KK74ACT151N

TECHNICAL DATA 8-Input Data Selector/Multiplexer High-Speed Silicon-Gate CMOS The KK74ACT151 is identical in pinout to the LS/ALS151, HC/HCT151. The KK74ACT151 may be used as a level converter for interfacing TTL or NMOS outputs to High Speed CMOS inputs. The device selects one of the eight binary Data Inputs, as determined by the Address Inputs. The Strobe pin must be at a low level for the selected data to appear at the outputs. If Strobe is high, the Y output is forced to a low level and the Y output is forced to a high level. • TTL/NMOS Compatible Input Levels • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 2.0 to 6.0 V • Low Input Current: 1.0 µA; 0.1 µA @ 25°C • Outputs Source/Sink 24 mA KK74ACT151 ORDERING INFORMATION KK74ACT151N Plastic KK74ACT151D SOIC TA = -40° to 85° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM FUNCTION TABLE Inputs A2 X L L PIN 16 =VCC PIN 8 = GND L L H H H H A1 X L L H H L L H H A0 X L H L H L H L H Strobe H L L L L L L L L Outputs Y L D0 D1 D2 D3 D4 D5 D6 D7 Y H D0 D1 D2 D3 D4 D5 D6 D7 D0,D1...D7=the level of the respective D input X = don’t care 1 KK74ACT151 MAXIMUM RATINGS* Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL * Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Sink/Source Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) Value -0.5 to +7.0 -0.5 to VCC +0.5 -0.5 to VCC +0.5 ±20 ±50 ±50 750 500 -65 to +150 260 Unit V V V mA mA mA mW °C °C Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT TJ TA IOH IOL tr, tf * Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Junction Temperature (PDIP) Operating Temperature, All Package Types Output Current - High Output Current - Low Input Rise and Fall Time (except Schmitt Inputs) * Min 4.5 0 -40 Max 5.5 VCC 140 +85 -24 24 Unit V V °C °C mA mA ns/V VCC =4.5 V VCC =5.5 V 0 0 10 8.0 VIN from 0.8 V to 2.0 V This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. 2 KK74ACT151 DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol VIH VIL VOH Parameter Minimum HighLevel Input Voltage Maximum Low Level Input Voltage Minimum HighLevel Output Voltage Test Conditions VOUT=0.1 V or VCC-0.1 V VOUT=0.1 V or VCC-0.1 V IOUT ≤ -50 µA VIN=VIH or VIL IOH=-24 mA IOH=-24 mA VOL Maximum LowLevel Output Voltage IOUT ≤ 50 µA * * Guaranteed Limits 2 5 °C 2.0 2.0 0.8 0.8 4.4 5.4 3.86 4.86 0.1 0.1 0.36 0.36 ±0.1 -40°C to 8 5 °C 2.0 2.0 0.8 0.8 4.4 5.4 3.76 4.76 0.1 0.1 0.44 0.44 ±1.0 1.5 75 -75 8.0 80 µA mA mA mA µA V Unit V V V V 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 5.5 5.5 5.5 5.5 5.5 VIN=VIH or VIL IOL=24 mA IOL=24 mA VIN=VCC or GND VIN=VCC - 2.1 V VOLD=1.65 V Max VOHD=3.85 V Min VIN=VCC or GND IIN ∆ICCT IOLD IOHD ICC Maximum Input Leakage Current Additional Max. ICC/Input +Minimum Dynamic Output Current +Minimum Dynamic Output Current Maximum Quiescent Supply Current (per Package) * All outputs loaded; thresholds on input associated with output under test. +Maximum test duration 2.0 ms, one output loaded at a time. 3 KK74ACT151 AC ELECTRICAL CHARACTERISTICS (VCC=5.0 V ± 10%, CL=50pF,Input tr=tf=3.0 ns) Guaranteed Limits Symbol Parameter 2 5 °C Min tPLH tPHL tPLH tPHL tPLH tPHL tPLH tPHL tPLH tPHL tPLH tPHL CIN Propagation Delay, Input A to Output Y (Figure 2) Propagation Delay, Input A to Output Y (Figure 2) Propagation Delay, Input A to Output Y (Figure 2) Propagation Delay, Input A to Output Y (Figure 2) Propagation Delay, Strobe to Output Y (Figures 4) Propagation Delay, Strobe to Output Y (Figures 4) Propagation Delay, Strobe to Output Y (Figures 5) Propagation Delay, Strobe to Output Y (Figures 5) Propagation Delay, Input D to Output Y (Figures 1) Propagation Delay, Input D to Output Y (Figures 1) Propagation Delay, Input D to Output Y (Figures 3) Propagation Delay, Input D to Output Y (Figures 3) Maximum Input Capacitance 3.5 3.5 3.5 4.0 2.5 2.5 2.5 3.0 3.5 3.5 3.5 4.0 4.5 Max 15.5 15.5 15.0 16.5 9.5 9.0 8.5 10.0 11.5 12.0 12.0 12.5 -40°C to 8 5 °C Min 3.0 3.0 3.0 3.5 2.5 2.5 2.5 2.5 3.0 3.0 3.0 3.0 4.5 Max 17.0 16.5 16.5 18.5 10.0 10.0 9.5 10.5 12.5 13.5 13.0 14.0 ns ns ns ns ns ns ns ns ns ns ns ns pF Unit Typical @25°C,VCC=5.0 V CPD Power Dissipation Capacitance 70 pF 4 KK74ACT151 Figure 1. Switching Waveforms Figure 2. Switching Waveforms Figure 3. Switching Waveforms Figure 4. Switching Waveforms Figure 5. Switching Waveforms EXPANDED LOGIC DIAGRAM 5 KK74ACT151 N S UFFIX PLAS TIC DIP (MS - 0 0 1 BB) A Dimens ion, mm 16 9 B Symbol A MIN 18.67 6.1 MAX 19.69 7.11 5.33 1 8 B C F L D F 0.36 1.14 2.54 7.62 0° 2.92 7.62 0.2 0.38 0.56 1.78 C -T- SEATING PLAN E G H H J N G D 0.25 (0.010) M T K M J K L M N 10° 3.81 8.26 0.36 NOTES : 1. Dimen s io n s “A ”, “B” d o n o t in clu d e mo ld flas h o r p ro tru s io n s . Maximu m mo ld flas h o r p ro tru s io n s 0.25 mm (0.010) p er s id e. D S UFFIX S OIC (MS - 0 1 2 AC) Dimens ion, mm A 16 9 Symbol A MIN 9.8 3.8 1.35 0.33 0.4 1.27 5.72 0° 0.1 0.19 5.8 0.25 MAX 10 4 1.75 0.51 1.27 H B P B C 1 G 8 C R x 45 D F G -TD 0.25 (0.010) M T C M K SEAT ING PLAN E J F M H J K M P R 8° 0.25 0.25 6.2 0.5 NOTES : 1. Dimen s io ns A an d B d o n o t in clud e mo ld flas h o r p rotru s ion . 2. M aximu m mo ld flas h o r p ro tru s io n 0.15 mm (0.006) p er s id e fo r A ; fo r B ‑ 0.25 mm (0.010) p er s id e. 6