TC1070VCT

TC1070/TC1071/TC1187 50mA, 100mA and 150mA Adjustable CMOS LDOs with Shutdown Features • • • • • • • • Zero Ground Current for Longer Battery Life Adjustable Output Voltage Very Low Dropout Voltage Choice of 50mA (TC1070), 100mA (TC1071) and 150mA (TC1187) Output Power-Saving Shutdown Mode Over Current and Over Temperature Protection Space-Saving 5-Pin SOT-23A Package Pin Compatible with Bipolar Regulators General Description The TC1070, TC1071 and TC1187 are adjustable LDOs designed to supersede a variety of older (bipolar) voltage regulators. Total supply current is typically 50µA at full load (20 to 60 times lower than in bipolar regulators). The devices’ key features include ultra low noise operation, very low dropout voltage – typically 85mV (TC1070); 180mV (TC1071); and 270mV (TC1187) at full load, and fast response to step changes in load. Supply current is reduced to 0.5µA (max) when the shutdown input is low. The devices incorporate both over-temperature and over-current protection. Output voltage is programmed with a simple resistor divider from VOUT to ADJ to GND. The TC1070, TC1071 and TC1187 are stable with an output capacitor of only 1µF and have a maximum output current of 50mA, 100mA and 150mA, respectively. For higher output versions, please see the TC1174 (IOUT = 300mA) data sheet. Applications • • • • • • • Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers Typical Application VIN 1 VIN VOUT 5 C1 + 1µF VOUT Device Selection Table Part Number TC1070VCT TC1071VCT TC1187VCT Output Voltage (V) Package Junction Temp. Range Adjustable 5-Pin SOT-23A -40°C to +125°C Adjustable 5-Pin SOT-23A -40°C to +125°C Adjustable 5-Pin SOT-23A -40°C to +125°C 2 TC1070 TC1071 TC1187 GND R1 Package Type 5-Pin SOT-23A VOUT 5 ADJ 4 3 SHDN ADJ 4 R2 Shutdown Control (from Power Control Logic) VOUT = VREF x [ R1 +1] R2 TC1070 TC1071 TC1187 1 VIN 2 GND 3 SHDN NOTE: 5-Pin SOT-23A is equivalent to the EIAJ (SC-74A) 2002 Microchip Technology Inc. DS21353B-page 1 © TC1070/TC1071/TC1187 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Input Voltage .........................................................6.5V Output Voltage........................... (-0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 5) Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V Operating Temperature Range...... -40°C < TJ < 125°C Storage Temperature.......................... -65°C to +150°C TC1070/TC1071/TC1187 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1mA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol VIN IOUTMAX Parameter Input Operating Voltage Maximum Output Current Min 2.7 50 100 150 VREF 1.165 — — TC1070; TC1071 TC1187 — — — — — — — — — — — — — — — Typ — — — — — 1.20 40 0.05 0.5 0.5 2 65 85 180 270 50 0.05 64 300 0.04 160 10 260 Max 6.0 — — — 5.5 1.235 — 0.35 2 3 — — 120 250 400 80 0.5 — 450 — — — — Units V mA Test Conditions Note 6 TC1070 TC1071 TC1187 VOUT VREF ∆VREF/∆T ∆VOUT/∆VIN ∆VOUT/VOUT Adjustable Output Voltage Range Reference Voltage VREF Temperature Coefficient Line Regulation Load Regulation V V ppm/°C % % Note 1 (VR + 1V) ≤ VIN ≤ 6V IL = 0.1mA to IOUTMAX IL = 0.1mA to IOUTMAX (Note 2) IL = 0.1mA IL = 20mA IL = 50mA IL = 100mA IL = 150mA (Note 3) SHDN = VIH , IL = 0 SHDN = 0V FRE ≤ 1kHz VOUT = 0V Note 4 VIN-VOUT Dropout Voltage mV TC1071; TC1187 TC1187 IIN IINSD PSRR IOUTSC ∆VOUT/∆PD TSD ∆TSD