C1410NCOA

M Features TC1410/TC1410N General Description The TC1410/TC1410N are 0.5A CMOS buffers/drivers. They will not latch-up under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either polarity occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of current of either polarity being forced back into their output. All terminals are fully protected against up to 4 kV of electrostatic discharge. As MOSFET drivers, the TC1410/TC1410N can easily charge a 500 pF gate capacitance in 25 nsec with matched rise and fall times, and provide low enough impedance in both the ‘ON’ and ‘OFF’ states to ensure the MOSFET’s intended state will not be affected, even by large transients. The leading and trailing edge propagation delay times are also matched to allow driving short-duration inputs with greater accuracy. 0.5A High-Speed MOSFET Drivers • Latch-Up Protected: Will Withstand 500 mA Reverse Current • Input Will Withstand Negative Inputs Up to 5V • ESD Protected: 4 kV • High Peak Output Current: 0.5A • Wide Input Supply Voltage Operating Range: - 4.5V to 16V • High Capacitive Load Drive Capability: - 500 pF in 25 nsec • Short Delay Time: 30 nsec Typ. • Consistent Delay Times With Changes in Supply Voltage • Matched Delay Times • Low Supply Current - With Logic ‘1’ Input: 500 µA - With Logic ‘0’ Input: 100 µA • Low Output Impedance: 16Ω • Available in Space-Saving 8-pin MSOP Package • Pinout Same as TC1411/TC1412/TC1413 Package Type 8-Pin MSOP/PDIP/SOIC VDD 1 IN 2 NC 3 GND 4 2 IN 2 NC 3 GND 4 2 8 VDD 7 OUT 6 OUT 5 GND 6,7 VDD 1 8 VDD 7 OUT 6 OUT 5 GND 6,7 Applications • • • • Switch Mode Power Supplies Line Drivers Pulse Transformer Drive Relay Driver Inverting NC = No Connection Non-Inverting NOTE: Duplicate pins must be connected together for proper operation.  2003 Microchip Technology Inc. DS21389C-page 1 TC1410N TC1410 TC1410/TC1410N Functional Block Diagram VDD TC1410 Inverting Output 300 mV Output Input Effective Input C = 10 pF 4.7V Non-Inverting Output TC1410N GND DS21389C-page 2  2003 Microchip Technology Inc. TC1410/TC1410N 1.0 ELECTRICAL CHARACTERISTICS PIN FUNCTION TABLE Symbol VDD INPUT NC GND GND OUTPUT OUTPUT VDD Control input No connection Ground Ground CMOS push-pull output, common to pin 7 CMOS push-pull output, common to pin 6 Supply input, 4.5V to 16V Description Supply input, 4.5V to 16V Absolute Maximum Ratings † Supply Voltage ..................................................... +20V Input Voltage ...................... VDD + 0.3V to GND – 5.0V Power Dissipation (TA ≤ 70°C) MSOP .......................................................... 340 mW PDIP ............................................................ 730 mW SOIC............................................................ 470 mW Storage Temperature Range.............. -65°C to +150°C Maximum Junction Temperature ...................... +150°C † Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS Electrical Specifications: U nless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V. Typical values are measured at TA = +25°C, VDD = 16V. Parameters Input Logic ‘1’, High Input Voltage Logic ‘0’, Low Input Voltage Input Current Output High Output Voltage Low Output Voltage Output Resistance VOH VOL RO VDD – 0.025 — — — — Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time tR — — — Fall Time tF — — — Delay Time tD1 — — — Note 1: Switching times ensured by design. 