MCP121

MCP111/112 Micropower Voltage Detector Features • Ultra-low supply current: 1.75 µA (max.) • Precision monitoring options of: - 1.90V, 2.32V, 2.63V, 2.90V, 2.93V, 3.08V, 4.38V and 4.63V • Resets microcontroller in a power-loss event • Active-low VOUT pin: - MCP111 active-low, open-drain - MCP112 active-low, push-pull • Available in SOT23-3, TO-92, SC-70 and SOT-89-3 packages • Temperature Range: - Extended: -40°C to +125°C (except MCP1XX-195) - Industrial: -40°C to +85°C (MCP1XX-195 only) • Pb-free devices Package Types 3-Pin SOT23-3/SC-70 VOUT 1 MCP111/112 3-Pin SOT-89 VDD 3 VDD MCP111/112 1 2 3 VOUT VDD VSS VSS 2 3-Pin TO-92 VOUT VDD VSS Applications • Critical Microcontroller and Microprocessor Power-Monitoring Applications • Computers • Intelligent Instruments • Portable Battery-Powered Equipment Block Diagram VDD Comparator + – Output Driver VOUT Description The MCP111/112 are voltage-detecting devices designed to keep a microcontroller in reset until the system voltage has stabilized at the appropriate level for reliable system operation. These devices also operate as protection from brown-out conditions when the system supply voltage drops below the specified threshold voltage level. Eight different trip voltages are available. Band Gap Reference VSS TABLE 1: Device DEVICE FEATURES Output Type Pull-up Resistor External No No No External Internal (~95 kΩ) Reset Delay (typ) No No 120 ms 120 ms 120 ms 120 ms Package Pin Out (Pin # 1, 2, 3) VOUT, VSS, VDD VOUT, VSS, VDD RST, VDD, VSS VSS, RST, VDD RST, VDD, VSS RST, VDD, VSS See MCP102/103/121/131 Data Sheet (DS21906) See MCP102/103/121/131 Data Sheet (DS21906) See MCP102/103/121/131 Data Sheet (DS21906) See MCP102/103/121/131 Data Sheet (DS21906) Comment MCP111 MCP112 MCP102 MCP103 MCP121 MCP131 Open-drain Push-pull Push-pull Push-pull Open-drain Open-Drain © 2005 Microchip Technology Inc. DS21889D-page 1 MCP111/112 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings† VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0V Input current (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA Output current (RST) . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA Rated Rise Time of VDD . . . . . . . . . . . . . . . . . . . . . . 100V/µs All inputs and outputs (except RST) w.r.t. VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.6V to (VDD + 1.0V) RST output w.r.t. VSS . . . . . . . . . . . . . . . . . . . -0.6V to 13.5V Storage temperature . . . . . . . . . . . . . . . . . . . 65°C to + 150°C Ambient temp. with power applied . . . . . . . -40°C to + 125°C Maximum Junction temp. with power applied . . . . . . . . 150°C ESD protection on all pins . . . . . . . . . . . . . . . . . . . . . . . . . ≥ 2 kV DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111), TA = -40°C to +125°C. Parameters Operating Voltage Range Specified VDD Value to VOUT low Operating Current VDD Trip Point MCP1XX-195 MCP1XX-240 MCP1XX-270 MCP1XX-290 MCP1XX-300 MCP1XX-315 MCP1XX-450 MCP1XX-475 VDD Trip Point Tempco Note 1: 2: 3: TTPCO Sym VDD VDD IDD VTRIP Min 1.0 1.0 — 1.872 1.853 2.285 2.262 2.591 2.564 2.857 2.828 2.886 2.857 3.034 3.003 4.314 4.271 4.561 4.514 — Typ — — 5.5V