LDGM4341-TRS-X

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND REEL TYPE LED LAMPS LDGM4341/TRS-X DATA SHEET DOC. NO : REV DATE : QW0905-LDGM4341/TRS-X A : 29 - Sep - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM4341/TRS-X Page 1/5 Package Dimensions P2 ΔH H2 H1 L W0 W2 W1 W3 D P1 P F -+ T 5.0 14.2 6.8 1.5 MAX 25.0MIN □0.5 TYP 1.0MIN 2.54TYP Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM4341/TRS-X Page 2/5 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol DGM Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 30 100 120 50 150 -20 ~ +80 -30 ~ +100 Max 260 ℃ for 5 sec Max (2mm from body) mA mA mW UNIT μA V ℃ ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO MATERIAL Emitted COLOR Lens Green Transparent Luminous Peak Dominant Spectral Forward voltage intensity wave wave halfwidth length length △λ nm @20mA(V) @20mA(mcd) λPnm λDnm Viewing angle 2θ 1/2 (deg) Typ. Max. Min. Typ. 518 525 36 3.5 4.0 550 1040 88 LDGM4341/TRS-X InGaN/GaN Green Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM4341/TRS-X •Dimensions Symbol Information SYMBOL ITEMS Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection Page3/5 SPECIFICATIONS Minimum Maximum mm 3.8 2.3 ------- OPTION SYMBOL CODE ------------------- inch 0.15 0.09 ------- mm 4.2 3.0 2.0 18.5 22.5 26.5 23.5 20.9 25.0 25.5 20.0 19.4 22.0 21.5 19.0 27.5 36 11.0 13.0 5.8 7.7 1.42 9.75 15.5 4.0 19.0 inch 0.17 0.12 0.08 0.73 0.89 1.04 0.93 0.82 0.98 1.0 0.79 0.76 0.88 0.85 0.76 1.08 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75 D F △H Feed Hole To Bottom Of Component TRS-1 TRS-2 TRS-3 TRS-5 TRS-6 TRS-7 TRS-8 TRS-9 TRS-10 TRS-11 TRS-12 TRS-13 TRS-14 ------------------------------------------------------------- H1 17.5 21.5 25.5 22.5 19.9 24.0 24.5 19.0 18.0 21.0 20.5 18.0 26.5 ------- 0.69 0.85 1.0 0.89 0.78 0.94 0.96 0.75 0.72 0.84 0.81 0.72 1.04 ------- Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width H2 L P P1 P2 T W0 W1 W2 W3 W0 12.4 4.4 5.1 ------- 0.49 0.17 0.2 ------- 8.5 14.5 0 17.5 0.33 0.57 0 0.69 REMARK: TRS=Tape And Reel Straight Leads • Dimensions Symbol Information Specification Description Symbol minimum mm Reel Diameter Core Diameter Hub Recess Inside Diameter Arbor Hole Diameter Overall Reel Thickness Iside Reel Flange Thickness • Package Dimensions maxmum mm 380 102 88.0 38.1 57.2 50.0 inch 14.96 4.02 3.46 1.5 2.25 1.97 D3 MARKING D2 D1 inch 3.08 1.37 1.13 0.54 ------- D D1 D2 D3 T2 T1 78.2 34.9 28.6 13.8 ------- D T1 T2 30.0 1.18 Package LDGM4341/TRS-X Quantity/Reel 1000PCS Order Increments LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM4341/TRS-X Page 4/5 Typical Electro-Optical Characteristics Curve DGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 1000 Forward Current(mA) 100 10 1.0 0.1 1.0 2.0 3.0 4.0 5.0 Relative Intensity Normalize @20mA 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize @25 ℃ -40 -20 0 20 40 60 80 100 Forward Voltage@20mA Normalize @25 ℃ 1.1 1.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 0.9 0.8 Ambient Temperature( ℃) Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength 1.0 Relative Intensity@20mA 0.5 0.0 450 500 550 600 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDGM4341/TRS-X Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec