SP6002

TVS Diode Arrays (SPA™ Family of Products) ESD and EMI Filter Devices - SP6002 Series SP6002 Series 15pF 30kV EMI Filter Array Description RoHS Pb GREEN Features • EMI filtering of frequencies from 800MHz to 3GHz 1 4 GND 8 5 Pinout • ESD, IEC61000-4-2, ±30kV contact, ±30kV air • Small, low-profile UDFN package (TYP 0.5mm height) • Greater than -30dB attenuation (TYP) at 1GHz UDFN-08 Applications • Keypad interface for portable electronics 6 SP6002-04UTG-1 • Mobile phone • Smartphone • Portable navigation device 1 UDFN-12 12 GND 7 • LCD and camera display interfaces for handsets • Connector interfaces for portable electronics SP6002-06UTG-1 Application Example Silicon Protection Array Dx: SP6003-04 Input LCD Module Controller 4 5 GND Functional Block Diagram SP6002-04UTG-1 1 2 3 4 Cd Cd Outside World SP6002-06UTG-1 8 7 6 5 1 2 3 4 5 6 Cd Cd Cd Cd 1 8 D1 D2 D3 D4 12 11 10 SP6002-04UTG (µDFN) Cd Cd Cd Cd Cd Cd Cd Cd Signal Ground 9 Cd Cd Cd Cd 8 Cd Cd 7 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 141 Revision: June 27, 2011 SP6002 Series SP6002 The Littelfuse SP6002 SPA series integrates 4 and 6 EMI filters (C-R-C) into a small, low-profile UDFN package with each filter providing greater than -30dB attenuation at 1GHz. Additionally, each I/O is capable of shunting ±30kV ESD strikes (IEC61000-4-2, contact discharge) away from sensitive electronic components. The performance of this small, slim design makes it extremely suitable for mobile handsets, PDAs and notebook computers. TVS Diode Arrays (SPA™ Family of Products) ESD and EMI Filter Devices - SP6002 Series Absolute Maximum Ratings Symbol TOP TSTOR Parameter Operating Temperature Storage Temperature Value -40 to 85 -60 to 150 Units °C °C Thermal Information Parameter Storage Temperature R ange Maximum J unction Temperature Maximum L ead Temperature (Soldering 20-40s) Rating -65 to 150 150 260 Units °C °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Breakdown Voltage Reverse Leakage Current Resistance Diode Capacitance Line Capacitance 1,2 Symbol VRWM VBR ILEAK RA CD CL VESD F-3dB Test Conditions IR=1mA VRWM=5V IR=10mA VR=2.5V,f=1MHz VR=2.5V,f=1MHz IEC61000-4-2 (Contact Discharge) IEC61000-4-2 (Air Discharge) Above this frequency, appreciable attenutation occurs Min 7 .0 Typ 7 .8 0.1 Max 6.0 8.5 1.0 115 Units V V µA Ω pF 85 100 15 1,2 24 ±30 ±30 30 36 pF kV kV ESD Withstand Voltage1 Cutoff Frequency3 100 MHz Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 3 Total line capacitance is two times the diode capacitance (CD). 50Ω source and 50Ω load termination Insertion Loss (S21) CH1 S 21 log MAG 5 dB/ REF 0 dB 1 _:-613 dB Analog Crosstalk (S41) CH1 S log MAG 10 dB/ REF 0 dB Cor Smo 1 Cor Del Smo x2 Start 3.000 000MHz Stop 6 000.000.000MHz x2 START 3.000 000 MHz STOP 6 000.000 000 MHz SP6002 Series 142 Revision: June 27, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) ESD and EMI Filter Devices - SP6002 Series Line Capacitance vs. DC Bias 60 Soldering Parameters Reflow Condition 50 Pb – Free assembly 150°C 60 – 180 secs 3°C/second max 3°C/second max 217°C 60 – 150 seconds 260+0/-5 °C 20 – 40 