applied ≤ 100s, current into pin limited to 2 mA, +25°C operation recommended Note 3, Note 4 Conditions TA = +25°C Open-drain Output Leakage Current (MCP111 only) Note 1: 2: 3: IOD — 0.1 — µA 4: Trip point is ±1.5% from typical value. Trip point is ±2.5% from typical value. This specification allows this device to be used in PICmicro® microcontroller applications that require the In-Circuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage requirements). This specification DOES NOT allow a continuous high voltage to be present on the open-drain output pin (VOUT). The total time that the VOUT pin can be above the maximum device operational voltage (5.5V) is 100 sec. Current into the VOUT pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 0°C to 70°C (+25°C preferred). For additional information, please refer to Figure 2-28. This parameter is established by characterization and is not 100% tested. © 2005 Microchip Technology Inc. DS21889D-page 3 MCP111/112 VTRIP 1V VDD tRPU tRPD VOH 1V VOUT tRT VOL FIGURE 1-1: Timing Diagram. AC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111), TA = -40°C to +125°C. Parameters VDD Detect to VOUT Inactive VDD Detect to VOUT Active Sym tRPU tRPD Min — — Typ 90 130 Max — — Units µs µs Conditions Figure 1-1 and CL = 50 pF (Note 1) VDD ramped from VTRIP(MAX) + 250 mV down to VTRIP(MIN) – 250 mV, per Figure 1-1, CL = 50 pF (Note 1) For VOUT 10% to 90% of final value per Figure 1-1, CL = 50 pF (Note 1) VOUT Rise Time After VOUT Active tRT — 5 — µs Note 1: These parameters are for design guidance only and are not 100% tested. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111), TA = -40°C to +125°C. Parameters Temperature Ranges Specified Temperature Range Specified Temperature Range Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 3L-SOT23 Thermal Resistance, 3L-SC-70 Thermal Resistance, 3L-TO-92 Thermal Resistance, 3L-SOT-89 θJA θJA θJA θJA — — — — 336 340 131.9 110 — — — — °C/W °C/W °C/W °C/W TA TA TJ TA -40 -40 — -65 — — — — +85 +125 +150 +150 °C °C °C °C MCP1XX-195 Except MCP1XX-195 Sym Min Typ Max Units Conditions DS21889D-page 4 © 2005 Microchip Technology Inc. MCP111/112 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111; see Figure 4-1), TA = -40°C to +125°C. 1.6 1.4 1.2 IDD (uA) IDD (uA) 1 0.8 0.6 0.4 0.2 0 20 40 60 80 100 120 140 -40 -20 0 Temperature (°C) 4.0V 2.8V 2.1V 1.7V 1.0V 1.6 MCP111-195 5.5V 5.0V 1.4 1.2 1 0.8 0.6 0.4 0.2 0 MCP111-195 +125°C +85°C -40°C +25°C 1.0 2.0 3.0 VDD (V) 4.0 5.0 6.0 FIGURE 2-1: (MCP111-195). 1.2 1 IDD (uA) 0.8 0.6 0.4 IDD vs. Temperature FIGURE 2-4: IDD vs. VDD (MCP111-195). MCP112-300 5.5V 5.0V 4.0V 2.8V 1.7V 2.1V 1.6 1.4 1.2 IDD (uA) 1 0.8 0.6 0.4 0.2 0 1.0 2.0 +85°C -40°C +25°C +125°C MCP112-300 0.2 0 20 40 60 80 100 120 -40 -20 0 1.0V 140 3.0 4.0 VDD (V) 5.0 6.0 Temperature (°C) FIGURE 2-2: (MCP112-300). 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 IDD vs. Temperature FIGURE 2-5: IDD vs. VDD (MCP112-300). 