79LV0832XPQI-20

79LV0832 8 Megabit (256K x 32-Bit) Low Voltage EEPROM MCM Memory FEATURES: • 256k x 32-bit EEPROM MCM • RAD-PAK® radiation-hardened against natural space radiation • Total dose hardness: - >100 krad (Si) - Dependent upon orbit • Excellent Single event effects - SELTH > 84.7 MeV/mg/cm2 - SEU > 26.6 MeV/mg/cm2 read mode - SEU = 11.4 MeV/mg/cm2 write mode • High endurance - 10,000 cycles/dword, 10 year data retention • Page Write Mode: 2 X 128 dword page • High Speed: - 200 and 250 ns maximum access times • Automatic programming - 15 ms automatic Page/dword write DESCRIPTION: Maxwell Technologies’ 79LV0832 multi-chip module (MCM) memory features a greater than 100 krad (Si) total dose tolerance, dependent upon orbit. Using Maxwell Technologies’ patented radiation-hardened RAD-PAK® MCM packaging technology, the 79LV0832 is the first radiation-hardened 8 megabit MCM EEPROM for space application. The 79LV0832 uses eight 1 Megabit high speed CMOS die to yield an 8 megabit product. The 79LV0832 is capable of in-system electrical dword and page programmability. It has a 128 x 32 byte page programming function to make its erase and write operations faster. It also features Data Polling and a Ready/Busy signal to indicate the completion of erase and programming operations. In the 79LV0832, hardware data protection is provided with the RES pin. Software data protection is implemented using the JEDEC standard algorithm. Maxwell Technologies' patented RAD-PAK® packaging technology incorporates radiation shielding in the microcircuit package. It eliminates the need for box shielding while providing the required radiation shielding for a lifetime in orbit or space mission. In a GEO orbit, RAD-PAK®‘ provides greater than 100 krad (Si) radiation dose tolerance. This product is available with screening up to MAxwell Technologies self-defined Class K. 01.10.05 Rev 8 All data sheets are subject to change without notice 1 (858) 503-3300 - Fax: (858) 503-3301 - www.maxwell.com ©2005 Maxwell Technologies All rights reserved. Low Voltage 8 Megabit (256K x 32-Bit) EEPROM MCM 79LV0832 Memory TABLE 1. 79LV0832 PINOUT DESCRIPTION PIN 84-77, 29-37 48-55, 66-73, 96, 1-7, 18-25 61 41, 43 45 10, 17, 28, 40, 44, 58, 65, 76, 87, 93 8, 9, 11-16, 26, 27, 38, 42, 46, 56, 57, 59, 60, 62-64, 74, 75, 85, 86, 88-92, 94, 95 39 47 SYMBOL ADDR0 to ADDR16 I/O0 to I/O31 OE CE0-1 WE 3.3V GND DESCRIPTION Address Input Data Input/Output Output Enable Chip Enable 0 through 1 Write Enable Power Supply Ground RDY/BUSY RES Ready/Busy Reset 01.10.05 Rev 8 All data sheets are subject to change without notice 2 ©2005 Maxwell Technologies All rights reserved Low Voltage 8 Megabit (256K x 32-Bit) EEPROM MCM 79LV0832 TYP MAX 7.0 7.0 45 38 3 ° C/W TABLE 2. 79LV0832 ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage Input Voltage Package Weight Thermal Impedance (RP and RT Packages; XP TBD) Operating Temperature Range Storage Temperature Range 1. VIN min = -3.0V for pulse width VOL VOH --VOL VOH Memory 01.10.05 Rev 8 All data sheets are subject to change without notice 8 ©2005 Maxwell Technologies All rights reserved Low Voltage 8 Megabit (256K x 32-Bit) EEPROM MCM FIGURE 1. READ TIMING WAVEFORM 79LV0832 High Memory FIGURE 2. DWORD WRITE TIMING WAVEFORM (1) (WE CONTROLLED) 01.10.05 Rev 8 All data sheets are subject to change without notice 9 ©2005 Maxwell Technologies All rights reserved Low Voltage 8 Megabit (256K x 32-Bit) EEPROM MCM 79LV0832 FIGURE 3. DWORD WRITE TIMING WAVEFORM (2) (CE CONTROLLED) Memory FIGURE 4. PAGE WRITE TIMING WAVEFORM (1) (WE CONTROLLED) 01.10.05 Rev 8 All data sheets are subject to change without notice 10 ©2005 Maxwell Technologies All rights reserved Low Voltage 8 Megabit (256K x 32-Bit) EEPROM MCM 79LV0832 FIGURE 5. PAGE WRITE TIMING WAVEFORM (2) (CE CONTROLLED)1,2 Memory 1) A7-A16 ARE PAGE ADDRESSES AND MUST BE THE SAME WITHIN A PAGE WRITE OPERATION 2) REFER TO TABLE 7 AND 8 FOR TIMING CHARACTERISTICS FIGURE 6. DATA POLLING TIMING WAVEFORM1 I/O7, 15, 23, 31 1) REFER TO TABLE 7 AND 8 FOR TIMING CHARACTORISTICS 01.10.05 Rev 8 All data sheets are subject to change without notice 11 ©2005 Maxwell Technologies All rights reserved Low Voltage 8 Megabit (256K x 32-Bit) EEPROM MCM 79LV0832 FIGURE 7. SOFTWARE DATA PROTECTION TIMING WAVEFORM (1) (IN PROTECTION MODE)1 1)REPEAT THE DATA PATTERN IN EACH OF THE FOUR BYTES. Memory FIGURE 8. SOFTWARE DATA PROTECTION WAVEFORM (2) (IN NON-PROTECTION MODE)1 1) REPEAT THE DATA PATTERN IN EACH OF THE FOUR BYTES. EEPROM APPLICATION NOTES This application note describes the programming procedures for the EEPROM modules and with details of various techniques to preserve data integrity. Automatic Page Write Page-mode write feature allows 1 to 128 dwords of data to be written into the EEPROM in a single write cycle. Loading the first dword of data, the data load window opens 30µ s for the second dword. In the same manner each additional dword of data can be loaded within 30µ s of the preceding falling edge of either WE or CE. When CE and WE are kept 01.10.05 Rev 8 All data sheets are subject to change without notice 12 ©2005 Maxwell Technologies All rights reserved Low Voltage 8 Megabit (256K x 32-Bit) EEPROM MCM 79LV0832 high for 100µ s after data input, the EEPROM enters the write mode automatically and the data input is written into the EEPROM. WE, CE Pin Operation During a write cycle, addresses are latched by the falling edge of WE or CE, and data is latched by the rising edge of WE or CE. Data Polling Data Polling function allows the status of the EEPROM to be determined. If EEPROM is set to read mode during a write cycle, an inversion of the last dword of data to be loaded outputs from I/O 7, 15, 23, 31 to indicate that the EEPROM is performing a write operation. RDY/Busy Signal RDY/Busy signal also allows a comparison operation to determine the status of the EEPROM. The RDY/Busy signal goes low (VOL) after the first write signal. At the end of the write cycle, the RDY/Busy returns to a high state ( VOH). RES Signal Memory When RES is LOW (VL), the EEPROM cannot be read or programmed. The EEPROM data must be protected by keeping RES low when VCC is power on and off. RES should be high (VH) during read and programming operations. Data Protection To protect the data during operation and power on/off, the EEPROM has the internal functions described below. 1. Data Protection at VCC on/off When VCC is turned on or off, noise on the control pins generated by external circuits, such as CPUs, may turn the EEPROM to programming mode by mistake. To prevent this unintentional programming, the EEPROM must be kept in an unprogrammable state during VCC on/off by using a CPU reset signal to RES pin. 01.10.05 Rev 8 All data sheets are subject to change without notice 13 ©2005 Maxwell Technologies All rights reserved Low Voltage 8 Megabit (256K x 32-Bit) EEPROM MCM 79LV0832 Data Protection To protect the data during operation and power on/off, the EEPROM has the internal functions described below. 1. Data Protection against Noise of Control Pins (CE, OE, WE) during Operation. During readout or standby, noise on the control pins may act as a trigger and turn the EEPROM to programming mode by mistake. To prevent this phenomenon, the EEPROM has a noise cancellation function that cuts noise if its width is 20ns or less in programming mode. Be careful not to allow noise of a width of more than 20ns on the control pins. Memory 2. RES Signal RES should be kept at VSS level when VCC is turned on or off. The EEPROM breaks off programming operation when RES become low, programming operation doesn’t finish correctly in case that RES falls low during programming operation. RES should be kept high for 10 ms after the last data is input 01.10.05 Rev 8 All data sheets are subject to change without notice 14 ©2005 Maxwell Technologies All rights reserved Low Voltage 8 Megabit (256K x 32-Bit) EEPROM MCM . 79LV0832 15mS 3. Software Data Protection Enable The 79LV0832 contains a software controlled write protection feature that allows the user to inhibit all write operations to the device. This is useful in protecting the device from unwanted write cycles due to uncontrollable circuit noise or inadvertent writes caused by minor bus contentions. Software data protection is enabled by writing the following data sequence to the EEPROM and allowing the write cycle period (tWC) of 10ms to elapse: . Memory Software Data Protection Enable Sequence Address 5555 AAAA or 2AAA 5555 Data AA AA AA AA 55 55 55 55 A0 A0 A0 A0 4. Writing to the Memory with Software Data Protection Enabled To write to the device once Software protection is enabled, the enable sequence must precede the data to be written. This sequence allows the write to occur while at the same time keeping the software protection enabled Sequence for Writing Data with Software Protection Enabled. Address 