25 27 29 25 27 29 30 33 35 35 40 40 35 40 40 40 45 45 nsec nsec nsec TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C, Figure 4-1 TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C, Figure 4-1 TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C, Figure 4-1 IPK IREV — — — — 16 20 20 0.5 0.5 — 0.025 22 28 28 — — A A V V Ω DC Test DC Test VDD = 16V, IO = 10 mA, TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C VDD = 16V Duty cycle ≤ 2%, t ≤ 300 µsec, VDD = 16V VIH VIL IIN 2.0 — -1 -10 — — — — — 0.8 1 10 V V µA 0V ≤ VIN ≤ VDD, TA = +25°C -40°C ≤ TA ≤ +85°C Sym Min Typ Max Units Conditions  2003 Microchip Technology Inc. DS21389C-page 3 TC1410/TC1410N DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: U nless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V. Typical values are measured at TA = +25°C, VDD = 16V. Parameters Delay Time Sym tD2 Min — — — Power Supply Power Supply Current Note 1: IS — — Switching times ensured by design. 0.5 0.1 1.0 0.15 mA VIN = 3V, VDD = 16V VIN = 0V Typ 30 33 35 Max 40 45 45 Units nsec TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C, Figure 4-1 Conditions TEMPERATURE CHARACTERISTICS Electrical Specifications: U nless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 16V. Parameters Temperature Ranges Specified Temperature Range (C) Specified Temperature Range (E) Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 8L-MSOP Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC θJA θJA θJA — — — 206 125 155 — — — ºC/W ºC/W ºC/W TA TA TJ TA 0 -40 — -65 — — — — +70 +85 +150 +150 ºC ºC ºC ºC Sym Min Typ Max Units Conditions DS21389C-page 4  2003 Microchip Technology Inc. TC1410/TC1410N 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V. 500 TA = +25°C 500 VSUPPLY = 16V VIN = 3V 400 400 ISUPPLY (µA) ISUPPLY (µA) VIN = 3V 300 300 200 200 100 VIN = 0V 100 VIN = 0V 0 4 6 8 10 12 14 16 0 -40 -20 0 20 40 60 80 VDD (V) TEMPERATURE (°C) FIGURE 2-1: Quiescent Supply Current vs. Supply Voltage. 1.6 FIGURE 2-4: vs. Temperature. 1.6 Quiescent Supply Current TA = +25°C VSUPPLY = 16V 1.5 1.5 VTHRESHOLD (V) 1.4 VTHRESHOLD (V) VIH VIH 1.4 1.3 1.3 1.2 VIL 1.2 VIL 1.1 4 6 8 10 12 14 16 1.1 -40 -20 0 20 40 60 80 VDD (V) TEMPERATURE (°C) FIGURE 2-2: Voltage. 50 40 Input Threshold vs. Supply FIGURE 2-5: Temperature. 50 Input Threshold vs. TA = +85°C TA = +25°C RDS-ON (Ohms) 40 30 RDS-ON (Ohms) 30 20 20 TA = -40°C 10 0 4 6 8 10 12 14 16 TA = +85°C TA = +25°C 10 TA = -40°C 0 4 6 8 10 12 14 16 VDD (V) VDD (V) FIGURE 2-3: High-State Output Resistance vs. Supply Voltage. FIGURE 2-6: Low-State Output Resistance vs. Supply Voltage.  2003 Microchip Technology Inc. DS21389C-page 5 TC1410/TC1410N Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V. 100 CLOAD = 500 pF 100 CLOAD = 500 pF 80 80 tRISE (nsec) 60 tFALL (nsec) TA = +85°C TA = +25°C 60 TA = +85°C 40 40 TA = +25°C 20 TA = -40°C 20 TA = -40°C 12 14 16 0 0 4 6 8 10 VDD (V) 4 6 8 10 VDD (V) 12 14 16 FIGURE 2-7: Voltage. 100 Rise Time vs. Supply FIGURE 2-10: Voltage. 100 Fall Time vs. Supply CLOAD = 500 pF CLOAD = 500 pF 80 80 tD1 (nsec) tD2 (nsec) 60 TA = +85°C 60 TA = +25°C TA = +85°C TA = +25°C 40 40 TA = -40°C 20 20 TA = -40°C 0 4 6 8 10 VDD (V) 12 14 16 0 4 6 8 10 VDD (V) 12 14 16 FIGURE 2-8: Supply Voltage. 100 Propagation Delay vs. FIGURE 2-11: Supply Voltage. 