eN Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Thermal Shutdown Die Temperature Thermal Shutdown Hysteresis Output Noise VOUT x ∆T 2: µA µA dB mA V/W °C °C nV/√Hz IL = IOUT MAX Note 1: TC VOUT = (VOUTMAX – VOUTMIN) x 106 Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.. The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to I OUT MAX. 3: 4: 5: 6: © DS21353B-page 2 2002 Microchip Technology Inc. TC1070/TC1071/TC1187 TC1070/TC1071/TC1187 ELECTRICAL SPECIFICATIONS (CONTINUED ) Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1mA, CL = 3.3µ F, SHDN > VIH , TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol SHDN Input VIH VIL ADJ Input IADJ Adjust Input Leakage Current 10 6 VOUT x ∆T Parameter Min Typ Max Units Test Conditions SHDN Input High Threshold SHDN Input Low Threshold 45 — — — — 50 — 15 — %VIN %VIN pA VIN = 2.5V to 6.5V VIN = 2.5V to 6.5V Note 1: TC VOUT = (VOUTMAX – VOUTMIN) x 2: 3: 4: 5: 6: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX . 2002 Microchip Technology Inc. DS21353B-page 3 © TC1070/TC1071/TC1187 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin No. (5-Pin SOT-23A) 1 2 3 PIN FUNCTION TABLE Symbol VIN GND SHDN Unregulated supply input. Ground terminal. Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.5 µA (max). Output voltage adjust terminal. Output voltage setting is programmed with a resistor divider from VOUT to this input. A capacitor may also be added to this input to reduce output noise (See Section 3.2, Output Capacitor). Regulated voltage output. Description 4 ADJ 5 VOUT © DS21353B-page 4 2002 Microchip Technology Inc. TC1070/TC1071/TC1187 3.0 DETAILED DESCRIPTION 3.1 Adjust Input The TC1070, TC1071 and TC1187 are adjustable fixed output voltage regulators. (If a fixed version is desired, please see the TC1014/TC1015/TC1185 data sheet.) Unlike bipolar regulators, the TC1070, TC1071 and TC1187 supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to IOUTMAX operating load current range, (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 3-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05µA (typical), VOUT falls to zero volts. The output voltage setting is determined by the values of R1 and R2 (Figure 3-1). The ohmic values of these resistors should be between 470K and 3M to minimize bleeder current. The output voltage setting is calculated using the following equation. EQUATION 3-1: VOUT = VREF x [ R1 R2 +1 ] The voltage adjustment range of the TC1070, TC1071 and TC1187 is from VREF to (VIN – 0.05V). If so desired, a small capacitor (100pF to 0.01µF) may be added to the ADJ input to further reduce output noise. 3.2 Output Capacitor FIGURE 3-1: BATTERY-OPERATED SUPPLY VIN VOUT 5 C2 + 1µF R1 470K +2.45V 3.0V Battery + 1 + C1 1µF TC1070 TC1071 TC1187 GND 2 3 SHDN ADJ 4 C3 100pF to 0.01µF (Optional) Shutdown Control (from Power Control Logic) R2 470K A 1µF (min) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance greater than 0.1Ω and less than 5.0Ω, and a resonant frequency above 1MHz. A 1µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 2002 Microchip Technology Inc. DS21353B-page 5 © TC1070/TC1071/TC1187 4.0 4.1 THERMAL CONSIDERATIONS Thermal Shutdown Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.0V ±10% VOUTMIN = 2.7V – 2% ILOADMAX = 40mA TJMAX TAMAX = 125°C = 55°C Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160°C. The regulator remains off until the die temperature