Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC
(Commercial Grade)
Overview
KEMET’s High Voltage surface mount MLCCs in C0G
dielectric are temperature compensating and are suited for
resonant circuit applications or those where Q and stability
of capacitance characteristics are required. C0G exhibits
no change in capacitance with respect to time and voltage
and boasts a negligible change in capacitance with
reference to ambient temperature. Capacitance change is
limited to ±30ppm/°C from −55°C to +125°C.
These devices exhibit low ESR at high frequencies and
find conventional use as snubbers or filters in applications
such as switching power supplies and lighting ballasts.
Their exceptional performance at high frequencies has
made C0G high voltage the preferred dielectric choice of
design engineers worldwide. In addition to Commercial
Grade, Automotive Grade devices are available which meet
the demanding Automotive Electronics Council's
AEC–Q200 qualification requirements.
Benefits
• Operating temperature range of −55°C to +125°C
• Capacitance offerings ranging from 1 pF to 0.15 μF
• DC voltage ratings of 500 V, 630 V, 1 KV, 1.5 KV, 2 KV, 2.5 KV,
3 KV and 10KV
• EIA 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220, 2225,
2824, 3040, 3640 and 4540 case sizes
• Extremely low ESR and ESL
• High ripple current capability
• No capacitance shift with voltage
• Negligible capacitance shift with respect to temperature
• No piezoelectric noise
• Lead (Pb)-Free, RoHS and REACH compliant
Applications
• High frequency power converters
• Wide bandgap (WBG), silicon carbide (SiC) and gallium nitride (GaN) systems
• Snubber (high dV/dT)
• Resonant circuits (LLC, Wireless Charging, etc)
• Timing
• Filtering
Built Into Tomorrow
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Ordering Information
C
1210
Ceramic
2
332
Case Size Specification/ Capacitance
(L" x W")
Series
Code (pF)
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
2824
3040
3640
4540
1
C
C = Standard
Two
significant
digits and
number of
zeros.
J
Capacitance
Tolerance1
B = ±0.10 pF
C = ±0.25 pF
D = ±0.5 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
C
G
A
Rated Voltage
Failure Rate/
Dielectric
(VDC)
Design
C = 500
B = 630
D = 1,000
F = 1,500
G = 2,000
Z = 2,500
H = 3,000
K = 10,000
G = C0G
A = N/A
C
TU
Termination Finish2
Packaging/
Grade (C-Spec)
C = 100% Matte Sn
L = SnPb
(5% Pb minimum)
See
"Packaging
C-Spec
Ordering
Options
Table"
Additional capacitance tolerance offerings may be available. Contact KEMET for details.
Additional termination finish options may be available. Contact KEMET for details.
Packaging C-Spec Ordering Options Table
Packaging Type1
Bulk Bag/Unmarked
7" Reel/Unmarked
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch2
Packaging/Grade
Ordering Code (C-Spec)
Not required (Blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
7082
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
"Bulk Bag" packaging option is not available for case sizes larger than 2225 (5664 Metric).
1
The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see “Capacitor Marking”.
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
1
1
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Dimensions – Millimeters (Inches)
L
W
B
T
S
EIA Size
Code
Metric Size
Code
0402
1005
0603
1608
0805
2012
1206
3216
1210
3225
1808
4520
1812
4532
1825
4564
2220
5650
2225
5664
2824
7260
3040
7610
3640
9210
4540
-
L
Length
W
Width
1.00 (0.040)
±0.05 (0.002)
1.60 (0.063)
±0.15 (0.006)
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
4.70 (0.185)
±0.50 (0.020)
4.50 (0.177)
±0.30 (0.012)
4.50 (0.177)
±0.30 (0.012)
5.70 (0.224)
±0.40 (0.016)
5.60 (0.220)
±0.40 (0.016)
7.10 (0.280)
±0.40 (0.016)
7.60 (0.300)
±0.40 (0.016)
9.10 (0.358)
±0.40 (0.016)
11.40 (0.449)
±0.40 (0.016)
0.50 (0.020)
±0.05 (0.002)
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.20 (0.008)
1.60 (0.063)
±0.20 (0.008)
2.50 (0.098)
±0.20 (0.008)
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.30 (0.012)
6.40 (0.252)
±0.40 (0.016)
5.00 (0.197)
±0.40 (0.016)
6.40 (0.248)
±0.40 (0.016)
6.10 (0.240)
±0.40 (0.016)
10.20 (0.402)
±0.40 (0.016)
10.20 (0.402)
±0.40 (0.016)
10.20 (0.402)
±0.40 (0.016)
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
T Thickness
B
Bandwidth
See Table 2 for
Thickness
0.30 (0.012)
±0.10 (0.004)
0.35 (0.014)
