MLX90393
Triaxis® Magnetic Node
Datasheet
1. Features and Benefits
Absolute Position Sensor IC featuring
Triaxis® Hall Technology
Simple & Robust Magnetic Design
Miniature size for tiny assemblies
Selectable SPI and I2C bus protocols
Wide dynamic range (5-50mT) with on-thefly programmable gain
2.2V-3.6V supply for battery powered
applications, down to 1.8V IO voltage
On board filter settings
On the fly programmable operating modes
and sleep times for micro-power use
External and internal acquisition triggering
modes
External interrupt pin when the field
changes
On board temperature sensor
3. Description
The MLX90393 brings the highest flexibility in the
Triaxis portfolio's smallest packaged assembly.
Additionally, the MLX90393 is designed for
micropower applications, with programmable
duty cycles in the range of 0.1% to 100% allowing
for configurable power consumption based on
system requirements.
The MLX90393 magnetic field sensor can be
reprogrammed to different modes and with
different settings at run-time to fine-tune the
performance and power consumed. The sensor
offers a 16-bit output proportional to the
magnetic flux density sensed along the X, Y, and Z
axes using the Melexis proprietary Triaxis
technology and offers a 16-bit temperature
output signal. These digital values are available via
I2C and SPI, where the MLX90393 is a slave on the
bus. Multiple sensors can be connected to the
same bus, by A0 and A1 hardwired connection (4x)
but also through ordering codes with different SW
address (4x).
By selecting which axes are to be measured, the
raw data can be used as input for further postprocessing, such as for joystick applications,
rotary knobs, and more complex 3D position
sensing applications. Unparalleled performance is
achieved with this sensor, which is primarily
targeting industrial and consumer applications.
2. Application Examples
Non-contacting HMI applications with
push-pull functionality
A1
State Machine
SDA/ MOSI
RAM
Triaxis®
VX
VY
VZ
SCL/ SCLK
VT
Control
SPI/ I2C
Interface
ADC
G
EEPROM
Temp Compensation
Temp Sensor
Home Security 3D closure detection
Accurate liquid level sensing
Factory automation position sensing
Magnetic fingerprint detection
REVISION 008 – JUL 15, 2022
M ISO
M S/ CS
Interrupt
Trigger
Oscillator
Low Power
Oscillator
Wake-Up
Joystick (gimbal or ball & socket)
3901090393
A0
Bias
Rotary knobs & dials
(Long stroke) Linear motion in one or
two axes for levers & sliding switches
VDD_IO
M UX
VDD
Figure 1: General Block Diagram
VSS
MLX90393
Triaxis® Magnetic Node
Datasheet
Contents
1. Features and Benefits ............................................................................................................................ 1
2. Application Examples............................................................................................................................. 1
3. Description ............................................................................................................................................ 1
4. Ordering Information ............................................................................................................................ 4
5. Functional Diagram ............................................................................................................................... 5
5.1. QFN-16 Block Diagram........................................................................................................................ 5
5.2. UTDFN-8 Block Diagram ..................................................................................................................... 5
6. Glossary of Terms .................................................................................................................................. 6
7. QFN-16 Pinout ....................................................................................................................................... 7
8. UTDFN-8 Pinout ..................................................................................................................................... 8
9. Absolute Maximum Ratings ................................................................................................................... 9
10. General Electrical Specifications ........................................................................................................ 10
11. Thermal Specification ........................................................................................................................ 11
12. Timing Specification........................................................................................................................... 12
13. Magnetic Specification ...................................................................................................................... 14
13.1. Noise vs Conversion Time .............................................................................................................. 16
14. Mode Selection ................................................................................................................................. 17
14.1. Burst mode...................................................................................................................................... 18
14.2. Single Measurement mode ............................................................................................................ 18
14.3. Wake-Up on Change mode ............................................................................................................ 19
15. Digital Specification ........................................................................................................................... 19
15.1. Command List ................................................................................................................................. 20
15.2. Status Byte ...................................................................................................................................... 21
15.3. SPI Communication......................................................................................................................... 21
15.3.1. Command implementation ...................................................................................................... 22
15.3.2. SPI Timing Specification............................................................................................................ 24
15.4. I2C Communication ......................................................................................................................... 24
15.4.1. Command Implementation ...................................................................................................... 25
15.4.2. I2C Timing Specification ............................................................................................................ 27
16. Memory Map..................................................................................................................................... 27
16.1. General Description ........................................................................................................................ 27
16.2. Parameter Description ................................................................................................................... 30
REVISION 008 – JUL 15, 2022
3901090393
Page 2 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
16.2.1. ANA_RESERVED_LOW .............................................................................................................. 31
16.2.2. BIST ............................................................................................................................................ 31
16.2.3. Z_Series ..................................................................................................................................... 31
16.2.4. GAIN_SEL[2:0] ........................................................................................................................... 32
16.2.5. HALLCONF[3:0] ......................................................................................................................... 33
16.2.6. TRIG_INT_SEL ............................................................................................................................ 33
16.2.7. COMM_MODE[1:0] .................................................................................................................. 33
16.2.8. WOC_DIFF ................................................................................................................................. 33
16.2.9. EXT_TRIG ................................................................................................................................... 34
16.2.10. TCMP_EN ................................................................................................................................ 34
16.2.11. BURST_SEL[3:0] ...................................................................................................................... 34
16.2.12. OSR2[1:0] ................................................................................................................................ 34
16.2.13. RES_XYZ[5:0] ........................................................................................................................... 34
16.2.14. DIG_FILT[1:0] .......................................................................................................................... 34
16.2.15. OSR[1:0] .................................................................................................................................. 34
16.2.16. SENS_TC_HT[7:0] .................................................................................................................... 34
16.2.17. SENS_TC_LT[7:0] .................................................................................................................... 34
16.2.18. OFFSET_i[15:0]........................................................................................................................ 35
16.2.19. WOi_THRESHOLD[15:0] ......................................................................................................... 35
17. Recommended Application Diagram ................................................................................................. 36
1.1 I2C........................................................................................................................................................ 36
1.2 SPI ....................................................................................................................................................... 36
18. Packaging Specification ..................................................................................................................... 37
18.1. QFN-16 ............................................................................................................................................ 37
18.1.1. Package dimensions and sensitive spot location .................................................................... 37
18.1.2. QFN-16 - Pinout and Marking .................................................................................................. 38
18.2. UDTFN-8 package ........................................................................................................................... 39
18.2.1. Package dimensions and sensitive spot location .................................................................... 39
18.2.2. UTDFN-8 - Pinout and Marking ................................................................................................ 40
19. Standard Information ........................................................................................................................ 40
20. ESD Precautions................................................................................................................................. 40
21. Revision History ................................................................................................................................. 41
22. Contact .............................................................................................................................................. 42
23. Disclaimer .......................................................................................................................................... 43
REVISION 008 – JUL 15, 2022
3901090393
Page 3 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
4. Ordering Information
Product
Temperature
MLX90393
MLX90393
MLX90393
MLX90393
MLX90393
MLX90393
MLX90393
MLX90393
MLX90393
MLX90393
S (-20°C to 85°C)
S (-20°C to 85°C)
S (-20°C to 85°C)
S (-20°C to 85°C)
E (-40°C to 85°C)
E (-40°C to 85°C)
E (-40°C to 85°C)
E (-40°C to 85°C)
S (-40°C to 85°C)
S (-20°C to 85°C)
Package Option Code
LW
LW
LW
LW
LW
LW
LW
LW
LW
LQ
Packing Form Definition
ABA-011
ABA-012
ABA-013
ABA-014
ABA-011
ABA-012
ABA-013
ABA-014
ABA-111
ABA-011
RE
RE
RE
RE
RE
RE
RE
RE
RE
RE
I2C address = 00011xx
I2C address = 00100xx
I2C address = 00101xx
I2C address = 00110xx
I2C address = 00011xx
I2C address = 00100xx
I2C address = 00101xx
I2C address = 00110xx
I2C address = 00011xx
I2C address = 0010000
Table 1: Product Ordering Codes
Legend:
Temperature Code:
S: from -20°C to 85°C
E: from -40°C to 85°C
Package Code:
“LW” for QFN-16 3x3x1mm package with wettable flanks
“LQ” for UTDFN-8 2.5x2mm package
Option Code:
ABA-xx1, ABA-xx2, ABA-xx3, ABA-xx4: Different I2C addresses – 5 most significant
bits. The 2 least significant bits of the address are defined by the external address
pins A0 and A1.
