LRB520S-30T1G

LESHAN RADIO COMPANY, LTD. SCHOTTKY BARRIER DIODE z Applications LRB520S-30T1G S-LRB520S-30T1G Low current rectification and high speed switching z Features Extremelysmall surface mounting type. (SC-79/SOD523) Extremely Fast Switching Speed Extremely Low Forward Voltage 0.6 V (max) @ IF = 200mA Low Reverse Current z Construction Silicon epitaxial planar 1 2 SOD523/SC-79 z We declare that the material of product compliance with RoHS requirements. 1 Cathode z S- Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable. 2 Anode DEVICE MARKING AND ORDERING INFORMATION Device Marking Shipping LRB520S-30T1G S-LRB520S-30T1G 5J 3000/Tape&Reel LRB520S-30T3G S-LRB520S-30T3G 5J 10000/Tape&Reel MAXIMUM RATINGS (TA = 25°C) Parameter DC reverse voltage Mean rectifying current Peak forward surge current Junction temperature Storage temperature Symbol VR IO IFSM Tj Tstg Limits 30 200 1 125 -40~+125 Unit V mA A °C °C PD 150 mW Total power dissipation@Ta=25 °C Derate above 25° C Thermal Resistance, Junction to Ambient Rja 1.2 mW/° C 833 ° C/W ELECTRICAL CHARACTERISTICS(TA = 25°C) Parameter Forward voltage Reverse current Symbol VF IR Min. - Typ - Max. 0.60 Unit V - - 1.0 µA Conditions I F=200mA VR=10V Rev.A 1/3 LESHAN RADIO COMPANY, LTD. LRB520S-30T1G,S-LRB520S-30T1G Electricalcharacteristiccurves(Ta=25OC) 1000 REVERSE CURRENT :IR(uA) FORWARD CURRENT:IF(A) 1 0.1 0.01 100 10 1 0.1 0.01 0.001 0 100 200 300 400 500 600 25℃ 125℃ 10 20 30 40 50 REVERSE VOLTAGE:VR(V) FORWARD VOLTAGE:VF(mV) -25℃ 100℃ 0 75℃ 150℃ Fig.1 FORWARD CHARACTERISTICS -25℃ 25℃ 75℃ 100℃ 125℃ 150℃ Fig.2 REVERSE CHARACTERISTICS TERMINAL CAPACITANCE : CT (pF) 35 30 25 20 15 10 5 0 0 10 20 30 40 REVERSE VOLTAGE:VR(V) Fig.3 VR-CT CHARACTERISTICS Rev.A 2/3 LESHAN RADIO COMPANY, LTD. LRB520S-30T1G,S-LRB520S-30T1G SC-79/SOD-523 −X− D −Y− E 2X b 0.08 1 DIM A b c D E HE L L2 2 X Y M NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. TOP VIEW MILLIMETERS MIN NOM MAX 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 1.10 1.20 1.30 0.70 0.80 0.90 1.50 1.60 1.70 0.30 REF 0.15 0.20 0.25 A c HE SIDE VIEW RECOMMENDED SOLDERING FOOTPRINT* 2X 0.48 PACKAGE OUTLINE 1.80 2X 0.40 DIMENSION: MILLIMETERS Rev.A 3/3