Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC
(Commercial & Automotive Grade)
Lead-free
Overview
KEMET's X7R with KONNEKT™ technology surface mount
capacitors are designed for applications where higher
capacitance and voltage are needed without requiring
additional board space. KONNEKT high density packaging
technology uses an innovative Transient Liquid Phase
Sintering (TLPS) material to create a surface mount multichip solution for high density packaging.
KEMET’s X7R dielectric features a 125°C maximum
operating temperature and is considered temperature
stable. The Electronics Components, Assemblies
and Materials Association (EIA) characterizes X7R
dielectric as a Class II material. Components of this
classification are fixed, ceramic dielectric capacitors
suited for bypass and decoupling applications or for
frequencydiscriminating circuits where Q and stability of
capacitance characteristics are not critical. X7R exhibits
a predictable change in capacitance with respect to time
and voltage, boasting a minimal change in capacitance
with reference to ambient temperature.
Capacitance change is limited to ±15% from −55°C to
+125°C.
In addition to their use in power supplies, these capacitors
can be used in industries related to automotive (hybrid),
telecommunications, medical, military, aerospace,
semiconductors and test/diagnostic equipment.
Automotive Grade devices are also available which meet
the demanding Automotive Electronics Council's AEC-Q200
qualification requirements
For added reliability, KEMET's flexible termination
technology is an available option that provides superior
flex performance over standard termination systems. This
technology was developed to address flex cracks, which are
the primary failure mode of MLCCs and typically the result
of excessive tensile and shear stresses produced during
board flexure and thermal cycling. Flexible termination
technology inhibits the transfer of board stress to the rigid
body of the MLCC, therefore mitigating flex cracks which
can result in low IR or short circuit failures.
Benefits
Applications
• Commercial and Automotive Grade (AEC-Q200)
• Industry-leading CV values
• Capacitance offerings ranging from 2.4 nF – 20 µF
• DC voltage ratings from 25 – 3,000 V
• EIA 1812 and 2220 case sizes
• Operating temperature range of −55°C to +125°C
• Low ESR and ESL
• Non-polar device, minimizing installation concerns
• Lead (Pb)-free, RoHS, and REACH compliant
• Surface mountable using standard MLCC reflow profiles
• Flexible termination option available.
• SMPS (Switch Mode Power Supplies)
• Lighting ballasts, HID lighting
• DC/DC Converters
• Telecom equipment
• Industrial and medical equipment
• Filters
• Snubbers
• DC Blocking
• Bypass
Built Into Tomorrow
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1108_KONNEKT_X7R • 8/25/2021
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Ordering Information
C
1812
Ceramic
C
C
944
Case Size Specification/ Capacitance
(L"x W")
Series
Code (pF)
1812
2220
C = Standard
X = Flexible
Termination
Two single
digits +
number of
zeros.
K
C
R
L
C
XXXX
Orientation and
Packaging
(Suffix/C-Spec)
Capacitance
Tolerance
Subclass
Rated
Dielectric
Designation
Voltage (V)
Termination
Finish
K = ±10%
M = ±20%
3 = 25 V
5 = 50 V
1 = 100 V
2 = 200 V
A = 250 V
C = 500 V
B = 630 V
D = 1,000 V
F = 1,500 V
G = 2,000 V
Z = 2,500 V
H = 3,000 V
R=
X7R
C=
100% matte Sn
L=
KONNEKT
See
"Packaging and
Orientation
C-Spec
Ordering
Options Table"
Additional termination finish options may be available. Contact KEMET for details.
