LTP5901IPC-IPMA#PBF

LTP5901-IPM/LTP5902-IPM SmartMesh IP Node 2.4GHz 802.15.4e Wireless Mote Module Network Features Description Complete Radio Transceiver, Embedded Processor, and Networking Software for Forming a Self-Healing Mesh Network n SmartMesh® Networks Incorporate: n Time Synchronized Network-Wide Scheduling n Per Transmission Frequency Hopping n Redundant Spatially Diverse Topologies n Network-Wide Reliability and Power Optimization n NIST Certified Security n SmartMesh Networks Deliver: n >99.999% Network Reliability Achieved in the Most Challenging RF Environments n Sub 50µA Routing Nodes n Compliant to 6LoWPAN Internet Protocol (IP) and IEEE 802.15.4e Standards SmartMesh IP™ wireless sensor networks are self managing, low power Internet Protocol (IP) networks built from wireless nodes called motes. The LTP™5901-IPM/ LTP5902-IPM is the IP mote product in the Eterna®* family of IEEE 802.15.4e printed circuit board assembly solutions, featuring a highly-integrated, low power radio design by Dust Networks® as well as an ARM Cortex-M3 32-bit microprocessor running Dust’s embedded SmartMesh IP networking software. Both the LTP5901-IPM (with chip antenna), at 24mm × 42mm, and the LTP5902-IPM (with MMCX connector), at 24mm × 37mm, are designed for surface mount assembly. n LTP5901-IPM/LTP5902-IPM Features Industry-Leading Low Power Radio Technology with 4.5mA to Receive and 9.7mA to Transmit at 8dBm n RF Modular Certification Include USA, Canada, EU, Japan, Taiwan, Korea, India, Australia and New Zealand n PCB Assembly with Chip Antenna (LTP5901-IPM) or with MMCX Antenna Connector (LTP5902-IPM). QFN Version (LTC®5800-IPM) Available n Micrium µCOS-II Real Time Operating System Based On-Chip Software Development Kit n With Dust’s time-synchronized SmartMesh IP networks, all motes in the network may route, source or terminate data, while providing many years of battery powered operation. The SmartMesh IP software provided with the LTP5901-IPM/LTP5902-IPM is fully tested and validated, and is readily configured via a software Application Programming Interface. SmartMesh IP motes deliver a highly flexible network with proven reliability and low power performance in an easy-to-integrate platform. L, LT, LTC, LTM, Linear Technology, the Linear logo, Dust, Dust Networks, SmartMesh and Eterna are registered trademarks and LTP, the Dust Networks logo and SmartMesh IP are trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. Protected by U.S. Patents, including 7375594, 7420980, 7529217, 7791419, 7881239, 7898322, 8222965. * Eterna is Dust Networks’ low power radio SoC architecture. Typical Application LTP5901-IPM LTP5901-IPR/ LTP5902-IPR ANTENNA IN+ LTC2379-18 SPI SENSOR µCONTROLLER UART UART IN– HOST APPLICATION 59012ipm TA01 59012ipmfa For more information www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM 1 LTP5901-IPM/LTP5902-IPM Table of Contents Network Features........................................... 1 LTP5901-IPM/LTP5902-IPM Features.................... 1 Typical Application ......................................... 1 Description.................................................. 1 Table of Contents ........................................... 2 SmartMesh Network Overview............................ 3 Absolute Maximum Ratings............................... 4 Pin Configuration........................................... 4 Order Information........................................... 5 Recommended Operating Conditions.................... 5 DC Characteristics.......................................... 5 Radio Specifications....................................... 6 Radio Receiver Characteristics........................... 6 Radio Transmitter Characteristics........................ 7 Digital I/O Characteristics................................. 7 Temperature Sensor Characteristics..................... 8 Analog Input Chain Characteristics...................... 8 System Characteristics.................................... 8 UART AC Characteristics................................... 