seconds 6°C/second max 8 minutes Max. 260°C Capacitance (pF) - Temperature Min (Ts(min)) 40 30 - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 20 10 - Temperature (T L) (Liquidus) - Temperature (t L) 0 DC Bias (V) Peak Temperature (T P) Time within 5°C of actual peak Temperature (tp) Product Characteristics Lead Plating Lead Material Lead Coplanarity Subsitute Material Body Material Flammability Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Ramp-down Rate Time 25°C to peak Temperature (TP) Pre-Plated Frame Copper Alloy 0.0004 inches (0.102mm) Temperature Do not exceed TP Ramp-up Ramp-up tP Critical Zone Critical Zone TL to TP Silicon Molded Epoxy UL94-V-0 TL TS(max) Preheat Preheat tL Ramp-do Ramp-down TS(min) tS 25 time to peak temperature Time Part Numbering System Part Marking System SP 6002 – 0x U T G -1 Silicon Protection Array (SPA ) Family of TVS Diode Arrays Series TM G= Green T= Tape & Reel Package UDFN-08 (1.7x1.35mm) UDFN-12 (2.5x1.35mm) KH4 KH6 JHx Product Series K = SP6002 Assembly Site 4 = UDFN-08 6 = UDFN-12 Number of Channels 04 = 4 Channel UDFN-08 06 = 6 Channel UDFN-12 Ordering Information Part Number SP6002-04UTG-1 SP6002-06UTG-1 Package uDFN-08 uDFN-12 Size 1.7x1.35mm 2.5x1.35mm Marking KH4 KH6 Min. Order Qty. 3000 3000 SP6002 Series ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 143 Revision: June 27, 2011 SP6002 Pre Heat - Temperature Max (Ts(max)) 200°C TVS Diode Arrays (SPA™ Family of Products) ESD and EMI Filter Devices - SP6002 Series Package Dimensions — UDFN-08 UDFN-08 Min A A1 A3 E Package Dimensions — UDFN-12 UDFN-12 Millimeters Min Max 0.55 0.05 0.25 2.60 2.10 1.45 0.50 A A1 A3 b D D2 E E2 e K L 0.45 0.00 0.15 2.40 1.90 1.25 0.30 0.20 0.15 0.35 Inches Min 0.018 0.000 0.006 0.094 0.075 0.049 0.012 0.008 0.006 Max 0.022 0.002 0.010 0.102 0.083 0.057 0.020 0.000 0.014 Max 0.002 0.010 0.051 0.057 0.020 0.000 0.014 A A3 A1 Max 0.55 0.05 0.25 1.80 1.30 1.45 0.50 Min 0.018 0.000 0.006 0.063 0.043 0.049 0.012 0.008 0.00 0.15 1.60 1.10 1.25 0.30 0.20 0.15 b D D2 E2 E E2 e K L K 0.400 BSC 0.35 0.016 BSC 0.006 K D2 E2 0.071 D2 E 0.127 REF 0.005 REF A3 D 0.45 0.022 D A1 A Millimeters Inches 0.127 REF 0.005 REF 0.400 BSC 0.016 BSC e e b Embossed Carrier Tape & Reel Specification – UDFN-08 P2 t E AO L b Embossed Carrier Tape & Reel Specification – UDFN-12 P2 oD / E L t A0 BO D W F KO F W P BO D1 oD / P Millimetres Min E F D1 D P 10P W P2 A0 B0 K0 t 1.65 3.45 0.55 3.90 7 .90 1.95 1.33 2.63 0.58 Max 1.85 3.55 0.65 4.10 8.30 2.05 1.53 2.83 0.78 Min 0.065 0.136 0.021 0.154 0.311 0.077 0.052 0.103 0.023 Inches Max 0.073 0.140 0.025 0.161 0.327 0.081 0.060 0.111 0.031 Millimetres Min E F D1 D P 10P W P2 A0 B0 K0 t 1.65 3.45 1.00 1.50 min 3.90 7 .70 1.95 1.55 1.90 0.95 4.10 8.30 2.05 1.75 2.1 1.15 40.0 +/- 0.20 Max 1.85 3.55 Min Inches Max 0.073 0.140 0.161 0.327 0.081 0.069 0.083 0.045 0.065 0.136 0.040 0.059 min 0.154 0.303 0.077 0.061 0.075 0.037 1.575 +/- 0.008 1.50 min 40.0 +/- 0.20 K0 0.059 min 1.575 +/- 0.008 0.30 max 0.012 max 0.22 max 0.009 max SP6002 Series 144 Revision: June 27, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.