±0.15 (0.006)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
1.27 (0.050)
±0.40 (0.016)
1.27 (0.050)
±0.40 (0.016)
1.27 (0.050)
±0.40 (0.016)
1.27 (0.050)
±0.40 (0.016)
S
Separation
Minimum
Mounting
Technique
0.30 (0.012)
Solder Reflow
Only
0.70 (0.028)
0.75 (0.030)
N/A
Solder Wave or
Solder Reflow
Solder Reflow
Only
C1009_C0G_HV_SMD • 8/18/2023
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1808 Case Sizes)
1000
500
630
1000
1500
2000
500
630
1000
1500
2000
2500
H
3000
Z
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
EF
EF
EF
EF
EG
EG
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
EF
EF
EF
EF
EG
EG
EG
EG
EG
EG
EG
EG
EG
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FG
FG
FG
FG
FG
FG
FG
FG
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FG
FG
FG
FG
FG
FG
FG
FG
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FG
FG
FG
FG
FG
FG
FG
FG
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LA
LA
LA
LA
LA
LA
LA
LA
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LA
LA
LA
LA
LA
LA
LA
LA
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LA
LA
LA
LA
LA
LA
LA
LA
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LA
LA
LA
LA
LA
LA
LA
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LC
LC
LC
LC
LC
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LC
LC
LC
LC
LC
LC
LC
LC
LC
LC
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LB
LC
LC
LC
LC
2500
G
3000
F
1500
D
2000
B
2000
C
1000
G
1500
F
1000
D
500
B
630
C
500
1000
G
D
F
G
Z
H
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
Rated Voltage (VDC)
2000
500
630
1000
1500
2000
500
630
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
1500
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
F
1000
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
D
630
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
B
500
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
C
1000
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
C1808C
D
630
B C D
C1210C
B
630
500
630
Capacitance
Tolerance
C1206C
C
500
Cap
Code
D
1000
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
161
181
201
221
241
B
500
Capacitance
109 - 919*
100 - 470*
Rated Voltage (VDC)
C
630
1.0 - 9.1 pF*
10 pF - 47pF*
11 pF
12 pF
13 pF
15 pF
16 pF
18 pF
20 pF
22 pF
24 pF
27 pF
30 pF
33 pF
36 pF
39 pF
43 pF
47 pF
51 pF
56 pF
62 pF
68 pF
75 pF
82 pF
91 pF
100 pF
110 pF
120 pF
130 pF
150 pF
160 pF
180 pF
200 pF
220 pF
240 pF
C
500
Capacitance Cap Code
Voltage Code
500
Case Size/Series C0402C C0603C C0805C
Voltage Code
C
C
B
D
C
B
D
C
B
D
F
G
C
B
D
F
G
C
B
Case Size/Series
C0402C
C0603C
C0805C
C1206C
C1210C
C1808C
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (configuration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1808 Case Sizes) cont.
500
2500
Z
EG EG FG FG FG FK FK LA LA LA
EG
FG FG FG FK FK LA LA LA
EG
FG FG FG FK FK LA LA LA
EG
FG FG FG FK FS LA LA LA
EG
FG FG FG FK FS LA LA LA
EG
FG FM FM FS FS LA LB LB
EG
FG FM FM FS FS LA LB LB
EG
FG FM FM FS FS LA LB LB
EG
FG FM FM FS FS LA LB LB
FG FM FM FS FS LA LB LB
FG FM FM FS FS LB LB LB
FG FM FM FM
LB LB LB
FG FM FM FM
LB LB LB
FM FM FM FY
LB LB LB
FM FM FM FY
LB LB LB
FM FK FK FS
LC LC LC
FM FK FK FS
LC LC LC
FM FS FS
LC LC LC
FK FS FS
LC LC LC
FK FS FS
LC LC LC
FK FS FS
LC LC LC
FK FL FS
LC LA LB
FK FL FS
LC LA LB
FS FL FS
LC LA LB
FS FL FS
LC LA LC
FS FL FF
LA LA LA
FS FM FG
LA LA LA
FL FM FG
LA LB LA
FL FY FL
LA LB LA
FM FY FL
LA LC LA
FM FY FM
LA LC LB
FY FS FM
LA LB LB
FY FS FM
LB LC LC
FY FE FY
LC LC LC
FY FE FY
LC LC LC
FS FF FS
LA LA
FS FF FS
LA LA
FF FF FS
LA LA
FG FG FS
LA LA
FG FG FM
LA LA
FM FM FS
LB LB
FM FM FS
LC LC
FY FY FS
FS FS
FS FS
LB
LB
LB
LB
LB
LC
LC
LC
LC
LA
LA
LA
LA
LA
LB
LB
LC
LC
LC
LC
LC
LC
LA
LA
LA
LA
LB
LB
LC
LC
LC
LC
LC
LC
LC
B
D
C
B
D
F
G
C
B
D
F
G
C0805C
C1206C
C1210C
2500
2000
C
3000
1500
D
2000
ED
EF
EF
EF
EF
EF
EG
EG
EG
EG
EG
EG
EG
EG
EG
ED
ED
ED
ED
ED
EF
EF
EF
EG
EG
1500
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
EF
EF
EF
EF
EG
EG
EG
EG
EG
EG
EB
EB
EB
EB
EB
EB
EC
EC
ED
ED
EE
EF
EF
EG
EG
EG
EG
EH
1000
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
ED
EF
EF
EF
EF
EF
EF
EG
EG
EG
EG
EB
EB
EC
EC
ED
ED
EE
EF
EF
EG
EG
EG
EG
EH
EG
EG
500
DG
DN
DN
DN
DN
DP
DP
DP
DG
DG
DG
DG
DG
630
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DN
DN
DN
DN
DN
DP
DP
DG
DG
DG
DG
DG
H
3000
G
1500
F
2000
D
1000
B