9 TIMEn AC Characteristics................................. 10 Radio_Inhibit AC Characteristics........................ 10 Flash AC Characteristics.................................. 11 Flash SPI Slave AC Characteristics..................... 11 SPI Master AC Characteristics........................... 12 I2C AC Characteristics..................................... 13 1-Wire Master.............................................. 13 Flash SPI Slave AC Characteristics..................... 14 Typical Performance Characteristics................... 15 Pin Functions............................................... 20 Operation................................................... 24 Power Supply........................................................... 24 Supply Monitoring and Reset..................................25 Precision Timing......................................................25 Application Time Synchronization...........................25 Time References......................................................25 Radio.......................................................................26 UARTs......................................................................26 Autonomous MAC.................................................... 27 Security................................................................... 27 Temperature Sensor................................................ 27 RADIO INHIBIT........................................................ 27 Software Installation................................................ 27 Flash Data Retention................................................ 28 State Diagram.......................................................... 28 I2C Master...............................................................30 SPI Master...............................................................30 1-Wire Master..........................................................30 Applications Information................................. 31 Modes of Operation................................................. 31 Regulatory and Standards Compliance.................... 31 Soldering Information.............................................. 32 Related Documentation................................... 32 Package Description...................................... 33 Revision History........................................... 35 Typical Application........................................ 36 Related Parts............................................... 36 59012ipmfa 2 For more information www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM LTP5901-IPM/LTP5902-IPM SmartMesh Network Overview A SmartMesh network consists of a self-forming multi-hop mesh of nodes, known as motes, which collect and relay data, and a network manager that monitors and manages network performance and security, and exchanges data with a host application. SmartMesh networks communicate using a time slotted channel hopping  (TSCH) link layer, pioneered by Dust Networks. In a TSCH network, all motes in the network are synchronized to within less than a millisecond. Time in the network is organized into time slots, which enables collision-free packet exchange and per-transmission channel-hopping. In a SmartMesh network, every device has one or more parents (e.g. mote 3 has motes 1 and 2 as parents) that provide redundant paths to overcome communications interruption due to interference, physical obstruction or multi-path fading. If a packet transmission fails on one path, the next retransmission may try on a different path and different RF channel. A network begins to form when the network manager instructs its on-board Access Point (AP) radio to begin sending advertisements—packets that contain information that enables a device to synchronize to the network and request to join. This message exchange is part of the security handshake that establishes encrypted communications between the manager or application, and mote. Once motes have joined the network, they maintain