US1881
Hall Latch – High Sensitivity
Features and Benefits
Applications
Wide operating voltage range from 3.5V to 24V
Automotive, Consumer and Industrial
High magnetic sensitivity – Multi-purpose
Solid-state switch
CMOS technology
Brushless DC motor commutation
Chopper-stabilized amplifier stage
Speed detection
Low current consumption
Linear position detection
Open drain output
Angular position detection
Thin SOT23 3L and flat TO-92 3L both RoHS
Compliant packages
Proximity detection
Ordering information
Product code
Temperature Code
Package Code
Option code
Packing form code
US1881
US1881
US1881
US1881
US1881
US1881
E
E
K
K
L
L
SE
UA
SE
UA
SE
UA
AAA-000
AAA-000
AAA-000
AAA-000
AAA-000
AAA-000
RE
BU
RE
BU
RE
UA
Legend:
Temperature code:
Package Code:
Packing Form:
Ordering Example:
L(-40 to 150°C)
E(-40 to 85°C)
K (-40 to 125°C)
SE = TSOT-23L
UA = TO92-3L
BU = Bulk
RE = Reel
US1881ESE-AAA-000-RE
1. Functional Diagram
2. General Description
The Melexis US1881 is a Hall-effect latch designed in
mixed signal CMOS technology.
The device integrates a voltage regulator, Hall sensor
with dynamic offset cancellation system, Schmitt trigger
and an open-drain output driver, all in a single package.
Thanks to its wide operating voltage range and extended
choice of temperature range, it is quite suitable for use
in automotive, industrial and consumer applications.
The device is delivered in a Thin Small Outline Transistor
(TSOT) for surface mount process and in a Plastic Single
In Line (TO-92 flat) for through-hole mount.
Both 3-lead packages are RoHS compliant.
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Contents
Features and Benefits ................................................................................................................................ 1
Applications ............................................................................................................................................... 1
Ordering information................................................................................................................................. 1
1. Functional Diagram................................................................................................................................ 1
2. General Description ............................................................................................................................... 1
3. Glossary of Terms .................................................................................................................................. 3
4. Absolute Maximum Ratings ................................................................................................................... 3
5. Pin Definitions and Descriptions ............................................................................................................ 3
6. General Electrical Specifications ............................................................................................................ 4
7. Magnetic Specifications ......................................................................................................................... 4
8. Output Behaviour versus Magnetic Pole ................................................................................................ 4
9. Detailed General Description ................................................................................................................. 5
10. Unique Features .................................................................................................................................. 5
11. Performance Graphs ............................................................................................................................ 6
11.1. Magnetic parameters vs. TA .............................................................................................................. 6
11.2. Magnetic parameters vs. VDD .......................................................................................................... 6
11.3. VDSON vs. TA ........................................................................................................................................ 6
11.4. VDSON vs. VDD ...................................................................................................................................... 6
11.5. IDD vs. TA ............................................................................................................................................ 6
11.6. IDD vs. VDD........................................................................................................................................... 6
11.7. IOFF vs. TA ........................................................................................................................................... 7
11.8. IOFF vs. VDD .......................................................................................................................................... 7
12. Test Conditions .................................................................................................................................... 7
12.1. Supply Current .................................................................................................................................. 7
12.2. Output Saturation Voltage ............................................................................................................... 7
