US1JF

JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD SMAF Plastic-Encapsulate Diodes US1AF THRU US1MF High Efficient Rectifier Diodes Features SMAF ●IF(AV) 1A ● VRRM 50V-1000V ●High surge current capability ● Polarity: Color band denotes cathode Applications ● Rectifier Marking ● US1X X : From A To M Limiting Values(Absolute Maximum Rating) US1 Item Symbol Unit Test Conditions AF BF DF GF JF KF MF Repetitive Peak Reverse Voltage VRRM V 50 100 200 400 600 800 1000 Maximum RMS Voltage V RMS V 35 70 140 280 420 560 700 Average Forward Current IF(AV) A 60Hz Half-sine wave， Resistance load，T L=115 ℃ 1.0 Surge(Non-repetitive)Forward Current IFSM A 60Hz Half-sine wave， 1 cycle，Ta=25℃ 30 Operation Junction and Storage Temperature Range TJ,TSTG ℃ KF MF -55 ~ +150 Electrical Characteristics (T=25℃ Unless otherwise specified） US1 Symbol Unit Peak Forward Voltage VF V Maximum reverse recovery time trr ns Item Peak Reverse Current Thermal Resistance(Typical) IRRM1 IRRM2 RθJ-A RθJ-L μA ℃/ W Test Condition IF =1.0A BF DF 1.0 IF=0.5A,IR=1.0A,Irr=0.25A VRM=VRRM AF GF 1.3 50 JF 1.7 75 Ta =25℃ 5 Ta =125℃ 100 Between junction and ambient 75 Between junction and terminal 27 Notes: Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pad areas www.jscj-elec.com 1 Rev. - 1.1 FIG.2: MAXIMUM NON-REPETITIVE FORWARD URGE CURRENT IFSM(A) IO(A) FIG.1: FORWARD CURRENT DERATING CURVE 1.0 35 30 0.8 8.3ms Single Half Sine Wave JEDEC Method 25 0.6 20 0.4 15 10 0.2 Resistive or Inductive Load P.C.B. Mounted on 0.2"×0.2" (5.0mm×5.0mm)Copper Pad Areas 5 0 0 25 75 50 100 125 150 TL(℃) 0 1 2 10 100 20 Number of Cycles FIG.4 TYPICAL REVERSE CHARACTERISTICS 100 IR(uA) IF(A) FIG.3: TYPICAL FORWARD CHARACTERISTICS TJ=25 Pulse width=300us 1% Duty Cycle Tj=150℃ US1AF-DF 10 10 US1GF 1.0 0.1 0.4 0.6 0.8 1.0 1.2 1.4 Tj=25℃ 0.01 0 0.01 0.2 Tj=100℃ 1.0 US1JF-MF 0.1 100 1.6 VF(V) 20 40 60 80 100 Voltage(%) FIG.5: Diagram of circuit and Testing wave form of reverse recovery time I D trr IF VR IF RL t 0 I RR IR www.jscj-elec.com 2 Rev. - 1.1 SMAF .193(4.90) .173(4.40) .047(1.20) .035(0.90) .146(3.70) .130(3.30) .063(1.60) .106(2.70) .051(1.30) .094(2.40) .007(0.18) .005(0.12) .051(1.30) .031(0.80) Dimensions in inches and (millimeters) SMAF 1.9 3.65 1.55 NOTICE JSCJ reserves the right to make modifications,enhancements,improvements,corrections or other changes without further notice to any product herein.JSCJ does not assume any liability arising out of the application or use of any product described herein. www.jscj-elec.com 3 Rev. - 1.1 Reel Taping Specifications For Surface Mount Dev ices- SMAF FIG:CONFIGURATION OF SURFACE MOUNTED DEVICES TAPING 54 1.0 2.13 0.039 www.jscj-elec.com 4 Rev. - 1.1