synchronization through time corrections when a packet is acknowledged. The Network Manager uses health reports to continually optimize the network to maintain >99.999% data reliability even in the most challenging RF environments. The use of TSCH allows SmartMesh devices to sleep in between scheduled communications and draw very little power in this state. Motes are only active in time slots where they are scheduled to transmit or receive, typically resulting in a duty cycle of < 1%. The optimization software in the Network Manager coordinates this schedule automatically. When combined with the Eterna low power radio, every mote in a SmartMesh network—even busy routing ones—can run on batteries for years. By default, all motes in a network are capable of routing traffic from other motes, which simplifies installation by avoiding the complexity of having distinct routers vs non-routing end nodes. Motes may be configured as non-routing to further reduce that particular mote’s power consumption and to support a wide variety of network topologies. ALL NODES ARE ROUTERS. THEY CAN TRANSMIT AND RECEIVE. THIS NEW NODE CAN JOIN ANYWHERE BECAUSE ALL NODES CAN ROUTE. HOST APPLICATION SNO 02 NETWORK MANAGER AP Mote 1 Mote 2 Mote 3 SNO 01 An ongoing discovery process ensures that the network continually discovers new paths as the RF conditions change. In addition, each mote in the network tracks performance statistics (e.g. quality of used paths, and lists of potential paths) and periodically sends that information to the network manager in packets called health reports. At the heart of SmartMesh motes and network managers is the Eterna IEEE 802.15.4e System-on-Chip (SoC), featuring Dust Networks’ highly integrated, low power radio design, plus an ARM Cortex-M3 32-bit microprocessor running SmartMesh networking software. The SmartMesh networking software comes fully compiled yet is configurable via a rich set of Application Programming Interfaces (APIs) which allows a host application to interact with the network, e.g. to transfer information to a device, to configure data publishing rates on one or more motes, or to monitor network state or performance metrics. Data publishing can be uniform or different for each device, with motes being able to publish infrequently or faster than once per second as needed. 59012ipmfa For more information www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM 3 LTP5901-IPM/LTP5902-IPM Absolute Maximum Ratings Pin Configuration (Note 1) Pin functions shown in italics are currently not supported in software. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 UARTC0_TX 31 UARTC0_RX 32 IPCS_MISO / GPIO6 33 CAUTION: This part is sensitive to electrostatic discharge (ESD). It is very important that proper ESD precautions be observed when handling the LTP5901-IPM/LTP5902-IPM. GND RESERVED NC GPIO17 GPIO18 GPIO19 AI_2 AI_1 AI_3 AI_0 GND RESERVED NC NC RESETn TDI TDO TMS TCK GND DP4 (GPIO23) RESERVED RESERVED RESERVED DP3 (GPIO22) / TIMER8_IN DP2 (GPIO21) / LPTIMER_IN SLEEPn / GPIO14 DP0 (GPIO0) / SPIM_SS_2n NC GND GND NC RADIO_INHIBIT / GPIO15 TIMEn / GPIO1 UART_TX UART_TX_CTSn UART_TX_RTSn UART_RX UART_RX_CTSn UART_RX_RTSn GND VSUPPLY RESERVED NC NC FLASH_P_ENn / GPIO2 SPIS_SSn / SDA SPIS_SCK / SCL SPIS_MOSI / GPIO26 / UARTC1_RX SPIS_MISO / 1_WIRE / UARTC1_TX PWM0 / GPIO16 DP1 (GPIO20) / TIMER16_IN SPIM_SS_0n / GPIO12 SPIM_SS_1n / GPIO13 GND SPIM_SCK / GPIO9 SPIM_MOSI / GPIO10 IPCS_SSn / GPIO3 SPIM_MISO / GPIO11 GND GND 34 IPCS_MOSI / GPIO5 35 IPCS_SCK / GPIO4 36 Supply Voltage on VSUPPLY...................................4.20V Input Voltage on AI_0/1/2/3 Inputs.........................1.98V Voltage on Any Digital I/O pin..................................... –0.3V to VSUPPLY + 0.3V Input RF Level..................................................... +10dBm Storage Temperature Range (Note 3)...... –55°C to 105°C Operating Temperature Range LTP5901I/LPT5902I..............................