5555 AAAA or 2AAA 5555 Write Address(s) Data AA AA AA AA 55 55 55 55 A0 A0 A0 A0 Normal Data Input 01.10.05 Rev 8 All data sheets are subject to change without notice 15 ©2005 Maxwell Technologies All rights reserved Low Voltage 8 Megabit (256K x 32-Bit) EEPROM MCM 79LV0832 5. Disabling Software Protection Software data protection mode can be disabled by inputting the following data sequence. Once the software protection sequence has been written, no data can be written to the memory until the write cycle (TWC) has elapsed. Software Protection Disable Sequence Address 5555 AAAA or 2AAA 5555 5555 AAAA or 2AAA 5555 Data AA AA AA AA 55 55 55 55 80 80 80 80 AA AA AA AA 55 55 55 55 20 20 20 20 Memory Devices are shipped in the “unprotected” state, meaning that the contents of the memory can be changed as required by the user. After the software data protection is enabled, the device enters the Protect Mode where no further write commands have any effect on the memory contents. 01.10.05 Rev 8 All data sheets are subject to change without notice 16 ©2005 Maxwell Technologies All rights reserved Low Voltage 8 Megabit (256K x 32-Bit) EEPROM MCM 79LV0832 Memory 96-PIN RAD-PAK® QUAD FLAT PACKAGE SYMBOL MIN A b c D D1 e S1 L L1 L2 A1 N --2.485 --.152 .184 .010 --1.408 DIMENSION NOM .200 .012 .009 1.420 1.162 .050 .129 2.528 2.500 1.700 .165 96 .178 2.543 2.505 MAX .216 .013 .012 1.432 Note: All dimensions in inches 01.10.05 Rev 8 All data sheets are subject to change without notice 17 ©2005 Maxwell Technologies All rights reserved Low Voltage 8 Megabit (256K x 32-Bit) EEPROM MCM 79LV0832 Pin #1 ID A1 c S1 MAXWELL TECHNOLOGIES e L2 b Memory D1 D(sq) L1(sq) L(sq) A 96 PIN RAD-TOLERANT QUAD FLAT PACKAGE SYMBOL MIN A b c D D1 e S1 L L1 L2 A1 N -2.485 -.152 .167 .010 -1.408 DIMENSION NOM .183 .012 .009 1.420 1.162 .050 .129 2.528 2.500 1.700 .165 96 2.543 2.505 -.178 MAX .199 .013 .012 1.432 Note: All dimensions in inches All data sheets are subject to change without notice 01.10.05 Rev 8 18 ©2005 Maxwell Technologies All rights reserved Low Voltage 8 Megabit (256K x 32-Bit) EEPROM MCM 79LV0832 Memory 96 PIN XRAY QUAD FLAT PACKAGE SYMBOL MIN A b c D D1 e S1 L L1 L2 A1 N 3.000 2.985 2.090 .115 .200 .007 .009 1.690 DIMENSION NOM .222 .010 .009 1.707 1.150 0.050 .278 3.020 3.000 2.200 .130 96 3.040 3.005 2.210 .145 MAX .245 .013 .012 1.725 Note: All dimensions in inches 01.10.05 Rev 8 All data sheets are subject to change without notice 19 ©2005 Maxwell Technologies All rights reserved Low Voltage 8 Megabit (256K x 32-Bit) EEPROM MCM Important Notice: 79LV0832 These data sheets are created using the chip manufacturers published specifications. Maxwell Technologies verifies functionality by testing key parameters either by 100% testing, sample testing or characterization. The specifications presented within these data sheets represent the latest and most accurate information available to date. However, these specifications are subject to change without notice and Maxwell Technologies assumes no responsibility for the use of this information. Maxwell Technologies’ products are not authorized for use as critical components in life support devices or systems without express written approval from Maxwell Technologies. Any claim against Maxwell Technologies must be made within 90 days from the date of shipment from Maxwell Technologies. Maxwell Technologies’ liability shall be limited to replacement of defective parts. Memory 01.10.05 Rev 8 All data sheets are subject to change without notice 20 ©2005 Maxwell Technologies All rights reserved Low Voltage 8 Megabit (256K x 32-Bit) EEPROM MCM Product Ordering Options 79LV0832 Model Number 79LV0832 XX Q X -XX Feature Access Time Option Details 20 = 200 ns 25 = 250 ns Screening Flow Multi Chip Module (MCM)1 K = Maxwell Self-Defined Class K H = Maxwell Self-Defined Class H I = Industrial (testing @ -55°C, +25°C, +125°C) E = Engineering (testing @ +25°C) Memory Package Q = Quad Flat Pack Radiation Feature RP = RAD-PAK® Package XP = XRAY-PAK Package RT1 = Guaranteed to 10 krad at die level RT2 = Guaranteed to 25 krad at die level RT4 = Guaranteed to 40 krad at Base Product Nomenclature 8 Megabit (256K x 32-Bit) Low Voltage EEPROM MCM 1) Products are manufactured and screened to Maxwell Technologies self-defined Class H and Class K flows. 01.10.05 Rev 8 All data sheets are subject to change without notice 21 ©2005 Maxwell Technologies All rights reserved