SBSGP2000683MXB

SBSG Surface Mount EMI Filters L1 L2 W T Type SBSGC Chip Size 1812 Max Current 10A Rated Voltage 50Vdc 100Vdc 200Vdc 500Vdc Dielectric C Pi 4.55 ± 0.25 (0.179 ± 0.010) 4.70 ± 0.4 (0.185 ± 0.015) 3.20 ± 0.2 (0.126 ± 0.008) 2.50 ± 0.15 (0.098 ± 0.006) 4.55 ± 0.25 (0.179 ± 0.010) 5.25 ± 0.4 (0.207 ± 0.015) 3.20 ± 0.2 (0.126 ± 0.008) 2.50 ± 0.15 (0.098 ± 0.006) 1.50 ± 0.4 (0.059 ± 0.015) B1 1.50 ± 0.4 (0.059 ± 0.015) B2 0.30 ± 0.25 (0.012 ± 0.010) 0.30 ± 0.25 (0.012 ± 0.010) SBSGP 1812 5A Minimum and maximum capacitance values C0G/NP0 - - X7R 220nF 220nF C0G/NP0 - - X7R 100nF-150nF 100nF-150nF C0G/NP0 - - X7R 68nF 68nF C0G/NP0 - - X7R 1nF-47nF 1nF-47nF Effects of mounting method on insertion loss C and Pi filters are mounted to PCBs and soldered in identical manner to chip capacitors. Solder connections made to each end (signal lines) and each side band (earth track). Whilst SBSG, SBSM and SBSP filters can be mounted conventionally on PCBs, they are also suitable for mounting in a wall or partition on a board. This greatly improves the screening between filter input and output, thereby enhancing the high frequency response. The following insertion loss curves (for SBSP, SBSG, SBSM Pi filters), based on actual measurements, show the effect. It can be seen that the filters conventionally mounted (Fig. 1) exhibit a drop in attenuation at higher frequencies. Improved shielding methods (Fig. 2), maintain excellent suppression characteristics to 1GHz and above. See below for application example. Syfer Technology Ltd. Old Stoke Road, Arminghall Norwich, Norfolk, NR14 8SQ United Kingdom Tel: +44 1603 723300 | Email sales@syfer.co.uk | www.syfer.com SBSGDatasheet Issue 1 (P107545) Release Date 26/04/13 Page 1 of 3 Insertion loss tables for surface mount EMI filters - C filter Rated Voltage (dc) DWV (dc) Approximate Resonant Frequency (MHz) 1GHz (±20%) Dielectric 100MHz Capacitance 10MHz Packing 1MHz Product Code 0.1MHz Typical No-Load Insertion Loss (dB)* X7R 500 750 186 0 0 5 23 18 1.5nF X7R 500 750 147 0 0 8 27 18 SBSGC5000222MX 2.2nF X7R 500 750 130 0 0 11 32 18 3.3nF X7R 500 750 110 0 1 14 34 18 4.7nF X7R 500 750 100 0 2 17 40 18 6.8nF X7R 500 750 80 0 4 20 38 18 10nF X7R 500 750 62.5 0 5 24 38 18 15nF X7R 500 750 50 0 8 27 38 18 22nF X7R 500 750 39 0 11 32 39 18 33nF X7R 500 750 33 1 14 34 39 18 SBSGC5000332MX SBSGC5000682MX SBSGC5000103MX SBSGC5000153MX SBSGC5000223MX SBSGC5000333MX B = Bulk Packed SBSGC5000472MX SBSGC5000473MX R = Tape-and-Reel (330mm / 13” reels) 1.0nF SBSGC5000152MX T = Tape-and-Reel (178mm / 7” reels) SBSGC5000102MX 47nF X7R 500 750 28 2 17 36 39 18 68nF X7R 200 500 23 3 20 37 39 18 100nF X7R 100 250 19 5 23 41 39 18 SBSGC1000154MX 150nF X7R 100 250 15.5 8 27 47 39 18 SBSGC0500224MX 220nF X7R 050 125 13 11 30 49 39 18 SBSGC2000683MX SBSGC1000104MX * - Insertion Loss performance quoted is measured on an open board mounted on a brass backplane in a 50Ÿ system. Performance curves can be supplied on request. Performance in circuit is liable to be different and is affected by board material, track layout, grounding efficiency and circuit impedances. Shielding can be used to improve high frequency performance. Insertion loss tables for surface mount EMI filters - Pi filter Rated Voltage (dc) DWV (dc) Approximate Resonant Frequency (MHz) 1GHz (±20%) Dielectric 100MHz Capacitance 10MHz Packing 1MHz Product Code 0.1MHz Typical No-Load Insertion Loss (dB)* X7R 500 750 140 0 0 5 39 18 1.5nF X7R 500 750 100 0 0 8 41 18 SBSGP5000222MX SBSGP5000332MX SBSGP5000682MX SBSGP5000103MX SBSGP5000153MX SBSGP5000223MX SBSGP5000333MX SBSGP5000473MX SBSGP2000683MX SBSGP1000104MX B = Bulk Packed SBSGP5000472MX R = Tape-and-Reel (330mm / 13” reels) 1.0nF SBSGP5000152MX T = Tape-and-Reel (178mm / 7” reels) SBSGP5000102MX 