ABA-0xx: Standard IMC, magnetic saturation onset at 50mT
ABA-1xx: Thin IMC, magnetic saturation onset at 25mT
Packing Form:
“RE for Reel”
Ordering Example:
“MLX90393-ELW-ABA-011-RE”
MLX90393 Micropower magnetometer with I2C address 00011xx where the last
two bits are defined by external address pins A0 and A1. In QFN package,
temperature range -40°C to 85°C.
Table 2: Product Ordering Code Example
REVISION 008 – JUL 15, 2022
3901090393
Page 4 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
5. Functional Diagram
5.1. QFN-16 Block Diagram
5.2. UTDFN-8 Block Diagram
REVISION 008 – JUL 15, 2022
3901090393
Page 5 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
6. Glossary of Terms
Term
Definition
TC
Temperature Coefficient (in ppm/°C)
Gauss (G), Tesla (T)
Units for the magnetic flux density 1 mT = 10 G
NC
Not Connected
PWM
Pulse Width Modulation
%DC
Duty Cycle of the output signal i.e. TON /(TON + TOFF)
ADC
Analog-to-Digital Converter
DAC
Digital-to-Analog Converter
LSb
Least Significant Bit
MSb
Most Significant Bit
DNL
Differential Non-Linearity
INL
Integral Non-Linearity
EMC
Electro-Magnetic Compatibility
REVISION 008 – JUL 15, 2022
3901090393
Page 6 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
7. QFN-16 Pinout
Pin Name
#
Type
Primary
Supply
System
Wiring Recommendation
Secondary Reference
To
I 2C
4-wire
SPI
3-wire
SPI
Optional
1
INT
I/O out
N/A
VDD_IO
Optional
Optional
2
SENB/CS
I/O in
MLX Test
VDD_IO
To
VDD_IO
Required Required
3
SCL/SCLK
I/O in
MLX Test
VDD_IO
Required
Required Required
4
N/C
--
--
--
--
--
5
SDA/MOSI I/O bi
MLX Test
VDD_IO
Required
Required
6
MISO
I/O out
MLX Test
VDD_IO
Floating
Required
7
INT/TRIG
I/O bi
N/A
VDD_IO
Optional
Optional
8
VDD_IO
Supply
N/A
Required
Required Required
9
N/C
--
--
--
--
--
--
10
N/C
--
--
--
--
--
--
11
A1
I2C Address LSB
MLX Test
VDD
To
To GND
VDD/GND
To GND
12
A0
I2C Address LSB
MLX Test
VDD
To
To GND
VDD/GND
To GND
13
VSS
Ground
N/A
14
N/C
--
--
15
VDD
Supply
N/A
16
N/C
--
--
--
--
-Short
together
Optional
Required
Required Required
--
--
Required
Required Required
--
--
--
--
Table 3: Pinout Description
It is recommended to connect the N/C pins (Not Connected) to Ground.
The exposed pad of the QFN package can be left floating or shorted to ground.
REVISION 008 – JUL 15, 2022
3901090393
Page 7 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
8. UTDFN-8 Pinout
Pin
#
Name
Type
Primary
Supply
System
Secondary Reference
To
1
2
3
SCL/SCLK
I/O in
SDA/MOSI I/O bi
MISO
I/O out
MLX Test
MLX Test
MLX Test
VDD_IO
VDD_IO
VDD_IO
4
5
6
7
VDD_IO
VSS
VDD
SENB/CS
Supply
Ground
Supply
I/O in
N/A
N/A
N/A
MLX Test
VDD_IO
8
INT
I/O out
N/A
VDD_IO
Wiring Recommendation
I 2C
4-wire
SPI
3-wire
SPI
Required
Required
Floating
Required Required
Required
Short
Required together
Required
Required
Required
To
VDD_IO
Optional
Required
Required
Required
Required
Required
Required
Required
Required
Optional
Optional
Table 4: UTDFN-8 Pinout Description
The exposed pad of the UTDFN-8 package can be left floating or shorted to ground.
REVISION 008 – JUL 15, 2022
3901090393
Page 8 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
9. Absolute Maximum Ratings
Parameter
Symbol
Min.
VDD_MAX
Analog Supply Voltage Limits
VDD_IO_MAX
Typ.
Max.
Unit
-0.3
4
V
Digital IO Supply Limits
-0.3
min(4, VDD+0.3)
V
TSTORAGE
Storage (idle) temperature range
-50
125
°C
ESDHBM
According to AEC-Q100-002
2.5
kV
ESDCDM
According to AEC-Q100-011-B (QFN)
750
V
Table 5: Absolute Maximum Ratings
Exceeding the absolute maximum ratings may cause permanent damage.
conditions for extended periods may affect device reliability.
REVISION 008 – JUL 15, 2022
3901090393
Exposure to absolute maximum-rated
Page 9 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
10. General Electrical Specifications
Parameter
Remark
Min
Nom
Max
Unit
Analog Supply Voltage
2.2
3
3.6
V
VDD_IO
Digital IO Supply
1.65
1.8
VDD
V
VPOR_LH
Power-on Reset threshold
1.42
1.55
V
VDD
(rising edge)
VPOR_HL
Power-on Reset threshold
1
1.31
V
(falling edge)
IDD,CONVXY
Conversion Current XY-axis
2.29
3
mA
IDD,CONVZ
Conversion Current Z-axis
2.96
4
mA
IDD,CONVT
Conversion Current Temperature
1.60
2
mA
Current during TCONV_END
1.5
1.75
mA
1.2
1.75
mA
1.2
1.75
mA
43
60
µA
2.4
5
µA
IDD, CONV_END
IDD_ACTIVE
Current during TACTIVE
IDD_IDLEtoSTBY
Current during TSTBY
IDD,STBY
Standby Current(1)
IDD,IDLE
Idle Current(2)
IDD,NOM
Nominal Current (TXYZ, Datarate = 10Hz,
OSR=OSR2=0, DIG_FILT=4)
1
100
µA
Table 6: General Electrical Specifications
1
Standby current corresponds to the current consumed in the digital where only the low power oscillator is running.
This standby current is present in burst mode, or whenever the IC is counting down to start a new conversion.
2
Idle current corresponds to the current drawn by the IC in idle mode where all operating functions are disabled except
communications.
REVISION 008 – JUL 15, 2022
3901090393
Page 10 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
11. Thermal Specification
The MLX90393 has an on-board temperature sensor which measures the temperature of the MLX90393
sensor. The temperature can be read out via the communication protocol in a digital format
Parameter
Symbol
Min.
Typ.
Max.
Unit
TRES
Temperature sensor resolution
45.2
LSB/°C
T25
Temperature sensor output at 25°C
46244
LSB16u
TLIN
Temperature Linearity (3)
+/-3
°C
TOPERATING
Operating temperature range [S code]
-20
25
85
°C
Operating temperature range [E code]
-40
25
85
°C
Table 7: Thermal Specifications
3
The linearity is defined as the best fit curve through the digital temperature outputs over the entire temperature
range. It includes ADC non-linearity effects
REVISION 008 – JUL 15, 2022
3901090393
Page 11 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
12. Timing Specification
The specifications are applicable at 25 Deg. C unless specified otherwise and for the complete supply range.
Parameter
Remark
Min
Nom
Max
Unit
Main Oscillator & Derived Timings
TSTBY
Time from IDLE to STBY
176
220
264
µs
TACTIVE
Time from STBY to ACTIVE
288
360
432
µs
TCONVM
Single Magnetic axis conversion time(4)
typical programming range
259
TCONVT
Temperature conversion time
typical programming range
259
TCONV_END
Time to end analog active mode
80
TCONV_SMM
Total conversion time in Single
Measurement Mode
66627
67 + 64 ∙ 2
∙ (2 + 2
_
)
1603
67 + 192 ∙ 2
100
120
µs
µs
µs
TSTBY + TACTIVE + m*TCONVM + TCONVT+
TCONV_END
ms
TCONV_BURST_NDLY
Total conversion time in BURST with burst
data rate =0
m*TCONVM + TCONVT+ TCONV_END
ms
TCONV_BURST_DLY
Total conversion time in BURST with burst
data rate > 0
TACTIVE + m*TCONVM + TCONVT+ TCONV_END
ms
TCONV_WOC_NDLY
Total conversion time in WOC with burst
data rate = 0
m*TCONVM + TCONVT+ TCONV_END
ms
TCONV_WOC_DLY
Total conversion time in WOC with burst
data rate > 0
TSTBY + TACTIVE + m*TCONVM + TCONVT+
TCONV_END
ms
TOSC_TRIM
Trimming accuracy
-5
+5
%
TOSC_THD
Thermal drift (full temperature range)
-5
+5
%
Low-power Oscillator & Derived Timings
TINTERVAL
Time in between 2 conversions (Burst
mode or Wake-Up on Change)(5)
0
1260
BURST_DATA_RATE * 20
ms
TLPOSC_TRIM
Trimming accuracy
-4
+4
%
TLPOSC_THD
Thermal drift (full temperature range)
-5
+5
%
4
This conversion time is defined as the time to acquire a single axis of the magnetic flux density. When measuring
multiple axes they are obtained through time multiplexing. The conversion time is programmable through parameters
OSR and DIG_FILT for magnetic values and OSR2 for the temperature value. The conversion sequence is TXYZ, opposite
of the ZYXT argument of the command set.
5
The time TINTERVAL is defined as the time between the end of one set of measurements (any combination of TXYZ) and
the start of the following same set of measurements in BURST and WOC mode. As a result of this, the maximum output
data rate is not only a function of TINTERVAL but equals 1/(TCONV_BURSTWOC + TINTERVAL).
REVISION 008 – JUL 15, 2022
3901090393
Page 12 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
Parameter
Remark
Min
Nom
Max
Unit
0.6
1.5
ms
250
µs
Startup
TPOR
Power-on-reset completion time
External Trigger
TTRIG
Trigger pulse width (active high)
0.01
Table 8: Timing Specifications
REVISION 008 – JUL 15, 2022
3901090393
Page 13 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
13. Magnetic Specification
The specifications are applicable at 25 Deg. C unless otherwise specified and for the complete supply voltage
range.
Parameter
Remark
NADC
ADC span
NOUT
Output span (taken from 19 by RESXYZ)
BRANGE
Output range (function of RESXYZ)
Min
Nom
Max
Unit
17.4
bits
16
bits
RANGE from Table 17:
mT
Sensitivity table for given gain
and resolution selection for
HALLCONF=0xC / SENSii
BSAT
Magnetic saturation onset
50
mT
25
mT
Option codes -011, -012, -013, -014
BSAT
Magnetic saturation onset
Option code -111
OFFS
OFFSTHD
SENSXX,
SENSYY
Deviation from expected 0mT output
Offset thermal drift, Delta from 25°C (6)
0
LSB
< ±1000
LSB
3.220
0.161
µT/LSB
311
6211
LSB/mT
5.872
0.294
µT/LSB
170
3406
LSB/mT
SENSZZ
Programming range of magnetic resolution
(µT/LSB) or sensitivity (LSB/mT) (7)
[modifying GAIN_SEL and RESXYZ], cfr. Table
17: Sensitivity table for given gain and
resolution selection for HALLCONF=0xC
SENSXY,
SENSYX
Cross-axis sensitivity (X/Y-axis sensitivity to
Y/X magnetic fields)
< ±1
%
SENSXZ,
SENSYZ
Cross-axis sensitivity (X/Y-axis sensitivity to Z
magnetic field)
< ±1
%
6
The offset thermal drift is defined as the deviation at 0Gauss from the output with respect to the output at 25°C when
sweeping the temperature. The highest gradient (µT/°C) typically occurs at 85°C. The spec value is based on
characterization on limited sample size at GAIN_SEL=0x7 and RES_XYZ=0x00.
7
The total axis sensitivity is programmable to support different applications, but has no Automatic Gain control on-chip
as do the other angular position sensors from Melexis. The highest gain corresponds to at least the minimum +/-4.8mT
magnetic measurement range and the magnetic resolution defined by SENS ii.
REVISION 008 – JUL 15, 2022
3901090393
Page 14 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
Parameter
Remark
Min
SENSZX,
SENSZY
Cross-axis sensitivity (Z-axis sensitivity to X
and Y magnetic fields)
SENSTHD
Sensitivity thermal drift
Nom
Max
Unit
< ±1
-3
%
+3
%
Delta from 25°C(8)
Table 9: Magnetic Specifications
8
The sensitivity thermal drift is expressed as a band around the sensitivity at 25°C. It is applicable on wafer level
trimming, but can be influenced by packaging (overmolding).
REVISION 008 – JUL 15, 2022
3901090393
Page 15 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
13.1. Noise vs Conversion Time
The MLX90393 provides configurable filters to adjust the tradeoff between current consumption, noise, and
conversion time. See section 15.1.5 for details on selecting the conversion time by adjusting OSR and
DIG_FILT.
XY-axis Noise over Conversion Time (bundled per OSR setting)
60
Noise Stdev [mGauss]
50
40
OSR = 0
30
OSR = 1
OSR = 2
20
OSR = 3
10
0
1
10
100
Conversion Time [ms]
Figure 2: XY axis RMS noise versus conversion time, expressed in mGauss for GAIN_SEL = 0x7 - Based on -0xx version
Z-axis Noise over Conversion Time (bundled per OSR setting)
90
80
Noise Stdev [mGauss]
70
60
50
OSR = 0
OSR = 1
40
OSR = 2
30
OSR = 3
20
10
0
1
10
100
Conversion Time [ms]
Figure 3: Z axis RMS noise versus conversion time, expressed in mGauss for GAIN_SEL = 0x7 - Based on -0xx version
REVISION 008 – JUL 15, 2022
3901090393
Page 16 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
14. Mode Selection
The MLX90393 can operate in three modes. They are: Burst mode, Single Measurement mode, and WakeOn-Change mode.
Burst mode
The ASIC will have a programmable data rate at which it will operate. This data rate implies autowakeup and sequencing of the ASIC, flagging that data is ready on a dedicated pin (INT/DRDY). The
maximum data rate corresponds to continuous burst mode, and is a function of the chosen
measurement axes. For non-continuous burst modes, the time during which the ASIC has a counter
running but is not doing an actual conversion is called the Standby mode (STBY).
