CPC1393G

CPC1393 Single-Pole, Normally Open 4-Pin OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 600 90 50 Description Units VP mArms / mADC  The CPC1393G is a single-pole, normally open (1-Form-A) Solid State Relay with an enhanced input to output isolation barrier of 5000Vrms. The relay output is constructed with efficient MOSFET switches that use IXYS Integrated Circuits Division's patented OptoMOS architecture. The input, a highly efficient infrared LED, controls the optically coupled output. Features • • • • • • • 5000Vrms Input/Output Isolation 600VP Blocking Voltage 100% Solid State Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 4-Pin Package Approvals • UL Certified Component: File E76270 • CSA Certified Component: Certificate 1172007 • EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003 Ordering Information Applications • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security • Aerospace • Industrial Controls Part Number CPC1393G CPC1393GV CPC1393GR CPC1393GRTR Description 4-Pin DIP (100/Tube) 4-Pin DIP V-Bend (100/Tube) 4-Pin Surface Mount (100/Tube) 4-Pin Surface Mount (1000/Reel) Pin Configuration + Control – Control 1 4 2 3 Load Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1393-R07 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1393 Absolute Maximum Ratings @ 25ºC Parameter Peak Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Package Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33mW / ºC 2 Derate linearly 3mW / ºC Ratings 600 5 50 1 100 550 5000 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms ºC ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameters Output Characteristics Load Current Continuous Peak On-Resistance 1 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 Conditions Symbol Min Typ Max Units t=10ms IL=90mA VL=600VP IL ILPK RON ILEAK - 35 - 90 ±350 50 1 mArms / mADC mAP  IF=0mA, VL=50V, f=1MHz ton toff COUT - 50 5 5 - IL=90mA IF=5mA VR=5V IF IF VF IR 0.2 0.9 - 0.55 1.2 - 2 1.4 10 VIO=0V, f=1MHz CIO - 3 - IF=5mA, VL=10V (See Timing Diagram) A ms pF mA V A pF Measurement taken within 1 second of on-time. Timing Diagram IF 0 mA 90% IL 2 10% 0 mA ton toff www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION CPC1393 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Typical LED Forward Voltage Drop (N=50, IF=5mA) Typical Turn-On Time (N=50, IF=2mA, IL=90mADC) 35 25 25 20 15 10 5 35 30 20 Device Count (N) Device Count (N) Device Count (N) 30 15 10 5 1.17 10 0.68 0.72 0.76 0.80 0.84 0.88 0.22 Typical IF for Switch Dropout (N=50, IL=90mADC) 0.24 20 15 10 5 0 0.26 0.28 Turn-Off (ms) 0.30 Typical On-Resistance Distribution (N=50, IL=90mADC) 35 30 Device Count (N) 20 Device Count (N) 25 15 10 5 25 20 15 10 5 0 0.55 0.56 0.57 0.58 LED Current (mA) 15 Turn-On (ms) 25 0.54 20 0 0.64 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=90mADC) 0.53 25 5 0 0 Device Count (N) Typical Turn-Off Time (N=50, IF=2mA, IL=90mADC) 0 0.59 0.33 0.34 0.35 0.36 0.37 0.38 LED Current (mA) 0.39 34.3 34.6 34.9 35.2 35.5 35.8 36.1 On-Resistance (:) Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 777 IF=50mA 1.2 IF=10mA IF=5mA 1.0 0.8 -40 -20 0 20 40 60 80 Temperature (ºC) 100 120 807 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off Time vs. LED Forward Current (IL=90mADC) 0.7 0.6 Turn-Off Time (ms) 1.4 Turn-On (ms) LED Forward Voltage Drop (V) 1.6 787 792 797 802 Blocking Voltage (VP) Typical Turn-On vs. LED Forward Current (IL=90mADC) Typical LED Forward Voltage Drop vs. Temperature 1.8 782 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R07 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1393 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 IF=5mA IF=10mA -40 -20 0 20 40 60 Temperature (ºC) 80 -20 0 20 40 60 Temperature (ºC) 80 1.0 -20 0 20 40 60 Temperature (ºC) 80 2.0 1.5 1.0 Maximum Load Current vs. Temperature (IF=2mA) 100 Blocking Voltage (VP) 90 80 70 60 50 40 30 20 10 -20 0 20 40 60 80 -20 0 20 40 60 80 Temperature (ºC) 100 120 20 40 60 Temperature (ºC) 80 100 60 30 0 -30 -90 -3.0 100 -2.0 -1.0 0 1.0 2.0 3.0 Temperature (ºC) Load Voltage (V) Typical Blocking Voltage vs. Temperature Typical Leakage vs. Temperature Measured Across Pins 3 & 4 950 0.040 900 0.035 850 800 750 700 0.030 0.025 0.020 0.015 0.010 650 0.005 600 -40 0 -60 -40 100 -20 90 Leakage (PA) -40 20 Typical Load Current vs. Load Voltage (IF=2mA) 0.0 0.0 30 Typical IF for Switch Dropout vs. Temperature (IL=50mADC) 0.5 0.5 40 -40 Load Current (mA) 1.5 50 100 2.5 LED Current (mA) LED Current (mA) 70 10 3.0 2.0 Typical On-Resistance vs. Temperature (IF=2mA, IL=50mADC) 60 -40 2.5 Load Current (mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 100 Typical IF for Switch Operation vs. Temperature (IL=50mADC) 3.0 Typical Turn-Off Time vs. Temperature (IF=5mA, IL=70mADC) On-Resistance (:) Typical Turn-On Time vs. Temperature (IL=70mADC) Turn-Off Time (ms) Turn-On Time (ms) PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* -40 -20 0 20 40 60 80 100 0 -40 -20 0 20 40 60 80 100 Temperature (ºC) Temperature (ºC) Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10μs 100μs 1ms 10ms 100ms Time 1s 10s 100s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION CPC1393 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1393G / CPC1393GV CPC1393GR MSL 1 MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1393GR, the solder reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed. For the through-hole devices, CPC1393G and CPC1393GV, and any other processes, the guidelines of J-STD-020 must be observed. Device Maximum Body Temperature (Tc) Time CPC1393GR 250ºC 15 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R07 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1393 MECHANICAL DIMENSIONS CPC1393G 0.991 (0.039) PC Board Pattern (Top View) 0.254 (0.010) 3.30 ± 0.050 (0.130 ± 0.002) 6 - 0.800 DIA. (6 - 0.031 DIA.) 6.350 ± 0.127 (0.250 ± 0.005) 4.572 ± 0.127 (0.180 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) PIN 1 9º (ALL) 9º (ALL) 7.620 ± 0.250 (0.300 ± 0.010) 2.159 (0.085) 0.457 ± 0.076 (0.018 ± 0.003) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) 0.508 (0.020) 3.175 (0.125) 2.540 ± 0.127 (0.100 ± 0.005) Dimensions mm (inches) CPC1393GV 0.254 (0.010) 0.991 (0.039) 3.30 ± 0.050 (0.130 ± 0.002) PC Board Pattern (Top View) 10.160 ± 0.508 (0.400 ± 0.020) 6 - 0.800 DIA. (6 - 0.031 DIA.) 6.350 ± 0.050 (0.250 ± 0.002) 4.572 ± 0.050 (0.180 ± 0.002) 9º (ALL) 0.457 ± 0.076 (0.018 ± 0.003) 2.540 ± 0.050 (0.100 ± 0.002) 6 2.540 ± 0.127 (0.100 ± 0.005) 10.160 ± 0.127 (0.400 ± 0.005) Pin 1 9º (ALL) 7.620 ± 0.254 (0.300 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 1.778 (0.070) 0.127 (0.005) Dimensions mm (inches) 2.92 (0.115) www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION CPC1393 CPC1393GR 2.540 ± 0.127 (0.100 ± 0.005) PCB Land Pattern 3.300 ± 0.050 (0.130 ± 0.002) 0.635 ± 0.254 (0.025 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 9.525 (0.375) 7.620 ± 0.254 (0.300 ± 0.010) 8.80 (0.346) 1.60 (0.063) PIN #1 0.991 (0.039) 3.480 ± 0.076 (0.137 ± 0.003) 4.572 ± 0.127 (0.180 ± 0.005) 9º ± 1º (ALL) 2.287 (0.09) 0.95 (0.037) 0.254 (0.010) 2.540 ± 0.127 (0.100 ± 0.005) Dimensions mm (inches) 0.102 min / 0.254 max (0.004 min / 0.010 max) 2.287 ± 0.127 (0.090 ± 0.005) CPC1393GRTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00±0.30 (0.630±0.012) B0=5.00 (0.197) K0=4.20 (0.165) K1=3.70 (0.146) A0=10.01 (0.394) P=12.00 (0.472) Dimensions mm (inches) Embossed Carrier Embossment NOTES: 1. All dimensions meet EIA-481-C requirements 2. Unless otherwise noted, tolerances = ±0.10 (0.004) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-CPC1393-R07 ©Copyright 2016, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/7/2016