12.3. Output Leakage Current ................................................................................................................... 7
12.4. Magnetic Thresholds ........................................................................................................................ 7
13. Application Information ....................................................................................................................... 8
13.1. Typical Three-Wire Application Circuit ............................................................................................ 8
13.2. Two-Wire Circuit ............................................................................................................................... 8
13.3. Automotive and Harsh, Noisy Environments Three-Wire Circuit ................................................... 8
14. Application Comments ......................................................................................................................... 8
15. Standard information regarding manufacturability of Melexis products with different soldering
processes .............................................................................................................................................. 9
16. ESD Precautions ................................................................................................................................... 9
17. Package Information .......................................................................................................................... 10
17.1. SE Package (TSOT-3L) ..................................................................................................................... 10
17.2. UA Package (TO-92 flat) .................................................................................................................. 11
18. Contact .............................................................................................................................................. 12
19. Disclaimer .......................................................................................................................................... 12
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3. Glossary of Terms
MilliTesla (mT), Gauss
Units of magnetic flux density:
1mT = 10 Gauss
Restriction of Hazardous Substances
Thin Small Outline Transistor (TSOT package) – also referred with the Melexis package
code “SE”
Electro-Static Discharge
Brush-Less Direct-Current
Magnetic flux density applied on the branded side of the package which turns
the output driver ON (VOUT = VDSon)
Magnetic flux density applied on the branded side of the package which turns
the output driver OFF (VOUT = high)
RoHS
TSOT
ESD
BLDC
Operating Point (BOP)
Release Point (BRP)
4. Absolute Maximum Ratings
Parameter
Supply Voltage
Supply Current
Output Voltage
Output Current
Storage Temperature Range
Maximum Junction Temperature
Symbol
VDD
IDD
VOUT
IOUT
TS
TJ
Value
28
50
28
50
-50 to 150
165
Units
V
mA
V
mA
°C
°C
Table 1: Absolute maximum ratings
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximum- rated
conditions for extended periods may affect device reliability.
Operating Temperature Range
Temperature Suffix “E”
Temperature Suffix “K”
Temperature Suffix “L”
Symbol
TA
TA
TA
Value
-40 to 85
-40 to 125
-40 to 150
Units
°C
°C
°C
5. Pin Definitions and Descriptions
SE Pin №
1
2
3
UA Pin №
1
3
2
Name
VDD
OUT
GND
Type
Supply
Output
Ground
Function
Supply Voltage pin
Open Drain Output pin
Ground pin
Table 2: Pin definitions and descriptions
SE package
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UA package
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Hall Latch – High Sensitivity
6. General Electrical Specifications
o
DC Operating Parameters TA = 25 C, VDD = 3.5V to 24V (unless otherwise specified)
Parameter
Symbol Test Conditions
Min
Typ
Supply Voltage
S VDD
Operating
3.5
ymbol Current
Supply
IDD
B < BRP
Output Saturation Voltage
VDSon
IOUT = 20mA, B > BOP
Test Conditions
Output
Leakage Current
IOFF
B < BRP, VOUT = 24V
0.3
Output Rise Time
tr
0.25
RL = 1kΩ, CL = 20pF
Min
Output Fall Time
tf
0.25
RL = 1kΩ, CL = 20pF
Maximum
Switching Frequency FSW
10
Typ
Package Thermal Resistance
RTH
Single layer (1S) Jedec board
301
Max
Max
24
5
0.5
10
Units
Max
Max
9.5
-0.5
12
9.5
-0.5
12
9.5
-0.5
12.5
Units
Units
mT
mT
mT
mT
mT
mT
mT
mT
mT
V
mA
V
µA
µs
µs
kHz
°C/W
Table 3: Electrical specifications
7.Units
Magnetic Specifications
DC Operating Parameters VDD = 3.5V to 24V (unless otherwise specified)
Parameter
Symbol
Test Conditions
Operating Point
BOP
Release Point
TA = 85°C, E spec.
BRP
Hysteresis
BHYST
Operating Point
BOP
Release Point
TA = 125°C, K spec.
BRP
Hysteresis
BHYST
Operating Point
BOP
Release Point
TA = 150°C, L spec.
BRP
Hysteresis
BHYST
Min
Min
0.5
-9.5
7
0.5
-9.5
7
0.5
-9.5
6
Typ
Typ
Table 4: Magnetic specifications
Note: For typical values, please refer to the performance graphs in section 11
8. Output Behaviour versus Magnetic Pole
DC Operating Parameters TA = -40 ᵒC to 150 ᵒC, VDD = 3.5V to 24V (unless otherwise specified)
Parameter
Test Conditions (SE)
OUT (SE)
Test Conditions (UA)
OUT (UA)
South pole
B < BRP
High
B > BOP
Low
North pole
B > BOP
Low
B < BRP
High
Table 5: Output behaviour versus magnetic pole
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9. Detailed General Description
Based on mixed signal CMOS technology, Melexis US1881 is a Hall-effect device with high magnetic sensitivity. This multipurpose latch suits most of the application requirements.
