231 Lawson Lane Santa Clara, CA 95054 Tel: 1-800-379-4774 Fax: (408) 588-0806 E-mail: sales@issi.com www.issi.com Integrated Silicon Solution, Inc. • 1-800-379-4774 Rev. B 06/28/01 19