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DG
DN
DN
DN
DN
DN
DP
DP
DG
DG
DG
DG
DG
C0603C
C
630
1500
2000
G
2000
1500
1000
1000
500
500
630
630
1000
F
1000
B
D
630
C
B
500
C
C0402C
C
2000
Voltage Code
Case Size/Series
Rated Voltage (VDC)
G
1500
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
F
500
1000
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
D
630
500
630
BB
BD
BD
B
1000
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
C
630
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
D
500
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
B
1000
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
C
C1808C
630
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
D
C1210C
500
Cap
Code
Capacitance
Tolerance
B
C1206C
1000
Capacitance
Rated Voltage (VDC)
C
500
271
301
331
361
391
431
471
511
561
621
681
751
821
911
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
123
153
183
223
273
333
C
630
270 pF
300 pF
330 pF
360 pF
390 pF
430 pF
470 pF
510 pF
560 pF
620 pF
680 pF
750 pF
820 pF
910 pF
1,000 pF
1,100 pF
1,200 pF
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
5,100 pF
5,600 pF
6,200pF
6,800pF
7,500pF
8,200 pF
9,100 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
Voltage Code
500
Capacitance Cap Code
500
Case Size/Series C0402C C0603C C0805C
C
B
D
F
G
Z
H
C1808C
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (configuration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes)
1000
1500
2000
2500
3000
10000
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GD
GD
GD
GD
GD
GD
GD
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GD
GD
GD
GD
GD
GD
GD
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GD
GD
GD
GD
GH
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GD
GD
GD
GD
GD
GD
GD
GB
GB
GB
GB
GB
GD
GD
GD
GD
GH
GH
GH
GH
GK
GK
GM
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GD
GD
GD
GD
GD
GD
GD
GD
GD
GH
GH
GH
GK
GK
GK
GK
GM
GM
GM
GO
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GD
GD
GD
GK
GK
GK
GM
GM
GM
GM
GM
GO
GO
GO
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HJ
HJ
HJ
HJ
HK
HK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JK
JK
JK
JE
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JK
JK
JK
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JK
JK
JK
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JK
JK
JL
JL
JL
JL
JN
JN
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KE
KE
KE
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KE
KE
KE
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KE
KE
KE
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KE
KE
KE
KE
KE
KE
KE
KE
KE
KE
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KF
KH
KH
KH
KJ
KJ
Rated Voltage (VDC)
10000
500
630
2500
2500
3000
3000
2000
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GD
GD
GD
GD
GD
GD
GD
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
2500
1500
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GD
GD
GD
GD
GD
GD
GD
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
3000
1000
1500
500
630
2000
K
1500
H
2000
Z
630
G
1000
F
630
D
1000
B
500
C
500
H
2500
Z
3000
G
2000
F
1500
D
1000
B
500
C
630
H
3000
Z
2500
G
2000
F
1500
D
1000
B
500
2500
3000
C
630
H
2500
Z
3000
1000
G
1500
500
F
2000
D
2000
B
1500
Cap
Code
C
C2225C
1000
Capacitance
100 - 470*
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
161
181
201
221
241
271
301
331
361
391
431
471
511
561
621
681
751
821
911
Voltage Code
C2220C
500
10 pF - 47pF*
11 pF
12 pF
13 pF
15 pF
16 pF
18 pF
20 pF
22 pF
24 pF
27 pF
30 pF
33 pF
36 pF
39 pF
43 pF
47 pF
51 pF
56 pF
62 pF
68 pF
75 pF
82 pF
91 pF
100 pF
110 pF
120 pF
130 pF
150 pF
160 pF
180 pF
200 pF
220 pF
240 pF
270 pF
300 pF
330 pF
360 pF
390 pF
430 pF
470 pF
510 pF
560 pF
620 pF
680 pF
750 pF
820 pF
910 pF
Cap
Code
C1825C
630
Capacitance
C1812C
630
Case Size/Series
Voltage Code
C
B
D
F
G
Z
H
C
B
D
F
G
Z
H
C
B
D
F
G
Z
H
C
B
D
F
G
Z
H
K
Rated Voltage (VDC)
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
Capacitance
Tolerance
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
Case Size/Series
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
C1812C
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
C1825C
C2220C
KE
KE
KE
KF
KF
KF
KF
KH
KH
KJ
KJ
KJ
C2225C
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (configuration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes) cont.
