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MLX90316EDC-BDG-100-RE

MLX90316EDC-BDG-100-RE

  • 厂商:

    MELEXIS(迈来芯)

  • 封装:

    SOIC-8_150mil

  • 描述:

    IC SENSOR INTERFACE ROTARY 8SOIC

  • 数据手册
  • 价格&库存
MLX90316EDC-BDG-100-RE 数据手册
MLX90316 Rotary Position Sensor IC Datasheet   Absolute Rotary Position Sensor IC Simple & Robust Magnetic Design   Tria⊗is® Hall Technology Programmable Angular Range up to 360 Degrees Programmable Linear Transfer Characteristic Selectable Analog (Ratiometric), PWM, Serial Protocol 12 bit Angular Resolution - 10 bit Angular Thermal Accuracy 40 bit ID Number Single Die – SOIC-8 Package RoHS Compliant Dual Die (Full Redundant) – TSSOP-16 Package RoHS Compliant       SOIC-8 TSSOP-16 Applications         Absolute Rotary Position Sensor Steering Wheel Position Sensor Pedal Position Sensor Motor-shaft Position Sensor Throttle Position Sensor Float-Level Sensor Ride Height Position Sensor Non-Contacting Potentiometer Description The MLX90316 is a Tria⊗is® Rotary Position Sensor providing the absolute angular position of a small dipole magnet rotating above the device surface (end-of-shaft magnet). Thanks to an Integrated Magneto-Concentrator (IMC) on its surface, the monolithic device senses, in a contactless fashion, the horizontal component of the applied magnetic flux density. This unique sensing principle applied to a rotary position sensor results into an impressive robustness of the angular position over the mechanical (airgap, off-axis) tolerances. The rotation of this horizontal component is sensed over a wide range (up to 360 Deg. complete revolution) and processed by the onchip DSP (Digital Signal Processing) to ultimately report the absolute angular position of the magnet either as a ratiometric analog output or as PWM (Pulse-Width Modulation) signal or as a 14bit data accessible through a 3-pin SPI (serial interface) channel. The output transfer characteristic is fully programmable (e.g. offset, gain, clamping levels, linearity, thermal drift, filtering, range...) to match any specific requirement through end-of-line calibration. The Melexis programming unit PTC-04 communicates and calibrates the device exclusively through the connector terminals (VDDVSS-OUT). VDD VDIG Prot. 3V3 Reg DSP Triaxis® EEPROM RAM VX VY MUX Features and Benefits Output Stage 12 bit Analog G ADC µC 12 bit PWM SPI ROM - Firmware OUT1 MOSI/MISO OUT2 SCLK Switch Out /SS VSS MLX90316 Rotary Position Sensor IC Datasheet Contents Features and Benefits................................................................................................................................... 1 Applications .................................................................................................................................................. 1 Description ................................................................................................................................................... 1 1. Ordering Information ............................................................................................................................... 5 2. Functional Diagram .................................................................................................................................. 6 3. Glossary of Terms ..................................................................................................................................... 7 4. Pinout ....................................................................................................................................................... 8 5. Absolute Maximum Ratings ...................................................................................................................... 9 6. Electrical Specification ............................................................................................................................ 10 7. Isolation Specification............................................................................................................................. 12 8. Timing Specification................................................................................................................................ 12 9. Accuracy Specification ............................................................................................................................ 13 10. Magnetic Specification ......................................................................................................................... 14 11. CPU & Memory Specification ............................................................................................................... 14 12. End-User Programmable Items ............................................................................................................ 15 13. Description of End-User Programmable Items ..................................................................................... 17 13.1. Output Mode ............................................................................................................................... 17 13.1.1. Analog Output Mode ............................................................................................................. 17 13.1.2. PWM Output Mode ............................................................................................................... 18 13.1.3. Serial Protocol Output Mode ................................................................................................. 18 13.1.4. Switch Out .............................................................................................................................. 19 13.2. Output Transfer Characteristic .................................................................................................... 19 13.2.1. CLOCKWISE Parameter .......................................................................................................... 20 13.2.2. Discontinuity Point (or Zero Degree Point) ........................................................................... 20 13.2.3. LNR Parameters ..................................................................................................................... 21 13.2.4. CLAMPING Parameters .......................................................................................................... 21 13.2.5. DEADZONE Parameter ........................................................................................................... 22 13.2.6. Output 2 (MLX90316xDC-BCS ONLY) .................................................................................... 22 13.3. Identification ................................................................................................................................ 23 13.4. Sensor Front-End ......................................................................................................................... 23 13.4.1. HIGHSPEED Parameter........................................................................................................... 23 REVISION 011 – AUGUST 17, 2017 Page 2 of 48 MLX90316 Rotary Position Sensor IC Datasheet 13.4.2. ARGC, AUTO_RG, RoughGain and FORCECRA75 Parameters ............................................... 24 13.4.3. RGThresL, RGThresH Parameters .......................................................................................... 24 13.5. FILTER ........................................................................................................................................... 25 13.5.1. Hysteresis Filter ...................................................................................................................... 25 13.5.2. FIR Filters ................................................................................................................................ 25 13.5.3. IIR Filters ................................................................................................................................. 27 13.6. Programmable Diagnostic Settings.............................................................................................. 28 13.6.1. RESONFAULT Parameter ........................................................................................................ 