C1210C225K3N1CAUTO

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade) Overview KEMET Power Solutions High Temperature (KPS HT) stacked capacitors utilize a proprietary lead-frame technology to vertically stack one or two multilayer ceramic chip capacitors into a single compact surface mount package. The attached lead-frame mechanically isolates the capacitor(s) from the printed circuit board, thereby offering advanced mechanical and thermal stress performance. Isolation also addresses concerns for audible, microphonic noise that may occur when a bias voltage is applied. A two-chip stack offers up to double the capacitance in the same or smaller design footprint when compared to traditional surface mount MLCC devices. Providing up to 10 mm of board flex capability, KPS Series capacitors are environmentally friendly and in compliance with RoHS legislation. Combined with X8L dielectric, these devices are capable of reliable operation up to 150°C and are well suited for high temperature filtering, bypass and decoupling applications. X8L exhibits a predictable change in capacitance with respect to time and voltage, and boasts a minimal change in capacitance with reference to ambient temperature up to 125°C. Beyond 125°C, X8L displays a wider variation in capacitance. Capacitance change is limited to ±15% from −55°C to +125°C and +15, −40% from 125°C to 150°C. In addition to Commercial grade, Automotive grade devices are available and meet the demanding Automotive Electronics Council's AEC-Q200 qualification requirements. Benefits • −55°C to +150°C operating temperature range • Reliable and robust termination system • EIA 1210 and 2220 case sizes • DC voltage ratings of 10 V, 16 V, 25 V, and 50 V • Capacitance offerings ranging from 0.47 μF up to 47 μF • Available capacitance tolerances of ±10% and ±20% • Higher capacitance in the same footprint • Potential board space savings • Advanced protection against thermal and mechanical stress • Provides up to 10 mm of board flex capability Ordering Information C Ceramic 2220 C Case Size Specification/ (L"x W") Series 1210 1812 2220 C = Standard 476 Capacitance Code (pF) Two significant digits and number of zeros. M 8 Rated Capacitance Voltage Tolerance1 (VDC) K = ±10% M = ±20% 8 = 10 4 = 16 3 = 25 5 = 50 N 2 C 7186 Dielectric FailureRate/ Design Leadframe Finish2 Packaging/Grade (C-Spec) N = X8L 1 = KPS single chip stack 2 = KPS double chip stack C = 100% Matte Sn See “Packaging C-Spec Ordering Options Table” Double chip stacks ("2" in the 13th character position of the ordering code) are only available in M (±20%) capacitance tolerance. Single chip stacks ("1" in the 13th character position of the ordering code) are available in K (±10%) or M (±20%) tolerances. 2 Additional leadframe finish options may be available. Contact KEMET for details. 1 Built Into Tomorrow © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1038_X8L_KPS_150C_SMD • 6/28/2021 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade) Packaging C-Spec Ordering Options Table Packaging/Grade Ordering Code (C-Spec)2 Packaging Type1 Commercial Grade 7" Reel (Embossed Plastic Tape)/Unmarked 13" Reel (Embossed Plastic Tape)/Unmarked 7186 7289 Automotive Grade 7" Reel (Embossed Plastic Tape)/Unmarked 13" Reel (Embossed Plastic Tape)/Unmarked AUTO AUTO7289 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking". 2 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information". 1 Benefits cont. • Reduces audible, microphonic noise • Extremely low ESR and ESL • Lead (Pb)-free, RoHS and REACH compliant • Capable of Pb-free reflow profiles • Non-polar device, minimizing installation concerns • Tantalum and electrolytic alternative • Commercial and Automotive (AEC-Q200) grades available Applications Typical applications include smoothing circuits, DC/DC converters, power supplies (input/output filters), noise reduction (piezoelectric/mechanical), circuits with a direct battery or power source connection, critical and safety relevant circuits without (integrated) current limitation and any application that is subject to extreme environments such as high temperature, high levels of board flexure and/or temperature cycling. Markets include industrial, aerospace, automotive, and telecom. Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1038_X8L_KPS_150C_SMD • 6/28/2021 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade) Automotive C-Spec Information KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.” This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below.) Product Change Notification (PCN) The KEMET product change notification system is used to communicate primarily the following types of changes: • Product/process changes that affect product form, fit, function, and/or reliability • Changes in manufacturing site • Product obsolescence Process/Product change Obsolescence* Days Prior To Implementation KEMET assigned Yes (with approval and sign off) Yes 180 days minimum AUTO Yes (without approval) Yes 90 days minimum 1 1 Customer Notification Due To: KEMET Automotive C-Spec KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: • To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. • To provide the evidence that all customer engineering design records and specification requirements are properly understood and fulfilled by the manufacturing organization. • To demonstrate that the established manufacturing process has the potential to produce the part. PPAP (Product Part Approval Process) Level KEMET Automotive C-Spec 1 2 3 4 5 KEMET assigned1 ● ● ● ● ● AUTO 1 ○ KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. ● Part number specific PPAP available ○ Product family PPAP only © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1038_X8L_KPS_150C_SMD • 6/28/2021 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade) Dimensions – Millimeters (Inches) TOP VIEW Single or Double Chip Stack PROFILE VIEW Double Chip Stack Single Chip Stack L L W H H LW Number of Chips EIA Metric Size Code Size Code Single Double LW L Length W Width H Height LW Lead Width 3.50 (0.138) ±0.30 (0.012) 5.00 (0.197) ±0.50 (0.020) 6.00 (0.236) ±0.50 (0.020) 3.50 (0.138) ±0.30 (0.012) 2.60 (0.102) ±0.30 (0.012) 3.50 (0.138) ±0.50 (0.020) 5.00 (0.197) ±0.50 (0.020) 2.60 (0.102) ±0.30 (0.012) 3.35 (0.132) ±0.10 (0.004) 2.65 (0.104) ±0.35 (0.014) 3.50 (0.138) ±0.30 (0.012) 6.15 (0.242) ±0.15 (0.006) 5.00 (0.197) −1.00/+0.50 (−0.040/+0.020) 5.00 (0.197) ±0.50 (0.020) 0.80 (0.032) ±0.15 (0.006) 1.10 (0.043) ±0.30 (0.012) 1.60 (0.063) ±0.30 (0.012) 0.80 (0.031) ±0.15 (0.006) 1210 3225 1812 4532 2220 5650 1210 3225 1812 4532 5.00 (0.197) ±0.50 (0.020) 3.50 (0.138) ±0.50 (0.020) 2220 5650 6.00 (0.236) ±0.50 (0.020) 5.00 (0.197) ±0.50 (0.020) Mounting Technique Solder Reflow Only 1.10 (0.043) ±0.30 (0.012) 1.60 (0.063) ±0.30 (0.012) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) Aging Rate (Maximum % Capacitance Loss/Decade Hour) 1 2 3 4 Dielectric Withstanding Voltage (DWV) Dissipation Factor (DF) Maximum Limit at 25°C Insulation Resistance (IR) Minimum Limit at 25°C −55°C to +150°C ±15% (−55ºC to 125ºC), +15, −40% (125ºC to 150ºC) 3.0% 250% of rated voltage (5±1 seconds and charge/discharge not exceeding 50 mA) 3.5% ( ≤ 16V) and 2.5% ( ≥ 25V) 500 megohm microfarads or 10 GΩ (Rated voltage applied for 120±5 seconds at 25°C) Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 3 Capacitance and dissipation factor (DF) measured under the following conditions: 1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤ 10µF 120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance > 10µF 4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON". 1 2 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1038_X8L_KPS_150C_SMD • 6/28/2021 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade) Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Rated DC Voltage Dielectric Capacitance Value ≥ 25 X8L Dissipation Factor (Maximum %) Insulation Resistance ±20% 10% of Initial Limit 3.0 All ≤ 16 Capacitance Shift 5.0 Table 1 – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes) Cap Capacitance Code 0.47 µF 1.0 µF 2.2 µF 3.3 µF 4.7 µF 10 µF 15 µF 22 µF 474 105 225 335 475 106 156 226 1.0 µF 2.2 µF 3.3 µF 4.7 µF 10 µF 22 µF 33 µF 47 µF 105 225 335 475 106 226 336 476 Cap Capacitance Code Case Size/ Series C1210C C1812C C2220C Voltage Code 8 4 3 5 1 A 4 3 5 1 A 8 4 3 5 1 A Rated Voltage (VDC) Capacitance Tolerance 10 16 25 50 100 250 16 25 50 100 250 10 16 25 50 100 250 K K K K K K K K M M M M M M M M FV FV FV FV FV FV FV FV FV FV FV FV FV FV FV M M M M M M M M FW FW FW FW FW FW FW FW FW FW FW FW FW FW FW Rated Voltage (VDC) 10 16 25 50 100 250 4 3 5 1 Voltage Code 8 4 3 5 1 A 16 25 50 100 Case Size/ Series Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions Single Chip Stack FV FV JP JP JP JP JP JP JP JP JP JP JP JP JP JP JR JR JR JR JR JR JR JR JR JR JR A 10 16 25 50 100 250 250 8 4 3 5 1 A Double Chip Stack FW FW GR C1210C GR GR C1812C C2220C These products are protected under US Patent 8,331,078 other patents pending, and any foreign counterparts. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1038_X8L_KPS_150C_SMD • 6/28/2021 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade) Table 2 – Chip Thickness/Tape & Reel Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel FV FW GR JP JR 1210 1210 1812 2220 2220 3.35 ± 0.10 6.15 ± 0.15 5.00 ± 0.50 3.50 ± 0.30 5.00 ± 0.50 0 0 0 0 0 0 0 0 0 0 600 300 400 300 200 2,000 1,000 1,700 1,300 800 Package quantity based on finished chip thickness specifications. Table 3 – KPS Land Pattern Design Recommendations (mm) Median (Nominal) Land Protrusion EIA SIZE CODE METRIC SIZE CODE C Y X V1 V2 1210 3225 1.50 1.14 1.75 5.05 3.40 2220 5650 2.69 2.08 4.78 7.70 6.00 V1 Y Y X X C C V2 Image at right based on an EIA 1210 case size. Grid Placement Courtyard KEMET’s KPS Series land pattern design recommendations have been evaluated through extensive internal testing and validation. KPS lead frames are used to mechanically isolate the MLCC from the PCB and provide stress relief for increased mechanical robustness. The land pattern dimensions for each EIA size code are designed to be encompassed within the end terminations thus regulating solder wicking and maintaining lead frame flexibility. This design is optimized to enable durable solder joint fillets which improve the mechanical integrity and reliability upon placement. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1038_X8L_KPS_150C_SMD • 6/28/2021 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade) Soldering Process To prevent degradation of temperature cycling capability, care must be taken to prevent solder from flowing into the inner side of the lead frames (inner side of "J" lead in contact with the circuit board). After soldering, the capacitors should be air cooled to room temperature before further processing. Forced air cooling is not recommended. Hand soldering should be performed with care due to the difficulty in process control. If performed, care should be taken to avoid contact of the soldering iron to the capacitor body. The iron should be used to heat the solder pad, applying solder between the pad and the lead, until reflow occurs. Once reflow occurs, the iron should be removed immediately. (Preheating is required when hand soldering to avoid thermal shock.) Profile Feature SnPb Assembly Pb-Free Assembly Preheat/Soak Temperature Minimum (TSmin) 100°C 150°C Temperature Maximum (TSmax) 150°C 200°C Time (ts) from Tsmin to Tsmax) 60 – 120 seconds 60 – 120 seconds Ramp-up Rate (TL to TP) 3°C/seconds maximum 3°C/seconds maximum Liquidous Temperature (TL) 183°C 217°C Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 235°C 250°C Time within 5°C of Maximum Peak Temperature (tP) 20 seconds maximum 10 seconds maximum Ramp-down Rate (TP to TL) Time 25°C to Peak Temperature 6°C/seconds maximum 6°C/seconds maximum 6 minutes maximum 8 minutes maximum Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow. TP TL Temperature KEMET’s KPS Series devices are compatible with IR reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for IR reflow reflect the profile conditions of the IPC/J–STD–020D standard for moisture sensitivity testing. tP Maximum Ramp-up Rate = 3°C/second Maximum Ramp-down Rate = 6°C/second tL Tsmax Tsmin 25 ts 25°C to Peak Time © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1038_X8L_KPS_150C_SMD • 6/28/2021 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS–C–6429 Appendix 2, Note: 5.0 mm minimum Magnification 50 X. Conditions: Solderability J–STD–002 a) Method B, 4 hours at 155°C, dry heat at 235°C b) Method B at 215°C category 3 c) Method D, category 3 at 250°C Temperature Cycling JESD22 Method JA–104 Biased Humidity MIL–STD–202 Method 103 Moisture Resistance Thermal Shock High Temperature Life Storage Life Vibration Mechanical Shock Resistance to Solvents MIL–STD–202 Method 106 MIL–STD–202 Method 107 MIL–STD–202 Method 108 MIL–STD–202 Method 108 MIL–STD–202 Method 204 MIL–STD–202 Method 213 MIL–STD–202 Method 215 1,000 cycles (−55°C to +150°C). Measurement at 24 hours ±4 hours after test conclusion. Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours ±4 hours after test conclusion. Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours ±4 hours after test conclusion. t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours ±4 hours after test conclusion. −55°C/+150°C. Note: Number of cycles required – 300, Maximum transfer time – 20 seconds, Dwell time – 15 minutes. Air – Air. 1,000 hours at 150°C with rated voltage applied. 