45 Propagation Delay vs. TA = +25°C VDD = 16V tRISE TA = +25°C VDD = 16V tD2 Propagation Delays (nsec) 80 41 tRISE, tFALL (nsec) tFALL 60 37 tD1 40 33 20 29 0 0 500 1000 1500 2000 2500 3000 3500 25 0 500 1000 1500 2000 2500 3000 3500 CLOAD (pF) CLOAD (pF) FIGURE 2-9: Capacitive Load. Rise and Fall Times vs. FIGURE 2-12: Capacitive Load. Propagation Delays vs. DS21389C-page 6  2003 Microchip Technology Inc. TC1410/TC1410N 3.0 PIN DESCRIPTIONS 3.3 The descriptions of the pins are listed in Table 3-1. CMOS Push-Pull Output (OUTPUT) TABLE 3-1: Pin No. 1 2 3 4 5 6 7 8 Symbol VDD INPUT NC GND GND PIN FUNCTION TABLE Description The MOSFET driver output is a low-impedance, CMOS, push-pull style output, capable of driving a capacitive load with 0.5 A peak currents. Supply input, 4.5V to 16V Control input No connection Ground Ground CMOS push-pull output, common to pin 7 CMOS push-pull output, common to pin 6 Supply input, 4.5V to 16V 3.4 Ground The ground pins are the return path for the bias current and for the high peak currents that discharge the load capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply source return. OUTPUT OUTPUT VDD 3.1 Supply Input (VDD) The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 16V with respect to the ground pin. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of the capacitor should be chosen based on the capacitive load that is being driven. A value of 1.0 µF is suggested. 3.2 Control Input (INPUT) The MOSFET driver input is a high-impedance, TTL/CMOS-compatible input. The input also has 300 mV of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow.  2003 Microchip Technology Inc. DS21389C-page 7 TC1410/TC1410N 4.0 APPLICATIONS INFORMATION +5V Input VDD = 16V 0V 1.0 µF 1, 8 Input 2 6, 7 Output CL = 500 pF 0.1 µF VDD Output 0V 10% 10% tD1 90% tF 90% tD2 tR 90% 10% TC1410 TC1410N +5V Input 4, 5 Input: 100 kHz, square wave, tRISE = tFALL ≤ 10 nsec 0V VDD Output 0V 10% Inverting Driver TC1410 90% tD1 90% 10% 90% tR tD2 tF 10% Non-Inverting Driver TC1410N FIGURE 4-1: Switching Time Test Circuit. DS21389C-page 8  2003 Microchip Technology Inc. TC1410/TC1410N 5.0 5.1 PACKAGING INFORMATION Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW Example: TC1410 CPA057 0346 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN Example: TC1410 COA0346 057 8-Lead MSOP Example: XXXXXXX YWWNNN 1410NE 346057 Legend: XX...X YY WW NNN Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Note : In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard marking consists of Microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.  2003 Microchip Technology Inc. DS21389C-page 9 TC1410/TC1410N 8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP) E1 D 2 n 1 α E A A2 c L A1 β eB B1 p B Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB α β MIN INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10 MAX MIN § .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 .170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 DS21389C-page 10  2003 Microchip Technology Inc. TC1410/TC1410N 8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 45° h α c A A2 φ β L A1 Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D h L φ c B α β MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX MIN .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057  2003 Microchip Technology Inc. DS21389C-page 11 TC1410/TC1410N 8-Lead Plastic Micro Small Outline Package (UA) (MSOP) E E1 p D 2 B n 1 α A c φ A1 (F) β A2 L 8 Number of Pins .026 BSC Pitch A .043 Overall Height A2 .030 .033 .037 Molded Package Thickness A1 .006 .000 Standoff E .193 TYP. Overall Width E1 .118 BSC Molded Package Width D .118 BSC Overall Length L .016 .024 .031 Foot Length Footprint (Reference) F .037 REF φ Foot Angle 0° 8° c Lead Thickness .003 .006 .009 B .009 .012 .016 Lead Width α 5° 15° Mold Draft Angle Top β 5° 15° Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. Units Dimension Limits n p MIN INCHES NOM MAX MIN MILLIMETERS* NOM 8 0.65 BSC 0.75 0.85 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.95 REF 0° 0.08 0.22 5° 5° - MAX 1.10 0.95 0.15 0.80 8° 0.23 0.40 15° 15° JEDEC Equivalent: MO-187 Drawing No. C04-111 DS21389C-page 12  2003 Microchip Technology Inc. TC1410/TC1410N PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package Examples: a) TC1410COA: 0.5A Single MOSFET driver, SOIC package, 0°C to +70°C. TC1410CPA: 0.5A Single MOSFET driver, PDIP package, 0°C to +70°C. TC1410EUA713: Tape and Reel, 0.5A Single MOSFET driver, MSOP package, -40°C to +85°C. b) Device: TC1410: 0.5A Single MOSFET Driver, Inverting TC1410N: 0.5A Single MOSFET Driver, Non-Inverting c) Temperature Range: C E = = 0°C to +70°C -40°C to +85°C Package: OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) UA = Plastic Micro Small Outline (MSOP), 8-lead * UA713 = Plastic Micro Small Outline (MSOP), 8-lead * (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead * MSOP package is only available in E-Temp. a) TC1410NCPA: b) TC1410NEPA: c) TC1410NEUA: 0.5A Single MOSFET driver, PDIP package, 0°C to +70°C. 0.5A Single MOSFET driver, PDIP package, -40°C to +85°C. 0.5A Single MOSFET driver, MSOP package, -40°C to +85°C. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2003 Microchip Technology Inc. DS21389C-page 13 TC1410/TC1410N NOTES: DS21389C-page 14  2003 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • • • Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” • • Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8 -bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.  2003 Microchip Technology Inc. DS21389C-page 15 M WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com ASIA/PACIFIC Australia Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Singapore 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 China - Beijing Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104 Atlanta 3780 Mansell Road, Suite 130 Alpharetta, GA 30022 Tel: 770-640-0034 Fax: 770-640-0307 Taiwan Kaohsiung Branch 30F - 1 No. 8 Min Chuan 2nd Road Kaohsiung 806, Taiwan Tel: 886-7-536-4818 Fax: 886-7-536-4803 Boston 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 China - Chengdu Rm. 2401-2402, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599 Taiwan Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 China - Fuzhou Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 EUROPE Austria Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 China - Hong Kong SAR Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 Denmark Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910 China - Shanghai Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Kokomo 2767 S. Albright Road Kokomo, IN 46902 Tel: 765-864-8360 Fax: 765-864-8387 France Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 China - Shenzhen Rm. 1812, 18/F, Building A, United Plaza No. 5022 Binhe Road, Futian District Shenzhen 518033, China Tel: 86-755-82901380 Fax: 86-755-8295-1393 Germany Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Phoenix 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-4338 China - Shunde Room 401, Hongjian Building No. 2 Fengxiangnan Road, Ronggui Town Shunde City, Guangdong 528303, China Tel: 86-765-8395507 Fax: 86-765-8395571 Italy Via Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781 San Jose 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 China - Qingdao Rm. B505A, Fullhope Plaza, No. 12 Hong Kong Central Rd. Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205 Netherlands P. A. De Biesbosch 14 NL-5152 SC Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 United Kingdom 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820 07/28/03 Japan Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 DS21389C-page 16  2003 Microchip Technology Inc.