28 13.6.2. EEHAMHOLE Parameter ........................................................................................................ 28 13.7. Lock .............................................................................................................................................. 28 13.7.1. MLXLOCK Parameter .............................................................................................................. 28 13.7.2. LOCK Parameter ..................................................................................................................... 28 14. Self Diagnostic ...................................................................................................................................... 29 15. Serial Protocol ...................................................................................................................................... 32 15.1. Introduction ................................................................................................................................. 32 15.2. SERIAL PROTOCOL Mode ............................................................................................................. 32 15.3. MOSI (Master Out Slave In) ......................................................................................................... 32 15.4. MISO (Master In Slave Out) ......................................................................................................... 32 15.5. /SS (Slave Select) .......................................................................................................................... 32 15.6. Master Start-Up ........................................................................................................................... 32 15.7. Slave Start-Up .............................................................................................................................. 33 15.8. Timing ........................................................................................................................................... 33 15.9. Slave Reset ................................................................................................................................... 34 15.10. Frame Layer ............................................................................................................................... 34 15.10.1. Command Device Mechanism ............................................................................................. 34 15.10.2. Data Frame Structure .......................................................................................................... 34 15.10.3. Timing ................................................................................................................................... 35 15.10.4. Data Structure ...................................................................................................................... 35 15.10.5. Angle Calculation ................................................................................................................. 36 15.10.6. Error Handling ...................................................................................................................... 36 16. Recommended Application Diagrams .................................................................................................. 37 16.1. Analog Output Wiring in SOIC-8 Package .................................................................................... 37 16.2. Analog Output Wiring in TSSOP-16 Package ............................................................................... 38 REVISION 011 – AUGUST 17, 2017 Page 3 of 48 MLX90316 Rotary Position Sensor IC Datasheet 16.3. PWM Low Side Output Wiring ..................................................................................................... 38 16.4. Serial Protocol .............................................................................................................................. 39 16.4.1. SPI Version – Single Die .......................................................................................................... 39 16.4.2. SPI Version – Dual Die ............................................................................................................ 40 16.4.3. Non SPI Version (Standard Version) ...................................................................................... 41 17. Standard information regarding manufacturability of Melexis products with different soldering processes ............................................................................................................................................... 42 18. ESD Precautions.................................................................................................................................... 42 19. Package Information............................................................................................................................. 43 19.1. SOIC-8 - Package Dimensions ...................................................................................................... 43 19.2. SOIC-8 - Pinout and Marking ....................................................................................................... 43 19.3. SOIC-8 - IMC Positionning ............................................................................................................ 44 19.4. TSSOP-16 - Package Dimensions ................................................................................................. 45 19.5. TSSOP-16 - Pinout and Marking................................................................................................... 46 19.6. TSSOP-16 - IMC Positionning ....................................................................................................... 46 20. Disclaimer ............................................................................................................................................. 48 21. Contact ................................................................................................................................................. 48 REVISION 011 – AUGUST 17, 2017 Page 4 of 48 MLX90316 Rotary Position Sensor IC Datasheet 1. Ordering Information Product Code Temperature Code Package Code Option Code Packing Form Code MLX90316 S DC BCG-000 RE MLX90316 E DC BCG-000 RE MLX90316 K DC BCG-000 RE MLX90316 L DC BCG-000 RE MLX90316 E GO BCG-000 RE MLX90316 K GO BCG-000 RE MLX90316 L GO BCG-000 RE MLX90316 K DC BCG-200 RE MLX90316 K GO BCG-200 RE MLX90316 K DC BCG-300 RE MLX90316 K GO BCG-300 RE MLX90316 E DC BDG-100 RE MLX90316 K DC BDG-100 RE MLX90316 L DC BDG-100 RE MLX90316 E GO BDG-100 RE MLX90316 K GO BDG-100 RE MLX90316 L GO BDG-100 RE MLX90316 L GO BDG-102 RE MLX90316 L DC BDG-102 RE MLX90316 L DC BCS-000 RE REVISION 011 – AUGUST 17, 2017 Page 5 of 48 MLX90316 Rotary Position Sensor IC Datasheet Legend: Temperature Code: S: from -20 Deg.C to 85 Deg.C E: from -40 Deg.C to 85 Deg.C K: from -40 Deg.C to 125 Deg.C L: from -40 Deg.C to 150 Deg.C Package Code: “DC” for SOIC-8 package “GO” for TSSOP-16 package (dual die) Option Code: AAA-xxx: die version xxx-000: standard xxx-100: SPI xxx-102: SPI75AGC, see section 13.4.2 xxx-200: PPA (Pre-programmed Analog) xxx-300: PPD (Pre-programmed Digital) Packing Form: “RE” for Reel “TU” for Tube Ordering Example: MLX90316KDC-BCG-000-TU Table 1 - Legend 2. Functional Diagram VDD VDIG Prot. 3V3 Reg DSP EEPROM RAM VX VY MUX Triaxis ® Output Stage 12 bit Analog G ADC µC 12 bit PWM SPI ROM - Firmware OUT1 MOSI/MISO OUT2 (1) SCLK Switch Out /SS VSS Figure 1 – Block Diagram 1 Output 2 only available on MLX90316xDC-BCS REVISION 011 – AUGUST 17, 2017 Page 6 of 48 MLX90316 Rotary Position Sensor IC Datasheet 3. Glossary of Terms Gauss (G), Tesla (T) TC NC PWM %DC ADC DAC LSB MSB DNL INL RISC ASP DSP ATAN IMC CoRDiC EMC Units for the magnetic flux density - 1 mT = 10 G Temperature Coefficient (in ppm/Deg.C.) Not Connected Pulse Width Modulation Duty Cycle of the output signal i.e. TON /(TON + TOFF) Analog-to-Digital Converter Digital-to-Analog Converter Least Significant Bit Most Significant Bit Differential Non-Linearity Integral Non-Linearity Reduced Instruction Set Computer Analog Signal Processing Digital Signal Processing Trigonometric function: arctangent (or inverse tangent) Integrated Magneto-Concentrator (IMC®) Coordinate Rotation Digital Computer (i.e. iterative rectangular-to-polar transform) Electro-Magnetic Compatibility Table 2 – Glossary of Terms REVISION 011 – AUGUST 17, 2017 Page 7 of 48 MLX90316 Rotary Position Sensor IC Datasheet 4. Pinout PIN SOIC-8 TSSOP-16 Analog / PWM Serial Protocol Analog / PWM Serial Protocol 1 VDD VDD VDIG1 VDIG1 2 Test 0 Test 0 VSS1 (Ground1) VSS1 (Ground1) 3 Switch OUT /SS VDD1 VDD1 4 Not Used / OUT 2 (2) SCLK Test 01 Test 01 5 OUT MOSI / MISO Switch OUT2 /SS2 6 Test 1 Test 1 Not Used2 SCLK2 7 VDIG VDIG OUT2 MOSI2 / MISO2 8 VSS (Ground) VSS (Ground) Test 12 Test 12 9 VDIG2 VDIG2 10 VSS2 (Ground2) VSS2 (Ground2) 11 VDD2 VDD2 12 Test 02 Test 02 13 Switch OUT1 /SS1 14 Not Used1 SCLK1 15 OUT1 MOSI1 / MISO1 16 Test 11 Test 11 For optimal EMC behavior, it is recommended to connect the unused pins (Not Used and Test) to the Ground (see section 16). 2 MLX90316xDC-BCS includes a programmable second output REVISION 011 – AUGUST 17, 2017 Page 8 of 48 MLX90316 Rotary Position Sensor IC Datasheet 5. Absolute Maximum Ratings Parameter Value Supply Voltage, VDD (overvoltage) + 20 V Reverse Voltage Protection - 10 V Positive Output Voltage – Standard Version + 10 V (Analog or PWM) + 14 V (200 s max – TA = + 25 Deg.C) Positive Output Voltage – SPI Version VDD + 0.3V Positive Output Voltage (Switch Out) + 10 V + 14 V (200 s max – TA = + 25 Deg.C) Output Current (IOUT) ± 30 mA Reverse Output Voltage - 0.3 V Reverse Output Current - 50 mA Operating Ambient Temperature Range, TA - 40 Deg.C … + 150 Deg.C Storage Temperature Range, TS - 40 Deg.C … + 150 Deg.C Magnetic Flux Density ± 700 mT Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximumrated conditions for extended periods may affect device reliability. REVISION 011 – AUGUST 17, 2017 Page 9 of 48 MLX90316 Rotary Position Sensor IC Datasheet 6. Electrical Specification DC Operating Parameters at VDD = 5V (unless otherwise specified) and for TA as specified by the Temperature suffix (S, E, K or L). Parameter Symbol Nominal Supply Voltage Supply Current (3) POR Level Output Current Output Short Circuit Current Output Load Analog Saturation Output Level Digital Saturation Output Level Min Typ Max Units 4.5 5 5.5 V Slow mode (4) 8.5 11 mA Fast mode (4) 13.5 16 mA 2.7 3 V VDD IDD VDD POR IOUT Ishort RL Supply Under Voltage 2 Analog Output mode -8 8 mA PWM Output mode -20 20 mA VOUT = 0 V 12 15 mA VOUT = 5 V 12 15 mA VOUT = 14 V (TA = 25 Deg.C) 24 45 mA 10 ∞ (6) kΩ 10 (6) kΩ Pull-down to Ground Pull-up to 5V (5) Vsat_lo Pull-up load RL ≥ 10 kΩ Vsat_hi Pull-down load RL ≥ 10 kΩ VsatD_lo VsatD_hi Diag_lo Active Diagnostic Output Level Diag_hi Passive Diagnostic Output Level Test Conditions BVSSPD 1 1 3 %VDD 96 Pull-up Low Side RL ≥ 10 kΩ %VDD 1.5 Push-Pull (IOUT = -20mA) Push-Pull (IOUT = 20mA) ∞ 97 Pull-down load RL ≥ 10 kΩ Pull-up load RL ≥ 10 kΩ %VDD %VDD 1 %VDD 1.5 %VDD Pull-down load RL ≥ 10 kΩ 97 %VDD Pull-up load RL ≥ 10 kΩ 98 %VDD Broken VSS (8) & Pull-down load RL ≤ 10 kΩ 4 (7) %VDD 3 Supply current per silicon die. Dual die version will consume twice the current See section 13.4.1 for details concerning Slow and Fast mode 5 Applicable for output in Analog and PWM (Open-Drain) mode 4 6 RL < ∞ for output in PWM mode REVISION 011 – AUGUST 17, 2017 Page 10 of 48 MLX90316 Rotary Position Sensor IC Datasheet Parameter Symbol (Broken Track Diagnostic) (7) BVSSPU BVDDPD BVDDPU Clamped Output Level (9) Switch Out (10) Test Conditions Broken VSS (8) & Pull-up load RL ≥ 1 kΩ Min Typ 99 100 Broken VDD (8) & Max %VDD 0 Pull-down load RL ≥ 1 kΩ Broken VDD & 1 %VDD No Broken Track diagnostic Pull-up load to 5 V Units %VDD Clamp_lo Programmable 0 100 %VDD Clamp_hi Programmable 0 100 %VDD Sw_lo Pull-up Load 1.5 kΩ to 5 V 0.55 1.1 V Sw_hi Pull-up Load 1.5 kΩ to 5 V 3.65 4.35 V As an illustration of the previous table, the MLX90316 fits the typical classification of the output span described on the Figure 2. 100 % 90 % 96 % 92 % 88 % Diagnostic Band (High) Clamping High 80 % Output Level 70 % 60 % Linear Range 50 % 40 % 30 % 20 % 10 % 0% 12 % 8% 4% Clamping Low Diagnostic Band (Low) Figure 2 – Output Span Classification 7 For detailed information, see also section 14 Not Valid for the SPI Version 9 Clamping levels need to be considered vs the saturation of the output stage (see Vsat_lo and Vsat_hi) 10 See section 13.1.4 for the application diagram 8 REVISION 011 – AUGUST 17, 2017 Page 11 of 48 MLX90316 Rotary Position Sensor IC Datasheet 7. Isolation Specification DC Operating Parameters at VDD = 5V (unless otherwise specified) and for TA as specified by the Temperature suffix (S, E, K or L). Only valid for the package code GO i.e. dual die version. Parameter Symbol Isolation Resistance Test Conditions Min Between dice Typ Max 4 Units MΩ 8. Timing Specification DC Operating Parameters at VDD = 5V (unless otherwise specified) and for TA as specified by the Temperature suffix (S, E, K or L). Parameter Main Clock Frequency Symbol Ck Sampling Rate Ts Watchdog Wd Start-up Cycle Tsu Analog Output Slew Rate Digital Output Rise Time Digital Output Fall Time 11 12 FPWM Min Typ Max Units Slow mode (11) 7 MHz Fast mode (11) 20 MHz Slow mode (11) 600 μs 200 μs Fast mode Step Response Time PWM Frequency Test Conditions (11) Slow mode (11), Filter = 5 (12) 4 ms 600 μs See section 14 5 ms Slow and Fast mode (11) 15 ms Fast mode (11) , Filter = 0 (12) 400 COUT = 42 nF 200 V/ms COUT = 100 nF 100 V/ms PWM Output Enabled 100 1000 Hz Mode 5 – 10 nF, RL = 10 kΩ 120 μs Mode 7 – 10 nF, RL = 10 kΩ 2.2 μs Mode 5 – 10 nF, RL = 10 kΩ 1.8 μs Mode 7 – 10 nF, RL = 10 kΩ 1.9 μs See section 13.4.1 for details concerning Slow and Fast mode See section 13.5 for details concerning Filter parameter REVISION 011 – AUGUST 17, 2017 Page 12 of 48 MLX90316 Rotary Position Sensor IC Datasheet 9. Accuracy Specification DC Operating Parameters at VDD = 5V (unless otherwise specified) and for TA as specified by the Temperature suffix (S, E, K or L). Parameter ADC Resolution on the raw signals sine and cosine Symbol RADC Test Conditions Min Slow Mode (13) Fast Mode (13) Typ Max Units 15 bits 14 bits Thermal Offset Drift at the DSP input (excl. DAC and output stage) Thermal Offset Drift #1 (14) -60 60 Temperature suffix L -90 90 LSB15 LSB15 Temperature suffix S, E and K -0.3 0.3 %VDD Temperature suffix L -0.4 0.4 %VDD Temperature suffix S, E and K -0.3 0.3 % Temperature suffix L -0.5 0.5 % -1 1 Deg. Thermal Offset Drift of the DAC and Output Stage Thermal Offset Drift #2 (to be considered only for the analog output mode) Thermal Drift of Sensitivity Mismatch (15) Intrinsic Linearity Error (16) Temperature suffix S, E and K Le TA = 25 Deg.C 12 bits DAC Analog Output Resolution Output stage Noise RDAC 0.025 %VDD /LSB (Theoretical – Noise free) INL -4 4 LSB DNL -2 2 LSB Clamped Output 0.05 %VDD 13 15 bits corresponds to 14 bits + sign and 14 bits corresponds to 13 bits + sign. After angular calculation, this corresponds to 0.005Deg./LSB15 in Low Speed Mode and 0.01Deg./LSB14 in High Speed. 14 For instance, Thermal Offset Drift #1 equal ± 60LSB15 yields to max. ± 0.3 Deg. angular error for the computed angular information (output of the DSP). See Front End Application Note for more details. This is only valid if automatic gain is set (See section 13.4.2) 15 For instance, Thermal Drift of Sensitivity Mismatch equal ± 0.4% yields to max. ± 0.1 Deg. angular error for the computed angular information (output of the DSP). See Front End Application Note for more details. 16 The Intrinsic Linearity Error refers to the IC itself (offset, sensitivity mismatch, orthogonality) taking into account an ideal rotating field. Once associated to a practical magnetic construction and the associated mechanical and magnetic tolerances, the output linearity error increases. However, it can be improved with the multi point end-user calibration that is available on the MLX90316. REVISION 011 – AUGUST 17, 2017 Page 13 of 48 MLX90316 Rotary Position Sensor IC Datasheet Parameter Symbol Noise pk-pk (17) Test Conditions Typ Max Units RG = 9, Slow mode, Filter = 5 0.03 0.06 Deg. RG = 9, Fast mode, Filter = 0 0.1 0.2 Deg. 0 0.1 %VDD Ratiometry Error -0.1 PWM Output Resolution RPWM PWM Jitter (18) JPWM Serial Protocol Output Resolution Min RSP 12 bits %DC/ 0.025 (Theoretical – Jitter free) RG = 6, LSB 0.2 FPWM = 250 Hz – 800 Hz 14 bits – 360 Deg. Mapping Deg./ 0.022 (Theoretical – Jitter free) %DC LSB 10. Magnetic Specification DC Operating Parameters at VDD = 5V (unless otherwise specified) and for TA as specified by the Temperature suffix (S, E, K or L). Parameter Symbol Test Conditions Min Typ Max Units 50 70 (19) mT Magnetic Flux Density B 20 Magnet Temperature Coefficient TCm -2400 ppm/ 0 Deg.C 11. CPU & Memory Specification The DSP is based on a 16 bit RISC µController. This CPU provides 5 MIPS while running at 20 MHz. Parameter Symbol Test Conditions Min Typ Max Units ROM 10 KB RAM 256 B EEPROM 128 B 17 The application diagram used is described in the recommended wiring. For detailed information, refer to section Filter in application mode (Section 13.5). 18 Jitter is defined by ± 3 σ for 1000 successive acquisitions and the slope of the transfer curve is 100%DC/360 Deg. 19 Above 70 mT, the IMC starts saturating yielding to an increase of the linearity error. REVISION 011 – AUGUST 17, 2017 Page 14 of 48 MLX90316 Rotary Position Sensor IC Datasheet 12. End-User Programmable Items Default Values Parameter Comments STANDARD SPI / SPI75AGC PPA PPD # bit Output Stage Mode 4 N/A 4 7 3 MLX90316BCS 2 N/A 2 N/A 3 PWMPOL1 PWM Polarity 0 N/A N/A 1 1 PWMT PWM Frequency 1000h N/A N/A 1kHz 16 0 0 0 1 1 Output Mode CLOCKWISE DP Discontinuity Point 0h 0h 0h 0h 15 LNR_S0 Initial Slope 0h N/A N/A N/A 16 LNR_A_X AX Coordinate 8000h 0 0 0 16 LNR_A_Y AY Coordinate 0h 0% 10% 10% 16 LNR_A_S AS Slope 0h 100%/360d 80%/360d 80%/360d 16 LNR_B_X BX Coordinate FFFFh FFFFh FFFFh FFFFh 16 LNR_B_Y BY Coordinate 0h FFFFh FFFFh FFFFh 16 LNR_B_S BS Slope 0h N/A N/A N/A 16 LNR_C_X CX Coordinate FFFFh FFFFh FFFFh FFFFh 16 LNR_C_Y CY Coordinate FFFFh FFFFh FFFFh FFFFh 16 LNR_C_S CS Slope 0h N/A N/A N/A 16 CLAMP_HIGH Clamping High 8% 0% 10% 10% 16 CLAMP_LOW Clamping Low 8% 100% 90% 90% 16 FFFFh FFFFh FFFFh FFFFh 16 0 N/A FFFFh N/A 16 N/A N/A N/A N/A 8 0 0 0 0 8 4 0 0 0 8 0 N/A 0 N/A 8 KD KDHYST Switch Out MLX90316BCS Hysteresis on Switch Out DEADZONE FHYST MLX90316BCS REVISION 011 – AUGUST 17, 2017 Page 15 of 48 MLX90316 Rotary Position Sensor IC Datasheet Default Values Parameter Comments STANDARD SPI / SPI75AGC PPA PPD # bit MLX MLX MLX MLX 16 1 1 1 1 8 CUSTID2 (21) 6 (22) 19 / 36 16 20 16 CUSTID3 MLX MLX MLX MLX 16 0 0 0 0 8 0 N/A 2Ah N/A 16 5 0 2 5 16 MLXID1 / MLXID2 / MLXID3 (20) CUSTID1 FREE2 MLX90316BCS FILTER FILTER A1 (21) Filter coefficient A1 for FILTER = 6 6600h N/A N/A N/A 16 FILTER A2 (21) Filter coefficient A2 for FILTER = 6 2A00h N/A N/A N/A 16 Auto Gain at Start Up 0 1 1 1 1 MLX90316BCS 0 N/A 1 N/A 1 HIGHSPEED 0 1 0 1 1 FSWAP 1 1 0 1 1 ARGC FORCECRA75 Radius Adjustment to 75% 0 0/1 0 0 1 AUTO_RG Automatic Rough Gain Selection 0 1 1 1 1 9 0 3 0 8 6 N/A 3 N/A 8 RGThresL 0 0 0 0 4 RGThresH 15 15 15 15 4 EEHAMHOLE 3131h 0 0 0 16 RESONFAULT 0 1 1 1 2 RoughGain MLX90316BCS 20 MLXIDs parameters contain unique ID programmed by Melexis to guarantee full part traceability Not available in MLX90316xDC-BCS 22 For MLX90316SDC–BCG–000, the CUSTID2 parameter might differ from the given value (28d instead of 6d) 21 REVISION 011 – AUGUST 17, 2017 Page 16 of 48 MLX90316 Rotary Position Sensor IC Datasheet Default Values Parameter Comments STANDARD SPI / SPI75AGC PPA PPD # bit 0 1 1 1 1 0 1 1 1 1 0 N/A 0 N/A 1 1 N/A 1 N/A 1 N/A N/A -1 N/A 8 OUT2 OFFSET MLX N/A 100% N/A 8 CLAMP_LOW OUT2 8% N/A 10% N/A 16 CLAMP_HIGH OUT2 8% N/A 90% N/A 16 MLXLOCK LOCK MLX90316BCS Parameters for MLX90316xDC-BCS only OUT2EN OUT2 SLOPE RATIO Was CUSTID2 13. Description of End-User Programmable Items 13.1. Output Mode The MLX90316 output type is defined by the Output Mode parameter. Parameter Analog Output Mode PWM Output Mode Serial Protocol Output Mode Value Description 2, 4 Analog Rail-to-Rail 5 Low Side (NMOS) 7 Push-Pull N/A Low Side (NMOS) 13.1.1. Analog Output Mode The Analog Output Mode is a rail-to-rail and ratiometric output with a push-pull output stage configuration allows the use of a pull-up or pull-down resistor. REVISION 011 – AUGUST 17, 2017 Page 17 of 48 MLX90316 Rotary Position Sensor IC Datasheet 13.1.2. PWM Output Mode If one of the PWM Output modes is selected, the output signal is a digital signal with Pulse Width Modulation (PWM). In mode 5, the output stage is an open drain NMOS transistor (low side), to be used with a pull-up resistor to VDD. In mode 7, the output stage is a push-pull stage for which Melexis recommends the use of a pull-up resistor to VDD. The PWM polarity is selected by the PWMPOL1 parameter:  PWMPOL1 = 0 for a low level at 100%  PWMPOL1 = 1 for a high level at 100% The PWM frequency is selected by the PWMT parameter. Oscillator Mode Pulse-Width Modulation Frequency (Hz) 100 200 500 1000 Low Speed ~35000 ~17500 ~7000 ~3500 High Speed - ~50000 ~20000 ~10000 Table 3 – PWM Frequency Code (based on typical main clock frequency) For instance, in Low Speed Mode, set PWMT = 7000 (decimal) to set the PWM frequency around 500 Hz (23). 13.1.3. Serial Protocol Output Mode The MLX90316 features a digital Serial Protocol mode. The MLX90316 is configured as a Slave node. See the dedicated Serial Protocol section for a full description (Section 15). 23 In order to compensate for the lot to lot variation of the main clock frequency (Ck), Melexis strongly recommends trimming the PWM frequency during EOL programming (see the PTC-04 documentation). REVISION 011 – AUGUST 17, 2017 Page 18 of 48 MLX90316 Rotary Position Sensor IC Datasheet 13.1.4. Switch Out Parameter KD KDHYST Value Unit 0 … 359.9999 Deg. 0 … 1.4 Deg. The switch is activated (Sw_lo) when the digital angle is greater than the value stored in the KD parameter. This angle refers to the internal angular reference linked to the parameter DP and not to the absolute physical 0 Deg. angle. The KDHYST defines the hysteresis amplitude around the Switch point. The switch is activated if the digital angle is greater than KD+KDHYST. It is deactivated if the digital angle is less than KD-KDHYST. The mandatory application diagram to use this feature is depicted in the Figure 3. See section 6 for the electrical characteristic. If the Switch feature is not used in the application, the output pin shall be connected to ground. 5V MLX 1.5kΩ 125Ω 175Ω Switch Out 6kΩ to µC I/O Port 100 nF ECU Figure 3 – Application Diagram for the Switch Out 13.2. Output Transfer Characteristic Parameter CLOCKWISE DP Value Unit 0  CCW 1  CW 0 … 359.9999 Deg. 0 … 359.9999 Deg. LNR_A_X LNR_B_X LNR_C_X REVISION 011 – AUGUST 17, 2017 Page 19 of 48 MLX90316 Rotary Position Sensor IC Datasheet Parameter Value Unit 0 … 100 % 0 … 17 %/Deg. -17 … 0 … 17 %/Deg. CLAMP_LOW 0 … 100 % CLAMP_HIGH 0 … 100 % 0 … 359.9999 Deg. OUT2 SLOPE RATIO -8 … 0 … 8 - OUT2 OFFSET -400 … 400 % CLAMP_LOW OUT2 0 … 100 % CLAMP_HIGH OUT2 0 … 100 % LNR_A_Y LNR_B_Y LNR_C_Y LNR_S0 LNR_A_S LNR_B_S LNR_C_S DEADZONE MLX90316 xDC – BCS only 13.2.1. CLOCKWISE Parameter The CLOCKWISE parameter defines the magnet rotation direction.  CCW is the defined by the 1-4-5-8 pin order direction for the SOIC-8 package and 1-8-9-16 pin order direction for the TSSOP-16 package.  CW is defined by the reverse direction: 8-5-4-1 pin order direction for the SOIC-8 and 16-9-8-1 pin order direction for the TSSOP-16 package. Refer to the drawing in the IMC positioning sections (Sections 19.3 and 19.6). 13.2.2. Discontinuity Point (or Zero Degree Point) The Discontinuity Point redefines the 0 Deg. point. The discontinuity point places the origin at any location of the trigonometric circle. The DP is used as reference for all the angular measurements. REVISION 011 – AUGUST 17, 2017 Page 20 of 48 MLX90316 Rotary Position Sensor IC Datasheet 0 Deg. 360 Deg. Figure 4 - The placement of the Discontinuity Point (Zero Degree Point) is programmable 13.2.3. LNR Parameters The LNR parameters, together with the clamping values, fully define the relation (the transfer function) between the digital angle and the output signal. The shape of the MLX90316 transfer function from the digital angle value to the output voltage is described by the drawing below. Six segments can be programmed but the clamping levels are necessarily flat. Two to five calibration points are then available, reducing the overall non-linearity of the IC by almost an order of magnitude each time. Three to five point calibration will be preferred by customers looking for excellent non-linearity figures. Two-point calibrations will be preferred by customers looking for a lower cost calibration set-up and shorter calibration time. 100% CLAMPHIGH Clamping High C Slope LNR_C_S LNR_C_Y LNR_B_Y LNR_A_Y CLAMPLOW 0% 0 (Deg.) Slope LNR_B_S B Slope LNR_A_S A Slope LNR_S0 LNR_A_X Clamping Low LNR_B_X LNR_C_X 360 (Deg.) 13.2.4. CLAMPING Parameters The clamping levels are two independent values to limit the output voltage range in normal operation. The CLAMP_LOW parameter sets the minimum output voltage level while the CLAMP_HIGH parameter sets the maximum output voltage level. Both parameters have 16 bits of adjustment. In analog mode the resolution REVISION 011 – AUGUST 17, 2017 Page 21 of 48 MLX90316 Rotary Position Sensor IC Datasheet will be limited by the D/A converter (12 bits) to 0.024%VDD. In PWM mode the resolution will be 0.024%DC. In SPI mode the resolution is 14bits or 0.022 Deg. over 360 Deg. 13.2.5. DEADZONE Parameter The dead zone is defined as the angle window between 0 and 359.9999 Deg. When the digital angle lies in this zone, the IC is in fault mode (RESONFAULT must be set to “1” – See section 13.6.1). 13.2.6. Output 2 (MLX90316xDC-BCS ONLY) The MLX90316BCS firmware offers the possibility to program a second output transfer characteristic of the single die version. The following formula is used in the 90316BCS: OUT2 = OUT2SlopeRatio * OUT1 + OUT2Offset Range OUT2 = [Clamp_Low OUT2 … Clamp_High OUT2] OUT2 SLOPE RATIO Controls the slope ratio OUT1 vs OUT2. The ratio can be positive or negative. The example of MLX90316LDC-BCS-PPA is given in the figure below (slope = -1, OUT2 = -1 x slope OUT1 + 100%). OUT1 Output Level (%VDD) 100% 90% 10% 0% 0 (Deg.) REVISION 011 – AUGUST 17, 2017 OUT2 360 (Deg.) Page 22 of 48 MLX90316 Rotary Position Sensor IC Datasheet 13.3. Identification Parameter Value MLXID1 0 … 65535 MLXID2 0 … 65535 MLXID3 0 … 65535 CUSTID1 0 … 255 CUSTID2 0 … 65535 CUSTID3 0 … 65535 Unit Identification number: 40 bits freely useable by Customer for traceability purpose. 13.4. Sensor Front-End Parameter HIGHSPEED Value Unit 0 = Slow mode 1 = Fast mode 0 = disable ARGC 1 = enable AUTO_RG 0 = disable 1 = enable RoughGain 0 … 15 RGThresL 0 … 15 RGThresH 0 … 15 13.4.1. HIGHSPEED Parameter The HIGHSPEED parameter defines the main frequency for the DSP:  HIGHSPEED = 0 selects the Slow mode with a 7 MHz master clock.  HIGHSPEED = 1 selects the Fast mode with a 20 MHz master clock. For better noise performance, the Slow Mode must be enabled. REVISION 011 – AUGUST 17, 2017 Page 23 of 48 MLX90316 Rotary Position Sensor IC Datasheet 13.4.2. ARGC, AUTO_RG, RoughGain and FORCECRA75 Parameters AUTO_RG and ARGC parameters enable the automatic gain control (AGC) of the analog chain. The AGC loop is based on (VX)²+ (VY)² = (Amplitude)² = (Radius)² and it targets an amplitude of 90% of the ADC input span. At Start-Up phase, the gain stored in the parameter RoughGain is always used. Depending of the AUTO_RG and ARGC settings, the AGC regulation acts as follow:  If ARGC is set, the regulation proceeds by jump to reach the target gain. Note that this regulation is only valid if the starting gain does not saturate the ADC. Melexis recommendation is to use RoughGain ≤ 3 if ARGC = 1.  If ARGC is “0” and AUTO_RG is set to “1”, the regulation adapts every cycle by one gain code the current gain to reach the 90% ADC span target. Note that if the value of RoughGain is too far from the actual gain, the chip will enter the normal operating mode (after the Start-Up phase) with an incorrect gain which will cause the device to go in diagnostic low (field too low/field too high – See section 14).  If ARGC and AUTO_RG are “0”, the AGC regulation is off and the gain used is the value stored in the parameter RoughGain. Melexis does not advise the use of this mode. The parameter AUTO_RG activates the automatic regulation during normal operation of the device as background task. The parameter FORCECRA75 modifies the target of the AGC algorithm to 75% - instead of 90% - of the ADC span (at start-up and in normal operation). Melexis strongly recommends to set ARGC = “1”, AUTO_RG = “1” and RoughGain ≤ 3 for all types of application. If the magnetic specifications of the application are well known and under control, the appropriate RoughGain can also be programmed with ARGC set to “0” and AUTO_RG to “1”. Please note that the angular errors listed in the section 9 are only valid if the AUTO_RG is activated. AUTO_RG avoids also the saturation of the analog chain and the associated linearity error. The current gain (RG) can be read out with the PTC-04 and gives a rough indication of the applied magnetic flux density (Amplitude). 13.4.3. RGThresL, RGThresH Parameters RGThresL & RGThresH define the boundaries within the gain setting (Rough Gain) is allowed to vary. Outside this range, the output is set in diagnostic low. REVISION 011 – AUGUST 17, 2017 Page 24 of 48 MLX90316 Rotary Position Sensor IC Datasheet 13.5. FILTER Parameter Value Unit FHYST 0 … 11; step 0.04 Deg. FILTER 0…6 0 FSWAP 1 The MLX90316 includes 3 types of filters:  Hysteresis Filter: programmable by the FHYST parameter  Low Pass FIR Filters controlled with the Filter parameter  Low Pass IIR Filter controlled with the Filter parameter and the coefficients FILTER A1 and FILTER A2 Note: if the parameter FSWAP is set to “1”, the filtering is active on the digital angle. If set to “0”, the filtering is active on the output transfer function. 13.5.1. Hysteresis Filter The FHYST parameter is a hysteresis filter. The output value of the IC is not updated when the digital step is smaller than the programmed FHYST parameter value. The output value is modified when the increment is bigger than the hysteresis. The hysteresis filter reduces therefore the resolution to a level compatible with the internal noise of the IC. The hysteresis must be programmed to a value close to the noise level. Please note that for the programmable version, the FHYST parameter is set to 4 by default. If you do not wish this feature, please set it to “0”. 13.5.2. FIR Filters The MLX90316 features 6 FIR filter modes controlled with Filter = 0 … 5. The transfer function is described below: yn = j ∑a i =0 REVISION 011 – AUGUST 17, 2017 j 1 ∑a x i =0 i n −i i Page 25 of 48 MLX90316 Rotary Position Sensor IC Datasheet The characteristics of the filters no 0 to 5 is given in the Table 4. Filter No (j) 0 Type 1 2 3 Disable Coefficients a0… a5 5 111100 122210 Finite Impulse Response N/A Title 4 110000 No Filter 121000 133100 Extra Light Light 90% Response Time 1 2 3 4 4 5 99% Response Time 1 2 3 4 4 5 Efficiency RMS (dB) 0 2.9 4.0 4.7 5.6 6.2 Efficiency P2P (dB) 0 2.9 3.6 5.0 6.1 7.0 Table 4 – FIR Filters Selection Table FIR and HYST Filters: Step Response Comparative Plot 40000 x(n) fir(n) hyst(n) [0..65535] Scale 38000 36000 34000 32000 30000 0 5 10 15 Milliseconds 20 25 30 FIR and HYST Filter : Gaussian white noise response 40200 x(n) fir(n) hyst(n) 40150 [0..65535] Scale 40100 40050 40000 39950 39900 39850 39800 0 20 40 60 80 100 120 140 Milliseconds Figure 5 - Step Response and Noise Response for FIR (No 3) and FHYST = 10 REVISION 011 – AUGUST 17, 2017 Page 26 of 48 MLX90316 Rotary Position Sensor IC Datasheet 13.5.3. IIR Filters The IIR Filter is enabled with Filter = 6. The diagram of the IIR Filter implemented in the MLX90316 is given in Figure 6. Only the parameters A1 and A2 are configurable (See Table 5). b0 = 1 x(n) y(n) Z-1 Z-1 -a1 b1 = 2 Z-1 Z-1 b2 = 1 -a2 Figure 6 - IIR Diagram Filter No 6 Type 2nd Order Infinite Impulse Response (IIR) Title Medium & Strong 90% Response Time 11 16 26 40 52 100 Efficiency RMS (dB) 9.9 11.4 13.6 15.3 16.2 >20 Efficiency P2P (dB) 12.9 14.6 17.1 18.8 20.0 >20 Coefficient A1 26112 28160 29120 30208 31296 31784 Coefficient A2 10752 12288 12992 13952 14976 15412 Table 5 – IIR Filter Selection Table The Figure 7 shows the response of the filter to a Gaussian noise with default coefficient A1 and A2. IIR Filter - Gaussian White Noise Response 40200 40150 x(n) 40100 y(n) 40050 40000 39950 39900 39850 39800 0 50 100 150 Figure 7 – Noise Response for the IIR Filter REVISION 011 – AUGUST 17, 2017 Page 27 of 48 MLX90316 Rotary Position Sensor IC Datasheet 13.6. Programmable Diagnostic Settings Parameter Value RESONFAULT 0, 1 EEHAMHOLE 0, 3131h Unit 13.6.1. RESONFAULT Parameter This RESONFAULT parameter enables the soft reset when a fault is detected by the CPU when the parameter is set to 1. By default, the parameter is set to “0” but it is recommended to set it to “1” to activate the self diagnostic modes (See section 14). Note that in the User Interface (MLX90316UI), the RESONFAULT is split in two bits:  DRESONFAULT: disable the reset in case of a fault.  