Packaging C-Spec Ordering Options Table
Packaging Type
Mounting Orientation1
Packaging/Grade
Ordering Code (C-Spec)
Commercial Grade
7" Reel/Unmarked
TU
13" Reel/Unmarked
7210
Automotive Grade
7" Reel/Unmarked
AUTO
13" Reel/Unmarked
AUTO7210
1 All parts are shipped in standard orientation which refers to the positioning of the KONNEKT capacitors in the Tape and Reel pockets.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1108_KONNEKT_X7R • 8/25/2021
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notification (PCN)
The KEMET product change notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
Process/Product change
Obsolescence*
Days Prior To
Implementation
KEMET assigned
Yes (with approval and sign off)
Yes
180 days minimum
AUTO
Yes (without approval)
Yes
90 days minimum
1
1
Customer Notification Due To:
KEMET Automotive
C-Spec
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specification requirements are properly
understood and fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
PPAP (Product Part Approval Process) Level
KEMET Automotive
C-Spec
1
2
3
4
5
KEMET assigned1
●
●
●
●
●
AUTO
1
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1108_KONNEKT_X7R • 8/25/2021
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
Standard Mounting
2 Chips
L
W
B
T
Number
of Chips
2
2
EIA
SIZE
CODE
1812
2220
METRIC
SIZE
CODE
TERMINATION
L
LENGTH
W
WIDTH
Standard
4.50 (0.177)
±0.30 (0.012)
3.20 (0.126)
±0.30 (0.012)
Flexible
4.50 (0.178)
±0.40 (0.016)
3.20 (0.126)
±0.30 (0.012)
Standard
5.70 (0.224)
±0.40 (0.016)
5.00 (0.197)
±0.40 (0.016
Flexible
5.90 (0.232)
±0.75 (0.030)
5.00 (0.197)
±0.40 (0.016)
4532
5750
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
T
THICKNESS
See Table 1A
for Thickness
See Table 1B
for Thickness
B
BANDWIDTH
0.60 (0.024)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014
0.70 (0.028)
±0.35 (0.014)
Mounting
Technique
Solder Reflow
Only
Solder Reflow
Only
C1108_KONNEKT_X7R • 8/25/2021
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Table 1A - 1812 Product Ordering Codes, Ratings, and Package Quantities
Thickness
mm (inch)
Typical
Average
Piece
Weight
(g)
25 V
3.30 (0.130)
±0.40 (0.16)
0.25
500
2,000
945
50 V
3.30 (0.130)
±0.40 (0.16)
0.25
500
2,000
6.6 µF
665
100 V
3.90 (0.153)
±0.40 (0.16)
0.28
275
1,050
C1812(a)944(b)2RLC(c)
0.94 µF
944
200 V
3.50 (0.138)
±0.30 (0.12)
0.25
500
2,000
C1812(a)944(b)ARLC(c)
0.94 µF
944
250 V
3.50 (0.138)
±0.30 (0.12)
0.25
500
2,000
C1812(a)664(b)CRLC(c)
0.66 µF
664
500 V
4.30 (0.169)
±0.20 (0.008)
0.30
250
1,000
C1812(a)304(b)BRLC(c)
0.3 µF
304
630 V
3.50 (0.138)
±0.40 (0.16)
0.25
500
2,000
C1812(a)204(b)DRLC(c)
0.2 µF
204
1,000 V
3.50 (0.138)
±0.30 (0.12)
0.25
500
2,000
C1812(a)663(b)FRLC(c)
0.066 µF
663
1,500 V
5.10 (0.201)
±0.40 (0.16)
0.35
200
900
C1812(a)203(b)GRLC(c)
0.044 µF
203
2,000 V
5.10 (0.201)
±0.40 (0.016)
0.35
200
900
C1812(a)942(b)ZRLC(c)
0.0094 µF
942
2,500 V
5.10 (0.201)
±0.40 (0.016)
0.35
200
900
C1812(a)242(b)HRLC(c)
0.0024 µF
242
3,000 V
3.50 (0.138)
±0.30 (0.12)
0.35
500
2,000
KEMET Part
Number1
Capacitance
Cap
Code
Voltage
C1812(a)206(b)3RLC(c)
20 µF
206
C1812(a)945(b)5RLC(c)
9.4 µF
C1812(a)665(b)1RLC(c)
Number
of
Chips
2
Tape & Reel Quantity
7" Tape & 13" Tape &
Reel
Reel
1 Complete part number requires additional characters in the numbered positions provided in order to indicate capacitance tolerance and grade.
For each numbered position, available options are as follows:
(a) End Termination "C" or "X".
(b) Capacitance tolerance character "K" or "M."
