MTSM6350-URUG-A

3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MTSM6350-URUG-A 3.2 x 2.8mm SMD TYPE MTSM6350-URUG-A 3.2 x 2.8mm SMD TYPE Package Dimensions 1.9 0.8 1 2.8 2.2 4 1 4 R 2.4 2 G 3.6 3.2 0.9 0.6 0.14 0.8 2 3 3 Notes: 1. All dimensions are in mm. 2. Tolerance is ±0.25mm unless otherwise noted. Description LED Chip Part No. Material AlGaInP/GaAs AlGaInP/GaAs Emitting Color Hyper Red Yellow Green Lens Color MTSM6350-URUG-A Water Clear VER.: 01 Date: 2009/04/21 Page: 1/7 MTSM6350-URUG-A Absolute Maximum Ratings at Ta=25℃ Parameter Power Dissipation Reverse Voltage D.C. Forward Current Peak Current(1/10Duty Cycle Pulse Width.) Operating Temperature Range Storage Temperature Range Soldering Temperature 3.2 x 2.8mm SMD TYPE Symbol Pd Vr If If(Peak) Topr. Tstg. Tsld. Rating 72 5 30 100 -40 to +100 -40 to +100 Unit mW V mA mA ℃ ℃ Reflow Soldering: 260℃ for 10 sec. Hand Soldering: 350℃ for 3 sec. Electrical and Optical Characteristics: Hyper Red Parameter Luminous Intensity Forward Voltage Peak Wavelength Dominant Wavelength Reverse Current Viewing Angle Spectrum Line Halfwidth Symbol IV Vf λp λd Ir 2θ1/2 Condition If=20mA If=20mA If=20mA If=20mA Vr=5V If=20mA If=20mA Min. 165 Typ. 200 1.9 632 625 Max. Unit mcd 2.4 V nm nm 100 120 20 µA deg nm ∆λ Notes: 1.The datas tested by IS tester. 2. Customer’s special requirements are also welcome. VER.: 01 Date: 2009/04/21 Page: 2/7 MTSM6350-URUG-A Absolute Maximum Ratings at Ta=25℃ Parameter Power Dissipation Reverse Voltage D.C. Forward Current Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Operating Temperature Range Storage Temperature Range Soldering Temperature 3.2 x 2.8mm SMD TYPE Symbol PD VR If If(Peak) Topr. Tstg. Tsld. Rating 72 5 30 100 -40 to +100 -40 to +100 Unit mW V mA mA ℃ ℃ Reflow Soldering: 260℃ for 10 sec. Hand Soldering: 350℃ for 3 sec. Electrical and Optical Characteristics: Yellow Green Parameter Luminous Intensity Forward Voltage Peak Wavelength Dominant Wavelength Reverse Current Viewing Angle Spectrum Line Halfwidth Symbol IV Vf λp λd Ir 2θ1/2 Condition If=20mA If=20mA If=20mA If=20mA Vr=5V If=20mA If=20mA Min. 36.7 Typ. 75 1.9 573 570 Max. Unit mcd 2.4 V nm nm 100 120 20 µA deg nm ∆λ Notes: 1.The datas tested by IS tester. 2. Customer’s special requirements are also welcome. VER.: 01 Date: 2009/04/21 Page: 3/7 MTSM6350-URUG-A Typical Electrical/Optical Characteristic Curves 3.2 x 2.8mm SMD TYPE (25℃ Ambient Temperature Unless Otherwise Noted) 50 Forward Current IF(mA) 40 30 20 10 Relative Luminous Intensity(mcd) R&G 250 200 150 R G 100 50 0 1.6 1.8 2.0 2.2 2.4 2.6 0.0 10.0 2 0.0 30.0 Applied Voltage (V) Forw ard C urrent (m A ) Forward Current VS. Applied Voltage Forward Current VS. Luminous Intensity 0° 10° 20° 30° 50 40 30 Forward Current IF(mA) 40° 1.0 50° 60° 70° 80° 90° 0.5 0.3 0.1 0.2 0.4 0.6 20 10 0.9 0.8 0 20 40 60 80 100 120 0.7 Ambient Temperature Ta (℃) Ambient Temperature VS. Forward Current Radiation Diagram VER.: 01 Date: 2009/04/21 Page: 4/7 MTSM6350-URUG-A PRECAUTION IN USE Storage 3.2 x 2.8mm SMD TYPE Recommended storage environment o C ~ 30oC (41oF ~ 86oF) Temperature: 5 Humidity: 60% RH Max. Use within 7 days after opening of sealed vapor/ESD barrier bags. If the mois ture absorbent mater ial (s ilica ge l) has faded a way or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. Fold the opened bag firmly and keep in dry environment. Soldering Reflow So ldering Lead Solder Lead – free Solder 120~150℃ 180~200 ℃ Pre-heat Pre-heat time 120sec. Max. 120sec. Max. 240℃ Max. 260℃ Max . Peak temperature Soldering time 10sec. Max. 10sec. Max. Condition refer to refer to T emperatureTemperatureprofile 1 profile 2 *After reflow soldering rapid cooling should be avoided. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. ＜1 : Lead Solder＞ 2.5~5°C/sec. Pre-heating 120~150°C 120sec. M ax. 2.5~5°C/sec. 240°CM ax. 10sec. M ax. Hand Soldering Temperature Soldering time 350℃ Max . 3sec. Max. (one time only) ＜2 : Lead-free Solder＞ 1~5°C/sec. Pre-heating 180~200°C 120sec. Max. 1~5°C/sec. 260°C Max. 10sec. Max. 60sec. Max. 60sec. M ax. [ Recommended soldering pad design ] Use the following conditions shown in the figure. 2.2 1.4 1.8 1.4 0.8 (UNIT:mm) VER.: 01 Date: 2009/04/21 Page: 5/7 MTSM6350-URUG-A 3.2 x 2.8mm SMD TYPE Handling of Silicone Resin LEDs Handling Indications During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound Figure 1 In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. Figure 2 When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. VER.: 01 Date: 2009/04/21 Page: 6/7 MTSM6350-URUG-A Dimensions for Tape 3.2 x 2.8mm SMD TYPE 2.0 1.5 1.75 4.0 2.24 5.5 4.0 4.0 0.25±0.05 Dimensions for Reel 178.0± 1 60.0±0.5 57 12 0.4 0.2 0.6 0.6 0.2 13.2±0.5 16.2±0.5 Notes: 1.All dimensions are in mm, tolerance is±2.0mm unless otherwise noted. 2.Specifications are subject to change without notice. VER.: 01 Date: 0.4 0.8 2009/04/21 Page: 7/7