CPC1832NTR

CPC1832 8V Output Solar Cell INTEGRATED CIRCUITS DIVISION Parameter Open Circuit Voltage Short Circuit Current Rating 8 50 * Direct sunlight (Approximately 6000 lux) Features • • • • • • • 8V Output Triggers with Natural Sunlight Provides True Wireless Power No EMI/RFI Generation Wave Solderable Replacement of Discrete Components Solid State Reliability Applications • • • • • • • • • • Portable Electronics Solar Battery Chargers Battery Operated Equipment Consumer Electronics Off-Grid Installation Wireless Sensors and Detection Flame Detection Self Powered Sunlight/ Light Detection Self Powered Products Remote Installation Pb DS-CPC1832-R04 Units V A Description The CPC1832 is a monolithic photovoltaic string of solar cells on Silicon-On-Insulator (SOI). This patented design allows for higher voltage solar cells in a compact package. When operating in sunlight or a bright artificial light environment, the optical energy will activate the cell array, and generate a voltage at the output. The solar cells are capable of generating a floating source voltage and current sufficient to drive and power CMOS ICs, logic gates, and/or provide "trickle charge" for battery applications. Ordering Information Part # Description CPC1832N 16-Pin Clear Molded SOIC Package (50/Tube) CPC1832NTR 16-Pin Clear Molded SOIC Package (1000/Reel) Block Diagram 1 16 V+ 8 9 V- e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1832 Absolute Maximum Ratings Parameter Reverse Voltage Operational Temperature Storage Temperature Ratings 10 -40 to +85 -40 to +125 Units V °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical absolute maximum ratings are at 25°C Electrical Characteristics Parameter Output Characteristics @ 25°C Open Circuit Voltage Short Circuit Current Conditions Symbol Min Typ Max Units Direct Sun (6000 lux) High Intensity Lamp Direct Sun (6000 lux) VOC VOC ISC - 8.5 10 50 - V V A PERFORMANCE DATA* Normalized Short Circuit Output Current vs. Light Intensity Normalized Output Current (PA) Normalized Output Voltage (V) Normalized Open Circuit Output Voltage vs. Light Intensity 16 14 12 10 8 6 4 2 0 0 2 4 6 8 Light Intensity (lux X 1000) 200 180 160 140 120 100 80 60 40 20 0 0 10 10 Normalized Short Circuit Output Current vs. Incident Angle of Light to Photodiode Surface Normalized Open Circuit Output Voltage vs. Incident Angle of Light to Photodiode Surface 1.2 1.2 Normalized Output Current Normalized Output Voltage 2 4 6 8 Light Intensity (lux X 1000) 1.0 0.8 0.6 0.4 0.2 0.0 1.0 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 Incident Angle (Degrees) 100 0 20 40 60 80 Incident Angle (Degrees) 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 2 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION CPC1832 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1832N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1832N 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R04 e3 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1832 MECHANICAL DIMENSIONS CPC1832N 0.60 (0.024) PIN 16 0.1905 - 0.2489 (0.0075 - 0.0098) 5.8014 - 6.1976 (0.2284 - 0.2440) 3.8024 - 3.9980 (0.1497 - 0.1574) 0.4064 - 1.2700 (0.0160 - 0.0500) 0.2515 - 0.4978 (0.0099 - 0.0196) PIN 1 5.40 (0.213) 1.55 (0.061) 0º -8º 1.27 (0.05) 9.8019 - 10.000 (0.3859 - 0.3937) 0.6706 - 0.8230 (0.0264 - 0.0324) 7º± 1º top & bottom 4 places 1.3513 - 1.7475 (0.0532 - 0.0688) 0.1016 - 0.2489 (0.0040 - 0.0098) 0.3302 - 0.5080 (0.0130 - 0.0200) DIMENSIONS mm (inches) 1.2192 - 1.3208 (0.0480 - 0.0520) CPC1832NTR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 0.30 ± 0.05 (0.012 ± 0.002) 8.00 ± 0.10 (0.315 ± 0.004) 2.00 ± 0.10 Note 3 (0.079 ± 0.004) 4.00 Note 1 (0.157) ‡ 1.5 +0.1 / -0.0 1.75 ± 0.10 (0.069 ± 0.004) A R 0.3 max ‡ 1.50 min A 7.5 ± 0.10 Note 3 R 0.5 typ (0.295 ± 0.004) 16.0 ± 0.3 NOTES: (0.63 ± 0.012) 1.10 Sprocket hole pitch cumulative tolerance ±0.2 2. Camber in compliance with EIA 481 Dimensions 3. Pocket position relative to sprocket hole measured mm as true position of pocket, not pocket hole (inches) B0=10.30 ± 0.10 (0.406 ± 0.004) Embossed Carrier K0=2.10 ± 0.1 (0.083 ± 0.004) Embossment Section A-A A0=6.50 ± 0.10 (0.256 ± 0.004) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 4 Specification: DS-CPC1832-R04 ©Copyright 2013, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 2/14/2013