R413N268050T0K

Metallized Polypropylene Film EMI Suppression Capacitors R41T, THB, Class X1/Y2, 300 VAC, 125°C (Automotive Grade) Overview Applications The R41T is constructed of metallized polypropylene film encapsulated with self-extinguishing resin, in a box of material meeting the requirements of UL 94 V–0. For use in electromagnetic interference (EMI) suppression filter in "line-to-ground" and "across-the-line" applications, requiring Y2/X1 safety classification. Suitable for use in situations where failure of the capacitor could lead to danger of electric shock. Automotive Grade devices meet the demanding Automotive Electronics Council's AEC–Q200 qualification requirements. Benefits • Approvals: ENEC, UL, cUL, CQC • Class X1/Y2 (IEC 60384-14) • THB Grade IIIB: 85°C, 85% RH, 1,000 hours at 300 V URAC acc. to IEC 60384-14 (not for 0.33 μF 1 minute ≥ 1 • 10 MΩ ( ≥ 5 • 105 MΩ )* ≥ 30,000 MΩ • µF ( ≥ 150,000 MΩ • µF )* 100 VDC 5 * Typical value © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com F3120_R41-T_Y2_300 • 7/7/2021 4 Metallized Polypropylene Film EMI Suppression Capacitors R41T, THB, Class X1/Y2, 300 VAC, 125°C (Automotive Grade) Performance Characteristics cont. Maximum Humidity in Storage Condition 100 90 80 70 60 50 40 30 20 10 0 −40 Maximum Irms vs. Th Relative Humidity (%) 120% Maximum Irms 100% 30 Days Annual Average 80% 60% 40% 20% −20 0 20 40 60 Temperature (°C) 80 0% 25 35 45 55 65 75 85 95 105 115 125 Temperature Th(°C) Maximum Overtemperature ∆Tlim vs Th 25 ∆Tlim (°C) 20 15 10 5 130 120 110 100 90 80 70 60 50 40 30 20 0 10 0 Temperature Th(°C) Th is the maximum ambient temperature surrounding the capacitor or hottest contact point (e.g. tracks), whichever is higher, in the worst operation conditions in °C. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com F3120_R41-T_Y2_300 • 7/7/2021 5 Metallized Polypropylene Film EMI Suppression Capacitors R41T, THB, Class X1/Y2, 300 VAC, 125°C (Automotive Grade) Maximum Voltage (Vrms) Versus Frequency (Sinusoidal Waveform/Th ≤ 85°C) Lead Spacing 10 mm Lead Spacing 7.5 mm 100 100 0.001 µF 0.0022 µF 0.0047 µF 10 1 Voltage (Vrms) 1,000 Voltage (Vrms) 1,000 0.1 1.0 Frequency (kHz) 10.0 0.001 µF 0.022 µF 0.068 µF 10 1 100.0 0.1 1.0 100 Voltage (Vrms) 100 Voltage (Vrms) 1,000 1 0.01 µF 0.022 µF 0.068 µF 0.1 Frequency (kHz) 10.0 1 100.0 0.1 1.0 100 Voltage (Vrms) 100 Voltage (Vrms) 1,000 1 0.22 µF 0.47 µF 0.68 µF 0.1 1.0 Frequency (kHz) 10.0 Frequency (kHz) 10.0 100.0 Lead Spacing 37.5 mm Lead Spacing 27.5 mm 1,000 10 100.0 0.047 µF 0.1 µF 0.22 µF 10 1.0 10.0 Lead Spacing 22.5 mm Lead Spacing 15 mm 1,000 10 Frequency (kHz) 100.0 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 0.47 µF 1 µF 10 1 0.1 1.0 Frequency (kHz) 10.0 F3120_R41-T_Y2_300 • 7/7/2021 100.0 6 Metallized Polypropylene Film EMI Suppression Capacitors R41T, THB, Class X1/Y2, 300 VAC, 125°C (Automotive Grade) Maximum Current (Irms) Versus Frequency (Sinusoidal Waveform/Th ≤ 85°C) Lead Spacing 7.5 mm Lead Spacing 10 mm 1 1 Current (Arms) Current (Arms) 0.001 µF 0.0022 µF 0.0047 µF 0.1 0.01 0.1 1.0 Frequency (kHz) 10.0 100.0 0.001 µF 0.022 µF 0.068 µF 0.1 