D
F
G
Z
H
C
B
D
F
G
Z
H
K
500
630
1000
1500
2000
2500
3000
500
630
1000
1500
2000
2500
3000
500
630
1000
1500
2000
2500
3000
10000
D
F
G
Z
C1812C
C1825C
JK
JK
JK
JE
JE
JE
JE
JK
JK
JL
JL
JL
JN
JN
JN
JK JN KE KE KE KF KE KF KJ
JK
KE KE KE KF KF KF
JL
KE KE KE KF KF KF
JL
KE KE KE KF KF KH
JL
KE KE KE KF KF KH
JL
KE KE KE KF KE KH
JN
KE KE KE KF KE KH
KE KE KE KF KE KJ
KE KE KE KF KF KJ
KE KE KE KE KH
KE KE KE KE KH
KE KE KE KE KH
KE KE KE KE KJ
KE KF KF KF KJ
KE KF KF KF KJ
KE KF KF KF
KE KF KF KH
KE KF KF KH
KE KF KF KH
KE KF KF KJ
KE KF KF KJ
KF KE KF
KF KE KF
KF KE KH
KF KE KH
KE KE KH
KE KF KJ
KE KH KE
KF KJ KF
KF KJ KH
KH KE KH
KJ KE KJ
KE KE
KE KE
KF KF
KH KH
KH KH
KJ KJ
H
C
B
D
F
G
C2220C
Z
H
C
B
D
F
G
10000
B
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JK
JK
JK
JK
JL
JL
JN
JN
JN
2500
C
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JK
JK
JL
JL
JL
JN
JE
JE
JK
JL
JN
3000
H
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JE
JK
JL
JL
JN
JN
JE
JE
JE
JK
JL
JL
JN
1500
Z
JE
JE
JE
JE
JE
JE
JE
JE
JE
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JK
JE
JE
JE
JE
JE
JK
JL
JN
JE
JE
JK
JL
JL
JN
2000
HG
HJ
HJ
HJ
HK
HK
630
HG
HG
HG
HE
HE
HG
HG
HJ
HJ
HJ
HK
HK
1000
HG
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HE
HG
HG
HJ
HJ
HJ
HK
HK
500
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HJ
HJ
HJ
HK
HK
HE
HE
HG
HJ
HK
HK
2500
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HE
HE
HG
HG
HG
HJ
HK
HE
HE
HE
HE
HE
HG
HJ
HK
HK
3000
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HE
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HG
HE
HE
HE
HE
HG
HJ
HJ
HK
HE
HE
HG
HJ
HK
HK
2000
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
1500
2500
3000
B
1000
G
C
500
F
H
630
D
Z
3000
B
G
2500
C
F
2000
Voltage Code
D
1500
Rated Voltage (VDC)
B
1000
GM
GO
GO
GO
GO
C2225C
C
500
GH
GH
GH
GH
GK
GK
GM
GM
GO
GO
GO
H
630
GB
GB
GB
GB
GB
GD
GD
GH
GH
GK
GK
GK
GK
GM
GM
GO
GO
GO
GO
GH
GH
GK
GK
GM
GM
GO
GO
Z
C2220C
2500
GB
GB
GB
GB
GB
GD
GD
GH
GH
GH
GH
GH
GH
GH
GH
GH
GH
GK
GK
GK
GM
GM
GO
GO
GO
GH
GH
GH
GH
GK
GM
GO
GO
C1825C
3000
1500
1000
G
2000
500
F
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GH
GH
GH
GH
GH
GH
GH
GK
GM
GM
GO
GO
GH
GH
GK
GM
GO
GO
Case Size/Series
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
D
2000
Capacitance
Cap
Code
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
Capacitance
Tolerance
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
G
J
K
B
1500
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
123
153
183
223
273
333
393
473
563
683
823
104
124
Rated Voltage (VDC)
C
1000
1,000 pF
1,100 pF
1,200 pF
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
5,100 pF
5,600 pF
6,200pF
6,800pF
7,500pF
8,200 pF
9,100 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.1 µF
0.12 µF
Voltage Code
500
Cap
Code
630
Capacitance
C1812C
630
Case Size/Series
Z
H
K
C2225C
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (configuration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Table 1C – Capacitance Range/Selection Waterfall (2824 – 4540 Case Sizes)
Case Size/Series
C2824C
2000
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SB
SB
SC
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SB
SB
SC
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SB
SB
SB
SC
SA
SA
SA
SA
SA
SA
SB
SB
SB
SC
SA
SA
SA
SA
SB
SB
SB
SC
2000
G
1500
F
1500
D
1000
F
B
1000
D
C
630
B
G
630
C
F
500
1500
Voltage Code
D
500
Rated Voltage (VDC)
B
2000
TA
TA
TA
TB
TB
TC
C
2000
500
TA
TA
TA
TA
TB
TB
TB
TC
G
C4540C
1500
2000
TA
TA
TA
TA
TA
TA
TA
TA
TA
TA
TB
TB
TC
F
1000
1500
TA
TA
TA
TA
TA
TA
TA
TA
TA
TA
TA
TA
TB
TB
TB
TC
D
630
1000
TA
TA
TA
TA
TA
TA
TA
TA
TA
TA
TA
TA
TA
TA
TB
TB
TB
TC
B
500
C
2000
G
1500
F
1000
D
C3640C
630
B
1000
G
C
B
D
F
G
630
1000
1500
G
C
B
D
F
C3040C
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MB
MB
MC
MC
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MB
MB
MC
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MA
MB
MB