The chopper-stabilized amplifier uses switched capacitor technique to suppress the offset generally observed with Hall
sensors and amplifiers. The CMOS technology makes this advanced technique possible and contributes to smaller chip
size and lower current consumption than bipolar technology. The small chip size is also an important factor to minimize
the effect of physical stress.
This combination results in more stable magnetic characteristics and enables faster and more precise design.
The wide operating voltage from 3.5V to 24V, low current consumption and large choice of operating temperature range
according to “L”, “K” and “E” specification make this device suitable for automotive, industrial and consumer
applications.
The output signal is open-drain type. Such output allows simple connectivity with TTL or CMOS logic by using a pull-up
resistor tied between a pull-up voltage and the device output.
10. Unique Features
The US1881 exhibits latch magnetic switching characteristics. Therefore, it requires both south and north poles
to operate properly.
The device behaves as a latch with symmetric operating and release switching points (BOP=|BRP|). This means
magnetic fields with equivalent strength and opposite direction drive the output high and low.
Removing the magnetic field (B→0) keeps the output in its previous state. This latching property defines the device as
a magnetic memory.
A magnetic hysteresis BHYST keeps BOP and BRP separated by a minimal value. This hysteresis prevents output oscillation
near the switching point.
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11. Performance Graphs
11.1. Magnetic parameters vs. TA
11.2. Magnetic parameters vs. VDD
11.3. VDSON vs. TA
11.4. VDSON vs. VDD
11.5. IDD vs. TA
11.6. IDD vs. VDD
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11.7. IOFF vs. TA
11.8. IOFF vs. VDD
12. Test Conditions
Note: DUT = Device under Test
12.1. Supply Current
12.2. Output Saturation Voltage
12.3. Output Leakage Current
12.4. Magnetic Thresholds
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13. Application Information
13.1. Typical Three-Wire Application Circuit
13.2. Two-Wire Circuit
13.3. Automotive and Harsh, Noisy Environments
Three-Wire Circuit
14. Application Comments
For proper operation, a 100nF bypass capacitor should be placed as close as possible to the device between the VDD and
ground pin.
For reverse voltage protection, it is recommended to connect a resistor or a diode in series with the VDD pin. When
using a resistor, three points are important:
- the resistor has to limit the reverse current to 50mA maximum (VCC / R1 ≤ 50mA)
- the resulting device supply voltage VDD has to be higher than VDD min (VDD = VCC – R1.IDD)
- the resistor has to withstand the power dissipated in reverse voltage condition (PD = VCC 2/ R1)
When using a diode, a reverse current cannot flow and the voltage drop is almost constant (≈0.7V).
Therefore, a 100Ω/0.25W resistor for 5V application and a diode for higher supply voltage are recommended. Both
solutions provide the required reverse voltage protection.
When a weak power supply is used or when the device is intended to be used in noisy environment, it is
recommended that figure 13.3 from the Application Information section is used.
The low-pass filter formed by R1 and C1 and the zener diode Z1 bypass the disturbances or voltage spikes occurring
on the device supply voltage VDD. The diode D1 provides additional reverse voltage protection.
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15. Standard information regarding manufacturability of Melexis products
with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level
according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature,
temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with
Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive
strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on
qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous
Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx
16. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
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17. Package Information
17.1. SE Package (TSOT-3L)
Notes:
1. Dimension “D” and “E1” do not include
mold flash or protrusions. Mold flash or
protrusion shall not exceed 0.15mm on
“D” and 0.25mm on “E” per side.