(c) Product Grade: "TU" for Commercial or "AUTO" for Automotive
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1108_KONNEKT_X7R • 8/25/2021
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Table 1B - 2220 Product Ordering Codes, Ratings, and Package Quantities
KEMET Part
Number1
Capacitance
Cap
Code
Voltage
C2220(a)206(b)5RLC(c)
20 µF
206
50 V
C2220(a)205(b)1RLC(c)
2 µF
205
100 V
C2220(a)205(b)2RLC(c)
2 µF
205
200 V
C2220(a)205(b)ARLC(c)
2 µF
205
250 V
C2220(a)944(b)CRLC(c)
0.94 µF
944
500 V
C2220(a)664(b)BRLC(c)
0.66 µF
664
630 V
C2220(a)244(b)DRLC(c)
0.24 µF
244
1,000 V
C2220(a)164(b)FRLC(c)
0.16 µF
164
1,500 V
C2220(a)443(b)GRLC(c)
0.044 µF
443
2,000 V
C2220(a)303(b)ZRLC(c)
0.030 µF
303
2,500 V
C2220(a)303(b)HRLC(c)
0.030 µF
303
3,000 V
Number
of
Chips
Thickness
mm (inch)
2
4.90 (0.193)
±0.30 (0.11)
3.1 (0.122)
±0.30 (0.11)
3.1 (0.122)
±0.30 (0.11)
3.1 (0.122)
±0.30 (0.11)
5.1 (0.200)
±0.40 (0.016)
5.1 (0.200)
±0.40 (0.016)
5.1 (0.200)
±0.40 (0.016)
5.1 (0.200)
±0.40 (0.016)
5.1 (0.200)
±0.40 (0.016)
5.1 (0.200)
±0.40 (0.016)
5.1 (0.200)
±0.40 (0.016)
Typical
Average
Piece
Weight
(g)
Tape & Reel Quantity
7" Tape &
Reel
13" Tape &
Reel
0.78
225
900
0.47
500
1,925
0.47
500
1,925
0.47
500
1,925
0.81
300
1,250
0.80
300
1,250
0.80
300
1,250
0.79
300
1,250
0.80
300
1,250
0.80
300
1,250
0.80
300
1,250
1 Complete part number requires additional characters in the numbered positions provided in order to indicate capacitance tolerance and grade.
For each numbered position, available options are as follows:
(a) End Termination "C" or "X".
(b) Capacitance tolerance character "K" or "M."
(c) Product Grade: "TU" for Commercial or "AUTO" for Automotive
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1108_KONNEKT_X7R • 8/25/2021
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Performance and Reliability: Test Methods and Conditions (Commercial Only)
Test
Reference
Test Condition
Limits
Visual and
Mechanical
KEMET
Internal
No defects that may affect performance (10X)
Dimensions according KEMET Spec Sheet
C ≤ 10 µF 1 kHz ±50 Hz and 1.0 ±0.2 Vrms
Capacitance
(Cap)
Dissipation
Factor (DF)
KEMET
Internal
KEMET
Internal
C > 10 µF 120 Hz ±10 Hz and 0.5 ±0.1 Vrms
Within Tolerance
Capacitance measurements (including tolerance)
are indexed to a referee time of 1,000 hours
C ≤ 10 µF
Frequency: 1 kHz ±50 Hz
Voltage: 1.0 ±0.2 Vrms,0.5 ±0.2 Vrms
C > 10 µF
Frequency: 120 Hz ±10 Hz
Voltage: 0.5 ±0.1 Vrms
Within Specification
EIA Case
Size
1812
Rated DC
Voltage
ALL
2220
Capacitance
Dissipation Factor
(Maximum %)
< 20 µF
2.5
20 µF
3.5
ALL
2.5
Within Specification
To obtain IR limit, divide MΩ-µF value by the capacitance and
compare to GΩ limit. Select the lower of the two limits.