1.6 MCP112-475 4.0V 2.8V 5.5V 2.1V 1.4 1.2 IDD (uA) 1 0.8 0.6 0.4 0.2 0 MCP112-475 5.0V IDD (uA) +125°C +85°C -40°C +25°C 1.7V 1.0V 20 40 60 -40 -20 80 100 120 140 1.0 2.0 3.0 VDD (V) 4.0 5.0 6.0 0 Temperature (°C) FIGURE 2-3: (MCP112-475). IDD vs. Temperature FIGURE 2-6: IDD vs. VDD (MCP112-475). © 2005 Microchip Technology Inc. DS21889D-page 5 MCP111/112 Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111; see Figure 4-1), TA = -40°C to +125°C. 0.120 1.950 1.945 1.940 1.935 1.930 1.925 1.920 1.915 1.910 1.905 1.900 1.895 0.050 VTRIP, V increasing 0.045 0.040 VHYS, Hysteresis 0.035 0.030 MCP111-195 0.025 max temp is 0.020 +85°C 0.015 VTRIP, V decreasing 0.010 0.005 0.000 -60 -10 40 90 140 Temperature (°C) 0.100 0.080 Hyst (V) VOL (V) 0.060 0.040 -40°C +85°C MCP111-195 VDD = 1.7V +125°C VTRIP (V) 0.020 0.000 0.00 +25°C 0.25 0.50 IOL (mA) 0.75 1.00 FIGURE 2-7: VTRIP and VHYST vs. Temperature (MCP111-195). FIGURE 2-10: VOL vs. IOL (MCP111-195 @ VDD = 1.7V). 0.080 3.040 3.020 3.000 VTRIP (V) 2.980 2.960 2.940 2.920 2.900 VTRIP, V increasing Hyst (V) VOL (V) VHYS, Hysteresis MCP112-300 VTRIP, V decreasing -60 -10 40 90 0.100 0.098 0.096 0.094 0.092 0.090 0.088 0.086 0.084 0.082 140 0.070 0.060 0.050 0.040 0.030 0.020 0.010 MCP112-300 VDD = 2.7V +125°C +85°C -40°C +25°C 0.000 0.00 0.25 0.50 IOL (mA) 0.75 1.00 Temperature (°C) FIGURE 2-8: VTRIP and VHYST vs. Temperature (MCP112-300). 4.800 4.780 4.760 4.740 4.720 4.700 4.680 4.660 4.640 4.620 4.600 4.580 -60 0.180 VTRIP, V increasing VHYS, Hysteresis FIGURE 2-11: VOL vs. IOL (MCP112-300 @ VDD = 2.7V). 0.050 0.040 Hyst (V) VOL (V) 0.030 0.020 0.010 0.000 0.00 +85°C -40°C +25°C 0.170 0.160 0.150 0.140 MCP112-475 MCP112-475 VDD = 4.4V VTRIP (V) +125°C 0.130 0.120 0.110 VTRIP, V decreasing -20 20 60 100 0.100 140 0.25 0.50 IOL (mA) 0.75 1.00 Temperature (°C) FIGURE 2-9: VTRIP and VHYST vs. Temperature (MCP112-475). FIGURE 2-12: VOL vs. IOL (MCP112-475 @ VDD = 4.4V). DS21889D-page 6 © 2005 Microchip Technology Inc. MCP111/112 Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111; see Figure 4-1), TA = -40°C to +125°C. 0.120 0.100 0.080 VOL (V) 0.060 0.040 0.020 IOL = 0.00 mA MCP111-195 VDD = 1.7 V IOL = 1.00 mA 3.150 3.100 VOH (V) 3.050 3.000 2.950 2.900 0.00 MCP112-300 VDD = 3.1V IOL = 0.75 mA -40 °C +25 °C IOL = 0.50 mA IOL = 0.25 mA +85 °C +125 °C 0.000 -40 0 40 Temperature (°C) 80 120 0.25 0.50 IOL (mA) 0.75 1.00 FIGURE 2-13: VOL vs. Temperature (MCP111-195 @ VDD = 1.7V). 0.080 0.070 0.060 VOL (V) 0.050 0.040 0.030 0.020 0.010 0.000 -40 0 40 Temperature (°C) 80 120 IOL = 0.25 mA IOL = 0.00 mA IOL = 0.50 mA MCP112-300 VDD = 2.7V IOL = 1.00 mA FIGURE 2-16: VOH vs. IOH (MCP112-300 @ VDD = 3.1V). 4.820 4.800 MCP112-475 VDD = 4.8V IOL = 0.75 mA 4.780 VOH (V) +25 °C 4.760 4.740 4.720 4.700 +85 °C -40 °C +125 °C 4.680 0.00 0.25 0.50 IOL (mA) 0.75 1.00 FIGURE 2-14: VOL vs. Temperature (MCP112-300 @ VDD = 2.7V). 0.050 0.040 IOL = 0.75 mA MCP112-475 VDD = 4.4V FIGURE 2-17: VOH vs. IOH (MCP112-475 @ VDD = 4.8V). 