WP115WUM/EGW

WP115WUM/EGW 3mm Single-Level Circuit Board Indicator DESCRIPTIONS z z PACKAGE DIMENSIONS The High Efficiency Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode The Green source color devices are made with Gallium Phosphide Green Light Emitting Diode FEATURES z z z z z z Pre-trimmed leads for pc mounting Black case enhances contrast ratio High reliability-life measured in years Housing UL rating: 94V-0 Housing material: Type 66 nylon RoHS compliant APPLICATIONS z z z z z Status indicator Illuminator Signage applications Decorative and entertainment lighting Commercial and residential architectural lighting Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the leads emerge from the package. 4. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. SELECTION GUIDE Part Number Emitting Color (Material) Lens Type ■ High Efficiency Red (GaAsP/GaP) Iv (mcd) @ 20mA [2] Min. Typ. 20 40 *12 *20 20 40 *20 *40 White Diffused WP115WUM/EGW ■ Green (GaP) Viewing Angle [1] 2θ1/2 60° Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. * Luminous intensity value is traceable to CIE127-2007 standards. © 2017 Kingbright. All Rights Reserved. Spec No: DSAP2519 / 1102010250 Rev No: V.1A Date: 08/10/2017 Page 1 / 4 WP115WUM/EGW ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C Parameter Symbol Emitting Color λpeak Value Unit Typ. Max. High Efficiency Red Green 627 565 - nm λdom [1] High Efficiency Red Green 617 568 - nm Spectral Bandwidth at 50% Φ REL MAX IF = 20mA Δλ High Efficiency Red Green 45 30 - nm Capacitance C High Efficiency Red Green 15 15 - pF Forward Voltage IF = 20mA VF [2] High Efficiency Red Green 2.0 2.2 2.5 2.5 V Reverse Current (VR = 5V) IR High Efficiency Red Green - 10 10 uA Wavelength at Peak Emission IF = 20mA Dominant Wavelength IF = 20mA Notes: 1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. ) 2. Forward voltage: ±0.1V. 3. Wavelength value is traceable to CIE127-2007 standards. 4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. ABSOLUTE MAXIMUM RATINGS at TA=25°C Value Parameter Symbol Unit High Efficiency Red Green Power Dissipation PD 75 62.5 mW Reverse Voltage VR 5 5 V Junction Temperature Tj 125 110 °C Operating Temperature Top -40 to +85 °C Storage Temperature Tstg -40 to +85 °C DC Forward Current IF 30 25 mA IFM [1] 160 140 mA - 8000 8000 V Peak Forward Current Electrostatic Discharge Threshold (HBM) Lead Solder Temperature [2] 260°C For 3 Seconds Lead Solder Temperature [3] 260°C For 5 Seconds Notes: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. 2. 2mm below package base. 3. 5mm below package base. 4. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033. © 2017 Kingbright. All Rights Reserved. Spec No: DSAP2519 / 1102010250 Rev No: V.1A Date: 08/10/2017 Page 2 / 4 WP115WUM/EGW TECHNICAL DATA SPATIAL DISTRIBUTION RELATIVE INTENSITY vs. WAVELENGTH Green Red Relative Intensity (a. u.) 100% Ta = 25 °C Ta = 25 °C 80% 0° -15° 15° 30° -30° 45° -45° 60% 60° -60° 40% 20% 75° -75° 0% 350 400 450 500 550 600 Wavelength (nm) 650 700 750 800 -90° 1.0 0.5 0.0 90° 1.0 0.5 HIGH EFFICIENCY RED Forward current (mA) Ta = 25 °C 40 30 20 10 1.7 1.9 2.1 2.3 Forward voltage (V) 2.5 Permissible forward current (mA) Luminous intensity normalised at 20mA 50 0 1.5 Forward Current Derating Curve Luminous Intensity vs. Forward Current Ta = 25 °C 2.0 1.5 1.0 0.5 0.0 2.5 0 10 20 30 40 Forward current (mA) 50 40 30 20 10 0 50 Luminous Intensity vs. Ambient Temperature Luminous intensity normalised at Ta = 25 °C Forward Current vs. Forward Voltage 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) -40 -20 0 20 40 60 80 100 Ambient temperature (°C) GREEN Forward current (mA) Ta = 25 °C 40 30 20 10 1.9 2.1 2.3 2.5 Forward voltage (V) 2.5 Permissible forward current (mA) Luminous intensity normalised at 20 mA 50 0 1.7 Forward Current Derating Curve Luminous Intensity vs. Forward Current Ta = 25 °C 2.0 1.5 1.0 0.5 0.0 2.7 0 10 20 30 40 Forward current (mA) 50 50 Luminous Intensity vs. Ambient Temperature Luminous intensity normalised at Ta = 25 °C Forward Current vs. Forward Voltage 40 30 20 10 0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) RECOMMENDED WAVE SOLDERING PROFILE Notes: 1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath temperature of 260°C 2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max). 3. Do not apply stress to the epoxy resin while the temperature is above 85°C. 4. Fixtures should not incur stress on the component when mounting and during soldering process. 5. SAC 305 solder alloy is recommended. 6. No more than one wave soldering pass. © 2017 Kingbright. All Rights Reserved. Spec No: DSAP2519 / 1102010250 Rev No: V.1A Date: 08/10/2017 Page 3 / 4 WP115WUM/EGW PACKING & LABEL SPECIFICATIONS PRECAUTIONS Storage Conditions 1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature. 2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%. 3. Product in the original sealed package is recommended to be assembled within 72 hours of opening. Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C. LED Mounting Method 1. The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement. Lead-forming may be required to insure the lead pitch matches the hole pitch. Refer to the figure below for proper lead forming procedures. Note 1-3: Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits. " ○" Correct mounting method " x " Incorrect mounting method Lead Forming Procedures 1. During soldering, component covers and holders should leave clearance to avoid placing damaging stress on the LED during soldering. 2. The tip of the soldering iron should never touch the lens epoxy. 3. Through-hole LEDs are incompatible with reflow soldering. 4. If the LED will undergo multiple soldering passes or face other processes where the part may be subjected to intense heat, please check with Kingbright for compatibility. PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes © 2017 Kingbright. All Rights Reserved. Spec No: DSAP2519 / 1102010250 Rev No: V.1A Date: 08/10/2017 Page 4 / 4