MC
MA
MA
MA
MA
MA
MA
MB
MB
MC
MA
MA
MA
MA
MB
MB
MB
MC
1500
QB
QB
QB
QB
QC
QC
QD
1000
QB
QB
QB
QB
QB
QC
QC
QD
QD
630
QB
QB
QB
QB
QB
QB
QB
QB
QB
QB
QC
QC
QC
QD
500
QB
QB
QB
QB
QB
QB
QB
QB
QB
QB
QB
QB
QC
QC
QC
QD
QD
2000
QB
QB
QB
QB
QB
QB
QB
QB
QB
QB
QB
QB
QB
QB
QB
QC
QC
QC
QD
500
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
2000
Capacitance
Cap
Code
C
Rated
Voltage (VDC)
Capacitance
Tolerance
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
J
K
M
630
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
Voltage Code
630
2,200 pF
2,700 pF
3,300 pF
3,900 pF
4,700 pF
5,600 pF
6,800 pF
8,200 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.1 µF
0.12 µF
0.15 µF
C3040C
500
Cap
Code
C2824C
500
Capacitance
Case Size/
Series
G
C
B
D
F
C3640C
C4540C
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (configuration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity
Plastic Quantity
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
BB
BD
CG
DN
DP
DG
EB
EC
ED
EE
EF
EG
EH
FE
FF
FG
FL
FM
FY
FK
FS
LA
LB
LC
GB
0402
0402
0603
0805
0805
0805
1206
1206
1206
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1210
1808
1808
1808
1812
0.50 ± 0.05
0.55 ± 0.05
0.80 ± 0.10*
0.78 ± 0.10*
0.90 ± 0.10*
1.25 ± 0.15
0.78 ± 0.10
0.90 ± 0.10
1.00 ± 0.10
1.10 ± 0.10
1.20 ± 0.15
1.60 ± 0.15
1.60 ± 0.20
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.40 ± 0.15
1.70 ± 0.20
2.00 ± 0.20
2.10 ± 0.20
2.50 ± 0.30
1.40 ± 0.15
1.60 ± 0.15
2.00 ± 0.15
1.00 ± 0.10
10000
10000
4000
4000
4000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
50000
50000
15000
15000
15000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
4,000
4,000
2,500
2,500
2,500
2,000
2,000
2,500
2,500
2,500
2,000
2,000
2,000
2,000
1,000
1,000
1,000
1,000
1,000
0
0
0
0
0
10,000
10,000
10,000
10,000
10,000
10,000
8,000
8,000
10,000
10,000
10,000
8,000
8,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Paper Quantity
Plastic Quantity
Package quantity based on finished chip thickness specifications.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities cont.
Paper Quantity
Plastic Quantity
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
GD
GH
GK
GM
GO
HE
HG
HJ
HK
JE
JK
JL
JN
KE
KF
KH
KJ
TA
TB
TC
QB
QC
QD
MA
MB
MC
SA
SB
SC
1812
1812
1812
1812
1812
1825
1825
1825
1825
2220
2220
2220
2220
2225
2225
2225
2225
2824
2824
2824
3040
3040
3040
3640
3640
3640
4540
4540
4540
1.25 ± 0.15
1.40 ± 0.15
1.60 ± 0.20
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
1.60 ± 0.20
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
1.60 ± 0.20
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
1.60 ± 0.20
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
2.00 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
2.00 ± 0.20
2.50 ± 0.20
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1,000
1,000
1,000
500
500
1,000
1,000
500
500
1,000
1,000
500
500
1,000
1,000
500
500
750
300
300
500
500
350
250
250
250
200
200
200
4,000
4,000
4,000
2,000
2,000
4,000
4,000
2,000
2,000
4,000
4,000
2,000
2,000
4,000
4,000
2,000
2,000
1,500
1,500
1,500
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Paper Quantity
Plastic Quantity
Package quantity based on finished chip thickness specifications.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Table 2B – Bulk Packaging Quantities
Loose Packaging
Packaging Type
Bulk Bag (default)
Packaging C-Spec1
N/A 2
Case Size
Packaging Quantities (pieces/unit packaging)
EIA (in)
Metric (mm)
0402
0603
0805
1206
1210
1808
1005
1608
2012
3216
3225
4520
1812
1825
2220
2225
4532
4564
5650
5664
Minimum
Maximum
50,000
1
20,000
The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be
included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.
Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk
bag packaging option for Automotive Grade products.
2
A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The
15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our
standard "Bulk Bag" packaging.
