LTST-G563EGBW

SMD LED Product Data Sheet LTST-G563EGBW Spec No. :DS22-2012-0212 Effective Date: 12/11/2018 Revision: C LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto SMD LED LTST-G563EGBW 1. Description SMD LEDs from Lite-On are available in miniature sizes and special configurations for automated PC board assembly and space-sensitive applications. These SMD LEDs are suitable for use in a wide variety of electronic equipment, including cordless and cellular phones, notebook computers, network systems, home appliances, and indoor signboard applications. 1.1 Features






1.2 Applications Meet ROHS Package in 12mm tape on 7" diameter reels EIA STD package I.C. compatible Compatible with automatic placement equipment Compatible with infrared reflow solder process Preconditioning: accelerate to JEDEC level 3



Telecommunication, Office automation, home appliances, industrial equipment Status indicator Signal and Symbol Luminary Front panel backlighting 2. Package Dimensions Part No. LTST-G563EGBW Lens Color White Diffused Source Color Pin Assignment AlInGaP Red 3, 4 InGaN Green 2, 5 InGaN Blue 1, 6 Notes: 1. 2. All dimensions are in millimeters. Tolerance is ±0.2 mm (.008") unless otherwise noted. 1/14 Part No. : LTST-G563EGBW BNS-OD-FC002/A4 SMD LED LTST-G563EGBW 3. Rating and Characteristics 3.1 Absolute Maximum Ratings at Ta=25°C LTST-G563EGBW Parameter Power Dissipation Unit Red Green Blue 130 114 114 mW 100 100 100 mA 50 30 30 mA Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) DC Forward Current Operating Temperature Range -40°C to + 85°C Storage Temperature Range -40°C to + 100°C 3.2 Suggest IR Reflow Condition for Pb Free Process: IR-Reflow Soldering Profile for lead free soldering (Acc. to J-STD-020B) 2/14 Part No. : LTST-G563EGBW BNS-OD-FC002/A4 SMD LED LTST-G563EGBW 3.3 Electrical / Optical Characteristics at Ta=25°C LTST-G563EGBW Parameter Luminous Intensity Symbol Iv Red Green Blue MIN. 560 1400 280 TYP. - - - MAX. 1120 2800 560 Viewing Angle 2θ1/2 TYP. Peak Emission Wavelength λP TYP. 630 518 468 MIN. 617 520 465 TYP. - - - MAX. 629 530 475 TYP. 25 35 20 MIN. 1.8 2.8 2.8 TYP. - - - MAX. 2.6 3.8 3.8 MAX. 10 10 10 Dominant Wavelength Spectral Line Half-Width Forward Voltage Reverse Current λd Δλ VF IR 120 Unit. Test Condition mcd IF=20mA Note 1 deg Note 2 (Fig.5) nm Measurement @ Peak (Fig.1) nm Note 3 nm - V IF=20mA Note 4 μA VR = 5V Note 5 Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Tolerance of Forward Voltage is +/- 0.1V. 5. Reverse voltage (VR) condition is applied to IR test only. The device is not designed for reverse operation. 3/14 Part No. : LTST-G563EGBW BNS-OD-FC002/A4 SMD LED LTST-G563EGBW 4. Bin Code List  Luminous Intensity Luminous Intensity Color : Red , Unit : mcd @ 20mA Bin Code Min. Max. U2 560.0 710.0 V1 710.0 900.0 V2 900.0 1120.0 Tolerance on each Intensity bin is +/-11% Luminous Intensity Color : Green , Unit : mcd @ 20mA Bin Code Min. Max. W2 1400.0 1800.0 X1 1800.0 2240.0 X2 2240.0 2800.0 Tolerance on each Intensity bin is +/-11% Luminous Intensity Color : Blue , Unit : mcd @ 20mA Bin Code Min. Max. T1 280.0 355.0 T2 355.0 450.0 U1 450.0 560.0 Tolerance on each Intensity bin is +/-11% 4/14 Part No. : LTST-G563EGBW BNS-OD-FC002/A4 SMD LED LTST-G563EGBW  Dominant Wavelength Dominant Wavelength Color : Green , Unit : nm @ 20mA Bin Code Min. Max. AP 520.0 525.0 AQ 525.0 530.0 Tolerance on each Dominant Wavelength bin is +/-1nm Dominant Wavelength Color : Blue , Unit : nm @ 20mA Bin Code Min. Max. AC 465.0 470.0 AD 470.0 475.0 Tolerance on each Dominant Wavelength bin is +/-1nm 5/14 Part No. : LTST-G563EGBW BNS-OD-FC002/A4 SMD LED LTST-G563EGBW  Bin Code on Tag Cross Table Luminous Intensity Red Bin Code On Tag Unit : mcd @ 20mA Code Green Range Code Blue Range Code Range T1 280-355 T2 355-450 A3 U1 450-560 A4 T1 280-355 T2 355-450 A6 U1 450-560 A7 T1 280-355 T2 355-450 A9 U1 450-560 B1 T1 280-355 T2 355-450 B3 U1 450-560 B4 T1 280-355 T2 355-450 B6 U1 450-560 B7 T1 280-355 T2 355-450 U1 450-560 A1 A2 A5 W2 U2 560-710 A8 X2 B2 B5 B8 X1 W2 V1 710-900 X1 X2 1400-1800 1800-2240 2240-2800 1400-1800 1800-2240 2240-2800 B9 Tolerance for each Intensity bin is +/- 11% 6/14 Part No. : LTST-G563EGBW BNS-OD-FC002/A4 SMD LED LTST-G563EGBW Luminous Intensity Red Bin Code On Tag Unit : mcd @ 20mA Code Green Range Code Blue Range Code Range T1 280-355 T2 355-450 C3 U1 450-560 C4 T1 280-355 T2 355-450 C6 U1 450-560 C7 T1 280-355 T2 355-450 U1 450-560 C1 C2 C5 W2 V2 900-1120 X1 C8 X2 1400-1800 1800-2240 2240-2800 C9 Tolerance for each Intensity bin is +/- 11% Dominant Wavelength Red Bin Code On Tag Unit : nm @ 20mA Code Green Range Blue Code Range AP 520-525 D1 D2 - Range AC 465-470 AD 470-475 AC 465-470 AD 470-475 617-629 D3 AQ D4 Code 525-530 Tolerance for each Dominate Wavelength bin is +/- 1nm 7/14 Part No. : LTST-G563EGBW BNS-OD-FC002/A4 SMD LED LTST-G563EGBW 5. Typical Electrical / Optical Characteristics Curves. (25°C Ambient Temperature Unless Otherwise Noted) 8/14 Part No. : LTST-G563EGBW BNS-OD-FC002/A4 SMD LED LTST-G563EGBW 6. User Guide 6.1 Cleaning Do not use unspecified chemical liquid to clean LED they could harm the package. If cleaning is necessary, immerse the LED in ethyl alcohol or isopropyl alcohol at normal temperature for less one minute. 6.2 Recommend Printed Circuit Board Attachment Pad 6.3 Package Dimensions of Tape and Reel Note: 1. All dimensions are in millimeters (inches). 9/14 Part No. : LTST-G563EGBW BNS-OD-FC002/A4 SMD LED LTST-G563EGBW 6.4 Package Dimensions of Reel Notes: 1. Empty component pockets sealed with top cover tape. 2. 7 inch reel 1000 pieces per reel. 3. Minimum packing quantity is 500 pieces for remainders. 4. The maximum number of consecutive missing lamps is two. 5. In accordance with EIA-481-1-B specifications. 10/14 Part No. : LTST-G563EGBW BNS-OD-FC002/A4 SMD LED LTST-G563EGBW 7. Cautions 7.1 Application The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 7.2 Storage The package is sealed: The LEDs should be stored at 30°C or less and 70%RH or less. And the LEDs are limited to use within one year, while the LEDs is packed in moisture-proof package with the desiccants inside. The package is opened: The storage ambient for the LEDs should not exceed 30°C temperature and 60% relative humidity. It is recommended that LEDs out of their original packaging are IR-reflowed within 168hrs. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient. LEDs stored out of their original packaging for more than 168hrs should be baked at about 60 °C for at least 48 hours before solder assembly. 7.3 Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary. 7.4 Soldering Recommended soldering conditions: Reflow soldering Pre-heat Pre-heat time Peak temperature Soldering time 150~200°C 120 sec. Max. 260°C Max. 10 sec. Max.