DOUTINFAULT: disable output in diagnostic low in case of fault. 13.6.2. EEHAMHOLE Parameter The EEHAMHOLE parameter disables the CRC check and the memory recovery (Hamming code) when it is equal to 3131h. Melexis strongly recommends to set the parameter to 0 (enable memory recovery). This is done automatically when using the MEMLOCK function. 13.7. Lock Parameter Value MLXLOCK 0, 1 LOCK 0, 1 Unit 13.7.1. MLXLOCK Parameter MLXLOCK locks all the parameters set by Melexis. 13.7.2. LOCK Parameter LOCK locks all the parameters set by the user. Once the lock is enabled, it is not possible to change the EEPROM values. However it is still possible to read back the memory contents with the PTC-04 programmer. Note that the lock bit should be set by the solver function “MemLock”. REVISION 011 – AUGUST 17, 2017 Page 28 of 48 MLX90316 Rotary Position Sensor IC Datasheet 14. Self Diagnostic The MLX90316 provides numerous self-diagnostic features. Those features increase the robustness of the IC functionality as it will prevent the IC to provide erroneous output signal in case of internal or external failure modes (“fail-safe”). Fault Mode Action Effect on Outputs Remark ROM CRC Error at start up (64 words including Intelligent Watch Dog - IWD) CPU Reset (24) Diagnostic low (25) All the outputs are already in Diagnostic low - (start-up) Enter Endless Loop: ROM CRC Error (Operation - Background task) RAM Test Fail (Start-up) - Progress (watchdog Acknowledge) Immediate Diagnostic low - Set Outputs in Diagnostic low CPU Reset Diagnostic low Start-Up Time is increased by 3 ms if successful recovery Calibration Data CRC Error (Start-Up) Hamming Code Recovery Hamming Code Recovery Error (Start-Up) CPU Reset Immediate Diagnostic low CPU Reset Immediate Diagnostic low Set Outputs in Diagnostic low. Normal Operation until the “dead zone” is left. Immediate Diagnostic low Set Outputs in Diagnostic low. Normal mode and CPU Reset If recovery Immediate Diagnostic low Calibration Data CRC Error (Operation - Background) Dead Zone ADC Clipping (ADC Output is 0000h or 7FFFh) All the outputs are already in Diagnostic low (start-up) See section 13.6.2 Immediate recovery if the “dead zone” is left 24 CPU reset means 1. Core Reset (same as Power-On-Reset). It induces a typical start up time. 2. Periphery Reset (same as Power-On-Reset) 3. Fault Flag/Status Lost 4. The reset can be disabled by clearing the RESONFAULT bit (See 13.6.1) 25 Refer to section 6 for the Diagnostic Output Level specifications REVISION 011 – AUGUST 17, 2017 Page 29 of 48 MLX90316 Rotary Position Sensor IC Datasheet Fault Mode Action Radius Overflow (> 100%) or Radius Underflow (< 50 %) Set Outputs in Diagnostic low. Normal mode and CPU Reset If recovery Immediate Diagnostic low Fine Gain Clipping Set Outputs in Diagnostic low. Normal mode, and CPU Reset If recovery Immediate Diagnostic low Set Outputs in Diagnostic low. Normal mode, and CPU Reset If recovery Immediate Diagnostic low Set Outputs in Diagnostic low. Normal mode, and CPU Reset If recovery Immediate Diagnostic low DAC Monitor (Digital to Analog converter) Set Outputs in Diagnostic low. Normal Mode with immediate recovery without CPU Reset Immediate Diagnostic low ADC Monitor (Analog to Digital Converter) Set Outputs in Diagnostic low. Normal Mode with immediate recovery without CPU Reset Immediate Diagnostic low (FG < 0d or > 63d) Rough Offset Clipping (RO is < 0d or > 127d) Rough Gain Clipping (RG < RGTHRESLOW or RG > RGTHRESHIGH) At Start-Up, wait until VDD > 3V. Effect on Outputs Remark (50 % - 100 %) No magnet / field too high See also section 13.4.2 See also section 13.4.2 ADC Inputs are Shorted - VDD < POR level => Outputs high impedance Undervoltage Mode During operation, CPU Reset after 3 ms debouncing Firmware Flow Error CPU Reset Immediate Diagnostic low Intelligent Watchdog (Observer) Read/Write Access out of physical memory CPU Reset Immediate Diagnostic low 100% Hardware detection Write Access to protected area (IO and RAM Words) CPU Reset Immediate Diagnostic low 100% Hardware detection Unauthorized entry in “SYSTEM” Mode CPU Reset Immediate Diagnostic low 100% Hardware detection VDD > 7 V Set Output High Impedance (Analog) REVISION 011 – AUGUST 17, 2017 - POR level < VDD < 3 V => Outputs in Diagnostic low Pull down resistive load => Diag. Low Pull up resistive load => Diag. High (25) 100% Hardware detection Page 30 of 48 MLX90316 Rotary Position Sensor IC Datasheet Fault Mode Action VDD > 9.4 V IC is switched off (internal supply) CPU Reset on recovery Effect on Outputs Pull down resistive load => Diag. Low Pull up resistive load => Diag. High Remark 100% Hardware detection 100% Hardware detection. Broken VSS (26) CPU Reset on recovery Pull down resistive load => Diag. Low Pull up resistive load => Diag. High Pull down load ≤ 10 kΩ to meet Diag Low spec: - < 2% VDD (temperature suffix S and E) - < 4% VDD ( temperature suffix K) - contact Melexis for temperature suffix L Broken VDD (26) 26 CPU Reset on recovery Pull down resistive load => Diag. Low Pull up resistive load => Diag. High No valid diagnostic for VPULLUP = VDD. Pull up load (≤ 10kΩ) to VPULLUP > 8 V to meet Diag Hi spec > 96% VDD. Not Valid for SPI Version REVISION 011 – AUGUST 17, 2017 Page 31 of 48 MLX90316 Rotary Position Sensor IC Datasheet 15. Serial Protocol 15.1. Introduction The MLX90316 features a digital Serial Protocol mode. The MLX90316 is configured as a Slave node. The serial protocol of the MLX90316 is a three wires protocol (/SS, SCLK, MOSI-MISO):  /SS pin is a 5 V tolerant digital input  SCLK pin is a 5 V tolerant digital input  MOSI-MISO pin is a 5 V tolerant open drain digital input/output The basic knowledge of the standard SPI specification is required for the good understanding of the present section. 15.2. SERIAL PROTOCOL Mode  CPHA = 1  even clock changes are used to sample the data  CPOL = 0  active-Hi clock The positive going edge shifts a bit to the Slave’s output stage and the negative going edge samples the bit at the Master’s input stage. 15.3. MOSI (Master Out Slave In) The Master sends a command to the Slave to get the angle information. 15.4. MISO (Master In Slave Out) The MISO of the slave is an open-collector stage. Due to the capacitive load, a >1 kΩ pull-up is used for the recessive high level (in fast mode). Note that MOSI and MISO use the same physical pin of the MLX90316. 15.5. /SS (Slave Select) The /SS pin enables a frame transfer (if CPHA = 1). It allows a re-synchronization between Slave and Master in case of communication error. 