Single Measure mode
The master will ask for data via the corresponding protocol (I2C or SPI), waking up the ASIC to make a
single conversion, immediately followed by an automatic return to sleep mode (IDLE) until the next
polling of the master. This polling can also be done by strobing the TRG pin instead, which has the
same effect as sending a protocol command for a single measurement.
Wake-Up on Change
This mode is similar to the burst mode in the sense that the device will be auto-sequencing, with the
difference that the measured component(s) is/are compared with a reference and in case the
difference is bigger than a user-defined threshold, the DRDY signal is set on the designated pin. The
user can select which axes and/or temperature fall under this cyclic check, and which thresholds are
allowed.
The user can change the operating mode at all time through a specific command on the bus. The device
waits in IDLE mode after power-up, but with a proper user command any mode can be set after power-up.
Changing to Burst or WOC mode, coming from Single Measure mode, is always accompanied by a
measurement first. The top-level state diagram indicating the different modes and some relevant timing is
shown below in Figure 4. In the Measure state, the MDATA flag will define which components will be
measured (ZYXT). The order of conversion is defined as TXYZ and cannot be modified by the user, only the
combination of axes is a degree of freedom.
Arrows indicated in grey are the direct result of an Exit command. The main difference between STANDBY
and WOC_IDLE is that in STANDBY mode, all analog circuitry is ready to make a conversion, but this is
accompanied by a larger current consumption than IDLE mode. For burst mode this extra current
consumption is justified because the emphasis is more on accurate timing intervals, avoiding the delay of
TSTBY before conversion and supporting an efficient continuous burst mode without standby overhead.
It is the user’s responsibility to read back the measured data as the MLX90393 is a slave device on the bus.
Even in burst mode and WOC mode when the MLX90393 is auto-sequencing, the master will be responsible
for collecting the acquired sensor data.
REVISION 008 – JUL 15, 2022
3901090393
Page 17 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
Figure 4: Top-level state diagram with indication of timings
14.1. Burst mode
When the sensor is operating in burst mode, it will make conversions at specific time intervals. The
programmability of the user is the following:
Burst speed (TINTERVAL) through parameter BURST_DATA_RATE
Conversion time (TCONV) through parameters OSR, OSR2 and DIG_FILT
Axes/Temperature (MDATA) through parameter BURST_SEL or via the command argument (ZYXT)
Whenever the MLX90393 has made the selected conversions (based on MDATA), the DRDY signal will be set
(active H) on the INT and/or INT/TRG pin to indicate that the data is ready for readback. It will remain high
until the master has sent the command to read out at least one of the converted quantities (ZYXT). Should
the master have failed to read out any of them by the time the sensor has made a new conversion, the
INT/DRDY pin will be strobed low for 10µs, and the next rising edge will indicate a new set of data is ready.
14.2. Single Measurement mode
Whenever the sensor is set to this mode (or after startup) the MLX90393 goes to the IDLE state where it
awaits a command from the master to perform a certain acquisition. The duration of the acquisition will be
the concatenation of the TSTBY, TACTIVE, m*TCONVM (with m # of axes) and TCONVT. The conversion time will
REVISION 008 – JUL 15, 2022
3901090393
Page 18 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
effectively be programmable by the user (see burst mode), but is equally a function of the required
axes/temperature to be measured.
Upon reception of such a polling command from the master, the sensor will make the necessary
acquisitions, and set the DRDY signal high to flag that the measurement has been performed and the master
can read out the data on the bus at his convenience. The INT/DRDY will be cleared either when:
The master has issued a command to read out at least one of the measured components
The master issues an Exit (EX) command to cancel the measurement
The chip is reset, after POR (Power-on reset) or Reset command (RT)
14.3. Wake-Up on Change mode
The Wake-Up on Change (WOC) functionality can be set by the master with as main purpose to only receive
an interrupt when a certain threshold is crossed. The WOC mode will always compare a new burst value with
a reference value to assess if the difference between both exceeds a user-defined threshold. The reference
value is defined as one of the following:
The first measurement of WOC mode is stored as reference value once. This measurement at “t=0” is
then the basis for comparison or,
The reference for acquisition(t) is always acquisition(t-1), in such a way that the INT signal will only
be set if the derivative of any component exceeds a threshold.
The in-application programmability is the same as for burst mode, but now the thresholds for setting the
interrupt are also programmable by the user, as well as the reference, if the latter is data(t=0) or data(t-1).
15. Digital Specification
The supported protocols are I2C and SPI. The SENB/CS pin is used to define the protocol to be used:
/CS = 0 for SPI, addressing the MLX90393 slave in SPI mode (3- and 4-wire), but releasing this line in
between commands (no permanent addressing allowed)
/CS = 1 for I2C, addressing the MLX90393 slave when the correct address is transmitted over the bus
(permanently kept high)
REVISION 008 – JUL 15, 2022
3901090393
Page 19 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
To ensure the activity on the SPI bus cannot be accidentally interpreted as I2C protocol, programming bits
are available in the memory of the MLX90393 to force the communication mode. It concerns the
COMM_MODE[1:0] bits with the following effect:
COMM_MODE[1] COMM_MODE[0]
Description
0
X
The mode in which the first valid command is transmitted to the
MLX90393 defines the operating mode (SPI or I2C) for all its future
commands, until a reset (hard or soft) is done.
1
0
SPI mode only
1
1
I2C mode only
Table 10: Communication mode definition
15.1. Command List
The MLX90393 only listens to a specific set of commands. Apart from the Reset command, all commands
generate a status byte that can be read out. The table below indicates the 10 different commands that are
(conditionally) accepted by the MLX90393. The MLX90393 will always acknowledge a command in I2C, even
if the command is not a valid command. Interpreting the associated status byte is the method for
verification of command acceptance.
Command Set
Command Name
Symbol
#
CMD1 byte
CMD2 byte CMD3 byte CMD4 byte
Start Burst Mode
SB
1
0001 zyxt
N/A
N/A
N/A
Start Wake-up on Change Mode
SW
2
0010 zyxt
N/A
N/A
N/A
Start Single Measurement Mode
SM
3
0011 zyxt
N/A
N/A
N/A
Read Measurement
RM
4
0100 zyxt
N/A
N/A
N/A
Read Register
RR
5
0101 0abc
{A5…A0,0,0}
N/A
N/A
Write Register
WR
6
0110 0abc
D15…D8
D7…D0
{A5…A0,0,0}
Exit Mode
EX
8
1000 0000
N/A
N/A
N/A
Memory Recall
HR
D
1101 0000
N/A
N/A
N/A
Memory Store
HS
E
1110 0000
N/A
N/A
N/A
Reset
RT
F
1111 0000
N/A
N/A
N/A
Table 11: Command List
The argument for the volatile memory access commands (RR/WR) «abc» should be set to 0x0, in order to get
normal read-out and write of the memory.
REVISION 008 – JUL 15, 2022
3901090393
Page 20 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
The argument in all mode-starting commands (SB/SW/SM) is a nibble specifying the conversions to be
performed by the sensor in the following order «zyxt». For example, if only Y axis and temperature are to be
measured in Single Measurement mode the correct command to be transmitted is 0x35. The sequence of
measurement execution on-chip is inverted to «TXYZ», so T will be measured before X, followed by Y and
finally Z. By issuing an all-zero «zyxt» nibble, the BURST_SEL value from RAM will be used instead of the
empty argument of the command.
15.2. Status Byte
The status byte is the first byte transmitted by the MLX90393 in response to a command issued by the
master. It is composed of a fixed combination of informative bits:
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
BURST_MODE
WOC_MODE
SM_MODE
ERROR
SED
RS
D1
D0
Table 12: Status Byte Definition
MODE bits
These bits define in which mode the MLX90393 is currently set. Whenever a mode transition
command is rejected, the first status byte after this command will have the expected mode bit
cleared, which serves as an indication that the command has been rejected, next to the ERROR bit.
The SM_MODE flag can be the result of an SM command or from raising the TRG pin when TRG mode
is enabled in the volatile memory of the MLX90393.
ERROR bit
This bit is set in case a command has been rejected or in case an uncorrectable error is detected in
the memory, a so called ECC_ERROR. A single error in the memory can be corrected (see SED bit),
two errors can be detected and will generate the ECC_ERROR. In such a case all commands but the
RT (Reset) command will be rejected. The error bit is equally set when the master is reading back
data while the DRDY flag is low.
SED bit
The single error detection bit simply flags that a bit error in the non-volatile memory has been
corrected. It is purely informative and has no impact on the operation of the MLX90393.
RS bit
Whenever the MLX90393 gets out of a reset situation – both hard and soft reset – the RS flag is set
to highlight this situation to the master in the first status byte that is read out. As soon as the first
status byte is read, the flag is cleared until the next reset occurs.
D[1:0] bits
These bits only have a meaning after the RR and RM commands, when data is expected as a response
from the MLX90393. The number of response bytes correspond to 2*D[1:0] + 2, so the expected byte
counts are either 2, 4, 6 or 8. For commands where no response is expected, the content of D[1:0]
should be ignored.
15.3. SPI Communication
The MLX90393 can handle SPI communication at a bitrate of 10Mhz. The SPI communication is implemented
in a half-duplex way, showing high similarities with I2C communication, but addressing through the \CS (Chip
Select) pin instead of through bus arbitration. The half-duplex nature is at the basis of the supported 3-wire
REVISION 008 – JUL 15, 2022
3901090393
Page 21 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
SPI operation. SPI mode 3 is implemented: CPHA=1 (data changed on leading edge and captured on trailing
edge, and CPOL=1 (high level is inactive state). The Chip Select line is active-low.
The communication is also bundled in bytes, equally MSB first and MSByte first. A command can of course
consist of more than 1 byte (refer to Table 10: Communication mode definition) as can the response be from
the MLX90393 in the form of multiple bytes after the status byte (not shown in Figure 5: SPI communication
example)
Figure 5: SPI communication example
15.3.1. Command implementation
For the examples give, the below convention is used.
Figure 6: SPI convention
15.3.1.1. SB, SWOC, SM, EX, HR, HS
All the commands follow the structure below. The reply from the MLX90393 is only the status byte. The
example below is for a start of a burst mode with X and Y being measured.
Figure 7: SB command, XY
After the HS command, wait at least 15ms before sending the next command to allow the IC to update the
NVRAM correctly.
REVISION 008 – JUL 15, 2022
3901090393
Page 22 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
15.3.1.2. RT
This command will (warm-)reset the IC. The status byte of the command following will indicate the reset
event. It is recommended to perform an ‘EX’ command before issuing a ‘RT’ command.
Figure 8: RT command
15.3.1.3. RM
This command differs depending on the value for zyxt. The data is returned in the order Status-TXYZ, where
the components which are set to zero are skipped.
Figure 9: RM command, XYZT
Figure 10: RM command, YT
15.3.1.4. RR
Important in this command is that the register address to be read needs to be shifter left by two bits. To
read register 0x12 for example, the MOSI byte becomes 0x48.
Figure 11: RR command
15.3.1.5. WR
Important in this command is that the register address to be read needs to be shifter left by two bits. To
read register 0x12 for example, the MOSI byte becomes 0x48.
Figure 12: WR command
REVISION 008 – JUL 15, 2022
3901090393
Page 23 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
15.3.2. SPI Timing Specification
All timings are referred to the levels found in Table 6: General Electrical Specifications.
Electrical Parameter
Symbol
SPI Clock Cycle
SPI Clock Cycle
CS Setup Time
CS Hold Time
SDI Input Setup Time
SDI Input Hold Time
SDO Valid Output Time
SDO Output Hold Time
SDO Output Disable Time
tc (SPC)
tc (SPC)
tsu (CS)
th (CS)
tsu (SI)
th (SI)
tv (SO)
th (SO)
tdis (SO)
Min.
Max.
Unit
100
10
5
10
5
15
50
5
50
ns
MHz
ns
ns
ns
ns
ns
ns
ns
Table 13: General SPI Timing Specification
Figure 13: SPI Timing Diagram
15.4. I2C Communication
The I2C protocol is implemented such that the command is written to a specific register in the RAM, and the
status and measurement data are read back from this RAM. The commands themselves are the same as for
SPI (section 15.3) except for the read measurement commands and the memory read/write commands. For
memory read/write commands, written can be done directly to the required register. Note that memory
read/write commands are required to be word-wise, so always in multiples of 2 bytes. Read measurement is
the same as a memory read, except starting from the status register. MSbits are sent first.
The 7-bit I2C-address is determined by the connection to the A0 and A1 pins. The 5 MSBs are programmed
by Melexis in the MLX90393. Please contact Melexis in case other addressing is required.
REVISION 008 – JUL 15, 2022
3901090393
Page 24 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
7
0
6
5
4
3
0
0
1
1
7-bit I2C address
2
0 if A1 shorted to ground
1 if A1 shorted to supply
1
0 if A0 shorted to ground
1 if A0 shorted to supply
R/W bit
0
2
0 for I C write
1 for I2C read
Ordering Code
EE_I2C_ADDR[4:0]
7-bit I2C addresses possible
MLX90393xLW-ABA-011-RE
0x03
0x0C, 0x0D, 0x0E, 0x0F
MLX90393xLW-ABA-012-RE
0x04
0x10, 0x11, 0x12, 0x13
MLX90393xLW-ABA-013-RE
0x05
0x14, 0x15, 0x16, 0x17
MLX90393xLW-ABA-014-RE
0x06
0x18, 0x19, 0x1A, 0x1B
MLX90393xLQ-ABA-011-RE
0x04
0x10
Table 14: I2C address ordering codes
15.4.1. Command Implementation
For the examples given, the below convention is used.
Figure 14: I2C Convention
15.4.1.1. SB, SWOC, SM, EX, HR, HS
All the commands follow the structure below. The reply from the MLX90393 is only the status byte. The
example below is for a start of a burst mode with X and Y being measured.
Figure 15: SB command, XY
After the HS command, wait at least 15ms before sending the next command to allow the IC to update the
NVRAM correctly.
REVISION 008 – JUL 15, 2022
3901090393
Page 25 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
15.4.1.2. RT
This command will (warm-)reset the IC. The status byte of the command following will indicate the reset
event. It is recommended to perform an ‘EX’ command before issuing a ‘RT’ command.
Figure 16: RT command
15.4.1.3. RM
This command differs depending on the value for zyxt. The data is returned in the order Status-TXYZ, where
the components which are set to zero are skipped.
Figure 17: RM command-XYZT
Figure 18: RM command-YT
15.4.1.4. RR
Important in this command is that the register address to be read needs to be shifted left by two bits. To
read register 0x12 for example, the SDA byte becomes 0x48.
Figure 19: RR command
15.4.1.5. WR
Important in this command is that the register address to be read needs to be shifted left by two bits. To
read register 0x12 for example, the SDA byte becomes 0x48.
Figure 20: WR command
REVISION 008 – JUL 15, 2022
3901090393
Page 26 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
15.4.2. I2C Timing Specification
All timings are referred to the levels found in Table 6: General Electrical Specifications.