–40°C to 85°C PC PACKAGE 66-LEAD PCB 59012ipmfa 4 For more information www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM LTP5901-IPM/LTP5902-IPM Order Information LEAD FREE FINISH† PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LTP5901IPC-IPMA#PBF LTP5901IPC-IPMA#PBF 66-Lead (42mm × 24mm × 5.5mm) PCB with Chip Antenna –40°C to 85°C LTP5902IPC-IPMA#PBF LTP5902IPC-IPMA#PBF 66-Lead (37.5mm × 24mm × 5.5mm) PCB with MMCX Connector –40°C to 85°C †This product ships with the flash erased at the time of order. OEMs will need to program devices during development and manufacturing. For legacy part numbers and ordering information go to: http://www.linear.com/product/LTP5901-IPM#orderinfo or http://www.linear.com/product/LTP5902-IPM#orderinfo *The temperature grade is identified by a label on the shipping container. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ Recommended Operating Conditions The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP VSUPPLY Supply Voltage Including Noise and Load Regulation l Supply Noise 50Hz to 2MHz l 250 mV Operating Relative Humidity Non-Condensing l 10 90 % RH Temperature Ramp Rate While Operating in Network l –8 +8 °C/min 2.1 MAX UNITS 3.76 V DC Characteristics The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted. OPERATION/STATE CONDITIONS Power-on Reset During Power-On Reset, Maximum 750µs + VSUPPLY Rise Time from 1V to 1.9V MIN TYP 12 MAX UNITS mA Doze RAM on, ARM Cortex-M3, Flash, Radio, and Peripherals Off, All Data and State Retained, 32.768kHz Reference Active 1.2 µA Deep Sleep RAM on, ARM Cortex-M3, Flash, Radio, and Peripherals Off, All Data and State Retained, 32.768kHz Reference Inactive 0.8 µA In-Circuit Programming RESETn and FLASH_P_ENn Asserted, IPCS_SCK at 8MHz 20 mA Peak Operating Current +8dBm +0dBm System Operating at 14.7MHz, Radio Transmitting, During Flash Write. Maximum Duration 4.33 ms. 30 26 mA mA Active ARM Cortex M3, RAM and Flash Operating, Radio and All Other Peripherals Off. Clock Frequency of CPU and Peripherals Set to 7.3728MHz, VCORE = 1.2V 1.3 mA Flash Write Single Bank Flash Write 3.7 mA Flash Erase Single Bank Page or Mass Erase 2.5 mA Radio Tx +0dBm +8dBm Current with Autonomous MAC Managing Radio Operation, CPU Inactive. Clock Frequency of CPU and Peripherals Set to 7.3728MHz. 5.4 9.7 mA mA Radio Rx Current with Autonomous MAC Managing Radio Operation, CPU Inactive. Clock Frequency of CPU and Peripherals Set to 7.3728MHz. 4.5 mA 59012ipmfa For more information www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM 5 LTP5901-IPM/LTP5902-IPM Radio Specifications The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted. PARAMETER CONDITIONS MIN TYP 2.4000 MAX UNITS 2.4835 GHz Frequency Band l Number of Channels l 15 Channel Separation l 5 MHz l 2405 + 5•(k-11) MHz l 250 kbps Channel Center Frequency Where k = 11 to 25, as Defined by IEEE 802.15.4 Modulation IEEE 802.15.4 Direct Sequence Spread Spectrum (DSSS) Raw Data Rate Antenna Pin ESD Protection HBM per JEDEC JESD22-A114F (Note 2) Range (Note 4) Indoor Outdoor Free Space 25°C, 50% RH, +2dBi Omni-Directional Antenna, Antenna 2m Above Ground ±6000 V 100 300 1200 m m m Radio Receiver Characteristics The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted. PARAMETER CONDITIONS Receiver Sensitivity Packet Error Rate (PER) = 1% (Note 5) MIN –93 dBm Receiver Sensitivity PER = 50% –95 dBm Saturation Maximum Input Level the Receiver Will Properly Receive Packets 0 dBm Adjacent Channel Rejection (High Side) Desired Signal at –82dBm, Adjacent Modulated Channel 5MHz Above the Desired Signal, PER = 1% (Note 5) 22 dBc Adjacent Channel Rejection (Low Side) Desired Signal at –82dBm, Adjacent Modulated Channel 5MHz Below the Desired Signal, PER = 1% (Note 5) 19 dBc Alternate Channel Rejection (High Side) Desired Signal at –82dBm, Alternate Modulated Channel 10MHz Above the Desired Signal, PER = 1% (Note 5) 40 dBc Alternate Channel Rejection (Low Side) Desired Signal at –82dBm, Alternate Modulated Channel 10MHz Below the Desired Signal, PER = 1% (Note 5) 36 dBc Second Alternate Channel