15.6. Master Start-Up /SS, SCLK, MISO can be undefined during the Master start-up as long as the Slave is re-synchronized before the first frame transfer. REVISION 011 – AUGUST 17, 2017 Page 32 of 48 MLX90316 Rotary Position Sensor IC Datasheet 15.7. Slave Start-Up The slave start-up (after power-up or an internal failure) takes 16 ms. Within this time /SS and SCLK is ignored by the Slave. The first frame can therefore be sent after 16 ms. MISO is Hi-Z (i.e. Hi-Impedance) until the Slave is selected by its /SS input. MLX90316 will cope with any signal from the Master while starting up. 15.8. Timing To synchronize communication, the Master deactivates /SS high for at least t5 (1.5 ms). In this case, the Slave will be ready to receive a new frame. The Master can re-synchronize at any time, even in the middle of a byte transfer. Note: Any time shorter than t5 leads to an undefined frame state, because the Slave may or may not have seen /SS inactive. t6 t1 t1 t1 t7 t1 t1 t4 t2 t9 t5 SCLK MOSI/ MISO /SS 2 Startbytes 27 Byte 1 Byte 0 Byte 2 Byte 7 Timings Min (27) Max t1 2.3 μs / 6.9 μs - t2 12.5 μs / 37.5 μs - t2 the minimum time between any other byte t4 2.3 μs / 6.9 μs - Time between last clock and /SS=high=chip de-selection t5 300 μs / 1500 μs - Minimum /SS = Hi time where it’s guaranteed that a frame re-synchronizations will be started. t5 0 μs - Maximum /SS = Hi time where it’s guaranteed that NO frame re-synchronizations will be started. t6 2.3 μs / 6.9 μs - The time t6 defines the minimum time between /SS = Lo and the first clock edge Remarks No capacitive load on MISO. t1 is the minimum clock period for any bits within a byte. Timings shown for oscillator base frequency of 20MHz (Fast Mode) / 7 MHz (Slow Mode) REVISION 011 – AUGUST 17, 2017 Page 33 of 48 MLX90316 Rotary Position Sensor IC Datasheet Timings Min (27) Max t7 15 μs / 45 μs - t9 - < 1 μs TStartUp - < 10 ms / 16 ms Remarks t7 is the minimum time between the StartByte and the Byte0 Maximum time between /SS = Hi and MISO Bus HighImpedance Minimum time between reset-inactive and any master signal change 15.9. Slave Reset On internal soft failures the Slave resets after 1 second or after an (error) frame is sent. On internal hard failures the Slave resets itself. In that case, the Serial Protocol will not come up. The serial protocol link is enabled only after the completion of the first synchronization (the Master deactivates /SS for at least t5). 15.10. Frame Layer 15.10.1. Command Device Mechanism Before each transmission of a data frame, the Master should send a byte AAh to enable a frame transfer. The latch point for the angle measurement is at the last clock before the first data frame byte. Latch Point /SS SCLK MOSI A A F F F F F F F F F F F F F F F F F F A A F F F F MISO F F F F D A T A F F F F F F F F F F F F D Figure 8 – Timing Diagram 15.10.2. Data Frame Structure A data frame consists of 10 bytes:  2 start bytes (AAh followed by FFh)  2 data bytes (DATA16 – most significant byte first)  2 inverted data bytes (/DATA16 - most significant byte first)  4 all-Hi bytes REVISION 011 – AUGUST 17, 2017 Page 34 of 48 MLX90316 Rotary Position Sensor IC Datasheet The Master should send AAh (55h in case of inverting transistor) followed by 9 bytes FFh. The Slave will answer with two bytes FFh followed by 4 data bytes and 4 bytes FFh. 15.10.3. Timing There are no timing limits for frames: a frame transmission could be initiated at any time. There is no interframe time defined. 15.10.4. Data Structure The DATA16 could be a valid angle or an error condition. The two meanings are distinguished by the LSB. DATA16: Angle A[13:0] with (Angle Span)/214 Most Significant Byte Least Significant Byte MSB A13 A12 A11 A10 A9 A8 A7 LSB MSB A6 A5 LSB A4 A3 A2 A1 A0 0 1 DATA16: Error Most Significant Byte Least Significant Byte MSB E15 E14 E13 E12 E11 E10 E9 LSB MSB E8 E7 LSB E6 E5 E4 E3 E2 E1 BIT NAME E0 0 E1 1 E2 F_ADCMONITOR ADC Failure E3 F_ADCSATURA ADC Saturation (Electrical failure or field too strong) E4 F_RGTOOLOW Analog Gain Below Trimmed Threshold (Likely reason: field too weak) E5 F_MAGTOOLOW Magnetic Field Too Weak E6 F_MAGTOOHIGH Magnetic Field Too Strong E7 F_RGTOOHIGH Analog Gain Above Trimmed Threshold (Likely reason: field too strong) E8 F_FGCLAMP Never occurring in serial protocol E9 F_ROCLAMP Analog Chain Rough Offset Compensation: Clipping E10 F_MT7V Device Supply VDD Greater than 7V REVISION 011 – AUGUST 17, 2017 E0 Description Page 35 of 48 MLX90316 Rotary Position Sensor IC Datasheet BIT NAME E11 - E12 - E13 - E14 F_DACMONITOR E15 - Description Never occurring in serial protocol 15.10.5. Angle Calculation All communication timing is independent (asynchronous) of the angle data processing. The angle is calculated continuously by the Slave:  Slow Mode: every 1.5 ms at most.  Fast Mode: every 350 μs at most. The last angle calculated is hold to be read by the Master at any time. Only valid angles are transferred by the Slave, because any internal failure of the Slave will lead to a soft reset. 15.10.6. Error Handling In case of any errors listed in section 15.10.4, the Serial protocol will be initialized and the error condition can be read by the master. The slave will perform a soft reset once the error frame is sent. In case of any other errors (ROM CRC error, EEPROM CRC error, RAM check error, intelligent watchdog error…) the Slave’s serial protocol is not initialized. The MOSI/MISO pin will stay Hi-impedant (no error frames are sent). REVISION 011 – AUGUST 17, 2017 Page 36 of 48 MLX90316 Rotary Position Sensor IC Datasheet 16. Recommended Application Diagrams 16.1. Analog Output Wiring in SOIC-8 Package ECU 5V VDD 8 1 VDD MLX90316 Test 0 VSS C2 100 nF VDIG Switch Out C1 100 nF Test 1 GND ADC C3 100 nF 5 4 Output OUT1 NotUsed R1 10k C4 4.7nF Figure 9 – Recommended wiring in SOIC-8 package (28) ECU 5V VDD 8 1 VDD VSS MLX90316BCS Test 0 Switch Out C1 100 nF C2 100 nF VDIG Test 1 5 4 OUT2 OUT1 GND C4 100 nF ADC C3 100 nF Output 1 Output 2 Figure 10 – Recommended wiring in SOIC-8 package – “BCS” Version 28 See section 13.1.4 if the Switch Output feature is used REVISION 011 – AUGUST 17, 2017 Page 37 of 48 MLX90316 Rotary Position Sensor IC Datasheet 16.2. Analog Output Wiring in TSSOP-16 Package ECU VDD1 VDD1 GND1 C3 100 nF 16 C1 100nF GND1 GND1 1 C2 100 nF VDIG1 VSS1 Output 1 OUT1 C7 4.7 nF R1 10k VDD1 C4 100 nF MLX90316 VDD2 VDIG2 C6 100 nF ADC 9 8 VSS2 OUT2 VDD2 VDD2 GND2 GND2 C5 100 nF Output 2 GND2 C8 4.7 nF R2 10k Figure 11 – Recommended wiring in TSSOP-16 package (dual die) 16.3. PWM Low Side Output Wiring ECU 5V VDD 8 1 VDD MLX90316 Test 0 Switch Out VSS C2 100 nF VDIG Test 1 5 4 NotUsed OUT1 C1 100 nF GND TIMER 5V C3 4.7 nF Output R1 1k C4 4.7nF Figure 12 – Recommended wiring for a PWM Low Side Output configuration (28) REVISION 011 – AUGUST 17, 2017 Page 38 of 48 MLX90316 Rotary Position Sensor IC Datasheet 16.4. Serial Protocol Generic schematics for single slave and dual slave applications are described. 16.4.1. SPI Version – Single Die SPI Master GND 8 1 VDD 5V C1 100 nF VDD MLX90316 Test 0 _SS _SS /SS Test 1 SCLK MOSI 5 MISO C2 100 nF VDIG 4 SCLK SCLK Vss MOSI R2 1k MOSI 3.3V/5V Figure 13 – SPI Version – Single Die – Application Diagram REVISION 011 – AUGUST 17, 2017 Page 39 of 48 MLX90316 Rotary Position Sensor IC Datasheet 16.4.2. SPI Version – Dual Die SPI Master C1 100nF GND 8 1 VDD 5V Vss VDD C2 100nF MLX90316 Test 0 _SS1 _SS1 /SS Test 1 5 MISO #1 4 SCLK1 SCLK1 VDIG MOSI SCLK MOSI R2 1K MOSI 3.3V/5V C1 100nF _SS2 8 1 VSS VDD SCLK2 C2 100nF MLX90316 Test 0 _SS2 #2 Test 1 5 4 SCLK2 /SS VDIG SCLK MOSI Figure 14 – SPI Version – Dual Die – Application Diagram REVISION 011 – AUGUST 17, 2017 Page 40 of 48 MLX90316 Rotary Position Sensor IC Datasheet 16.4.3. Non SPI Version (Standard Version) SPI Master 8 SCLK 1 VDD 5V _SS C1 100 nF GND VDD _SS VSS Test 0 R4 R5 VDIG /SS Test 1 SCLK MOSI R1 MOSI 5 4 MISO R3 C2 100 nF MLX90316 MOSI R2 3.3V/5V Figure 15 – Single Die - Serial Protocol Mode Application Type μCtrl Supply (V) Pull-up 90316 Supply (V) Supply (V) R1 (Ω) R2 (Ω) R3 (Ω) R4 (Ω) R5 (Ω) MOS Type 5V μCtrl w/o O.D. w/o 3.3V 5V 5V 5V 100 1000 20,000 1000 20,000 BS170 5V μCtrl w/o O.D. w/ 3.3V 5V 3.3V 5V 150 1000 N/A 1000 20,000 BS170 3.3V 3.3V 5V 150 1000 N/A N/A N/A BS170 5V 5V 5V 100 1000 20,000 1000 20,000 N/A 3.3V 3.3V 5V 150 1000 N/A N/A N/A N/A 3.3V μCtrl w/o O.D. (29) 5V μCtrl w/ O.D. w/o 3.3V (30) 3.3V μCtrl w/ O.D. Table 6 – Resistor Values for Common Specific Applications 29 30 μCtrl w/ O.D. : Micro-controller with open-drain capability (for instance NEC V850ES series) μCtrl w/o O.D. : Micro-controller without open-drain capability (like TI TMS320 series or ATMEL AVR) REVISION 011 – AUGUST 17, 2017 Page 41 of 48 MLX90316 Rotary Position Sensor IC Datasheet 17. Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to standards in place in Semiconductor industry. For further details about test method references and for compliance verification of selected soldering method for product integration, Melexis recommends reviewing on our web site the General Guidelines soldering recommendation (http://www.melexis.com/en/quality-environment/soldering). For all soldering technologies deviating from the one mentioned in above document (regarding peak temperature, temperature gradient, temperature profile etc), additional classification and qualification tests have to be agreed upon with Melexis. For package technology embedding trim and form post-delivery capability, Melexis recommends consulting the dedicated trim&forming recommendation application note: lead trimming and forming recommendations (http://www.melexis.com/en/documents/documentation/application-notes/leadtrimming-and-forming-recommendations). Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/en/quality-environment. 18. ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. REVISION 011 – AUGUST 17, 2017 Page 42 of 48 MLX90316 Rotary Position Sensor IC Datasheet 19. Package Information 19.1. SOIC-8 - Package Dimensions 1.27 TYP NOTES: 3.81 5.80 3.99** 6.20 4.80 4.98* All dimensions are in millimeters (angles in degrees). * Dimension does not include mold flash, protrusions or gate burrs (shall not exceed 0.15 per side). ** Dimension does not include interleads flash or protrusion (shall not exceed 0.25 per side). *** Dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. 1.37 1.57 1.52 1.72 0.36 0.46*** 0.19 0.25 0.100 0.250 0.41 1.27 0° 8° 8 OUT MOSI/MISO Test 1 VDIG VSS 19.2. SOIC-8 - Pinout and Marking Marking : Part Number MLX90316 (3 digits) Die Version (3 digits) 5 Top 316Bxx M12345 Xy-E M12345 Xy-E REVISION 011 – AUGUST 17, 2017 OUT2 SCLK \SS Switch Test 0 4 VDD 1 316 Bottom YY BCG Standard BDG SPI Version BCS BCS Version Lot number: “M” + 5 digits Split lot number + “-E” (Optional ) WW Week Date code (2 digits) Year Date code (2 digits) Page 43 of 48 MLX90316 Rotary Position Sensor IC Datasheet 19.3. SOIC-8 - IMC Positionning CW 8 7 6 5 CCW COS 1.25 1.65 1 2 1.96 2.26 3 0.46 +/- 0.06 4 SIN Angle detection SOIC-8 N 2 3 1 5 8 7 4 1 2 7 2 5 8 7 5 3 4 6 5 3 4 S S N 1 6 6 ~ 270 Deg.* ~ 180 Deg.* 8 S 6 8 ~ 90 Deg.* N 7 S ~ 0 Deg.* 3 4 1 2 N * No absolute reference for the angular information. The MLX90316 is an absolute angular position sensor but the linearity error (Le – See section 9) does not include the error linked to the absolute reference 0 Deg. (which can be fixed in the application through the discontinuity point – See 13.2.2). REVISION 011 – AUGUST 17, 2017 Page 44 of 48 MLX90316 Rotary Position Sensor IC Datasheet 19.4. TSSOP-16 - Package Dimensions 0.65 TYP 12O TYP 0.20 TYP 0.09 MIN 1.0 DIA 4.30 4.50** 6.4 TYP 0.09 MIN 1.0 12O TYP 1.0 0.50 0.75 0O 8O 1.0 TYP 0.85 0.95 4.90 5.10* 1.1 MAX 0.19 0.30*** 0.09 0.20 0.05 0.15 NOTES: All dimensions are in millimeters (angles in degrees). * Dimension does not include mold flash, protrusions or gate burrs (shall not exceed 0.15 per side). ** Dimension does not include interleads flash or protrusion (shall not exceed 0.25 per side). *** Dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. REVISION 011 – AUGUST 17, 2017 Page 45 of 48 MLX90316 Rotary Position Sensor IC Datasheet 19.5. TSSOP-16 - Pinout and Marking 16 1 VDIG1 VSS1 Test 11 OUT1/MOSI/MISO1 SCLK1 316BxG M12345 Xy-E VDD1 Test 01 \SS2/Switch2 SCLK2 \SS1/Switch1 Test 02 VDD2 Marking : VSS2 OUT2/MOSI/MISO2 9 8 Test 12 Part Number MLX90316 (3 digits) Die Version (3 digits) VDIG2 Top 316 BCG Standard BDG SPI Version M12345 Lot number: “M” + 5 digits Xy-E Bottom YY Split lot number + “-E” (Optional) WW Week Date code (2 digits) Year Date code (2 digits) 19.6. TSSOP-16 - IMC Positionning CW COS 2 9 16 Die 1 Die 2 SIN 2 SIN 1 0.30 +/- 0.06 CCW 1.95 2.45 1 8 1.84 2.04 COS 1 2.76 2.96 REVISION 011 – AUGUST 17, 2017 Page 46 of 48 MLX90316 Rotary Position Sensor IC Datasheet Angle detection TSSOP-16 ~ 180 Deg.* 16 9 Die 2 S S Die 2 9 Die 1 N 1 ~ 90 Deg.* 16 S Die 1 8 ~ 270 Deg.* 9 S 16 Die 2 1 ~ 0 Deg.* ~ 180 Deg.* 9 Die 1 8 1 ~ 270 Deg.* 16 N N Die 1 ~ 90 Deg.* 8 1 Die 2 N ~ 0 Deg.* 8 * No absolute reference for the angular information. The MLX90316 is an absolute angular position sensor but the linearity error (Le – See section 9) does not include the error linked to the absolute reference 0 Deg. (which can be fixed in the application through the discontinuity point – See 13.2.2). REVISION 011 – AUGUST 17, 2017 Page 47 of 48 MLX90316 Rotary Position Sensor IC Datasheet 20. Disclaimer The information furnished by Melexis herein is believed to be correct and accurate. Melexis disclaims (i) any and all liability in connection with or arising out of the furnishing, performance or use of the technical data or use of the product as described herein, (ii) any and all liability, including without limitation, special, consequential or incidental damages, and (iii) any and all warranties, express, statutory, implied, or by description, including warranties of fitness for particular purpose, non-infringement and merchantability. No obligation or liability shall arise or flow out of Melexis’ rendering of technical or other services. The information contained herein is provided "as is” and Melexis reserves the right to change specifications and/or any other information contained herein at any time and without notice. Therefore, before placing orders and/or prior to designing this product into a system, users or any third party should obtain the latest version of the relevant information to verify that the information being relied upon is current. This document supersedes and replaces all prior information regarding the product(s) as described herein and/or previous versions of this document. Users or any third party must further determine the suitability of the Melexis’ product(s) described herein for its application, including the level of reliability required and determine whether it is fit for a particular purpose. The information contained herein is proprietary and/or confidential information of Melexis. The information contained herein or any use thereof does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. This document as well as the product(s) described herein may be subject to export control regulations. Please be aware that export might require a prior authorization from competent authorities. The product(s) as described herein is/are intended for use in normal commercial applications. Unless otherwise agreed upon in writing, the product(s) described herein are not designed, authorized or warranted to be suitable in applications requiring extended temperature range, unusual environmental requirements. High reliability applications, such as medical life-support or lifesustaining equipment are specifically not recommended by Melexis. The product(s) may not be used for the following applications subject to export control regulations: the development, production, processing, operation, maintenance, storage, recognition or proliferation of 1) chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such weapons: 2) civil firearms, including spare parts or ammunition for such arms; 3) defense related products, or other material for military use or for law enforcement; 4) any applications that, alone or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can be used as a means of violence in an armed conflict or any similar violent situation. Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found at https://www.melexis.com/en/legal/terms-and-conditions. Melexis NV © - No part of this document may be reproduced without the prior written consent of Melexis. (2017) ISO/TS 16949 and ISO14001 Certified 21. Contact For the latest version of this document, go to our website at www.melexis.com. For additional information, please contact our Direct Sales team and get help for your specific needs: Europe, Africa Telephone: +32 13 67 04 95 Email : sales_europe@melexis.com Americas Telephone: +1 603 223 2362 Email : sales_usa@melexis.com Asia Email : sales_asia@melexis.com REVISION 011 – AUGUST 17, 2017 Page 48 of 48
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