Electrical Parameter
Symbol
SCL Clock Frequency
SCL Clock Low Time
SCL Clock High Time
SDA Setup Time
SDA Data Hold Time
f (SCL)
tw (SCLL)
tw (SCLH)
tsu (SDA)
th (SDA)
tr (SDA)
tr (SCL)
tr (SDA)
tr (SCL)
th (ST)
tsu (SR)
tsu (SP)
SDA and SCL Rise Time
SDA and SCL Fall Time
START Condition Hold Time
REPEATED START Condition Setup Time
STOP Condition Setup Time
Bus Free Time Between STOP and START
Condition
I2C Standard Mode
Min.
Max.
100
I2C Fast Mode
Min.
Unit
3.45
1.3
0.6
100
0
0.9
kHz
µs
µs
ns
µs
1000
20+0.1*Cb(9)
300
ns
300
20+0.1*Cb(9)
300
ns
4.7
4
250
tw (SP:ST)
Max.
400
4
4.7
4
0.6
0.6
0.6
µs
µs
µs
4.7
1.3
µs
Table 15: General I2C Timing Specification
tf (SDA)
REPEATED
START
tr (SDA)
START
tsu (SR)
SDA
STOP
tsu (SDA)
START
th (SDA)
tsu (SP)
tw (SP:ST)
SCL
th (ST)
tw (SCLL) tw (SCLH)
tr (SCL)
tf (SCL)
Figure 21: I2C Timing Diagram
16. Memory Map
16.1. General Description
The MLX90393 has 1kbit of non-volatile memory, and the same amount of volatile memory. Each memory
consists out of 64 addresses containing 16 bit words. The non-volatile memory has automatic 2-bit error
9
Where Cb is the total bus capacitance (in pF)
REVISION 008 – JUL 15, 2022
3901090393
Page 27 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
detection and 1-bit error correction capabilities per address. The handling of such corrections & detections
is explained in Section 15.2.
The memory is split in 2 areas:
Customer area [address 0x00 to 0x1F]
Melexis area [address 0x20 to 0x3F]
The RR and WR commands impact the volatile memory only, there no direct access possible to the nonvolatile memory. The customer area of the volatile memory is bidirectionally accessible to the customer; the
Melexis area is write-protected. Only modifications in the blue area are allowed with the WR command. The
adjustments in the customer area can be stored in the permanent non-volatile memory with the STORE
command HS, which copies the entire volatile memory including the Melexis area to the non-volatile one.
With the HR command the non-volatile memory content can be recalled to the volatile memory, which can
restore any modifications due to prior WR commands. The HR step is performed automatically at start-up of
the ASIC, either through cold reset or warm reset with the RT command.
The above is graphically shown in Figure 22.
Figure 22: The memories of the MLX90393, their areas and the impacting commands.
The customer area houses 3 types of data:
Analog configuration bits
Digital configuration bits
Informative (free) bits
REVISION 008 – JUL 15, 2022
3901090393
Page 28 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
The latter can be filled with customer content freely, and covers the address span from (and including) 0x0A
to 0x1F, a total of 352 bits. The memory mapping of volatile and non-volatile memory on address level is
identical. The volatile memory map is given in Figure 23.
The table below gives an overview of the customer area in the MLX90393’s NVRAM.
In the register map, the 16-bit words are split into 2 bytes for the sake of readability. The general format is
shown below in the yellow table.
Register
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0x..
Bit 7
Bit 15 (MSB)
Bit 6
Bit 14
Bit 5
Bit 13
Bit 4
Bit 12
Bit 3
Bit 11
Bit 2
Bit 10
Bit 1
Bit 9
Bit 0 (LSB)
Bit 8
Register
Bit 7
Bit 6
Bit 5
0x00h
0x01h
0x02h
Z-SERIES
Bit 4
Bit 3
GAIN_SEL
Bit 2
Bit 1
Bit 0
HALLCONF
ANA_RESERVED_LOW
BURST_SEL (zyxt)
TRIG_INT
COMM_MODE
RES_Y
0x03h
RES_X
BURST_DATA_RATE (BDR)
WOC_DIFF EXT_TRG TCMP_EN
DIG_FILT
OSR2
0x05h
OFFSET_Y
OFFSET_Y
RES_Z
RES_Y
OFFSET_Z
OFFSET_Z
0x07h
WOXY_THRESHOLD
WOXY_THRESHOLD
0x08h
WOZ_THRESHOLD
WOZ_THRESHOLD
0x0Ah
…
0x1Fh
OSR
SENS_TC_HT
OFFSET_X
OFFSET_X
0x09h
BURST_SEL (zyxt)
SENS_TC_LT
0x04h
0x06h
BIST
WOT_THRESHOLD
WOT_THRESHOLD
FREE
Figure 23: Customer area memory map.
The non-volatile memory can only be written (HS store command) if pin VDD is supplied with 3.3V minimum,
otherwise the write sequence cannot be performed in a reliable way. Additionally, this HS command was
designed to be used as one-time calibration, but not as multi write-cycle memory within the application. In
case memory is written within the application, the number of write cycles should be kept to a minimum.
There is no limit to the write cycles in the volatile memory (WR write command).
REVISION 008 – JUL 15, 2022
3901090393
Page 29 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
16.2. Parameter Description
The meaning of each customer accessible parameter is explained in this section. The customer area of both
the volatile and the non-volatile memory can be written through standard SPI and I2C communication, within
the application. No external high-voltages are needed to perform such operations, nor access to dedicated
pins that need to be grounded in the application.
Parameter
Description
ANA_RESERVED_LOW
Reserved IO trimming bits
BIST
Enabled the on-chip coil, applying a Z-field [Built-In Self Test]
Z_SERIES
Enable all plates for Z-measurement
GAIN_SEL[2:0]
Analog chain gain setting, factor 5 between min and max code
HALLCONF[3:0]
Hall plate spinning rate adjustment
TRIG_INT_SEL
Puts TRIG_INT pin in TRIG mode when cleared, INT mode otherwise
COMM_MODE[1:0]
Allow only SPI [10b], only I2C [11b] or both [0Xb] according to CS pin
WOC_DIFF
Sets the Wake-up On Change based on Δ{sample(t),sample(t-1)}
EXT_TRIG
Allows external trigger inputs when set, if TRIG_INT_SEL = 0
TCMP_EN
Enables on-chip sensitivity drift compensation
BURST_SEL[3:0]
Defines the MDATA in burst mode if SB command argument = 0
BURST_DATARATE[6:0]
Defines TINTERVAL as BURST_DATA_RATE * 20ms
OSR2[1:0]
Temperature sensor ADC oversampling ratio
RES_XYZ[5:0]
Selects the desired 16-bit output value from the 19-bit ADC
DIG_FILT[1:0]
Digital filter applicable to ADC
OSR[1:0]
Magnetic sensor ADC oversampling ratio
SENS_TC_HT[7:0]
Sensitivity drift compensation factor for T < TREF
SENS_TC_LT[7:0]
Sensitivity drift compensation factor for T > TREF
OFFSET_i[15:0]
Constant offset correction, independent for i = X, Y, Z
WOi_THRESHOLD[15:0]
Wake-up On Change threshold, independent for i = X, Y, Z and T
Table 16: NVRAM parameter description
REVISION 008 – JUL 15, 2022
3901090393
Page 30 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
16.2.1. ANA_RESERVED_LOW
Reserved bits for analog trimming at Melexis factory. Do not modify.
16.2.2. BIST
Enables (1) or disables (0) the built in self-test coil. In normal operation set to 0. A measurement with this
coil enabled shows a change in magnetic field sensed on the Z-axis.
