TS122PTR

TS122 Multifunction Telecom Switch INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 250 170 20 Description Units VP mArms / mADC  The TS122 integrated circuit device combines a 250V, normally open (1-Form-A) relay with an optocoupler in a single package. The relay, with enhanced peak load current handling capability, uses optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. Features • 3750Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • FCC Compatible • VDE Compatible • No EMI/RFI Generation • No Moving Parts • High Reliability • Arc-Free With No Snubbing Circuits • Small 8-Pin Package • Machine Insertable, Wave Solderable • Surface Mount and Tape & Reel Versions Available Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Aerospace • Industrial Controls Its optically coupled relay outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. Telecom circuit designers, using the TS122, can now take advantage of two discrete functions in a single component that uses less space than traditional discrete component solutions. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1175739 • EN/IEC 60950 Certified Component: TUV Certificate: B 10 05 49410 006 Ordering Information Part # TS122 TS122P TS122PTR TS122S TS122STR Description 8-Pin DIP (50/Tube) 8-Pin Flatpack (50/Tube) 8-Pin Flatpack (1000/Reel) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1000/Reel) Pin Configuration + LED - Relay – LED - Relay Collector - Phototransistor Emitter - Phototransistor 1 8 2 7 3 6 4 5 Load - Relay (MOSFET Output) Load - Relay (MOSFET Output) LED - Phototransistor –/+ LED - Phototransistor +/– Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD Pb DS-TS122-R09 ton e3 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION TS122 Absolute Maximum Ratings @ 25ºC Parameter Relay Blocking Voltage Input Power Dissipation 1 Input Control Current, Relay Peak (10ms) Reverse Input Voltage Input Control Current, Detector Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Ratings 250 150 50 1 5 100 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP mW mA A V mA mW Vrms °C °C Electrical Characteristics @25ºC: Relay Section Parameter Output Characteristics Load Current Continuous Peak On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Dropout Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance Conditions Symbol Min Typ Max Units t=10ms IL=170mA VL=250V IL ILPK RON ILEAK - 12 - 170 ±400 20 1 mArms / mADC mAP  VL=50V, f=1MHz ton toff COUT - 50 5 5 - ms ms pF IL=170mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.2 - 5 1.4 10 mA mA V A - CI/O - 3 - pF IF=5mA, VL=10V A Electrical Characteristics @25ºC: Detector Section Parameter Output Characteristics Phototransistor Blocking Voltage Phototransistor Dark Current Saturation Voltage Current Transfer Ratio Input Characteristics Input Control Current Input Voltage Drop Input Current (Detector must be off) Input to Output Capacitance Isolation, Input to Output 2 Conditions Symbol Min Typ Max Units IC=10A VCE=5V, IF=0mA IC=2mA, IF=16mA IF=6mA, VCE=0.5V BVCEO ICEO VSAT CTR 20 33 50 50 0.3 100 500 0.5 - V nA V % IC=2mA, VCE=0.5V IF=5mA IC=1A, VCE=5V - IF VF IF VI/O 0.9 5 3750 2 1.2 25 3 - 6 1.4 - mA V A pF Vrms www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION TS122 RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* 25 20 15 10 5 25 20 20 15 10 5 0 0 25 Typical Turn-Off Time (N=50, IF=5mA, IL=170mADC) 15 10 5 0 0.625 0.875 1.125 1.375 1.625 1.875 2.125 0.335 0.525 0.715 0.905 1.095 1.285 1.475 LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms) Typical IF for Switch Operation (N=50, IL=170mADC) Typical IF for Switch Dropout (N=50, IL=170mADC) Typical On-Resistance Distribution (N=50, IF=5mA, IL=170mADC, VL=250V) 1.17 1.19 1.21 1.23 1.25 25 20 Device Count (N) Device Count (N) 25 Device Count (N) Device Count (N) Device Count (N) 30 15 10 5 0 35 30 20 Device Count (N) 35 Typical Turn-On Time (N=50, IF=5mA, IL=170mADC) Typical LED Forward Voltage Drop (N=50, IF=5mA) 15 10 5 0.5 0.7 0.9 1.1 1.3 20 15 10 5 0 0.3 25 0 1.5 0.15 