600 Transient Duration (µs) 500 400 300 200 100 0 0.001 MCP112-475 MCP112-300 MCP111-195 IOL = 1.00 mA VOL (V) 0.030 IOL = 0.50 mA 0.020 IOL = 0.25 mA 0.010 IOL = 0.00 mA 0.000 -40 0 40 Temperature (°C) 80 120 0.01 0.1 VTRIP(min) - VDD 1 10 FIGURE 2-15: VOL vs. Temperature (MCP112-475 @ VDD = 4.4V). FIGURE 2-18: (25 °C). Typical Transient Response © 2005 Microchip Technology Inc. DS21889D-page 7 MCP111/112 Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111; see Figure 4-1), TA = -40°C to +125°C. 350 300 250 tRPD (µs) 200 150 100 50 0 -40 -15 10 35 60 85 110 Temperature (°C) VDD decreasing from: 5V - 0V VDD decreasing from: 5V - 1.7V 400 MCP111-195 MCP111-195 350 300 tRPU (µs) VDD increasing from: 0V - 2.1V VDD decreasing from: VTRIP(max) + 0.25V to VTRIP(min) - 0.25V 250 200 150 100 50 0 -40 -15 VDD increasing from: 0V - 2.8V VDD increasing from: 0V - 4.0V VDD increasing from: 0V - 5.5V 10 35 60 85 110 Temperature (°C) FIGURE 2-19: (MCP111-195). 160 MCP112-300 tRPD vs. Temperature FIGURE 2-22: (MCP111-195). 140 tRPU vs. Temperature 140 120 tRPD (µs) VDD decreasing from: VTRIP(max) + 0.25V to VTRIP(min) - 0.25V 120 100 tRPU (µs) VDD increasing from: 0V - 3.1V MCP112-300 100 80 60 40 20 0 -40 VDD decreasing from: 5V - 2.7V 80 60 40 VDD increasing from: 0V - 3.3V VDD increasing from: 0V - 4.0V VDD decreasing from: 5V - 0V 20 0 VDD increasing from: 0V - 5.5V -15 10 35 60 85 110 -40 -15 Temperature (°C) 10 35 60 Temperature (°C) 85 110 FIGURE 2-20: (MCP112-300). 250 200 tRPD (µs) 150 100 50 tRPD vs. Temperature FIGURE 2-23: (MCP112-300). 250 tRPU vs. Temperature VDD decreasing from: 5V - 4.4V MCP112-475 MCP112-475 200 tRPU (µs) 150 100 50 VDD increasing from: 0V - 4.9V VDD decreasing from: VTRIP(max) + 0.25V to VTRIP(min) - 0.25V VDD increasing from: 0V - 5.0V VDD increasing from: 0V - 5.5V VDD decreasing from: 5V - 0V 0 -40 -15 10 35 60 Temperature (°C) 85 110 0 -40 -15 10 35 60 85 110 Temperature (°C) FIGURE 2-21: (MCP112-475). tRPD vs. Temperature FIGURE 2-24: (MCP112-475). tRPU vs. Temperature DS21889D-page 8 © 2005 Microchip Technology Inc. MCP111/112 Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111; see Figure 4-1), TA = -40°C to +125°C. 60 55 50 tRT (µs) 45 40 35 30 25 20 -40 -15 10 35 60 85 110 VDD increasing from: 0V - 2.8V VDD increasing from: 0V - 2.1V VDD increasing from: 0V - 5.5V VDD increasing from: 0V - 4.0V 0.1500 MCP111-195 MCP112-475 0.1400 0.1300 tRT (µs) 0.1200 0.1100 0.1000 0.0900 0.0800 -40 -15 10 35 60 85 110 VDD increasing from: 0V - 4.8V VDD increasing from: 0V - 5.5V VDD increasing from: 0V - 4.9V VDD increasing from: 0V - 5.0V Temperature (°C) Temperature (°C) FIGURE 2-25: (MCP111-195). 0.4 0.35 0.3 tRT (µs) 0.25 0.2 0.15 0.1 0.05 0 -40 -15 tRT vs. Temperature FIGURE 2-27: (MCP112-475). 1.E-02 10m 1.E-03 1m 1.E-04 100µ 1.E-05 10µ 1.E-06 1µ 1.E-07 100n 1.E-08 10n 1.E-09 1n 1.E-10 100p 1.E-11 10p 1.E-12 1p 1.E-13 100f 0 1 2 3 4 tRT vs. Temperature Open-Drain Leakage (A) VDD increasing from: 0V - 3.1V VDD increasing from: 0V - 3.3V 125°C VDD increasing from: 0V - 5.5V VDD increasing from: 0V - 4.0V 25°C - 40°C MCP112-300 10 35 60 85 110 5 6 7 8 9 10 11 12 13 14 Temperature (°C) Pull-Up Voltage (V) FIGURE 2-26: (MCP112-300). tRT vs. Temperature FIGURE 2-28: Open-Drain Leakage Current vs. Voltage Applied to VOUT Pin (MCP111-195). © 2005 Microchip Technology Inc. DS21889D-page 9 MCP111/112 3.0 PIN DESCRIPTION The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. Symbol SOT-89-3 1 T0-92 1 VOUT Output State VDD Falling: H = VDD > VTRIP L = VDD < VTRIP VDD Rising: H = VDD > VTRIP + VHYS L = VDD < VTRIP + VHYS Function SOT-23-3 SC-70 1 2 3 — 2 3 4 3 2 — VSS VDD VDD Ground reference Positive power supply Positive power supply DS21889D-page 10 © 2005 Microchip Technology Inc. MCP111/112 4.0 APPLICATION INFORMATION 4.1 VTRIP Operation For many of today’s microcontroller applications, care must be taken to prevent low-power conditions that can cause many different system problems. The most common causes are brown-out conditions, where the system supply drops below the operating level momentarily. The second most common cause is when a slowly decaying power supply causes the microcontroller to begin executing instructions without sufficient voltage to sustain SRAM, thus producing indeterminate results. Figure 4-1 shows a typical application circuit. VDD 3 0.1 µF VDD MCP11X VOUT VSS 2 1 RPU (1) The voltage trip point (VTRIP) is determined on the falling edge of VDD. The actual voltage trip point (VTRIPAC) will be between the minimum trip point (VTRIPMIN) and the maximum trip point (VTRIPMAX). There is a hysteresis on this trip point to remove any “jitter” that would occur on the VOUT pin when the device VDD is at the trip point. Figure 4-2 shows the state of the VOUT pin as determined by the VDD voltage. The VTRIP specification is for falling VDD voltages. When the VDD voltage is rising, the VOUT pin will not be driven high until VDD is at VTRIP + VHYS. VDD PICmicro® Microcontroller MCLR (Reset Input) GND Note 1: RPU may be required with the MCP111 due to the open-drain output. Resistor RPU is not required with the MCP112. FIGURE 4-1: Typical Application Circuit. VDD VTRIPMAX VTRIPMIN 1V VTRIPAC + VHYSAC VTRIPAC VTRIPAC VOUT < 1 V is outside the device specifications FIGURE 4-2: VOUT Operation as Determined by the VTRIP and VHYS. © 2005 Microchip Technology Inc. DS21889D-page 11 MCP111/112 4.2 Negative Going VDD Transients 4.3 The minimum pulse width (time) required to cause a reset may be an important criteria in the implementation of a Power-on Reset (POR) circuit. This time is referred to as transient duration, defined as the amount of time needed for these supervisory devices to respond to a drop in VDD. The transient duration time is dependant on the magnitude of VTRIP – VDD. Generally speaking, the transient duration decreases with increases in VTRIP – VDD. Figure 4-3 shows a typical transient duration vs. reset comparator overdrive for which the MCP111/112 will not generate a reset pulse. It shows that the farther below the trip point the transient pulse goes, the duration of the pulse required to cause a reset gets shorter. Figure 2-18 shows the transient response characteristics for the MCP111/112. A 0.1 µF bypass capacitor, mounted as close as possible to the VDD pin, provides additional transient immunity (refer to Figure 4-1). Effect of Temperature on Time-out Period (tRPU) The time-out period (tRPU) determines how long the device remains in the reset condition. This is affected by both VDD and temperature. The graph shown in Figures 2-22, 2-23 and 2-24 show the typical response for different VDD values and temperatures. 