0.01 0.1 1.0 Lead Spacing 15 mm Frequency (kHz) 10.0 100.0 Lead Spacing 22.5 mm 10 1 1 Current (Arms) Current (Arms) 10 0.1 0.047 µF 0.1 µF 0.22 µF 0.1 0.01 µF 0.022 µF 0.068 µF 0.01 0.1 1.0 Frequency (kHz) 10.0 100.0 0.01 0.1 1.0 Lead Spacing 27.5 mm 10.0 100.0 Lead Spacing 37.5 mm 10 10 1 Current (Arms) Current (Arms) 1 0.22 µF 0.47 µF 0.68 µF 0.47 µF 1 µF 0.1 0.1 0.01 Frequency (kHz) 0.1 1.0 Frequency (kHz) 10.0 100.0 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 0.01 0.1 1.0 Frequency (kHz) 10.0 F3120_R41-T_Y2_300 • 7/7/2021 100.0 7 Metallized Polypropylene Film EMI Suppression Capacitors R41T, THB, Class X1/Y2, 300 VAC, 125°C (Automotive Grade) Qualification Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com. Impedance Graph 10000000 1000000 100000 |Z| (Ω) 10000 1000 1 nF - p 7.5 10 nF - p 15 100 100 nF - p 22.5 1µF - p 37.5 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 10 Frequency (MHz) 100 1000 © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 10000 F3120_R41-T_Y2_300 • 7/7/2021 8 Metallized Polypropylene Film EMI Suppression Capacitors R41T, THB, Class X1/Y2, 300 VAC, 125°C (Automotive Grade) Environmental Test Data Test IEC Publication Procedure Endurance IEC 60384-14 1.7 x VR VAC 50 Hz, once every hour increase to 1,000 VAC for 0.1 second, 1,000 hours at upper rated temperature" Vibration IEC 60068-2-6 Test Fc 3 directions at 2 hours each 10 – 55 Hz at 0.75 mm or 98m/s2 Bump IEC 60068-2-29 Test Eb 1,000 bumps at 390 m/s2 Change of Temperature IEC 60068-2-14 Test Na Upper and lower rated temperature 5 cycles Active Flammability IEC 60384-14 VR +20 surge pulses at 5 kV (pulse every 5 seconds) Passive Flammability IEC 60384-14 IEC 60384-1, IEC 60695-11-5 Needle Flame Test Damp Heat Steady State IEC 60068-2-78 Test Cab +40°C and 93% RH, 56 days 85°C, 85% RH and 1,500 VDC, 1,000 hours Capacitance change (Δ C/C): ≤ 10% for ≥P10 (≤20% for P7.5 parts) Dissipation factor change (Δtanδ): ≤ 150 * 10−4 (at 1 kHz for Cap > 1 µF) Dissipation factor change (Δtanδ): ≤ 240 * 10−4 (at 10 kHz for Cap ≤ 1 µF) IR ≥ 50% of initial limit or minimum 200 MΩ 85°C, 85% RH and 1,500 VDC, 1,000 hours Capacitance change (Δ C/C): ≤ 10% for ≥P10 (≤20% for P7.5 parts) Dissipation factor change (Δtanδ): ≤ 150 * 10−4 (at 1 kHz for Cap > 1 µF) Dissipation factor change (Δtanδ): ≤ 240 * 10−4 (at 10 kHz for Cap ≤ 1 µF) IR ≥ 50% of initial limit or minimum 200 MΩ 85°C, 85% RH and 300 VAC, 1,000 hours Capacitance change (Δ C/C): ≤ 10% Dissipation factor change (Δtanδ): ≤ 150 * 10−4 (at 1 kHz for Cap > 1 µF) Dissipation factor change (Δtanδ): ≤ 240 * 10−4 (at 10 kHz for Cap ≤ 1 µF) IR ≥ 50% of initial limit or minimum 200 MΩ 85°C, 85% RH and 240 VAC, 1,000 hours Capacitance change (Δ C/C): ≤ 10% for P10 (≤20% for P7.5 parts) Dissipation factor change (Δtanδ): ≤ 150 * 10−4 (at 1 kHz for Cap > 1 µF) Dissipation factor change (Δtanδ): ≤ 240 * 10−4 (at 10 kHz for Cap ≤ 1 µF) IR ≥ 50% of initial limit or minimum 200 MΩ 85°C, 85% RH and 300 VAC, 500 hours Capacitance change (Δ C/C): ≤ 10% Dissipation factor change (Δtanδ): ≤ 150 * 10−4 (at 1 kHz for Cap > 1 µF) Dissipation factor change (Δtanδ): ≤ 240 * 10−4 (at 10 kHz for Cap ≤ 1 µF) IR ≥ 50% of initial limit or minimum 200 MΩ THB test1 THB test2 THB test3 For P10 (≥ 2.2 nF) and ≥ P15 Parts THB test4 For P10 (< 2.2 nF) and all P7.5 Parts THB test5 For P10 (< 2.2 nF) Parts Approvals Certification Body Mark Specification File Number IMQ S.p.A. EN/IEC 60384-14 V4160 UL UL 60384-14 and CAN/CSA E60384-14 (300 VAC) E97797 IEC 60384-14 CQC14001116018 CQC13001101264 CQC15001128704 CQC19001218777 CQC13001087758 CQC © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com F3120_R41-T_Y2_300 • 7/7/2021 9 Metallized Polypropylene Film EMI Suppression Capacitors R41T, THB, Class X1/Y2, 300 VAC, 125°C (Automotive Grade) Environmental Compliance All KEMET EMI capacitors are RoHS Compliant. Table 1 – Ratings & Part Number Reference Dimensions in mm Capacitance Value (µF) T H 0.001 0.0015 0.0022 0.0033 0.0047 0.001 0.0015 0.0022 0.0033 0.0047 0.0047 0.0068 0.0047 0.0068 0.010 0.015 0.015 0.022 0.022 0.033 0.033 0.047 0.068 0.047 0.068 0.10 0.10 0.15 0.15 0.22 0.22 0.33 0.47  0.68 0.47 0.68 1.0 4.0 4.0 5.0 6.0 6.0 4.0 4.0 4.0 5.0 5.0 6.0 6.0 5.0 5.0 5.0 5.0 6.0 6.0 7.5 7.5 8.5 10.0 11.0 6.0 7.0 8.5 10.0 10.0 11.0 13.0 13.0 14.0 18.0 18.0 13.0 16.0 20.0 9.0 9.0 10.5 12.0 12.0 9.0 9.0 9.0 11.0 11.0 12.0 12.0 11.0 11.0 11.0 11.0 12.0 12.0 13.5 13.5 14.5 16.0 19.0 15.0 16.0 17.0 18.5 18.5 20.0 22.0 22.0 28.0 33.0 33.0 24.0 28.5 40.0 Capacitance Value (µF) T (mm) H (mm) L Lead Spacing (S) dV/dt (V/µs) KEMET Part Number Customer Part Number 10.0 10.0 10.0 10.5 10.5 13.0 13.0 13.0 13.0 13.0 13.0 13.0 18.0 18.0 18.0 18.0 18.0 18.0 18.0 18.0 18.0 18.0 18.0 26.5 26.5 26.5 26.5 26.5 26.5 26.5 32.0 32.0 32.0 32.0 41.5 41.5 41.5 7.5 7.5 7.5 7.5 7.5 10.0 10.0 10.0 10.0 10.0 10.0 10.0 15.0 15.0 15.0 15.0 15.0 15.0 15.0 15.0 15.0 15.0 15.0 22.5 22.5 22.5 22.5 22.5 22.5 22.5 27.5 27.5 27.5 27.5 37.5 37.5 37.5 800 800 800 800 800 800 800 800 800 800 800 800 600 600 600 600 600 600 600 600 600 600 600 500 500 500 500 500 500 500 400 400 400 400 300 300 300 413D1100(1)T0(2) 413D1150(1)T0(2) 413D1220(1)T0(2) 413D1330(1)T0(2) 413D1470(1)T0(2) 413F1100(1)T0(2) 413F1150(1)T0(2) 413F1220(1)T0(2) 413F1330(1)T0(2) 413F1470(1)T1(2) 413F1470(1)T0(2) 413F1680(1)T0(2) 413I1470(1)T0(2) 413I1680(1)T0(2) 413I2100(1)T0(2) 413I2150(1)T1(2) 413I2150(1)T0(2) 413I2220(1)T1(2) 413I2220(1)T0(2) 413I2330(1)T1(2) 413I2330(1)T0(2) 413I2470(1)T0(2) 413I2680(1)T0(2) 413N2470(1)T0(2) 413N2680(1)T0(2) 413N3100(1)T1(2) 413N3100(1)T0(2) 413N3150(1)T1(2) 413N3150(1)T0(2) 413N3220(1)T0(2) 413R3220(1)T0(2) 413R3330(1)T0(2) 413R3470(1)T0(2) 413R3680(1)T0(2) 413W3470(1)T0(2) 413W3680(1)T0(2) 413W4100(1)T0(2) R413D1100(1)T0(2) R413D1150(1)T0(2) R413D1220(1)T0(2) R413D1330(1)T0(2) R413D1470(1)T0(2) R413F1100(1)T0(2) R413F1150(1)T0(2) R413F1220(1)T0(2) R413F1330(1)T0(2) R413F1470(1)T1(2) R413F1470(1)T0(2) R413F1680(1)T0(2) R413I1470(1)T0(2) R413I1680(1)T0(2) R413I2100(1)T0(2) R413I2150(1)T1(2) R413I2150(1)T0(2) R413I2220(1)T1(2) R413I2220(1)T0(2) R413I2330(1)T1(2) R413I2330(1)T0(2) R413I2470(1)T0(2) R413I2680(1)T0(2) R413N2470(1)T0(2) R413N2680(1)T0(2) R413N3100(1)T1(2) R413N3100(1)T0(2) R413N3150(1)T1(2) R413N3150(1)T0(2) R413N3220(1)T0(2) R413R3220(1)T0(2) R413R3330(1)T0(2) R413R3470(1)T0(2) R413R3680(1)T0(2) R413W3470(1)T0(2) R413W3680(1)T0(2) R413W4100(1)T0(2) L (mm) Lead Spacing (S) dV/dt (V/µs) KEMET Part Number Customer Part Number (1) Insert lead and packaging code. See Ordering Options Table for available options. (2) M = ±20%, K = ±10% (3) M = ±20% (only available tolerance). © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com F3120_R41-T_Y2_300 • 7/7/2021 10 Metallized Polypropylene Film EMI Suppression Capacitors R41T, THB, Class X1/Y2, 300 VAC, 125°C (Automotive Grade) Soldering Process The implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder. This has increased the liquidus temperature from that of 183°C for SnPb eutectic alloy to 217 – 221°C for the new alloys. As a result, the heat stress to the components, even in wave soldering, has increased considerably due to higher pre-heat and wave temperatures. Polypropylene capacitors are especially sensitive to heat (the melting point of polypropylene is 160 – 170°C). Wave soldering can be destructive, especially for mechanically small polypropylene capacitors (with lead spacing of 5 mm to 15 mm), and great care has to be taken during soldering. The recommended solder profiles from KEMET should be used. Please consult KEMET with any questions. In general, the wave soldering curve from IEC Publication 61760-1 Edition 2 serves as a solid guideline for successful soldering. Please see Figure 1. Reflow soldering is not recommended for through-hole film capacitors. Exposing capacitors to a soldering profile in excess of the above the recommended limits may result to degradation or permanent damage to the capacitors. Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert through-hole parts after the curing of surface mount parts. Consult KEMET to discuss the actual temperature profile in the oven, if through-hole components must pass through the adhesive curing process. A maximum two soldering cycles is recommended. Please allow time for the capacitor surface temperature to return to a normal temperature before the second soldering cycle. Wave Soldering Recommendations Manual Soldering Recommendations The following is the recommendation for manual soldering with a soldering iron. 300 Second Wave First Wave Recommended Soldering Temperature Temperature (°C) 200 400 350 Soldering Iron Bit Temperature (°C) 2+3 seconds max 260°C 250 300 ∆ T < 150°C Cooling Preheating 150 ca. 2°C/second ca. 3.5°C/second typical ca. 5°C/second Tpreheat 100 Typical 250 50 200 150 0 100 0 40 80 120 160 200 240 Time (seconds) 50 0 0 1 2 3 4 5 6 7 8 Soldering Time (seconds) The soldering iron tip temperature should be set at 350°C (+10°C maximum) with the soldering duration not to exceed more than 3 seconds. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com F3120_R41-T_Y2_300 • 7/7/2021 11 Metallized Polypropylene Film EMI Suppression Capacitors R41T, THB, Class X1/Y2, 300 VAC, 125°C (Automotive Grade) Soldering Process cont. Wave Soldering Recommendations cont. 1. The table indicates the maximum set-up temperature of the soldering process Figure 1 Dielectric Film Material Maximum Preheat Temperature Maximum Peak Soldering Temperature Capacitor Capacitor Capacitor Capacitor Pitch Pitch Pitch Pitch ≤ 15 mm > 15 mm ≤ 15 mm > 15 mm Polyester 130°C 130°C 270°C 270°C Polypropylene 125°C 130°C 260°C 270°C Paper 130°C 140°C 270°C 270°C Polyphenylene Sulphide 150°C 160°C 270°C 270°C 2. The maximum temperature measured inside the capacitor: Set the temperature so that inside the element the maximum temperature is below the limit: Dielectric Film Material Maximum temperature measured inside the element Polyester 160°C Polypropylene 125°C Paper 160°C Polyphenylene sulphide 160°C Temperature monitored inside the capacitor. Selective Soldering Recommendations Selective dip soldering is a variation of reflow soldering. In this method, the printed circuit board with through-hole components to be soldered is preheated and transported over the solder bath as in normal flow soldering without touching the solder. When the board is over the bath, it is stopped and pre-designed solder pots are lifted from the bath with molten solder only at the places of the selected components, and pressed against the lower surface of the board to solder the components. The temperature profile for selective soldering is similar to the double wave flow soldering outlined in this document, however, instead of two baths, there is only one bath with a time from 3 to 10 seconds. In selective soldering, the risk of overheating is greater than in double wave flow soldering, and great care must be taken so that the parts are not overheated. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com F3120_R41-T_Y2_300 • 7/7/2021 12 Metallized Polypropylene Film EMI Suppression Capacitors R41T, THB, Class X1/Y2, 300 VAC, 125°C (Automotive Grade) Mounting Resistance to Vibration and Mechanical Shock AEC-Q200 Mechanical Stress Tests: Mechanical Shock Vibration MIL-SDT-202 Method 213 Test condition C Peak value 100 g, duration 6 ms, half-sine-wave (see MIL-HDBK for details) MIL-SDT-202 Method 204 5 g for 20 minutes, 12 cycles each of 3 orientations Use 8"X5" PCB, 0.031" thick. 7 secure points on one 8" side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 – 2,000 Hz. The capacitors are designed for PCB mounting. The stand-off pipes must be in good contact with the printed circuit board. The capacitors with pitch ≤ 22.5 mm can be mechanically fixed by the leads, for pitch > 22.5 mm, the capacitor body has to be properly fixed (e.g. clamped or glued). Construction 2 Sections Molded Plastic Case Detailed Cross Section Molded Plastic Self-Extinguishing Case Resin Single-sided Metallized Polypropylene Film (Second Layer) Margin Margin Metal Contact Layer Metal Contact Layer FILM WINDING SCHEME OPTIONS Margin Leads etallized Polypropylene Film Double-sided Metallized Polyester Film Winding Scheme sided ized pylene m sided ized pylene Single-sided Metallized Polypropylene Film (First Layer) Single-sided Metallized Polypropylene Film Double-sided Metallized Polypropylene Polyester Carrier Film Dielectric Film Double-sided Metallized Polyester Carrier Film 2 Sections © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com Double-sided Single-sided Metallized Metallized Polyester Polypropylene 2 Sections 1 Section F3120_R41-T_Y2_300 • 7/7/2021 Double-sided Metallized Polypropylene Polyester Carrier Film Dielectric Film 13 Metallized Polypropylene Film EMI Suppression Capacitors R41T, THB, Class X1/Y2, 300 VAC, 125°C (Automotive Grade) Marking Lead Spacing 7.5 mm FRONT TOP Capacitance Approval Marks Approval Marks Series, Safety Class Rated Voltage Rated Temperature T-Series Plant Code Manufacturer’s Logo Date Code Capacitance Tolerance NOTE: Hot imprinting with or without color or ink jet or laser marking Lead Spacing 7.5 mm (alternatives*) FRONT TOP Capacitance Tolerance Approval Marks Approval Marks Series, Safety Class Manufacturer’s Logo Capacitance T-Series Plant Code Rated Temperature Date Code NOTE: Hot imprinting with or without color or ink jet or laser marking Rated Voltage * Differences caused by technology (clichee, laser or ink jet) and production line Manufacturing Date Code (IEC 60062) Year Code Year Code Year Code Month Code Month Code 2010 2011 2012 2013 2014 2015 2016 A B C D E F H 2017 2018 2019 2020 2021 2022 2023 J K L M N P R 2024 2025 2026 2027 2028 2029 2030 S T U V W X A January February March April May June 1 2 3 4 5 6 July August September October November December 7 8 9 O N D © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com F3120_R41-T_Y2_300 • 7/7/2021 14 IEC Climatic Category Date Code Metallized Polypropylene Film EMI Suppression Capacitors Passive Flammability R41T, THB, Class X1/Y2, 300 VAC, 125°CCategory (Automotive Grade) Manufacturing Plant NOTE: Hot imprinting with or without color or ink jet or laser marking Marking cont. Lead Spacing ≥ 10 mm, 22.5 mm (small case sizes) FRONT TOP Capacitance Tolerance Series, Dielectric Code, Safety Class, Self Healing Approval Marks Manufacturer’s Logo T-Series Capacitance, Rated Voltage Date Code IEC Climatic Category Passive Flammability Category: B for volume ≥ 1750 mm3 C for volume < 1750 mm3 Manufacturing Plant NOTE: Hot imprinting with or without color or ink jet or laser marking Lead Spacing 22.5 and 27.5 mm (alternatives*) and 37.5 mm FRONT TOP Series Dielectric Code Safety Class Self Healing Manufacturer’s Logo Approval Marks Rated Voltage Capacitance, Capacitance Tolerance IEC Climatic Category T Series Passive Flammability Category QA Number Manufacturing Plant Date Code * Differences caused by technology (clichee, laser or ink jet) and production line Manufacturing Date Code (IEC 60062) Year Code Year Code Year Code Month Code Month Code 2010 2011 2012 2013 2014 2015 2016 A B C D E F H 2017 2018 2019 2020 2021 2022 2023 J K L M N P R 2024 2025 2026 2027 2028 2029 2030 S T U V W X A January February March April May June 1 2 3 4 5 6 July August September October November December 7 8 9 O N D © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com F3120_R41-T_Y2_300 • 7/7/2021 15 Metallized Polypropylene Film EMI Suppression Capacitors R41T, THB, Class X1/Y2, 300 VAC, 125°C (Automotive Grade) Packaging Quantities Lead Spacing (mm) Thickness (mm) Height (mm) Length (mm) Bulk Short