LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
ROUND TYPE LED LAMPS
Pb
Lead-Free Parts
LSGM3333-PF
DATA SHEET
DOC. NO : REV. DATE : :
QW0905- LSGM3333-PF A 23 - May - 2005
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSGM3333-PF Page 1/5
Package Dimensions
5.0
5.9
7.6
8.6
1.5 MAX
25.0MIN
□0.5 TYP
2.54TYP
1.0MIN
Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
Directivity Radiation
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSGM3333-PF Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Ratings Parameter Symbol SGM Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 30 100 100 50 1000 -20 ~ +80 -30 ~ +100 Max 260 ℃ for 5 sec Max (2mm from body) mA mA mW UNIT
μA V ℃ ℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
COLOR PART NO MATERIAL Emitted Lens
Luminous Peak Dominant Spectral Forward wave intensity wave halfwidth voltage length length △λ nm @20mA(V) @20mA(mcd) λ P nm λ D nm
Viewing angle 2θ 1/2 (deg)
Typ. Max. Min. 518 525 35 3.5
Typ. 12
LSGM3333-PF InGaN/SiC Green Water Clear
4.2 1500 2700
Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSGM3333-PF Page 3/5
Typical Electro-Optical Characteristics Curve
SGM CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Forward Current vs. Relative Intensity
2.5
30
Forward Current(mA)
Forward Current(mA)
1.0 1.5 2.5 3.5
2.0 1.5 1.0 0.5 0.0
20
10
0 2.0 3.0 4.0
0
10
20
30
40
50
Forward Voltage(V) Fig.3 Forward Current vs. Temperature
60 50 40 30 20 10 0 0 20 40 60 80 100
Relative Intensity Normalize @20mA Fig.4 Relative Intensity vs. Temperature
2.0
Relative Intensity@20mA Normalize @25 ℃
Forward Current@20mA
1.5
1.0
0.5 0.0 20 30 40 50 60 70
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 450
500
550
600
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSGM3333-PF Page 4/5
Wave soldering Profile
Temp(°C) 245° C 5sec Max 245° 5°/sec max 3°/sec max Preheat
1 20 Seconds Max
Soldering Soldering Iron:30W Max Temperature 300 ° C Max Soldering Time:3 Seconds Max Distance:2mm Min(From solder joint to case)
120°
25°
Dip Soldering Preheat: 120 °C Max Time(sec) Preheat time: 120 seconds Max Ramp-up 3° C/sec(max) Ramp-Down:-5 ° C/sec(max) Solder Bath:245 °C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case)
Wave Soldering Profile (Pb Free)
Temp(°C) 265°C 5sec Max 265°
Soldering Soldering Iron:30W Max Temperature:350 °CMax Soldering Time:3seconds Max Distance:2mm Min(From solder joint to case)
140° 3° /sec max Preheat
120 Seconds Max
5°/sec max
25°
Dip Soldering Preheat: 140°C Max Preheat time: 120seconds Max Time(sec) Ramp-up 3°C/sec(max) Ramp-Down:-5 ° C/sec(max) Solder Bath:265 ° C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSGM3333-PF Page 5/5
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
J IS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs
The purpose of this test is the resistance of the device under tropical for hous.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2
PACKING SPECIFICATION 1. 500PCS / BAG
2. 10 BAG / INNER BOX SIZE : L X W X H 33cm X 19cm X 8cm
L W H
3. 12 INNER BOXES / CARTON SIZE : L X W X H 58cm X 34cm X 34cm
L W
C/NO: MADE IN CHINA
. NO M IT E Y : Q'T ,: W: N, , W G,
S PC gs k s kg
H
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