16.2.3. Z_Series
Enables series connection of hall plates for Z axis measurement. In normal operation set to 0.
REVISION 008 – JUL 15, 2022
3901090393
Page 31 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
16.2.4. GAIN_SEL[2:0]
Sets the analog gain to the desired value. The sensitivity is dependent on the axis (the X- and Y-axis have
higher sensitivity, compared with the Z-axis, expressed in LSB/µT) as well as the setting of the RES_XYZ[5:0]
parameter. The relationship is given in the below table.
Table for HALLCONF(10) = 0xC, sensitivity in µT/LSB, TC off, T=25°C:
GAIN_SEL
0
1
2
3
4
5
6
7
RES = 0
SENSXY SENSZ
0.751
1.210
0.601
0.968
0.451
0.726
0.376
0.605
0.300
0.484
0.250
0.403
0.200
0.323
0.150
0.242
RES = 1
SENSXY SENSZ
1.502
2.420
1.202
1.936
0.901
1.452
0.751
1.210
0.601
0.968
0.501
0.807
0.401
0.645
0.300
0.484
RES = 2
SENSXY SENSZ
3.004
4.840
2.403
3.872
1.803
2.904
1.502
2.420
1.202
1.936
1.001
1.613
0.801
1.291
0.601
0.968
RES = 3
SENSXY SENSZ
6.009
9.680
4.840
7.744
3.605
5.808
3.004
4.840
2.403
3.872
2.003
3.227
1.602
2.581
1.202
1.936
Table 17: Sensitivity table for given gain and resolution selection for HALLCONF=0xC
Table for HALLCONF(10) = 0xC, sensitivity in µT/LSB, TC off, T=35°C:
GAIN_SEL
0
1
2
3
4
5
6
7
RES = 0
SENSXY
SENSZ
0.787
1.267
0.629
1.014
0.472
0.760
0.393
0.634
0.315
0.507
0.262
0.422
0.210
0.338
0.157
0.253
RES = 1
SENSXY SENSZ
1.573
2.534
1.258
2.027
0.944
1.521
0.787
1.267
0.629
1.014
0.524
0.845
0.419
0.676
0.315
0.507
RES = 2
SENSXY
SENSZ
3.146
5.068
2.517
4.055
1.888
3.041
1.573
2.534
1.258
2.027
1.049
1.689
0.839
1.352
0.629
1.014
RES = 3
SENSXY
SENSZ
6.292
10.137
5.034
8.109
3.775
6.082
3.146
5.068
2.517
4.055
2.097
3.379
1.678
2.703
1.258
2.027
Table 18: Sensitivity table for given gain and resolution selection for HALLCONF=0xC
10
For HALLCONF = 0x0, the sensitivity scales with a factor 98/75. For example (0.150µT/LSB with HALLCONF 0xC
becomes 0.196µT/LSB with HALLCONF 0x0)
REVISION 008 – JUL 15, 2022
3901090393
Page 32 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
16.2.5. HALLCONF[3:0]
Modifies the hall plate spinning (2-phase vs 4-phase) which has an effect on the minimum sampling rate
achievable. Some configurations of OSR and DIG_FILT are not permitted. The cells shown in red are not
permitted with HALL_CONF=0xC (default) but are allowed when HALL_CONF=0x0.
DIG_FILT
OSR
Typical TCONV(TXYZ)
for OSR2=0x0 [ms]
0
1
2
3
0
1.27 1.84
3.00
5.30
1
1.46 2.23
3.76
6.84
2
1.84 3.00
5.30
9.91
3
2.61 4.53
8.37
16.05
4
4.15 7.60 14.52 28.34
5
7.22 13.75 26.80 52.92
6
13.36 26.04 51.38 102.07
7
25.65 50.61 100.53 200.37
Table 19: TCONV as a function of OSR & DIG_FILT
DIG_FILT
Maximum ODR
for OSR2=0x0 [Hz]
0
1
2
3
4
5
6
7
OSR
0
716.9
622.7
493.0
348.0
219.2
125.9
68.0
35.4
1
493.0
408.0
303.4
200.6
119.6
66.1
34.9
18.0
2
303.4
241.5
171.5
108.6
62.6
33.9
17.7
9.0
3
171.5
133.0
91.8
56.6
32.1
17.2
8.9
4.5
Table 20: Maximum Output Data Rate (ODR) as a function of OSR & DIG_FILT
16.2.6. TRIG_INT_SEL
When set to 0 the TRIG_INT pin is in trigger mode. When set to 1 the TRIG_INT pin acts as an interrupt pin.
16.2.7. COMM_MODE[1:0]
When set to 0x2 only SPI communication is allowed. When set to 0x3 only I2C communication is allowed.
When set to 0x0 or 0x1 both communication modes can be used but the selection is made by the CS pin.
16.2.8. WOC_DIFF
When wake-on-change mode is enabled this parameter defines the mode to use. When enabled, a
comparison on the current measurement is made with the previous measurement. When disabled, the first
initial measurement is used as a reference.
REVISION 008 – JUL 15, 2022
3901090393
Page 33 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
16.2.9. EXT_TRIG
Allows for external trigger events when set to 1 and TRIG_INT_SEL = 0. When enabled an acquisition will
start with the external trigger pin detects a high value. Acquisitions will continue to be triggered until the
EXT_TRIG pin is brought low.
16.2.10. TCMP_EN
Enables (1) or disables (0) the on-chip sensitivity drift compensation. Enabling the temperature
compensation will influence the way the magnetic values are encoded and transmitted to the system
microcontroller as shown in the table below.
RESi
ABA
TCMP_EN = 0x0
RANGE
0
±215
1
±215
2
±22000
3
±11000
TYPE
2’s complement
0µT = 0LSB
2’s complement
0µT = 0LSB
unsigned
0µT = 215LSB
unsigned
0µT = 214LSB
TCMP_EN = 0x1
RANGE
±215
±215
TYPE
unsigned
0µT = 215LSB
unsigned
0µT = 215LSB
N/A
Table 21: Output Range and Type as a function of TCMP_EN and RES_XYZ={RESX,RESY,RESZ}
16.2.11. BURST_SEL[3:0]
Defines the axes that will be converted in burst mode if the SB command argument is 0.
16.2.12. OSR2[1:0]
Selects the temperature sensor ADC oversampling ratio
16.2.13. RES_XYZ[5:0]
See 16.2.4 for the relationship between the gain and resolution. Additionally, section 16.2.10 for the
relationship between RES_XYZ and the output data format.
16.2.14. DIG_FILT[1:0]
See 16.2.5 for the selection of DIG_FILT and the impact on conversion time.
16.2.15. OSR[1:0]
Oversampling ratio for the magnetic measurements. See 16.2.5 for the selection of OSR
16.2.16. SENS_TC_HT[7:0]
Sensitivity drift compensation factor for T > TREF
16.2.17. SENS_TC_LT[7:0]
Sensitivity drift compensation factor for T < TREF
REVISION 008 – JUL 15, 2022
3901090393
Page 34 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
16.2.18. OFFSET_i[15:0]
Constant offset correction, independent of temperature, and programmable for each individual axis where
i=X, Y, or Z.
16.2.19. WOi_THRESHOLD[15:0]
Wake-on-change threshold. Independently programmable for each magnetic axis (i=X, Y, Z) and temperature
(i=T)
REVISION 008 – JUL 15, 2022
3901090393
Page 35 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
17. Recommended Application Diagram
1.1 I2C
Figure 24: I2C recommended schematic
1.2 SPI
Figure 25: 3/4wire SPI recommended schematic
REVISION 008 – JUL 15, 2022
3901090393
Page 36 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
18. Packaging Specification
18.1. QFN-16
The MLX90393 shall be delivered in a QFN-16 package as shown below in Figure 26.