0.45 0.75 1.05 1.35 1.65 5.5 1.95 6.5 LED Current (mA) LED Current (mA) 7.5 8.5 9.5 10.5 11.5 On-Resistance (:) Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 305 315 325 335 345 355 365 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=170mADC) 1.4 1.8 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 0.8 Trun-Off Time (ms) 1.4 1.0 0.8 0.6 0.4 -20 0 20 40 60 Temperature (ºC) 80 100 120 0.40 0.39 0.38 0.37 0.36 0.35 0.2 -40 Typical Turn-Off Time vs. LED Forward Current (IL=170mADC) 0.41 1.2 1.6 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0.34 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R09 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION TS122 Typical Turn-On Time vs. Temperature (IL=170mADC) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 IF=10mA IF=20mA 0.5 0.4 0.3 0.2 0 -20 0 20 40 60 80 100 40 30 20 0 -40 -20 0 20 40 60 80 -40 100 -20 0 20 40 60 80 Temperature (ºC) Temperature (ºC) Temperature (ºC) Typical IF for Switch Operation vs. Temperature (IL=170mADC) Typical IF for Switch Dropout vs. Temperature (IL=170mADC) Maximum Load Current vs. Temperature 3.0 2.5 2.5 2.0 1.5 1.0 2.0 1.5 1.0 0.5 0.5 0 0 0 20 40 60 80 200 IF=20mA IF=10mA IF=5mA 150 100 50 0 -40 100 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 Temperature (ºC) Temperature (ºC) Temperature (ºC) Typical Load Current vs. Load Voltage (IF=5mA) Typical Blocking Voltage vs. Temperature Typical Leakage vs. Temperature Measured across Pins 7&8 350 150 345 Blocking Voltage (VP) 200 100 50 0 -50 -100 -150 -200 -2.5 -2 -1.5 -1 -0.5 0 0.020 340 335 330 325 1 1.5 2 -40 2.5 -20 0 20 40 60 80 100 Temperature (ºC) Load Voltage (V) 0.015 0.010 0.005 320 315 0.5 120 0.025 Leakage (PA) -20 100 250 Load Current (mA) 3.0 -40 50 10 0.1 LED Current (mA) LED Current (mA) On-Resistance (:) IF=5mA Typical On-Resistance vs. Temperature (IF=5mA, IL=170mADC) 60 0.6 -40 Load Current (mA) Typical Turn-Off Time vs. Temperature (IF=5mA, IL=170mADC) 0.7 Turn-Off Time (ms) Turn-On Time (ms) RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* 0 -40 -20 0 20 40 60 80 100 Temperature (ºC) Energy Rating Curve 1.2 Load Current (A) 1.0 0.8 0.6 0.4 0.2 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION TS122 DETECTOR PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* 8 4.0 7 3.5 3.0 2.5 2.0 1.5 1.0 12 6 5 4 IF=1mA IF=2mA IF=5mA IF=10mA IF=15mA IF=20mA 3 2 1 0.5 0 2 4 6 8 10 12 14 Forward Current (mA) 16 18 20 0 -40 -20 0 20 40 60 80 Temperature (ºC) 100 120 Collector Current (mA) 4.5 0 Typical Collector Current vs. Forward Current (VCE=0.5V) Typical Normalized CTR vs. Temperature (VCE=0.5V) Normalized CTR (%) Normalized CTR (%) Typical Normalized CTR vs. Forward Current (VCE=0.5V) 10 8 6 4 2 0 0 2 4 6 8 10 12 14 16 18 20 Forward Current (mA) * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R09 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION TS122 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating TS122 / TS122P / TS122S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time TS122 / TS122S 250ºC for 30 seconds TS122P 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb 6 e3 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION TS122 Mechanical Dimensions TS122 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) TS122P 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 8.70 (0.3425) 1.55 (0.0610) 0.203 ± 0.013 (0.008 ± 0.0005) 9.652 ± 0.381 (0.380 ± 0.015) PCB Land Pattern 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) Dimensions mm (inches) TS122S 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) R09 www.ixysic.com 7 INTEGRATED CIRCUITS DIVISION TS122 TS122STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=16.00 (0.63) Bo=10.30 (0.406) K0 =4.90 (0.193) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 TS122PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) P = 12.00 (0.472) User Direction of Feed Ao = 10.30 (0.406) Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 8 Specification: DS-TS122-R09 ©Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012