WP710A10F3C

WP710A10F3C T-1 (3mm) Infrared Emitting Diode DESCRIPTION
PACKAGE DIMENSIONS F3 Made with Gallium Arsenide Infrared Emitting diodes FEATURES

Mechanically and spectrally matched to the phototransistor RoHS compliant APPLICATIONS





Infrared Illumination for cameras Machine vision systems Surveillance systems Industrial electronics IR data transmission Remote control Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the leads emerge from the package. 4. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. SELECTION GUIDE Part Number WP710A10F3C Emitting Color (Material) Infrared (GaAs) Po (mW/sr) @ 20mA [2] Po (mW/sr) @ 50mA [2] Viewing Angle [1] Lens Type Min. Typ. Min. Typ. 5 10 18 32 Water Clear 2θ1/2 30° *3 *8 *12 *25 Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Radiant Intensity / luminous flux: +/-15%. * Radiant intensity value is traceable to CIE127-2007 standards. © 2020 Kingbright. All Rights Reserved. Spec No: DSAL0499 / 1101029174 Rev No: V.7A Date: 05/20/2020 Page 1 / 5 WP710A10F3C ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C Value Parameter Symbol Emitting Color Unit Typ. Max. Wavelength at Peak Emission IF = 20mA λpeak Infrared 940 - nm Spectral Bandwidth at 50% Φ REL MAX IF = 20mA ∆λ Infrared 50 - nm Capacitance C Infrared 90 - pF Forward Voltage IF = 20mA VF [1] Infrared 1.2 1.6 V Reverse Current (VR = 5V) IR Infrared - 10 µA Temperature Coefficient of Wavelength IF = 20mA, -10°C ≤ T ≤ 85°C TCλ Infrared 0.3 - nm/°C Temperature Coefficient of VF IF = 20mA, -10°C ≤ T ≤ 85°C TCV Infrared -1.2 - mV/°C Notes: 1. Forward voltage: ±0.1V. 2. Wavelength value is traceable to CIE127-2007 standards. 3. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. ABSOLUTE MAXIMUM RATINGS at TA=25°C Parameter Symbol Value Unit Power Dissipation PD 90 mW Reverse Voltage VR 5 V Junction Temperature Tj 115 °C Operating Temperature Top -40 to +85 °C Storage Temperature Tstg -40 to +85 °C DC Forward Current IF 50 mA IFM [1] 1.2 A Electrostatic Discharge Threshold (HBM) - 8000 V Thermal Resistance (Junction / Ambient) Rth JA [2] 540 °C/W Thermal Resistance (Junction / Solder point) Rth JS [2] 320 °C/W Peak Forward Current Lead Solder Temperature [3] 260°C For 3 Seconds Lead Solder Temperature [4] 260°C For 5 Seconds Notes: 1. 1/100 Duty Cycle, 10µs Pulse Width. 2. Rt h JA ,Rt h JS Results from mounting on PC board FR4 (pad size ≥ 16 mm 2 per pad). 3. 2mm below package base. 4. 5mm below package base. 5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033. © 2020 Kingbright. All Rights Reserved. Spec No: DSAL0499 / 1101029174 Rev No: V.7A Date: 05/20/2020 Page 2 / 5 WP710A10F3C TECHNICAL DATA SPATIAL DISTRIBUTION RELATIVE INTENSITY vs. WAVELENGTH F3 Relative Intensity (a. u.) 100% 0° -15° Ta = 25 °C Ta = 25 °C -30° 80% 15° 30° -45° 45° 60% 60° -60° 40% 20% 75° -75° 0% 550 600 650 700 750 800 850 Wavelength (nm) 900 950 1000 1050 -90° 1.0 0.5 0.0 0.5 90° 1.0 INFRARED Forward current (mA) Ta = 25 °C 40 30 20 10 Permissible forward current (mA) 2.5 Radiant intensity normalised at 20mA 50 0 0.8 Forward Current Derating Curve Radiant Intensity vs. Forward Current Ta = 25 °C 2.0 1.5 1.0 0.5 0.0 1.0 1.2 1.4 1.6 Forward voltage (V) 1.8 0 10 20 30 40 Forward current (mA) 50 Radiant Intensity vs. Ambient Temperature 70 2.5 Radiant intensity normalised at Ta = 25 °C Forward Current vs. Forward Voltage 60 50 40 30 20 10 0 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) -40 -20 0 20 40 60 80 100 Ambient temperature (°C) RECOMMENDED WAVE SOLDERING PROFILE Notes: 1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath temperature of 260°C 2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max). 3. Do not apply stress to the epoxy resin while the temperature is above 85°C. 4. Fixtures should not incur stress on the component when mounting and during soldering process. 5. SAC 305 solder alloy is recommended. 6. No more than one wave soldering pass. PACKING & LABEL SPECIFICATIONS © 2020 Kingbright. All Rights Reserved. Spec No: DSAL0499 / 1101029174 Rev No: V.7A Date: 05/20/2020 Page 3 / 5 WP710A10F3C PRECAUTIONS Storage conditions 1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature. 2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%. 3. Product in the original sealed package is recommended to be assembled within 72 hours of opening. Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C. LED Mounting Method 1. The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement. Lead-forming may be required to insure the lead pitch matches the hole pitch. Refer to the figure below for proper lead forming procedures. Note 1-3: Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits. " ○" Correct mounting method "x " Incorrect mounting method 2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact. Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the internal structures and cause failure. 3. Use stand-offs (Fig.1) or spacers (Fig.2) to securely position the LED above the PCB. 4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead bend (Fig. 3 ,Fig. 4). 5. During lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures. Do not perform lead forming once the component has been mounted onto the PCB. (Fig. 5 ) © 2020 Kingbright. All Rights Reserved. Spec No: DSAL0499 / 1101029174 Rev No: V.7A Date: 05/20/2020 Page 4 / 5 WP710A10F3C Lead Forming Procedures 1. Do not bend the leads more than twice. (Fig. 6 ) 2. During soldering, component covers and holders should leave clearance to avoid placing damaging stress on the LED during soldering. (Fig. 7) 3. The tip of the soldering iron should never touch the lens epoxy. 4. Through-hole LEDs are incompatible with reflow soldering. 5. If the LED will undergo multiple soldering passes or face other processes where the part may be subjected to intense heat, please check with Kingbright for compatibility. PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes © 2020 Kingbright. All Rights Reserved. Spec No: DSAL0499 / 1101029174 Rev No: V.7A Date: 05/20/2020 Page 5 / 5