18.1.1. Package dimensions and sensitive spot location
Figure 26: QFN-16 - Package Outline Drawing
The sensing elements – Hall plates with the patented IMC technology – are located in the center of the die, which on its turn
is located in the center of the package.
REVISION 008 – JUL 15, 2022
3901090393
Page 37 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
18.1.2. QFN-16 - Pinout and Marking
A1
11
Part Number MLX90393 (3 digits)
Die Version (1 digit)
13
8
393A
1234
5YWW
1
2
3
SCL/SCLK
15
MS/CS
VDD
12
INT
VSS
A0
Marking :
VDD_IO
393
1234
7 INT/TRG
6
MISO
5
SDA/MOSI
A
5
Lot number: First 4 digits
YWW
Assembly Year (Y) and week (WW)
5th number of lot number (1 digit)
Figure 27: QFN-16 Pinout and Marking – Top view
REVISION 008 – JUL 15, 2022
3901090393
Page 38 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
18.2. UDTFN-8 package
The MLX90393 shall be delivered in a UTDFN-8 package as shown below in Figure 28:
18.2.1. Package dimensions and sensitive spot location
Y
Y
X
X
Z
Z
Figure 28: UTDFN-8 - Package Outline Drawing
REVISION 008 – JUL 15, 2022
3901090393
Page 39 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
18.2.2. UTDFN-8 - Pinout and Marking
Figure 29: UTDFN-8 – Pinout and Marking
19. Standard Information
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level
according to standards in place in Semiconductor industry.
For further details about test method references and for compliance verification of selected soldering method for
product integration, Melexis recommends reviewing on our web site the General Guidelines soldering
recommendation. For all soldering technologies deviating from the one mentioned in above document (regarding peak
temperature, temperature gradient, temperature profile, etc.), additional classification and qualification tests have to
be agreed upon with Melexis.
For package technology embedding trim and form post-delivery capability, Melexis recommends to consult the
dedicated trim & form recommendation application note: lead trimming and forming recommendations
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information
on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain
Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/en/quality-environment
20. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
REVISION 008 – JUL 15, 2022
3901090393
Page 40 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
21. Revision History
Date
Revision
Remark
11-Nov-2014
001
First Document Release
16-Feb-2015
002
Changed Ordering Code to indicate QFN wettable flanks
Update Document number
Added description of yellow cells in Table 1 and Table 2.
13-Jul-2017
003
Added additional ordering codes for up to 16 sensors on the same
bus and their description in Table 2
Added E temperature code for -40°C capable products and the
associated update of the operating range in chapter 3
Updated template to new Melexis format
28-May-2019
004
UTDFN-8 Package / Pinout/ Marking
Updated sensitivity tables
Additional Communication commands details
Functional flowchart updated
Timings and current consumption updated
08-Jan-2020
006
Additional specifications of Idd, IdletoStby, Idd, Active and
Idd,Conv_end
14-Jan-2021
007
RR + WR in I2C: typo (one bit->two bits)
Sensitivity chapter: footer, and footnote corrected; uT to µT. Added
note that sensitivity increase is in LSB/µT.
RM commands: wrong explanation
RES_XYZ[5:0] and DIG_FILT[1:0]: corrected cross references
OSR[1:0]: link to HALLCONF added
I2C timing diagram
I2C address of UTDFN (was 0001100, now 0010000), in both option
codes and table (I2C chapter)
BIST: some more explanation
13-Jul-2022
008
REVISION 008 – JUL 15, 2022
3901090393
Added version -111
Pin number (8) missing in figure “QFN-16 Pinout and Marking – Top
view”
UTDFN coordinate system rotated 90 degrees
Exposed pad (QFN-16 and UTDFN-8) explanation
us to µs
Page 41 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
22. Contact
For the latest version of this document visit www.melexis.com/MLX90393
For additional information, www.melexis.com/contact
REVISION 008 – JUL 15, 2022
3901090393
Page 42 of 43
MLX90393
Triaxis® Magnetic Node
Datasheet
23. Disclaimer
The content of this document is believed to be correct and accurate. However, the content of this document is furnished "as is" for
informational use only and no representation, nor warranty is provided by Melexis about its accuracy, nor about the results of its
implementation. Melexis assumes no responsibility or liability for any errors or inaccuracies that may appear in this document. Customer
will follow the practices contained in this document under its sole responsibility. This documentation is in fact provided without warranty,
term, or condition of any kind, either implied or expressed, including but not limited to warranties of merchantability, satisfactory quality,
non-infringement, and fitness for purpose. Melexis, its employees and agents and its affiliates' and their employees and agents will not be
responsible for any loss, however arising, from the use of, or reliance on this document. Notwithstanding the foregoing, contractual
obligations expressly undertaken in writing by Melexis prevail over this disclaimer.
This document is subject to change without notice, and should not be construed as a commitment by Melexis. Therefore, before placing
orders or prior to designing the product into a system, users or any third party should obtain the latest version of the relevant information.
Users or any third party must determine the suitability of the product described in this document for its application, including the level of
reliability required and determine whether it is fit for a particular purpose.
This document as well as the product here described may be subject to export control regulations. Be aware that export might require a
prior authorization from competent authorities. The product is not designed, authorized or warranted to be suitable in applications
requiring extended temperature range and/or unusual environmental requirements. High reliability applications, such as medical lifesupport or life-sustaining equipment or avionics application are specifically excluded by Melexis. The product may not be used for the
following applications subject to export control regulations: the development, production, processing, operation, maintenance, storage,
recognition or proliferation of:
1. chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such
weapons;
2. civil firearms, including spare parts or ammunition for such arms;
3. defense related products, or other material for military use or for law enforcement;
4. any applications that, alone or in combination with other goods, substances or organisms could cause serious harm to
persons or goods and that can be used as a means of violence in an armed conflict or any similar violent situation.
No license nor any other right or interest is granted to any of Melexis' or third party's intellectual property rights.
If this document is marked “restricted” or with similar words, or if in any case the content of this document is to be reasonably
understood as being confidential, the recipient of this document shall not communicate, nor disclose to any third party, any part of
the document without Melexis’ express written consent. The recipient shall take all necessary measures to apply and preserve the
confidential character of the document. In particular, the recipient shall (i) hold document in confidence with at least the same
degree of care by which it maintains the confidentiality of its own proprietary and confidential information, but no less than
reasonable care; (ii) restrict the disclosure of the document solely to its employees for the purpose for which this document was
received, on a strictly need to know basis and providing that such persons to whom the document is disclosed are bound by
confidentiality terms substantially similar to those in this disclaimer; (iii) use the document only in connection with the purpose for
which this document was received, and reproduce document only to the extent necessary for such purposes; (iv) not use the
document for commercial purposes or to the detriment of Melexis or its customers. The confidentiality obligations set forth in this
disclaimer will have indefinite duration and in any case they will be effective for no less than 10 years from the receipt of this
document.
This disclaimer will be governed by and construed in accordance with Belgian law and any disputes relating to this disclaimer will be
subject to the exclusive jurisdiction of the courts of Brussels, Belgium.
The invalidity or ineffectiveness of any of the provisions of this disclaimer does not affect the validity or effectiveness of the other
provisions.
The previous versions of this document are repealed.
Melexis © - No part of this document may be reproduced without the prior written consent of Melexis. (2022)
IATF 16949 and ISO 14001 Certified
REVISION 008 – JUL 15, 2022
3901090393
Page 43 of 43
工商网监
湘ICP备2023018690号