EIA
Case
Size
Insulation
Resistance (IR)
KEMET
Internal
Apply rated voltage for 120 seconds at 25°C
1812
2220
Rated
DC Voltage
IR Limit
25 – 100 V
500 megaohm microfarads or 10 GΩ
200 – 250 V
1,000 megaohm microfarads or 100 GΩ
500 – 1,000 V
100 megaohm microfarads or 10 GΩ
1,500 – 3,000 V
1,000 megaohm microfarads or 100 GΩ
50 – 100 V
500 megaohm microfarads or 10 GΩ
200 – 250 V
1,000 megaohm microfarads or 100 GΩ
500 – 630 V
100 megaohm microfarads or 10 GΩ
1,000 – 3,000 V
1,000 megaohm microfarads or 100 GΩ
C ≤ 10µF
Frequency: 1 kHz ±50 Hz
Voltage*: 1.0 ±0.2 Vrms
Temperature
Coefficient of
Capacitance
(TCC)
C > 10µF
Frequency: 120 Hz ±10 Hz
Voltage: 0.5 ±0.1 Vrms
KEMET
Internal
* See part number specification sheet for voltage
Step
Temperature (°C)
1
+25°C
2
−55°C
3
+25°C (Reference)
4
+125°C
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Capacitance ±15% over
−55°C to +125°C
C1108_KONNEKT_X7R • 8/25/2021
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Performance and Reliability: Test Methods and Conditions (Commercial Only) cont.
Test
Dielectric
Withstanding
Voltage
(DWV)
Reference
Test Condition
KEMET
Internal
Rated
DC Voltage
DWV Voltage
(% of Rated)
< 500
250%
500/630
150%
≥ 1,000
120%
Limits
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Withstand test voltage without
insulation breakdown or damage.
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
Aging Rate
(Maximum %
Capacitance
Loss/Decade Hour)
KEMET
Internal
Capacitance measurements (including tolerance) are indexed to a
referee time of 1,000 hours.
Please refer to a part number specific datasheet for referee time
details.
3% Loss/Decade Hour
Shear stress test per specific case size, Time: 60±1 seconds
Terminal
Strength
KEMET
Internal
Case
Size
1812
2220
Board
Flex
AEC-Q200-005
Solderability
KEMET
Custom Test
Temperature
Cycling
JESD22
Method JA-104
Force
No evidence of mechanical
damage
18N
Standard Termination System 2.0 mm
Flexible Termination System 3.0 mm
Test time: 60± 5 seconds
Ramp time: 1 mm/second
1. Board shear – SAC305 solder. Shear force of 1.8 kg (minimum)
2. Wetting balance – IEC 60068–2–69
1,000 cycles (−55°C to +125°C)
2 – 3 cycles per hour
Soak Time 1 or 5 minutes
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
No evidence of mechanical
damage
Visual Inspection.
95% coverage on termination.
No leaching
Measurement at 24 hours ±4
hours after test conclusion.
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
C1108_KONNEKT_X7R • 8/25/2021
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Performance and Reliability: Test Methods and Conditions (Commercial Only) cont.
Test
Biased
Humidity
Reference
MIL-STD-202
Method 103
Test Condition
Load Humidity:
1,000 hours 85°C/85% RH and 200 VDC maximum.
Low Volt Humidity:
1,000 hours 85°C/85% RH and 1.5 V.
Limits
Measurement at 24 hours ±4 hours after
test conclusion.
Within Post Environmental Limits
Cap: ±20% shift
IR: 10% of Initial Limit
DF Limits
Maximum (%)
Initial
Post
2.5
3.0
3.5
5.0
Measurement at 24 hours ±4 hours after
test conclusion.
Within Post Environmental Limits
Cap: ±20% shift
IR: 10% of Initial Limit
Moisture
Resistance
Thermal Shock
MIL-STD-202
Method 106
MIL-STD-202
Method 107
High
Temperature
Life
Number of cycles required 10, 24 hours per cycle.
Steps 7a and 7b not required.
Number of cycles required 5, (−55°C to 125°C)
Dwell time 15 minutes.