(Max. two times) Soldering iron Temperature Soldering time 300°C Max. 3 sec. Max. (one time only) Notes: Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit boards, no single temperature profile works for all possible combinations. However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific characterization. LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly. The results of this testing are verified through post-reflow reliability testing.Profiles used at LITE-ON are based on JEDEC standards to ensure that all packages can be successfully and reliably surface mounted. Figure on page3 shows a sample temperature profile compliant to JEDEC standards. You can use this example as a generic target to set up your reflow process. You should adhere to the JEDEC profile limits as well as specifications and recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder joint. 11/14 Part No. : LTST-G563EGBW BNS-OD-FC002/A4 SMD LED LTST-G563EGBW 7.5 Drive Method A LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below. Circuit model A LED Circuit model B LED (A) Recommended circuit. (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs. 7.6 ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage:



Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs. All devices, equipment, and machinery must be properly grounded. Work tables, storage racks, etc. should be properly grounded. Use ion blower to neutralize the static charge which might have built up on surface of the LED’s plastic lens as a result of friction between LEDs during storage and handling. ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or “ no lightup ” at low currents. To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents. The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product. 12/14 Part No. : LTST-G563EGBW BNS-OD-FC002/A4 SMD LED LTST-G563EGBW 8. Reliability Test No. Test item 1 Resistance to soldering heat 2 Solderability Test condition Reference standard Tsld = 260°C, 10sec. 3 times JEITA ED-4701 300 301 Tsld=245± 5°C (Lead Free Solder, Coverage ≧ 95% of the JEITA ED-4701 300 303 dipped surface) 3 Thermal Shock 85 ± 5°C ~ -30°C ± 5°C 30min 30min 100cycles JEITA ED-4701 300 307 4 Temperature Cycle -55°C ~ 25°C ~ 100°C ~ 25°C 30min 5min 30min 5min 100cycles JEITA ED-4701 100 105 5 High Temperature Storage 100°C 1000hrs JEITA ED- 4701 200 201 6 Low Temperature Storage -55°C 1000hrs JEITA ED-4 701 200 202 7 Temperature Humidity Storage 60°C/90%RH 300hrs 8 Room temp life test 25°C, IF: Max current , 1000hrs JEIT A ED-4701 100 103 -- 9. Others The appearance and specifications of the product may be modified for improvement without prior notice. 13/14 Part No. : LTST-G563EGBW BNS-OD-FC002/A4 SMD LED LTST-G563EGBW 10. Suggested Checking List Training and Certification 1. Everyone working in a static-safe area is ESD-certified? 2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 1. Static-safe workstation or work-areas have ESD signs? 2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 3. All ionizer activated, positioned towards the units? 4. Each work surface mats grounding is good? Personnel Grounding 1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel strap or conductive shoes with conductive flooring? 2. If conductive footwear used, conductive flooring also present where operator stand or walk? 3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs? 5. All wrist strap or heel strap checkers calibration up to date? Note: *50V for InGaN LED. Device Handling 1. Every ESDS items identified by EIA-471 labels on item or packaging? 2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 4. All flexible conductive and dissipative package materials inspected before reuse or recycles? Others 1. Audit result reported to entity ESD control coordinator? 2. Corrective action from previous audits completed? 3. Are audit records complete and on file? 14/14 Part No. : LTST-G563EGBW BNS-OD-FC002/A4