2.2nF X7R 500 750 75 0 0 10 39 18 3.3nF X7R 500 750 54 0 1 15 39 18 4.7nF X7R 500 750 44 0 2 17 39 18 6.8nF X7R 500 750 35 0 3 23 39 18 10nF X7R 500 750 28 0 5 28 39 18 15nF X7R 500 750 23 0 8 35 39 18 22nF X7R 500 750 19 0 10 43 39 18 33nF X7R 500 750 15 1 12 46 39 18 47nF X7R 500 750 12 2 14 53 39 18 68nF X7R 200 500 10 3 16 55 39 18 100nF X7R 100 250 7.5 5 17 56 39 18 SBSGP1000154MX 150nF X7R 100 250 6 8 20 58 39 18 SBSGP0500224MX 220nF X7R 050 125 5.2 11 25 58 39 18 * - Insertion Loss performance quoted is measured on an open FR4 board mounted on a brass backplane in a 50Ÿ system. Performance curves can be supplied on request. Performance in circuit is liable to be different and is affected by board material, track layout, grounding efficiency and circuit impedances. Shielding can be used to improve high frequency performance. SBSGDatasheet Issue 1 (P107545) Release Date 26/04/13 Page 2 of 3 Ordering Information SBS G P 500 0473 M X T Type Size Configuration Rated Voltage Capacitance in Pico farads (pF) Tolerance Dielectric Packaging Surface mount board filter G = 1812 M = ±20% X = X7R T=178mm (7”) reel C = C section 050 = 50Vdc First digit is 0. P = Pi Section 100 = 100Vdc Second and third digits are significant figures of capacitance code. The fourth digit is number of zeros following. Example: 200 = 200Vdc 500 = 500Vdc R=330mm (13”) reel B = Bulk 0473 = 47nF Reeled Quantities 178mm (7”) reel 1812 500 330mm (13”) reel Surface mount and panel mount solder-in filters Solder pad layouts are included with the detailed information for each part. Recommended soldering profile 1812 2000 260°C. For SBSG, SBSM and SFSS ranges, solder time should be minimised, and the temperature controlled to a maximum of 220°C. For SFSR, SFST and SFSU ranges the maximum temperature is 250°C. Cooling to ambient temperature should be allowed to occur naturally. Natural cooling allows a gradual relaxation of thermal mismatch stresses in the solder joints. Draughts should be avoided. Forced air cooling can induce thermal breakage, and cleaning with cold fluids immediately after a soldering process may result in cracked filters. Note: The use of FlexiCap™ terminations is strongly recommended to reduce the risk of mechanical cracking. Soldering to axial wire leads Soldering temperature The tip temperature of the iron should not exceed 300°C. Dwell time Soldering of filters The soldering process should be controlled such that the filter does not experience any thermal shocks which may induce thermal cracks in the ceramic dielectric. The pre-heat temperature rise of the filter should be kept to around 2°C per second. In practice successful temperature rises tend to be in the region of 1.5°C to 4°C per second dependent upon substrate and components. The introduction of a soak after pre-heat can be useful as it allows temperature uniformity to be established across the substrate thus preventing substrate warping. The magnitude or direction of any warping may change on cooling imposing damaging stresses upon the filter. Dwell time should be 3-5 seconds maximum to minimise the risk of cracking the capacitor due to thermal shock. Heat sink Where possible, a heat sink should be used between the solder joint and the body, especially if longer dwell times are required. Bending or cropping of wire leads Bending or cropping of the filter terminations should not be carried out within 4mm (0.157”) of the epoxy encapsulation, the wire should be supported when cropping. A more comprehensive application note covering installation of all Syfer products is available on the Syfer website. E01, E03, E07 SBSP ranges are compatible with all standard solder types including lead-free, maximum temperature SBSGDatasheet Issue 1 (P107545) Release Date 26/04/13 Page 3 of 3