1,000 hours at 125°C with 1.0 X rated voltage applied
Initial
Post
2.5
3.0
3.5
5.0
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Within Post Environmental Limits
Cap: ±20% shift
IR: 10% of Initial Limit
DF Limits
Maximum (%)
MIL-STD-202
Method 108
Storage Life
DF Limits
Maximum (%)
1,000 hours at 125°C, Unpowered
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Initial
Post
2.5
3.0
3.5
5.0
C1108_KONNEKT_X7R • 8/25/2021
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Performance and Reliability: Test Methods and Conditions (Commercial Only) cont.
Test
Reference
Test Condition
Limits
Vibration
MIL-STD-202
Method 204
5 g's for 20 minutes, 12 cycles each of 3 orientations.
Test from 10 – 2,000 Hz
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Mechanical
Shock
MIL-STD-202
Method 213
1,500 g’s 0.5 ms Half-sine,
Velocity Change 15.4 feet/second
(Condition F)
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Resistance to
Solvents
MIL-STD-202
Method 215
Add Aqueous wash chemical OKEMCLEAN
(A 6% concentrated Oakite cleaner) or equivalent.
Do not use banned solvents.
Visual Inspection 10X
Readable marking,
no decoloration or stains.
No physical damage.
Environmental Compliance
Lead-free
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
Land Pattern Design Recommendations per IPC-7351 (mm)
Chip
Number
2
2
Mounting
Standard
Standard
EIA SIZE
CODE
1812
2220
METRIC
SIZE CODE
4532
5750
Median (Nominal) Land
Protrusion
END
TERMINATION
C
Y
X
V1
V2
Standard
2.05
1.40
3.50
6.00
4.00
Flexible
2.00
1.60
3.50
6.10
4.00
Standard
2.65
1.50
5.40
7.30
5.90
Flexible
2.75
1.90
5.40
7.90
5.90
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1108_KONNEKT_X7R • 8/25/2021
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Reflow Soldering Profile
KEMET's KONNEKT family of high density surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with
convection and IR reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress.
KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020
standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these
conditions.
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Termination Finish
TP
100% matte Sn
150°C
200°C
Time (tS) from TSmin to TSmax
60 – 120 seconds
Ramp-Up Rate (TL to TP)
3°C/second maximum
Liquidous Temperature (TL)
217°C
Time Above Liquidous (tL)
60 – 150 seconds
Peak Temperature (TP)
260°C
Time Within 5°C of Maximum Peak
Temperature (tP)
30 seconds maximum
Ramp-Down Rate (TP to TL)
6°C/second maximum
Time 25°C to Peak Temperature
8 minutes maximum
TL
Temperature
Profile Feature
tP
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tL
Tsmax
Tsmin
25
ts
25°C to Peak
Time
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Hand Soldering and Removal of KONNEKT Capacitors
The preferred method of attachment for KEMET’s KONNEKT Capacitors is IR or convection reflow where temperature, time
and air flow are well controlled.
However, it is understood that the manual attachment of KONNEKT capacitors is necessary for prototype and lab testing. In
these instances, care must be taken not to introduce excessive temperature gradients in the KONNEKT part type that may
lead to cracking in the ceramic or separation of the TLPS material.
Please see KEMET's KONNEKT Soldering Guidelines here.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1108_KONNEKT_X7R • 8/25/2021
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum
storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid
condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized
solderability chip stock should be used promptly, preferably within 1.5 years upon receipt.
Construction – Standard Termination
Detailed Cross Section
Termination Finish
(100% matte Sn)
Dielectric Material
(BaTiO3)
Bonding Material
(See Image Below)
Dielectric Material
(BaTiO3)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
End Termination/
External Electrode
(Cu)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Termination Finish
(100% matte Sn)
C1108_KONNEKT_X7R • 8/25/2021
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Construction – Flexible Termination
Bonding Material
MLCC
CuSn TLPS
MLCC
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1108_KONNEKT_X7R • 8/25/2021
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers X7R with KONNEKT technology capacitors packaged in 16 mm tape on 7" and 13" reels in accordance
with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems.