Leads Bulk Long Leads Standard Reel ø 355 mm Large Reel ø 500 mm Ammo Taped 00 - JA - JB JE - JH JM - 40 - 50 GY - CK1 CK DQ 7.5 3.0 4.0 5.0 6.0 8.0 9.0 10.5 12.0 10.0 10.0 10.0 10.5 1,500 2,000 1,500 1,000 1,750 1,500 1,000 800 2,100 1,500 1,200 1,000 - 2,800 2,100 1,600 1,350 10 4.0 5.0 6.0 9.0 11.0 12.0 13.0 13.0 13.0 2,000 1,300 1,000 1,800 1,500 1,200 750 600 500 1,500 1,250 1,000 1,000 800 680 15 5.0 6.0 7.5 8.5 10.0 11.0 11.0 12.0 13.5 14.5 16.0 19.0 18.0 18.0 18.0 18.0 18.0 18.0 2,000 1,750 1,000 1,000 750 450 1,000 900 700 500 500 350 600 500 350 300 270 270 1,250 1,000 800 700 600 500 800 680 500 440 380 340 22.5 6.0 7.0 8.5 10.0 11.0 13.0 15.0 16.0 17.0 18.5 20.0 22.0 26.5 26.5 26.5 26.5 26.5 26.5 805 700 468 396 360 300 500 500 300 300 250 200 300 250 250 160 190 130 700 550 450 350 350 300 464 380 280 235 217 - 27.5 13.0 14.0 18.0 22.0 28.0 33.0 32.0 32.0 32.0 480 352 256 288 176 128 - 300 - - 37.5 13.0 16.0 20.0 24.0 28.5 40.0 41.5 41.5 41.5 360 216 126 216 108 84 - - - 1 Only for 7.5 mm lead spacing 2 Only for >7.5 mm lead spacing © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com F3120_R41-T_Y2_300 • 7/7/2021 16 Metallized Polypropylene Film EMI Suppression Capacitors R41T, THB, Class X1/Y2, 300 VAC, 125°C (Automotive Grade) Lead Taping & Packaging (IEC 60286–2) Figure 1 Lead Spacing 10 mm Figure 2 Lead Spacing 15 mm Figure 3 Lead Spacing 22.5 – 27.5 mm P W2 P2 ød A B W W0 W1 H0 P1 P0 F P h h D0 P1 P2 A-B t Taping Specification Dimensions (mm) Description Symbol 10 Fig. 1 Lead Space 15 22.5 Fig. 2 Fig. 3 27.5 Fig. 3 Tol. Lead wire diameter d 0.6 0.6–0.8 0.8 0.8 ±0.05 Taping lead space P 25.4 25.4 38.1 38.1 ±1 Feed hole lead space * P0 12.7 12.7 12.7 12.7 ±0.2 ** Centering of the lead wire P1 7.7 5.2 7.8 5.3 ±0.7 Centering of the body P2 12.7 12.7 19.05 19.05 ±1.3 Lead spacing (pitch) *** F 10 15 22.5 27.5 +0.6/−0.1 Component alignment Δh 0 0 0 0 ±2 Height of component from tape center H 0 **** 18.5 18.5 18.5 18.5 ±0.5 Carrier tape width W 18 18 18 18 +1/−0.5 Hold down tape width W0 9 10 10 10 Minimum Hole position W1 9 9 9 9 ±0.5 Hold down tape position W2 3 3 3 3 Maximum Feed hole diameter D0 4 4 4 4 ±0.2 Total tape thickness t 0.7 0.7 0.7 0.7 ±0.2 * 15 mm also available ** Maximum of 1 mm on 20 lead spaces *** Pitches 15 mm and 10 mm taped to 7.5 mm (crimped leads) available upon request **** H0 = 16.5 mm is available upon request © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com F3120_R41-T_Y2_300 • 7/7/2021 17 Metallized Polypropylene Film EMI Suppression Capacitors R41T, THB, Class X1/Y2, 300 VAC, 125°C (Automotive Grade) Lead Taping & Packaging (IEC 60286–2) cont. Ammo Specifications Dimensions (mm) H W T 360 340 59 H T W Reel Specifications Reel Size Standard Large Dimensions (mm) D H W 355 500 30 25 55 Maximum D H W © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com F3120_R41-T_Y2_300 • 7/7/2021 18 Metallized Polypropylene Film EMI Suppression Capacitors R41T, THB, Class X1/Y2, 300 VAC, 125°C (Automotive Grade) KEMET Electronics Corporation Sales Offices For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com F3120_R41-T_Y2_300 • 7/7/2021 19