Rejection Desired Signal at –82dBm, Second Alternate Modulated Channel Either 15MHz Above or Below, PER = 1% (Note 5) 42 dBc Co-Channel Rejection Desired Signal at –82dBm, Undesired Signal is an 802.15.4 Modulated Signal at the Same Frequency, PER = 1% –6 dBc LO Feed Through –55 dBm Frequency Error Tolerance (Note 6) ±50 ppm Symbol Error Tolerance Received Signal Strength Indicator (RSSI) Input Range TYP MAX UNITS ±50 ppm –90 to –10 dBm RSSI Accuracy ±6 dB RSSI Resolution 1 dB 59012ipmfa 6 For more information www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM LTP5901-IPM/LTP5902-IPM Radio Transmitter Characteristics The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted. PARAMETER CONDITIONS Output Power High Calibrated Setting Low Calibrated Setting Delivered to a 50Ω load Spurious Emissions Conducted Measurement with a 50Ω Single-Ended Load, +8dBm Output Power. All Measurements Made with Max Hold. 30MHz to 1000MHz 1GHz to 12.75GHz 2.4GHz ISM Upper Band Edge (Peak) 2.4GHz ISM Upper Band Edge (Average) 2.4GHz ISM Lower Band Edge RBW = 120kHz, VBW = 100Hz RBW = 1MHz, VBW = 3MHz RBW = 1MHz, VBW = 3MHz RBW = 1MHz, VBW = 10Hz RBW = 100kHz, VBW = 100kHz Harmonic Emissions 2nd Harmonic 3rd Harmonic Conducted Measurement Delivered to a 50Ω Load, Resolution Bandwidth = 1MHz, Video Bandwidth = 1MHz MIN TYP MAX UNITS 8 0 dBm dBm 85°C can be approximated by calculating the dimensionless acceleration factor using the following equation. AF = e  Ea    1 1 −   •    k   TUSE +273 TSTRESS +273  State Diagram In order to provide capabilities and flexibility in addition to ultralow power, Eterna operates in various states, as shown in Figure 11. Eterna State Diagram and described in this section. State transitions shown in red are not recommended. Start-Up Start-up occurs as a result of either crossing the power-on reset threshold or asserting RESETn. After the completion of power-on reset or the falling edge of an internally synchronized RESETn, Eterna loads its fuse table which, as described in the previous section, includes setting I/O direction. In this state, Eterna checks the state of the FLASH_P_ENn and RESETn and enters the serial flash emulation mode if both signals are asserted. If the FLASH_P_ENn pin is not asserted but RESETn is asserted, Eterna automatically reduces its energy consumption to a minimum until RESETn is released. Once RESETn is de-asserted, Eterna goes through a boot sequence, and then enters the active state. Where: Serial Flash Emulation AF = acceleration factor When both RESETn and FLASH_P_ENn are asserted, Eterna disables normal operation and enters a mode to emulate the operation of a serial flash. In this mode, its flash can be programmed. Ea = activation energy = 0.6eV k = 8.625 • 10–5eV/°K TUSE = is the specified temperature retention in °C TSTRESS = actual storage temperature in °C Example: Calculate the effect on retention when storing at a temperature of 105°C. TSTRESS = 105°C TUSE = 85°C AF = 2.8 So the overall retention of the flash would be degraded by a factor of 2.8, reducing data retention from 20 years at 85°C to 7.1 years at 105°C. Operation Once Eterna has completed start-up, Eterna transitions to the operational group of states (active/CPU active, active/ CPU inactive, and Doze). There, Eterna cycles between the various states, automatically selecting the lowest possible power state while fulfilling the demands of network operation. Active State In the active state, Eterna’s relaxation oscillator is running and peripherals are enabled as needed. The ARM Cortex-M3 59012ipmfa 28 For more information www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM LTP5901-IPM/LTP5902-IPM Operation cycles between CPU-active and CPU-inactive (referred to in the ARM Cortex-M3 literature as sleep now mode). Eterna’s extensive use of DMA and intelligent peripherals that independently move Eterna between active state and doze state minimizes the time the CPU is active, significantly reducing Eterna’s energy consumption. POWER-ON RESET Doze