SP1005-01WTG

SPA™ Silicon Protection Array Products 30pF Bi-Directional 0201 TVS Diode for ESD Protection HF RoHS Pb GREEN SP1005 Lead-Free/Green Series Description The SP1005 includes back-to-back Zener diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present. Pinout Features ±30kV contact, ±30kV air (@ VR=0V) 0.1μA at 5V footprint available (0201) 1 Note: Drawing not to scale. 2 (5/50ns) 10A (tP=8/20μs) Functional Block Diagram Applications devices 1 2 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 39 Revised: May 17, 2010 SP1005 Lead-Free/Green Series Lead-Free/Green SP1005 SPA™ Silicon Protection Array Products 30pF Bi-Directional 0201 TVS Diode for ESD Protection Absolute Maximum Ratings Symbol IPP TOP TSTOR Peak Current (tp=8/20μs) Operating Temperature Storage Temperature Parameter Value 10.0 -40 to 85 -65 to 150 Units A °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Rating -65 to 150 150 260 Units °C °C °C Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Voltage Drop Leakage Current Symbol V VD ILEAK IR=1mA VR=5V with 1 pin at GND IPP=1A, tp Clamp Voltage 1 Test Conditions Min Typ Max 6.0 Units V V μA V V V Ω kV kV 8.5 0.1 9.3 10.0 15.6 0.7 ±30 ±30 30 23 9.5 0.5 VC IPP=2A, tp IPP=10A, tP Dynamic Resistance ESD Withstand Voltage1 RDYN VESD (VC2 - VC1) / (IPP2 - IPP1) IEC61000-4-2 (Contact Discharge) IEC61000-4-2 (Air Discharge) Reverse Bias=0V Diode Capacitance1 NOTES: 1 CD Reverse Bias=2.5V Parameter is guaranteed by design and/or device characterization. SP1005 Lead-Free/Green Series 40 Revised: May 17, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 30pF Bi-Directional 0201 TVS Diode for ESD Protection Capacitance vs. Reverse Bias 40.0 35.0 30.0 Pulse Waveform 110% 100% 90% 80% Capacitance (pF) 25.0 20.0 15.0 70% 60% 50% 40% 10.0 5.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 30% 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Bias Voltage (V) Clamping Voltage vs. IPP 18.0 16.0 14.0 Insertion Loss (S21) I/O to GND 5 0 -5 Clamp Voltage (VC) 12.0 10.0 8.0 6.0 4.0 Attenuation (dB) -10 -15 -20 -25 -30 2.0 0.0 1.0 -35 2.0 3.0 4.0 5.0 6.0 7 .0 8.0 9.0 10.0 Peak Pulse Current-IPP (A) Frequency (MHz) ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 41 Revised: May 17, 2010 SP1005 Lead-Free/Green Series Lead-Free/Green SP1005 1 10 100 1000 10000 SPA™ Silicon Protection Array Products 30pF Bi-Directional 0201 TVS Diode for ESD Protection Application Example Keypads P1 P2 P3 P4 I/O Controller Outside World IC SP1005 (x4) GND Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) 150°C 200°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 250+0/-5 °C 20 – 40 seconds 6°C/second max Peak Temperature (TP) Time within 5°C of actual peak Temperature (tp) Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed 260°C SP1005 Lead-Free/Green Series 42 Revised: May 17, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 30pF Bi-Directional 0201 TVS Diode for ESD Protection Package Dimensions - 0201 Flipchip 0201 Flipchip A Symbol Min A B 0.595 0.295 0.245 0.145 0.245 0.245 0.005 Millimeters Typ 0.620 0.320 0.275 0.150 0.250 0.250 0.010 Max 0.645 0.345 0.305 0.155 0.255 0.255 0.015 Min 0.0234 0.0116 0.0096 0.0057 0.0096 0.0096 0.0002 Inches Typ 0.0244 0.0126 0.0108 0.0059 0.0098 0.0098 0.0004 Max 0.0254 0.0136 0.0120 0.0061 0.0100 0.0100 0.0006 B F C C D G E F G D E D Part Numbering System Product Characteristics Lead Plating G= Green T= Tape & Reel SP 1005 – 01 W T G Silicon Protection Array Series Sn Copper 6 um (max) Silicon Silicon Lead Material Lead Coplanarity Subsitute Material Number of Channels Package W: 0201 Flipchip Body Material Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. Part Marking System 3. Dimensions are exclusive of mold flash & metal burr. 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Ordering Information Part Number SP1005-01WTG Package Marking Min. Order Qty. 10000 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 43 Revised: May 17, 2010 SP1005 Lead-Free/Green Series Lead-Free/Green SP1005 SPA™ Silicon Protection Array Products 30pF Bi-Directional 0201 TVS Diode for ESD Protection Embossed Carrier Tape & Reel Specification – 0201 Flipchip P1 P2 P0 D E Symbol A0 B0 D D1 E Millimeters 0.41+/-0.03 0.70+/-0.03 ø 1.50 + 0.10 ø 0.20 +/- 0.05 1.75+/-0.10 3.50+/-0.05 0.38+/-0.03 2.00+/-0.05 2.00+/-0.05 4.00+/-0.10 8.00 + 0.30 -0.10 0.23+/-0.02 W F F K0 P0 P1 P2 W T D1 T A0 K0 Recommended Solder Pad Footprint 0.30 B0 0.28 0.75 0.19 *Sizes in mm SP1005 Lead-Free/Green Series 44 Revised: May 17, 2010 ©2010 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.