LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
TOWER TYPE LED LAMPS
LSI11240
DATA SHEET
DOC. NO REV. DATE
: :
QW0905- LSI11240 A
: 01 - Mar - 2005
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSI11240 Page 1/4
Package Dimensions
2.4 R1.7 3.3 1.8
1.6 1.5MAX
3.0
25.0MIN
□0.5 TYP
1.0MIN 2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
Directivity Radiation
0° -30° 30°
-60°
60°
100% 75% 50%
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSI11240
Page 2/4
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Parameter
Symbol
SI
UNIT
Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature Soldering Temperature
IF IFP PD Ir Topr Tstg Tsol
20 80 80 10 -40 ~ +85 -40 ~ +100 Max 260 ℃ for 5 sec Max
mA mA mW
μA ℃ ℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
MATERIAL Emitted
COLOR
Peak wave length λPnm
Spectral halfwidth △λ nm
Forward voltage @20mA(V)
Luminous intensity @10mA(mcd)
Viewing angle 2θ1/2 (deg)
Lens Red Diffused 610 45
Min. 1.7
Max. 2.6
Min. 4.5
Typ. 7.5 50
LSI11240
GaAsP/GaP
Orange
Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSI11240 Page3/4
Typical Electro-Optical Characteristics Curve
SI CHIP
Fig.1 Forward current vs. Forward Voltage
1000
Fig.2 Relative Intensity vs. Forward Current
3.0
Forward Current(mA)
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
100
2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
10
1.0 0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Forward Voltage@20mA Normalize @25 ℃
Relative Intensity@20mA Normalize @25 ℃
80 100
2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1
1.0
0.9
0.8 -40 -20 0 20 40 60
Ambient Temperature( ℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0.0 550 600 650 700 750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSI11240 Page 4/4
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs
The purpose of this test is the resistance of the device under tropical for hous.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2
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