4.4 Using in PICmicro® Microcontroller ICSP™ Applications (MCP111 only) Figure 4-4 shows the typical application circuit for using the MCP111 for voltage supervisory function when the PICmicro microcontroller will be programmed via the In-Circuit Serial Programming™ (ICSP) feature. Additional information is available in TB087, “Using Voltage Supervisors with PICmicro® Microcontroller Systems which Implement In-Circuit Serial Programming™”, DS91087. Note: It is recommended that the current into the RST pin be current limited by a 1 kΩ resistor. VDD/VPP 0.1 µF VDD RPU VDD PICmicro® MCU MCLR (reset input) (Active-Low) VSS 5V Supply Voltage VTRIP(MIN) - VDD VTRIP(MAX) VTRIP(MIN) tTRANS Time (µs) 0V MCP111 RST VSS 1 kΩ FIGURE 4-3: Example of Typical Transient Duration Waveform. FIGURE 4-4: Typical Application Circuit for PICmicro® Microcontroller with the ICSP™ feature. DS21889D-page 12 © 2005 Microchip Technology Inc. MCP111/112 5.0 5.1 PACKAGING INFORMATION Package Marking Information 3-Lead TO-92 XXXXXX XXXXXX XXXXXX YWWNNN Example: MCP111 290E TO^^ e3 547256 3-Pin SOT-23 Part Number MCP111T-195I/TT SOT-23 MPNN MQNN MGNN NHNN MJNN MKNN MLNN MMNN Example: Part Number MCP112T-195I/TT MCP112T-240ETT MCP112T-270E/TT MCP112T-290E/TT MCP112T-300E/TT MCP112T-315E/TT MCP112T-450E/TT MCP112T-475E/TT SOT-23 MRNN MSNN MANN MBNN MCNN MDNN MENN MFNN XXNN MCP111T-240ETT MCP111T-270E/TT MCP111T-290E/TT MCP111T-300E/TT MCP111T-315E/TT MCP111T-450E/TT MCP111T-475E/TT 3-Pin SOT-89 Part Number XXYYWW NNN MCP111T-195I/MB MCP111T-240EMB MCP111T-270E/MB MCP111T-290E/MB MCP111T-300E/MB MCP111T-315E/MB MCP111T-450E/MB MCP111T-475E/MB SOT-89 MP MQ MG NH MJ MK ML MM Example: Part Number MCP112T-195I/MB MCP112T-240EMB MCP112T-270E/MB MCP112T-290E/MB MCP112T-300E/MB MCP112T-315E/MB MCP112T-450E/MB MCP112T-475E/MB SOT-89 MR MS MA MB MC MD ME MF Legend: XX...X Y WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2005 Microchip Technology Inc. DS21889D-page 13 MCP111/112 Package Marking Information (Continued) 3-Pin SC-70 Part Number MCP111T-195I/LB Example: SC-70 EPN EQN EGN EHN EJN EKN ELN EMN Part Number MCP112T-195I/LB MCP112T-240E/LB MCP112T-270E/LB MCP112T-290E/LB MCP112T-300E/LB MCP112T-315E/LB MCP112T-450E/LB MCP112T-475E/LB SC-70 ERN ESN EAN EBN ECN EDN EEN EFN XXN Top Side MCP111T-240E/LB MCP111T-270E/LB MCP111T-290E/LB MCP111T-300E/LB MCP111T-315E/LB MCP111T-450E/LB MCP111T-475E/LB OR Part Number MCP111T-195I/LB MCP111T-240E/LB MCP111T-270E/LB MCP111T-290E/LB MCP111T-300E/LB Top Side MCP111T-315E/LB MCP111T-450E/LB MCP111T-475E/LB Example: SC-70 EPNN EQNN EGNN EHNN EJNN EKNN ELNN EMNN Part Number MCP112T-195I/LB MCP112T-240E/LB MCP112T-270E/LB MCP112T-290E/LB MCP112T-300E/LB MCP112T-315E/LB MCP112T-450E/LB MCP112T-475E/LB SC-70 ERNN ESNN EANN EBNN ECNN EDNN EENN EFNN XXNN DS21889D-page 14 © 2005 Microchip Technology Inc. MCP111/112 3-Lead Plastic Small Outline Transistor (MB) (SOT89) H E B1 3 B D D1 2 R 1 B1 L E1 p p1 A C Pitch Outside lead pitch (basic) Overall Height Overall Width Molded Package Width at Base Molded Package Width at Top Overall Length Tab Length Tab Corner Radii Foot Length Lead Thickness Lead 2 Width Leads 1 & 3 Width Units Dimension Limits p p1 A H E E1 D D1 R L c B B1 INCHES MIN MAX .059 BSC .118 BSC .055 .063 .155 .167 .090 .102 .084 .090 .173 .181 .064 .072 .010 .035 .047 .014 .017 .017 .022 .014 .019 MILLIMETERS* MIN MAX 1.50 BSC 3.00 BSC 1.40 1.60 3.94 4.25 2.29 2.60 2.13 2.29 4.40 4.60 1.62 1.83 0.254 0.89 1.20 0.35 0.44 0.43 0.56 0.36 0.48 *Controlling Parameter Notes: Dimensions D and E1 do not include mold or flash protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEDEC Equivalent: TO-243 Drawing No. C04-29 Revised 07-24-03 © 2005 Microchip Technology Inc. DS21889D-page 15 MCP111/112 3-Lead Plastic Small Outline Transistor (TT) (SOT-23) E E1 2 B n p p1 D 1 α c A A2 φ β L A1 Units Dimension Limits n Number of Pins p Pitch p1 Outside lead pitch (basic) Overall Height A Molded Package Thickness A2 Standoff § A1 Overall Width E Molded Package Width E1 Overall Length D Foot Length L φ Foot Angle c Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic B α β MIN INCHES* NOM 3 .038 .076 .040 .037 .002 .093 .051 .115 .018 5 .006 .017 5 5 MAX MIN .035 .035 .000 .083 .047 .110 .014 0 .004 .015 0 0 .044 .040 .004 .104 .055 .120 .022 10 .007 .020 10 10 MILLIMETERS NOM 3 0.96 1.92 0.89 1.01 0.88 0.95 0.01 0.06 2.10 2.37 1.20 1.30 2.80 2.92 0.35 0.45 0 5 0.09 0.14 0.37 0.44 0 5 0 5 MAX 1.12 1.02 0.10 2.64 1.40 3.04 0.55 10 0.18 0.51 10 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: TO-236 Drawing No. C04-104 DS21889D-page 16 © 2005 Microchip Technology Inc. MCP111/112 3-Lead Plastic Small Outline Transistor (LB) (SC-70) E E1 B 2 p1 D 3 1 p a c A A2 b L A1 Units Dimension Limits Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom p p1 A A2 A1 E E1 D L c B a b INCHES MIN 3 .026 BSC. .051 BSC. .031 .031 .000 .071 .045 .071 .004 .003 .006 8° 8° MAX .043 .039 .0004 .094 .053 .089 .016 .010 .016 12° 12° MILLIMETERS* MIN MAX 3 0.65 BSC. 1.30 BSC. 0.80 1.10 0.80 1.00 0.00 .010 1.80 2.40 1.15 1.35 1.80 2.25 0.10 0.41 0.08 0.25 0.15 0.40 8° 12° 8° 12° *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (EIAJ) Equivalent: SC70 Drawing No. C04-104 © 2005 Microchip Technology Inc. DS21889D-page 17 MCP111/112 3-Lead Plastic Transistor Outline (TO) (TO-92) E1 D 1 n L 1 2 3 B p c α A R β INCHES* NOM MILLIMETERS NOM 3 1.27 3.30 3.62 4.45 4.71 4.32 4.64 2.16 2.29 12.70 14.10 0.36 0.43 0.41 0.48 4 5 2 3 Number of Pins 3 Pitch .050 Bottom to Package Flat A .130 .143 .155 Overall Width E1 .175 .186 .195 Overall Length D .170 .183 .195 Molded Package Radius R .085 .090 .095 Tip to Seating Plane L .500 .555 .610 c Lead Thickness .014 .017 .020 Lead Width B .016 .019 .022 α 4 5 6 Mold Draft Angle Top β Mold Draft Angle Bottom 2 3 4 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: TO-92 Drawing No. C04-101 Units Dimension Limits n p MIN MAX MIN MAX 3.94 4.95 4.95 2.41 15.49 0.51 0.56 6 4 DS21889D-page 18 © 2005 Microchip Technology Inc. MCP111/112 5.2 Product Tape and Reel Specifications EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY) Top Cover Tape FIGURE 5-1: A0 W K0 B0 P TABLE 1: Case Outline TT LB CARRIER TAPE/CAVITY DIMENSIONS Package Type SOT-23B SC-70 3L 3L Carrier Dimensions W mm 8 8 P mm 4 4 A0 mm 3.15 2.4 Cavity Dimensions B0 mm 2.77 2.4 K0 mm 1.22 1.19 Output Quantity Units 3000 3000 Reel Diameter in