150°C, 0 VDC for 1,000 hours. 5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB .031" thick, 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 – 2,000 Hz. Figure 1 of Method 213, Condition F. Add aqueous wash chemical, OKEM Clean or equivalent. Storage & Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1038_X8L_KPS_150C_SMD • 6/28/2021 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade) Construction Detailed Cross Section Dielectric Material (BaTiO3) Leadframe (Phosphor Bronze - Alloy 510) Leadframe Attach (High Melting Point Solder) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Dielectric Material (BaTiO3) Termination Finish (Sn) Termination Finish (Sn) Inner Electrodes Barrier Layer (Ni) (Ni) End Termination/ External Electrode (Cu) Product Marking Laser marking option is not available on: • C0G, Ultra Stable X8R and Y5V dielectric devices • EIA 0402 case size devices • EIA 0603 case size devices with Flexible Termination option. • KPS Commercial and Automotive grade stacked devices. These capacitors are supplied unmarked only. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1038_X8L_KPS_150C_SMD • 6/28/2021 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Embossed Carrier Embossment 12 mm (0.472”) or 16 mm (0.629”) Top Tape Thickness 0.10 mm (0.004”) Maximum Thickness 180 mm (7.0”) or 330 mm (13.0”) Table 4 – Carrier Tape Configuration – Embossed Plastic (mm) EIA Case Size Tape Size (W)* Pitch (P1)* 01005 – 0402 8 2 0603 – 1210 8 4 1805 – 1808 12 4 ≥ 1812 12 8 KPS 1210 12 8 KPS 1812 & 2220 16 12 Array 0508 & 0612 8 4 *Refer to Figure 1 for W and P1 carrier tape reference locations. *Refer to Table 5 for tolerance specifications. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1038_X8L_KPS_150C_SMD • 6/28/2021 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 P0 (10 pitches cumulative tolerance on tape ±0.2 mm) A0 E1 F K0 B1 S1 W E2 B0 P1 T1 Center Lines of Cavity B1 is for tape feeder reference only, including draft concentric about B0. Embossment For cavity size, see Note 1 Table 4 ØD1 Cover Tape User Direction of Unreeling Table 5 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5+0.10/0.0−0.0 (0.059+0.004/−0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 P2 1.75±0.10 4.0±0.10 2.0±0.05 (0.069±0.004) (0.157±0.004) (0.079±0.002) R Reference Note 2 25.0 (0.984) 30 (1.181) S1 Minimum Note 3 T Maximum T1 Maximim 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Single (4 mm) 12 mm Single (4 mm) & Double (8 mm) 16 mm Triple (12 mm) B1 Maximum E2 Minimum Note 4 4.35 6.25 (0.171) (0.246) 8.2 10.25 (0.323) (0.404) 12.1 14.25 (0.476) (0.561) F P1 3.5±0.05 4.0±0.10 (0.138±0.002) (0.157±0.004) 5.5±0.05 8.0±0.10 (0.217±0.002) (0.315±0.004) 7.5±0.05 12.0±0.10 (0.138±0.002) (0.157±0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0 , B 0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 5). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 3). (e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1038_X8L_KPS_150C_SMD • 6/28/2021 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 2 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 200 10 Bo ° T) Typical Component Centerline Ao Figure 3 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum ° s Tape Width (mm) 8,12 16 – 56 72 – 200 Maximum Rotation ( 20 10 5 Figure 4 – Bending Radius Embossed Carrier 16 mm Tape ° S) Punched Carrier 1.0 mm maximum 1.0 mm maximum R © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Bending Radius R C1038_X8L_KPS_150C_SMD • 6/28/2021 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade) Figure 5 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 6 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178±0.20 (7.008±0.008) or 330±0.20 (13.000±0.008) 1.5 (0.059) 13.0+0.5/−0.2 (0.521+0.02/−0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4+1.5/−0.0 (0.331+0.059/−0.0) 12.4+2.0/−0.0 (0.488+0.078/−0.0) 16.4+2.0/−0.0 (0.646+0.078/−0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1038_X8L_KPS_150C_SMD • 6/28/2021 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade) Figure 6 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum leader 400 mm minimum Top Cover Tape Figure 7 – Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1038_X8L_KPS_150C_SMD • 6/28/2021 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade) KEMET Electronics Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com C1038_X8L_KPS_150C_SMD • 6/28/2021 15