State The doze state consumes orders of magnitude less current than the active state and is entered when all of the peripherals and the CPU are inactive. In the doze state Eterna’s full state is retained, timing is maintained, and Eterna is configured to detect, wake, and rapidly respond to activity on I/Os (such as UART signals and the TIMEn pin). In the doze state the 32.768kHz oscillator and associated timers are active. VSUPPLY > PoR RESETn LOW AND FLASH_P_ENn LOW LOAD FUSE SETTINGS RESETn LOW AND FLASH_P_ENn HIGH SET RESETn HIGH AND FLASH_P_ENn HIGH FOR 125µs, THEN SET RESETn LOW SERIAL FLASH EMULATION RESETn HIGH AND FLASH_P_ENn HIGH RESET DEASSERT RESETn BOOT START-UP ASSERT RESETn DOZE ASSERT RESETn CPU AND PERIPHERALS INACTIVE HW OR PMU EVENT OPERATION ASSERT RESETn CPU ACTIVE ACTIVE CPU INACTIVE DEEP SLEEP LOW POWER SLEEP COMMAND INACTIVE 59012ipm F15 Figure 15. Eterna State Diagram 59012ipmfa For more information www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM 29 LTP5901-IPM/LTP5902-IPM Operation I2C Master The I2C Master enables control of I2C slave devices, including support for clock stretching slaves. I2C Multimaster and bus arbitration protocols are not supported. For implementation details refer to the On-Chip Software Development Kit (On-Chip SDK). SPI Master The Eterna SPI master controller supports all configurations of clock polarity and phase, supporting shift clock frequencies of 460.8kHz, 921.6kHz, 1.8432MHz, or 3.6864MHz. In addition the SPI master controller can be configured to repetitively issue commands and capture the correspond- ing output, enabling repetitive sampling of signals from a SPI ADC or SPI sensor based upon a clock reference of better than ±50ppm. For implementation details refer to the On-Chip Software Development Kit (On-Chip SDK). 1-Wire Master The Eterna 1-Wire Master controller supports the reset, presence detect, read and write 1-Wire protocol operations, incorporating an active pull-up. The active pull-up becomes active when the passive pull-up raises the voltage on the 1_WIRE pin nominally above 1.4V, driving the 1_WIRE signal as specified in Digital I/O Characteristics. For implementation details refer to the On-Chip Software Development Kit (On-Chip SDK). 59012ipmfa 30 For more information www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM LTP5901-IPM/LTP5902-IPM Applications Information Modes of Operation General Purpose Input-Output (GPIO) pins n Analog-to-Digital Converter (ADC) n Universal Asynchronous Receiver/Transmitter (UART) n Serial Peripheral Interface (SPI) Master n Inter-Integrated Circuit (I2C) Master n The SmartMesh IP Mote software can be operated in three distinct modes, namely, namely Slave, Master, and OnChip SDK. Mode selection should be considered during the architecture/design phase of the development process. Slave Mode In Slave mode, the Eterna is connected to an external microprocessor through the API UART and is solely used as a networking device. None of the built in I/Os are accessible in this mode. Refer to the SmartMesh IP User's Guide for more detailed information. Master Mode In Master mode, no external µProcessor is required and a limited set of functionality is made available with no programming required on the device. The following features are available n On-Chip Temperature Sensor n 4 Analog Inputs n 4 Digital Inputs n 3 Digital Outputs Refer to the SmartMesh IP User's Guide for more detailed information. On-Chip SDK (OCSDK) The SmartMesh IP On-Chip Software Development Kit (OnChip SDK) enables development of C-code applications for execution on the LTC5800-IPM, running Micrium’s µCOS-II real-time operating system. With the On-Chip SDK, users may quickly and easily develop application code without the need for an external microprocessor. Applications written within the On-Chip SDK may send and receive wireless messages through the mesh network; process data, such as statistical analysis; execute local decision-making and control; and manage the following