1
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
0402
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
1005
0.50
0.72
0.72
2.20
1.20
0.45
0.62
0.62
1.90
1.00
0.40
0.52
0.52
1.60
0.80
0603
1608
0.90
1.15
1.10
4.00
2.10
0.80
0.95
1.00
3.10
1.50
0.60
0.75
0.90
2.40
1.20
0805
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1206
3216
1.60
1.35
1.90
5.60
2.90
1.50
1.15
1.80
4.70
2.30
1.40
0.95
1.70
4.00
2.00
1210
3225
1.60
1.35
2.80
5.65
3.80
1.50
1.15
2.70
4.70
3.20
1.40
0.95
2.60
4.00
2.90
1808
4520
2.30
1.75
2.30
7.40
3.30
2.20
1.55
2.20
6.50
2.70
2.10
1.35
2.10
5.80
2.40
1812
4532
2.15
1.60
3.60
6.90
4.60
2.05
1.40
3.50
6.00
4.00
1.95
1.20
3.40
5.30
3.70
1825
4564
2.15
1.60
6.90
6.90
7.90
2.05
1.40
6.80
6.00
7.30
1.95
1.20
6.70
5.30
7.00
2220
5650
2.75
1.70
5.50
8.20
6.50
2.65
1.50
5.40
7.30
5.90
2.55
1.30
5.30
6.60
5.60
2225
5664
2.70
1.70
6.90
8.10
7.90
2.60
1.50
6.80
7.20
7.30
2.50
1.30
6.70
6.50
7.00
2824
7260
3.45
1.70
6.60
9.60
7.60
3.35
1.50
6.50
8.70
7.00
3.25
1.30
6.40
8.00
6.70
3040
7610
3.70
1.70
10.70
10.10
11.70
3.60
1.50
10.60
9.20
11.10
3.50
1.30
10.50
8.50
10.80
3640
9210
4.45
1.70
10.70
11.60
11.70
4.35
1.50
10.60
10.70
11.10
4.25
1.30
10.50
10.00
10.80
4540
-
5.60
1.70
10.70
13.90
11.70
5.50
1.50
10.60
13.00
11.10
5.40
1.30
10.50
12.30
10.80
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
X
C
C
V2
Grid Placement Courtyard
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/
J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes
at these conditions.
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Termination Finish
SnPb
TP
100% Matte Sn
100°C
150°C
150°C
200°C
Time (tS) from TSmin to TSmax
60 – 120 seconds
60 – 120 seconds
Ramp-Up Rate (TL to TP)
3°C/second
maximum
3°C/second
maximum
Liquidous Temperature (TL)
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (TP to TL)
6°C/second
maximum
6°C/second
maximum
Time 25°C to Peak
Temperature
6 minutes
maximum
8 minutes
maximum
TL
Temperature
Profile Feature
tP
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tL
Tsmax
Tsmin
25
ts
25°C to Peak
Time
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Visual and
Mechanical
KEMET Internal
Capacitance
(Cap)
KEMET Internal
Test Condition
No defects that may affect performance (10X)
C ≤ 1,000 pF
Frequency: 1 MHz ±100 kHz
Voltage*:1.0 Vrms ±0.2 V
C > 1,000 pF
Frequency: 1 kHz ±50 Hz
Voltage: 1.0 Vrms ±0.2 V
Limits
Dimensions according
KEMET Spec Sheet
Within Tolerance
* See part number specification sheet for voltage
Dissipation
Factor (DF)
KEMET Internal
C ≤ 1,000 pF
Frequency: 1 MHz ±100 kHz
Voltage*:1.0 Vrms ±0.2 V
C > 1,000 pF
Frequency: 1 kHz ±50 Hz
Voltage: 1.0 Vrms ±0.2 V
Within Specification
Dissipation factor (DF) maximum
limit at 25°C = 0.1%
* See part number specification sheet for voltage
Insulation
Resistance (IR)
KEMET Internal
500 VDC applied for 120 ±5 seconds at 25°C
Within Specification
To obtain IR limit, divide MΩ-µF value
by the capacitance and compare to
GΩ limit. Select the lower of the two
limits. 1,000 megohm microfarads
or 100 GΩ.
Capacitance change with reference to +25°C and
0 VDC applied.
Temperature
Coefficient of
Capacitance (TCC)
* See part number specification sheet
for voltage
KEMET Internal
Step
Temperature (°C)
1
+25°C
2
−55°C
3
+25°C (Reference Temperature)
4
+125°C
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Within Specification: ±30 ppm / °C
C1009_C0G_HV_SMD • 8/18/2023
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions cont.
Stress
Reference
Test Condition
Limits
See Dielectric Withstanding Voltage (DWV) Table
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
EIA
Case
Size
500 V
630 V
≥ 1,000 V
0402
120% of rated voltage
N/A
N/A
0603
Dielectric
Withstanding
Voltage (DWV)
130% of rated voltage
0805
KEMET Internal
1206
1210
1808
150%
1812
1825
2220
2225
Aging Rate
(Maximum %
Capacitance
Loss/Decade Hour)
KEMET Internal
< 620pF 150% of rated voltage
≥ 620pF 130% of rated voltage
< 5.1nF 150% of rated voltage
≥ 5.1nF 130% of rated voltage
< 7.5nF 150% of rated voltage
≥ 7.5nF 130% of rated voltage
< 5.1nF 150% of rated voltage
≥ 5.1nF 130% of rated voltage
< 12nF 150% of rated voltage
≥ 12nF 130% of rated voltage
< 22nF 150% of rated voltage
≥ 22nF 130% of rated voltage
< 27nF 150% of rated voltage
≥ 27nF 130% of rated voltage
< 33nF 150% of rated voltage
≥ 33nF 130% of rated voltage
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
120% of
Maximum % capacitance loss/decade hour
Withstand test voltage without
insulation breakdown or damage.