mm 180 180 FIGURE 5-2: 3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation © 2005 Microchip Technology Inc. DS21889D-page 19 MCP111/112 FIGURE 5-3: TO-92 DEVICES User Direction of Feed P Device Marking MARK FACE MARK FACE MARK FACE Seal Tape Back Tape W Note: Bent leads are for Tape and Reel only. FIGURE 5-4: SOT-89 DEVICES User Direction of Feed Pin 1 W, Width of Carrier Tape Pin 1 Standard Reel Component Orientation P, Pitch Reverse Reel Component Orientation DS21889D-page 20 © 2005 Microchip Technology Inc. MCP111/112 APPENDIX A: REVISION HISTORY Revision D (June 2005) 1. Added SOT-89-3 throughout. package information Revision C (March 2005) The following is the list of modifications: 1. Added Section 4.4 “Using in PICmicro® Microcontroller ICSP™ Applications (MCP111 only)” on using the MCP111 in PICmicro microcontroller ICSP applications. Added VODH specifications in Section 1.0 “Electrical Characteristics” (for ICSP applications). Added Figure 2-28. Added devices features table to page 1. Updated SC-70 package markings and added Pb-free marking information to Section 5.0 “Packaging information”. Added Appendix A: “Revision History”. 2. 3. 4. 5. 6. Revision B (August 2004) 1. Corrected package marking information in Section 5.0 “Packaging information” Revision A (May 2004) • Original Release of this Document. © 2005 Microchip Technology Inc. DS21889D-page 21 MCP111/112 NOTES: DS21889D-page 22 © 2005 Microchip Technology Inc. MCP111/112 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X XXX X XX Examples: a) MCP111T-195I/TT: Tape and Reel, 1.95V option, open-drain, -40°C to +85°C, SOT-23B package. MCP111T-315E/LB: Tape and Reel, 3.15V option, open-drain, -40°C to +125°C, SC-70-3 package. MCP111-300E/TO: 3.00V option, open-drain, -40°C to +125°C, TO-92-3 package. MCP111-315E/MB: 3.15V option, open-drain, -40°C to +125°C, SOT-89-3 package. Tape/Reel Monitoring Temperature Package Range Option Options MCP111: MicroPower Voltage Detector, open-drain MCP111T: MicroPower Voltage Detector, open-drain (Tape and Reel) MCP112: MicroPower Voltage Detector, push-pull MCP112T: MicroPower Voltage Detector, push-pull (Tape and Reel) b) Device: c) d) Monitoring Options: 195 240 270 290 300 315 450 475 = = = = = = = = 1.90V 2.32V 2.63V 2.90V 2.93V 3.08V 4.38V 4.63V a) b) Temperature Range: I E = -40°C to +85°C (MCP11X-195 only) = -40°C to +125°C (Except MCP11X-195 only) c) Package: LB MB TO TT = = = = SC-70, 3-lead SOT-89, 3-lead TO-92, 3-lead SOT-23B, 3-lead d) MCP112T-290E/TT: Tape and Reel, 2.90V option, push-pull, 40°C to +125°C, SOT-23B-3 package. MCP112T-475E/LB: Tape and Reel, 4.75V option, push-pull, -40°C to +125°C, SC-70-3 package. MCP112-450E/TO: 4.5V option, push-pull, -40°C to +125°C, TO-92-3 package. MCP112-315E/MB: 3.15V option, push-pull, -40°C to +125°C, SOT-89-3 package. © 2005 Microchip Technology Inc. DS21889D-page 23 MCP111/112 NOTES: DS21889D-page 24 © 2005 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • • Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” • • • Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2005 Microchip Technology Inc. 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