peripherals: 1-Wire Master n Network connectivity and quality of service is handled by the SmartMesh IP protocol stack. The SmartMesh IP stack comes as a pre-compiled library and delivers >99.999% data reliability while providing ultra low power operation. Regulatory and Standards Compliance Radio Certification The LTP5901 and LTP5902 have been certified under a single modular certification, with the module name of ETERNA2. Following the regulatory requirements provided in the ETERNA2 User’s Guide enables customers to ship products in the supported geographies, by simply completing an unintentional radiator scan of the finished product(s). The ETERNA2 User’s Guide also provides the technical information needed to enable customers to further certify either the modules or products based upon the modules in geographies that have not or do not support modular certification. Compliance to Restriction of Hazardous Substances (RoHS) Restriction of Hazardous Substances 2 (RoHS 2) is a directive that places maximum concentration limits on the use of certain hazardous substances in electrical and electronic equipment. Linear Technology is committed to meeting the requirements of the European Community directive 2011/65/EU. 59012ipmfa For more information www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM 31 LTP5901-IPM/LTP5902-IPM Applications Information This product has been specifically designed to utilize RoHS-compliant materials and to eliminate or reduce the use of restricted materials to comply with 2011/65/EU. The RoHS-compliant design features include: RoHS-compliant solder for solder joints Note: Customers may elect to use certain types of leadfree solder alloys in accordance with the European Community directive 2011/65/EU. Depending on the type of solder paste chosen, a corresponding process change to optimize reflow temperatures may be required. n RoHS-compliant base metal alloys Soldering Information RoHS-compliant precious metal plating The LTP5901 and LTP5902 are suitable for both eutectic PbSn and RoHS-6 reflow. The maximum reflow soldering temperature is 260°C. A more detailed description of layout recommendations, assembly procedures and design considerations is included in the LTP5901 and LTP5902 Hardware Integration Guide. n n RoHS-compliant cable assemblies and connector choices n RoHS-compliant and 245°C reflow compatible n Related Documentation TITLE LOCATION DESCRIPTION SmartMesh IP Users Guide http://www.linear.com/docs/41880 Theory of operation for SmartMesh IP networks and motes SmartMesh IP Mote API Guide http://www.linear.com/docs/41886 Definitions of the applications interface commands available over the API UART SmartMesh IP Mote CLI Guide http://www.linear.com/docs/41885 Definitions of the command line interface commands available over the CLI UART LTP5901 and LTP5902 Hardware Integration Guide http://www.linear.com/docs/41877 Recommended practices for designing with the LTP5901 and LTP5902 ETERNA2 User’s Guide http://www.linear.com/docs/42916 The ETERNA2 module user’s guide includes certification requirements applicable to certified geographies and support documentation enabling customer certification in additional geographies for the LTP5901 and LTP5902 SmartMesh IP Tools Guide http://www.linear.com/docs/42453 The user’s guide for all IP related tools, and specifically the definition for the On-chip Application Protocol (OAP) 59012ipmfa 32 For more information www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM LTP5901-IPM/LTP5902-IPM Package Description Please refer to http://www.linear.com/product/LTP5901#packaging for the most recent package drawings. 1 2 4 3 5 PC Package 66-Lead PCB (24mm × 42mm) (Reference LTC DWG # 05-08-10002 Rev A) D .100 2.54 .039 1.00 .945 24.00 .039 1.00 1.57 40.00 .039 1.00 C 1.213 30.80 1.122 28.50 1.102 28.00 1.063 27.00 1.031 26.20 R.010 TYP 0.25 1.654 42.00 .039 TYP 1.00 B .079 2.00 4X .039 1.00 .035 0.90 0 0.00 .039 1.00 .87 22.00 .728 18.50 .630 16.00 .591 15.00 .551 14.00 .444 11.28 .394 10.00 .197 5.00 .236 6.00 .344 8.74 A 0 0.00 .157 4.00 .039 1.00 .08 2.00 .08 2.00 LTP5901 Mechanical Drawing 1 2 3 PROPRIETARY AND CONFIDENTIAL THE INFORMATION CONTAINED IN THIS DRAWING IS THE S PROPERTY OF LINEAR INCORPORATED. ANY REPRODUCT IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISS OF LINEAR INCORPORATED IS PROHIBITED. 