0% Loss/Decade Hour
Shear stress test per specific case size,
Time: 60 ±1 second.
Terminal
Strength
Case Size
KEMET Internal
Force
0402
3N
0603
5N
0805
9N
≥ 1206
18N
Standard Termination
System 2.0 mm
Flexible Termination
System 3.0 mm
Test Time: 60 ±5 seconds
Ramp Time: 1 mm/second
No evidence of mechanical damage
Board Flex
AEC-Q200-005
Solderability
J-STD-002
Condition: 4 hours ± 15 minutes at 155°C dry bake
apply all methods
Test 245 ±5°C (SnPb & Pb-Free)
Visual Inspection. 95% coverage on
termination. No leaching
JESD22
Method JA-104
1,000 cycles (−55°C to +125°C)
2 – 3 cycles per hour
Soak Time 1 or 5 minutes
Measurement at 24 hours ±4 hours
after test conclusion.
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Temperature
Cycling
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
No evidence of mechanical damage
C1009_C0G_HV_SMD • 8/18/2023
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Biased Humidity
Reference
MIL-STD-202
Method 103
Test Condition
Load Humidity: 1,000 hours 85°C/85% RH and
200 VDC maximum
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V.
Moisture
Resistance
MIL-STD-202
Method 106
Number of Cycles Required: 10, 24 hours per cycle.
Steps 7a and 7b not required
Thermal Shock
MIL-STD-202
Method 107
Number of Cycles Required: 5, (−55°C to 125°C)
Dwell time 15 minutes.
High Temperature
Life
Storage Life
MIL-STD-202
Method 108
1,000 hours at 125°C with 1.2 X rated voltage applied.
Limits
Measurement at 24 hours ±4 hours
after test conclusion.
Within Post Environmental Limits
Cap: ±0.3% or ±0.25 pF shift
IR: 10% of Initial Limit
DF Limits Maximum: 0.5%
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
1,000 hours at 150°C, Unpowered
Within Post Environmental Limits
Cap: ±0.3% or ±0.25 pF shift
DF Limits Maximum: 0.5%
IR: 10% of Initial Limit
Vibration
MIL-STD-202
Method 204
5 g's for 20 minutes, 12 cycles each of 3 orientations.
Test from 10 – 2,000 Hz
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Mechanical
Shock
MIL-STD-202
Method 213
1,500 g’s 0.5 millisecond Half-sine,
Velocity Change: 15.4 feet/second
(Condition F)
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Resistance to
Solvents
MIL-STD-202
Method 215
Add Aqueous wash chemical OKEMCLEAN
(A 6% concentrated Oakite cleaner) or equivalent.
Do not use banned solvents.
Visual Inspection 10X
Readable marking, no decoloration
or stains.
No physical damage.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Construction
Detailed Cross Section
Dielectric Material
(CaZrO3)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Dielectric Material
(CaZrO3)
End Termination/
External Electrode
(Cu)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Inner Electrodes
(Ni)
Capacitor Marking (Optional)
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12, 16 and 24 mm tape on 7" and 13" reels in accordance
with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2
for details on reeling quantities for commercial chips.
Bar code label
Anti-static reel
®
Embossed plastic* or
punched paper carrier.
ET
KEM
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
Sprocket holes
Embossment or punched cavity
8 mm, 12 mm
or 16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic
7" Reel
13" Reel
Pitch (P1)*
Punched Paper
7" Reel
13" Reel
Pitch (P1)*
01005 – 0402
8
2
2
0603
8
2/4
2/4
0805
8
4
4
4
4
1206 – 1210
8
4
4
4
4
1805 – 1808
12
4
4
≥ 1812
12
8
8
2824
16
12
12
3040 – 4540
24
16
16
KPS 1210
12
8
8
KPS 1812 & 2220
16
12
12
Array 0508 & 0612
8
4
4
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance specifications.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
C-3191
C-7081
C-7082
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs
• Double the parts on each reel results in fewer reel
changes and increased effi ciency
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste
C1009_C0G_HV_SMD • 8/18/2023
18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØD0
P0
(10 pitches cumulative
tolerance on tape ±0.2 mm)
A0
E1
F
K0
B1
E2
B0
S1
W
P1
T1
Center Lines of Cavity
ØD1
Cover Tape
B1 is for tape feeder reference only,
including draft concentric about B0.
