MT3030-WT-A

3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MT3030-WT-A 3.0mm ROUND LED LAMP ATTENTION OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES 3.0mm ROUND LED LAMP MT3030-WT-A Description This white lamp is made with InGaN/Sapphire chip and water clear 3.85 epoxy resin. 24.0 MIN. 1.5 TYP. 0.5 MAX. 5.3 1.0 3.0 2.54±0.1 A K Notes: 1. All dimensions are in mm. 2. Tolerance is ± 0.25mm unless otherwise noted. Description Part No. MT3030-WT-A LED Chip Material InGaN/Sapphire Emitting Color White VER.: 01 Lens Color Water clear Date: 2011/09/24 Page: 1/6 3.0mm ROUND LED LAMP MT3030-WT-A Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation PD 114 mW Reverse Voltage VR 5 V D.C. Forward Current If 30 mA Reverse (Leakage) Current Ir 50 μA If(Peak) 100 mA Operating Temperature Range Topr -25 to +85 ℃ Storage Temperature Range Tstg -40 to +100 ℃ Soldering Temperature(1.6mm from body) Tsol Electrostatic discharge ESD Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Dip Soldering : 260℃ for 5 sec. Hand Soldering : 350℃ for 3 sec. 6000 V Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. 4180 8500 Luminous Intensity IV = If 20mA Forward Voltage Vf If=20mA 3.2 CIE Chromaticity Coordinates:X Axis X = If 20mA 0.30 CIE Chromaticity Coordinates:Y Axis Y = If 20mA 0.30 Reverse (Leakage) Current Ir Viewing Angle 2θ1/2 Vr=5V = If 20mA Max. Unit mcd 3.8 V 50 µA 30 deg Notes:1. The datas tested by IS tester. 2. Customer’s special requirements are also welcome. VER.: 01 Date: 2011/09/24 Page: 2/6 3.0mm ROUND LED LAMP MT3030-WT-A Chromaticity Coordinates Specifications for Bin Grading: COLOR RANKS(IF=20Ma.Ta=25℃) BiN We Wf Wg Wh RANK BiN RANK X 0.27 0.28 0.291 0.281 Y 0.265 0.282 0.273 0.256 X 0.281 0.291 0.302 0.292 Y 0.256 0.273 0.265 0.248 X 0.28 0.288 0.299 0.291 Y 0.282 0.294 0.286 0.273 X 0.291 0.299 0.31 0.302 Y 0.273 0.286 0.277 0.265 Wj Wk Wm Wn X 0.296 0.304 0.315 0.307 Y 0.307 0.319 0.311 0.298 X 0.307 0.315 0.326 0.318 Y 0.298 0.311 0.303 0.29 X 0.304 0.312 0.323 0.315 Y 0.319 0.331 0.323 0.311 X 0.315 0.323 0.334 0.326 Y 0.311 0.323 0.315 0.303 W2 W3 Notes:X.Y Tolerance each Bin limit is± 0.01. Chromaticity Coordinates & Bin grading diagram: VER.: 01 Date: 2011/09/24 Page: 3/6 MT3030-WT-A 3.0mm ROUND LED LAMP Specifications for Bin Grading: Iv(mcd) Bin Min Max X0 4180 5860 Y0 5860 8200 Z0 8200 12000 Specifications for Vf Group: Vf(V) Bin Min Max 28 3.0 3.2 29 3.2 3.4 2a 3.4 3.6 2b 3.6 3.8 VER.: 01 Date: 2011/09/24 Page: 4/6 3.0mm ROUND LED LAMP MT3030-WT-A Relative Response Typical Electrical / Optical Characteristics Curves : Wavelength(nm) WHITE LED SPECTRUM VS. WAVELENGTH 10000 Relative Luminous Intensity Forward Current IF(mA) 50 40 30 20 10 2.0 2.6 3.0 3.4 3.8 8000 6000 4000 2000 4.2 0.0 Applied Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGE 30.0 FORWARD CURRENT VS. LUMINOUS INTENSITY 0° 50 Forward Current IF(mA) 20.0 10.0 Forward Current (mA) 20° 10° 30° 40 40° 30 1.0 20 60° 0.8 10 0 50° 0.9 20 40 60 Temperature (℃) 80 100 70° 80° 90° 0.7 0.5 FORWARD CURRENT VS. AMBIENT TEMPERATURE 0.3 0.1 0.2 0.4 0.6 RADIATION DIAGRAM VER.: 01 Date: 2011/09/24 Page: 5/6 3.0mm ROUND LED LAMP MT3030-WT-A Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at h igh temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip soldering : Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds. Solder bath: 260±5℃ (Solder temperature), Within 5 seconds. (3) H and soldering: 350℃ max. (Temperature of soldering iron tip), Within 3 seconds. 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same. 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make s ure not to apply external force, stress, and excessive vibration to the LED and follow the con ditions below. Ba king temperature: 120℃ max. Bak ing time: Within 60 seconds. If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2011/09/24 Page: 6/6