4 5 59012ipmfa For more information www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM 33 LTP5901-IPM/LTP5902-IPM Package Description Please refer to http://www.linear.com/product/LTP5902#packaging for the most recent package drawings. 1 2 4 3 5 6 PC Package 66-Lead PCB (24mm × 37.5mm) (Reference LTC DWG # 05-08-10003 Rev A) D .100 2.54 .177 4.50 .039 1.00 .945 24.00 .039 1.00 .029 0.73 1.40 35.50 1.272 32.30 C .039 1.00 1.213 30.80 1.122 28.50 1.102 28.00 1.063 27.00 1.031 26.20 R.010 TYP 0.25 1.476 37.50 .039 TYP 1.00 B 4X .035 0.90 .079 2.00 .039 1.00 0 0.00 .866 22.00 .591 15.00 .630 16.00 .728 18.50 .551 14.00 .394 10.00 .444 11.28 .344 8.73 .197 5.00 .236 6.00 .157 4.00 A 0 0.00 .071 1.80 .039 1.00 .078 2.0 .039 1.00 .079 2.01 DRN BY: CHK: APPD: LTP5902 Mechanical Drawing 1 2 3 APPD: PROPRIETARY AND CONFIDENTIAL 4 THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF LINEAR TECHNOLOGY CORPORATION. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF LINEAR TECHNOLOGY CORPORATION IS PROHIBITED. 5 6 59012ipmfa 34 For more information www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM PROJ MGR PROD R ENG LTP5901-IPM/LTP5902-IPM Revision History REV DATE DESCRIPTION A 11/15 Updated ordering part number PAGE NUMBER Added On-Chip SDK section Added Software Installation section 5 23, 30, 31 27 59012ipmfa Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representationmore that theinformation interconnection of its circuits as described herein will infringe on existing patent rights. For www.linear.com/LTP5901-IPM or not www.linear.com/LTP5902-IPM 35 LTP5901-IPM/LTP5902-IPM Typical Application Mesh Network Thermistor TADIRAN TL-5903 Li-SOCI2 LTP5902-IPM ANTENNA VSUPPLY LT6654 VIN IPCS_MISO VOUT 0.1µF 0.1µF GND2 5k 0.1% AI_0 1000pF 59012ipm TA02 10k, 0.2C OMEGA 4406 5k 0.1% AI_1 GND GND1 1000pF 5k 0.1% RT = 5k • AI_0 / (2 • AI_1 – AI_0) T(°C) = 1 / {A + B [Ln(RT)] + C[Ln(RT)]3} – 273.15 A = 1.032 • 10–3 B = 2.387 • 10–4 C = 1.580 • 10–7 Related Parts PART NUMBER DESCRIPTION COMMENTS LTC5800-IPM IP Wireless Mote Ultralow Power Mote, 72-Lead 10mm × 10mm QFN LTP5901-IPR IP Wireless Mesh Manager PCB Module with Chip Includes Modular Radio Certification in the United States, Canada, Europe, Japan, Antenna South Korea, Taiwan, India, Australia and New Zealand LTP5902-IPR IP Wireless Mesh Manager PCB Module with MMCX Antenna Connector LT6654 Precision High Output Drive Low Noise Reference 1.6ppm Peak-to-Peak Noise (0.1Hz to 10Hz, Sink/Source ±10mA, 5ppm/°C Max Drift LTC2379-18 18-Bit,1.6Msps/1Msps/500ksps/250ksps Serial, Low Power ADC 2.5V Supply, Differential Input, 101.2dB SNR, ±5V Input Range, DGC LTC3388-1/ LTC3388-3 20V High Efficiency Nanopower Step-Down Regulator 860nA IQ in Sleep, 2.7V to 20V Input, VOUT = 1.2V to 5V, Enable and Standby Pins LTC3588-1 Piezoelectric Energy Generator with Integrated High Efficiency Buck Converter VIN = 2.7V to 20V, VOUT(MIN) = Fixed to 1.8V/2.5V/3.3V/3.6V, IQ = 0.95μA, 3mm × 3mm DFN-10 and MSOP-10E Packages LTC3108-1 Ultralow Voltage Step-Up Converter and Power Manager VIN = 0.02V to 1V, VOUT = 2.5V/3V/3.7V/4.5V Fixed, IQ = 6μA, 3mm × 4mm DFN-12 and SSOP-16 Packages LTC3459 Micropower Synchronous Boost Converter VIN = 1.5V to 5.5V, VOUT(MAX) = 10V, IQ = 10μA, 2mm × 2mm DFN, 2mm × 3mm DFN or SOT-23 Package Includes Modular Radio Certification in the United States, Canada, Europe, Japan, South Korea, Taiwan, India, Australia and New Zealand 59012ipmfa 36 Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 For more information www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com/LTP5901-IPM or www.linear.com/LTP5902-IPM LT 1115 REV A • PRINTED IN USA  LINEAR TECHNOLOGY CORPORATION 2014