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
1.5+0.10/−0.0
(0.059+0.004/−0.0)
1.75±0.10
(0.069±0.004)
4.0±0.10
(0.157±0.004)
2.0±0.05
(0.079±0.002)
1.5+0.10/−0.0
(0.059+0.004/−0.0)
1.75±0.10
(0.069±0.004)
4.0±0.10
(0.157±0.004)
2.0±0.10
(0.078±0.003)
8 mm
12 mm
16 mm
24 mm
R Reference
Note 2
25.0
(0.984)
30
(1.181)
30
(1.181)
S1 Minimum
Note 3
T
Maximum
T1
Maximum
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
5
(0.196)
0.250
(0.009)
0.350
(0.013)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Single (4 mm)
12 mm
Single (4 mm) &
Double (8 mm)
16 mm
Triple (12 mm)
24 mm
16 mm
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
22.25
(0.875)
F
P1
3.5±0.05
(0.138±0.002)
5.5±0.05
(0.217±0.002)
7.5±0.05
(0.138±0.002)
11.5±0.10
(0.452±0.003)
4.0±0.10
(0.157±0.004)
8.0±0.10
(0.315±0.004)
12.0±0.10
(0.157±0.004)
16.0±0.10
(0.629±0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
3
(0.118)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
24.3
(0.956)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see
Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
Po
ØDo
(10 pitches cumulative
tolerance on tape ±0.2 mm)
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
8 mm
1.5+0.10/−0.0
(0.059+0.004/−0.0)
1.75±0.10
(0.069±0.004)
4.0±0.10
(0.157±0.004)
2.0±0.05
(0.079±0.002)
0.10
(0.004)
Maximum
R Reference
Note 2
0.75
(0.030)
2
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B 0
6.25
(0.246)
3.5±0.05
(0.138±0.002)
2.0±0.05
(0.079±0.002)
4.0±0.10
(0.157±0.004)
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 newton (10 to 130 gf)
24 mm
0.1 to 1.6 newton (10 to 160 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 200
10
Bo
°
T)
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
°
s
Tape
Width (mm)
8,12
16 – 56
72 – 200
Maximum
Rotation (
20
10
5
Figure 5 – Bending Radius
Embossed
Carrier
16 mm Tape
°
S)
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Bending
Radius
R
C1009_C0G_HV_SMD • 8/18/2023
21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3
(Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
W2
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
(Measured at hub)
W1
(Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
12 mm
16 mm
24 mm
A
B Minimum
C
D Minimum
178±0.20
(7.008±0.008)
or
330±0.20
(13.000±0.008)
1.5
(0.059)
13.0+0.5/−0.2
(0.521+0.02/−0.008)
20.2
(0.795)
1.2
(0.047)
13.0 + −0.2
(0.521 + −0.008)
21
(0.826)
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4+1.5/−0.0
(0.331+0.059/−0.0)
12.4+2.0/−0.0
(0.488+0.078/−0.0)
16.4+2.0/−0.0
(0.646+0.078/−0.0)
25+1.0/−0.0
(0.984+0.039/−0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
27.4+1.0/−1.0
(1.078+0.039/−0.039)
Shall accommodate tape
width without interference
8 mm
12 mm
16 mm
24 mm
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Punched Carrier
8 mm & 12 mm only
END
Carrier Tape
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm minimum
Components
100 mm
minimum leader
400 mm minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated Sprocket Holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
23
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Application Guide
Solder Fluxes and Cleaning
The use of water-soluble fluxes provides advantages of excellent solderability due to high activation. However, these fluxes
contain organic acids that can induce arcing under high DC or AC voltages. Notable problem areas are underneath the MLCC
where flux can be trapped between the ceramic material and PCB. It is therefore critical that PCBs are properly cleaned to
remove all flux residue to maintain reliability.
Coating for High Voltage MLCCs
For MLCC ratings ≥1500V, it is recommended to apply a conformal coating to MLCC to prevent surface arcing. To reduce
possibility of inducing cracks in the MLCC, select a coating with thermal expansions close to that of the MLCC.
Dielectric
CTE (ppm/°C)
Class II BaTiO3
10.7
Class I CaZrO3
9.8
Slits in PCB
It is recommended to apply a slit in the PCB under the MLCC to improve washing of flux residue that may get trapped
underneath. In some cases, it is not possible to slit entirely through the PCB due to underlying metal planes. It is also
acceptable to apply a recessed slit under the MLCC which will also promote cleaning.
• Recommended for case sizes ≥1206
• The width (w) of the slit should be 1mm
• Length of the slit should be as short as possible to prevent damaging the MLCC due to mechanical stress of the PCB.
• Slits also reduce the risk of solder balls under MLCC which decreased the creepage distance.
Solder Resist
If a slit cannot be applied as above, it is recommended to not use solder resist directly under the MLCC. The use of solder
resist material reduces the distance between MLCC ceramic material and PCB thus making it difficult to clean.
Solder Balls
Improper reflow techniques and/or improper washing can induce solder balls under or adjacent to the MLCC. Solder balls
reduce the creepage distance between the MLCC terminations and increase the risk of arcing or damage to the ceramic
material. To reduce the risk of solder balls:
• Follow KEMET’s solder recommendations as outlined in the datasheet.
• If performing a cleaning procedure, properly clean the PCB per KEMET’s cleaning recommendations.
• Add slit to the PCB as shown above.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
24
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
KEMET Electronics Corporation Sales Offices
For a complete list of our global sales offi ces, please visit www.kemet.com/sales.
Disclaimer
YAGEO Corporation and its affi liates do not recommend the use of commercial or automotive grade products for high reliability applications or manned space fl ight.
All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1009_C0G_HV_SMD • 8/18/2023
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