Bar code label
Anti-static reel
KONNEKT
Standard
orientation
in pocket
®
ET
KEM
Embossed
plastic carrier
Sprocket
holes
16 mm carrier tape
Embossment
cavity
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
180 mm (7.00")
or
330 mm (13.00")
Table 4 – Carrier Tape Configuration, Embossed Plastic (mm)
EIA Case Size
KONNEKT 1812
KONNEKT 2220
Number of
Chips
2
2
Chip Thickness
Tape Size
(W)1
≤ 3.5 mm
> 3.5 mm
≤ 3.5 mm
>5.0 mm & ≤ 5.3 mm
> 3.5 mm ≤ 5.0
16
16
Embossed Plastic
7" Reel
13" Reel
Pitch (P1)2
8
8
12
12
8
8
12
12
1. Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
2. Refer to Tables 4 and 5 for tolerance specifications.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1108_KONNEKT_X7R • 8/25/2021
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØD0
P0
(10 pitches cumulative
tolerance on tape ±0.2 mm)
A0
E1
F
K0
B1
E2
B0
S1
W
P1
T1
Center Lines of Cavity
B1 is for tape feeder reference only,
including draft concentric about B0.
Embossment
For cavity size,
see Note 1 Table 4
ØD1
Cover Tape
User Direction of Unreeling
Table 5 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape
Size
D0
D1 Minimum
Note 1
E1
P0
P2
R Reference
Note 2
16 mm
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
1.5
(0.059)
1.75±0.10
(0.069±0.004)
4.0±0.10
(0.157±0.004)
2.0±0.05
(0.079±0.002)
30
(1.181)
S1 Minimum
T
T1
Note 3
Maximum Maximum
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Case
Size
Number
of Chips
Tape
Size
1812
2
16 mm
2220
2
16 mm
Pitch
Triple
(12mm)
Double
(8mm)
Triple
(12mm)
Double
(8mm)
B1 Maximum
Note 4
7.9
(0.311)
7.5
(0.295)
8.5
(0.335)
9.2
(0.363)
E2
Minimum
14.25
(0.561)
14.25
(0.561)
F
P1
12.0±0.10
(0.472±0.004)
7.5±0.05
(0.138±0.002)
8.0±0.10
(0.315±0.004)
12.0±0.10
(0.472±0.004)
7.5±0.05
(0.138±0.002)
8.0±0.10
(0.315±0.004)
T2
Maximum
W
Maximum
A0,B0 & K0
6.5
(0.256)
16.3
(0.642)
Note 5
6.5
(0.256)
16.3
(0.642)
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied. See EIA Document 481, Paragraph 4.3 (b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4).
(e) For KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1108_KONNEKT_X7R • 8/25/2021
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
16 mm
0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 2 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 200
10
Bo
°
T)
°
s
Typical Component Centerline
Ao
Tape
Width (mm)
8,12
16 – 56
72 – 200
Maximum
Rotation (
20
10
5
°
S)
Figure 3 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
16 mm Tape
1.0 mm maximum
1.0 mm maximum
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1108_KONNEKT_X7R • 8/25/2021
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Figure 5 – Reel Dimensions
Full Radius,
See Note
W3
(Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
W2
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
(Measured at hub)
W1
(Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 6 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
16 mm
178±0.20
(7.008±0.008)
or
330±0.20
(13.000±0.008)
1.5
(0.059)
13.0 +0.5/−0.2
(0.521 +0.02/−0.008)
20.2
(0.795)
Variable Dimensions — Millimeters (Inches)
Tape Size
16 mm
N Minimum
See Note 2, Tables 2-3
50
(1.969)
W1
W2 Maximum
W3
16.4 +2.0/−0.0
(0.646 +0.078/−0.0)
22.4
(0.882)
Shall accommodate tape
width without interference
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1108_KONNEKT_X7R • 8/25/2021
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Figure 6 – Tape Leader & Trailer Dimensions
Embossed Carrier
Punched Carrier
8 mm & 12 mm only
END
Carrier Tape
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm minimum
Components
100 mm
minimum leader
400 mm minimum
Top Cover Tape
Figure 7 – Maximum Camber
Elongated Sprocket Holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1108_KONNEKT_X7R • 8/25/2021
18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
KEMET Electronics Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1108_KONNEKT_X7R • 8/25/2021
19
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