2. Dimension “b” does not include dambar
protrusion.
Marking:
Top side :1yww
1 = part number (US1881)
y = last digit of year
ww = calendar week
Bottom side: zzzz
zzzz = last 4 digits for lot#
Hall plate location
0.891
1.417
Notes:
1. All dimensions are in millimeters
0.275
END VIEW
Package line
TOP VIEW
This table in mm
min
max
A
A1
A2
D
E
E1
L
b
c
e
e1
–
1.00
0.025
0.10
0.85
0.90
2.80
3.00
2.60
3.00
1.50
1.70
0.30
0.50
0.30
0.45
0.10
0.20
0.95
BSC
1.90
BSC
0°
8°
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17.2. UA Package (TO-92 flat)
Notes:
1.
2.
Mold flashes and protrusion are not included.
Gate burrs shall not exceed 0.127mm on the top side.
2.0
1.4
0.425
This table in mm
min
max
min
max
A
D
E
F
J
L
L1
S
b1
b2
c
e
e1
2.80
3.20
3.90
4.30
1.40
1.60
0.00
0.20
2.51
2.72
14.0
15.0
1.55
1.75
0.63
0.84
0.35
0.44
0.43
0.52
0.35
0.44
2.51
2.57
1.24
1.30
5°
MAX
5°
REF
45°
REF
3°
REF
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18. Contact
For the latest version of this document, go to our website at www.melexis.com.
For additional information, please contact our Direct Sales team and get help for your specific needs:
Europe, Africa
Telephone: +32 13 67 04 95
Email : sales_europe@melexis.com
Americas
Telephone: +1 603 223 2362
Email : sales_usa@melexis.com
Asia
Email : sales_asia@melexis.com
19. Disclaimer
The information furnished by Melexis herein (“Information”) is believed to be correct and accurate. Melexis disclaims (i) any and all liability in connection with or arising out of the
furnishing, performance or use of the technical data or use of the product(s) as described herein (“Product”) (ii) any and all liability, including without limitation, special,
consequential or incidental damages, and (iii) any and all warranties, express, statutory, implied, or by description, includ ing warranties of fitness for particular purpose, noninfringement and merchantability. No obligation or liability shall arise or flow out of Melexis’ rendering of technical or other services.
The Information is provided "as is” and Melexis reserves the right to change the Information at any time and without notice. Therefore, before placing orders and/or prior to
designing the Product into a system, users or any third party should obtain the latest version of the relevant information to verify that the information being relied upon is current.
Users or any third party must further determine the suitability of the Product for its application, including the level of reliability required and determine whether it is fit for a
particular purpose.
The Information is proprietary and/or confidential information of Melexis and the use thereof or anything described by the Information does not grant, explicitly or implicitly, to
any party any patent rights, licenses, or any other intellectual property rights.
This document as well as the Product(s) may be subject to export control regulations. Please be aware that export might require a prior authorization from competent authorities.
The Product(s) are intended for use in normal commercial applications. Unless otherwise agreed upon in writing, the Product(s) are not designed, authorized or warranted to be
suitable in applications requiring extended temperature range and/or unusual environmental requirements. High reliability applications, such as medical life-support or lifesustaining equipment are specifically not recommended by Melexis.
The Product(s) may not be used for the following applications subject to export control regulations: the development, product ion, processing, operation, maintenance, storage,
recognition or proliferation of 1) chemical, biological or nuclear weapons, or for the development, production, maintenance o r storage of missiles for such weapons: 2) civil
firearms, including spare parts or ammunition for such arms; 3) defense related products, or other material for military use or for law enforcement; 4) any applications that, alone
or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can be used as a means of violence in an armed conflict or any
similar violent situation.
The Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found at https://www.melexis.com/en/legal/terms-andconditions.
This document supersedes and replaces all prior information regarding the Product(s) and/or previous versions of this document.
Melexis NV © - No part of this document may be reproduced without the prior written consent of Melexis. (2016)
ISO/TS 16949 and ISO14001 Certified
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