drops to approximately 150°C. 4.2 Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD ≈ (VINMAX – VOUTMIN)ILOADMAX = [(3.0 x 1.10) – (2.7 x .0.98)]40 x 10–3 = 26.2mW Maximum allowable power dissipation: PDMAX = (T JMAX – TAMAX) θJA = (125 – 55) 220 = 318mW In this example, the TC1070 dissipates a maximum of 26.2mW; below the allowable limit of 318mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. EQUATION 4-1: PD ≈ (VINMAX – VOUTMIN)ILOADMAX Where: PD VINMAX VOUTMIN ILOADMAX = Worst case actual power dissipation = Maximum voltage on VIN = Minimum regulator output voltage = Maximum output (load) current The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (θJA). The 5-Pin SOT-23A package has a θJA of approximately 220°C/Watt. EQUATION 4-2: PDMAX = (TJMAX – TAMAX) θJA Where all terms are previously defined. 4.3 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θJA and therefore increase the maximum allowable power dissipation limit. © DS21353B-page 6 2002 Microchip Technology Inc. TC1070/TC1071/TC1187 5.0 Note: TYPICAL CHARACTERISTICS (Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C) The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0.020 0.018 Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 10mA 0.100 0.090 DROPOUT VOLTAGE (V) Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 50mA DROPOUT VOLTAGE (V) 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0.000 -40 -20 0 20 50 TEMPERATURE (°C) 70 125 0.080 0.070 0.060 0.050 0.040 0.030 0.020 0.010 0.000 -40 -20 0 20 50 TEMPERATURE (°C) 70 125 CIN = 1µF COUT = 1µF CIN = 1µF COUT = 1µF 0.200 0.180 DROPOUT VOLTAGE (V) Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 100mA DROPOUT VOLTAGE (V) 0.300 0.250 0.200 0.150 0.100 0.050 0.000 Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 150mA 0.160 0.140 0.120 0.100 0.080 0.060 0.040 0.020 0.000 -40 -20 0 20 50 70 125 CIN = 1µF COUT = 1µF CIN = 1µF COUT = 1µF -40 -20 0 20 50 TEMPERATURE (°C) 70 125 TEMPERATURE (°C) 90 80 Ground Current vs. VIN (VOUT = 3.3V) ILOAD = 10mA GND CURRENT (µA) 90 80 70 60 50 40 30 20 10 0 Ground Current vs. VIN (VOUT = 3.3V) ILOAD = 100mA GND CURRENT (µA) 70 60 50 40 30 20 10 0 CIN = 1µF COUT = 1µF 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) CIN = 1µF COUT = 1µF 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) 2002 Microchip Technology Inc. DS21353B-page 7 © TC1070/TC1071/TC1187 5.0 TYPICAL CHARACTERISTICS (CONTINUED) (Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C) 80 70 GND CURRENT (µA) Ground Current vs. VIN (VOUT = 3.3V) ILOAD = 150mA 3.5 VOUT vs. VIN (VOUT = 3.3V) ILOAD = 0 3 2.5 60 VOUT (V) 50 40 30 20 10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) 2 1.5 1 CIN = 1µF COUT = 1µF 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 CIN = 1µF COUT = 1µF 5.5 6 6.5 7 VIN (V) 3.5 3.0 2.5 VOUT (V) VOUT vs. VIN (VOUT = 3.3V) 3.320 3.315 3.310 3.305 Output Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 10mA ILOAD = 100mA 2.0 1.5 1.0 0.5 0.0 0 VOUT (V) 3.300 3.295 3.290 3.285 CIN = 1µF COUT = 1µF 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 VIN (V) 3.280 3.275 -40 CIN = 1µF COUT = 1µF VIN = 4.3V -20 -10 0 20 40 85 125 TEMPERATURE (°C) 3.290 3.288 3.286 Output Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 150mA VOUT (V) 3.284 3.282 3.280 3.278 3.276 3 .274 -40 -20 -10 0 20 40 85 125 CIN = 1µF COUT = 1µF VIN = 4.3V TEMPERATURE (°C) © DS21353B-page 8 2002 Microchip Technology Inc. TC1070/TC1071/TC1187 5.0 TYPICAL CHARACTERISTICS (CONTINUED) (Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C) 5.025 5.020 5.015 Output Voltage vs. Temperature (VOUT = 5V) ILOAD = 10mA 4.994 4.992 4.990 4.988 Output Voltage vs. Temperature (VOUT = 5V) ILOAD = 150mA VOUT (V) 5.005 5.000 4.995 4.990 4.985 VOUT (V) VIN = 6V CIN = 1µF COUT = 1µF -40 -20 -10 0 20 40 85 125 5.010 4.986 4.984 4.982 4.980 4.978 4.976 4.974 -40 -20 -10 0 20 40 85 125 VIN = 6V CIN = 1µF COUT = 1µF TEMPERATURE (°C) TEMPERATURE (°C) 70 60 Temperature vs. Quiescent Current (VOUT = 5V) ILOAD = 10mA GND CURRENT (µA) 80 70 60 50 40 30 20 10 0 Temperature vs. Quiescent Current (VOUT = 5V) ILOAD = 150mA GND CURRENT (µA) 50 40 30 20 10 0 -40 -20 -10 0 20 40 TEMPERATURE (°C) 85 125 VIN = 6V CIN = 1µF COUT = 1µF VIN = 6V CIN = 1µF COUT = 1µF -40 -20 -10 0 20 40 85 125 TEMPERATURE (°C) Output Noise vs. Frequency 10.0 RLOAD = 50Ω COUT = 1µF CIN = 1µF 1000 Stability Region vs. Load Current COUT = 1µF to 10µF -30 -35 -40 100 COUT ESR (Ω) 10 1 Stable Region Stable Region PSRR (dB) -45 -50 -55 -60 -65 0.1 -70 -75 Power Supply Rejection Ratio IOUT = 10mA VINDC = 4V VINAC = 100mVp-p VOUT = 3V CIN = 0 COUT = 1µF NOISE (µV/√Hz) 1.0 0.1 0.0 0.01K 0.1K 0.01 1K 10K 100K 1000K FREQUENCY (Hz) 0 10 20 30 40 50 60 70 80 90 100 LOAD CURRENT (mA) -80 0.01K 0.1K 1K 10K 100K 1000K FREQUENCY (Hz) 2002 Microchip Technology Inc. DS21353B-page 9 © TC1070/TC1071/TC1187 5.0 TYPICAL CHARACTERISTICS (CONTINUED) Measure Rise Time of 3.3V LDO Conditions: CIN = 1µF, COUT = 1µF, ILOAD = 100mA, VIN = 4.3V, Temp = 25°C, Fall Time = 184µS Measure Fall Time of 3.3V LDO Conditions: CIN = 1µF, COUT = 1µF, ILOAD = 100mA, VIN = 4.3V, Temp = 25°C, Fall Time = 52µS VSHDN VSHDN VOUT VOUT Measure Rise Time of 5.0V LDO Conditions: CIN = 1µF, COUT = 1µF, ILOAD = 100mA, VIN = 6V, Temp = 25°C, Fall Time = 192µS Measure Fall Time of 5.0V LDO Conditions: CIN = 1µF, COUT = 1µF, ILOAD = 100mA, VIN = 6V, Temp = 25°C, Fall Time = 88µS VSHDN VSHDN VOUT VOUT Thermal Shutdown Response of 5.0V LDO Conditions: VIN = 6V, CIN = 0µF, COUT = 1µF VOUT ILOAD was increased until temperature of die reached about 160°C, at which time integrated thermal protection circuitry shuts the regulator off when die temperature exceeds approximately 160°C. The regulator remains off until die temperature drops to approximately 150°C. © DS21353B-page 10 2002 Microchip Technology Inc. TC1070/TC1071/TC1187 6.0 6.1 PACKAGING INFORMATION Package Marking Information “1” & “2” = part number code + temperature range and voltage (V) Adjustable TC1070 Code BA TC1071 Code BB TC1187 Code R9 “3” represents year and quarter code “4” represents lot ID number 6.2 Taping Form Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 5-Pin SOT-23A 8 mm 4 mm 3000 7 in 2002 Microchip Technology Inc. DS21353B-page 11 © TC1070/TC1071/TC1187 6.3 Package Dimensions SOT-23A-5 .075 (1.90) REF. .122 (3.10) .098 (2.50) .020 (0.50) .012 (0.30) PIN 1 .122 (3.10) .106 (2.70) .057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00) .071 (1.80) .059 (1.50) .037 (0.95) REF. 10° MAX. .024 (0.60) .004 (0.10) .010 (0.25) .004 (0.09) Dimensions: inches (mm) © DS21353B-page 12 2002 Microchip Technology Inc. TC1070/TC1071/TC1187 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2002 Microchip Technology Inc. DS21353B-page 13 TC1070/TC1071/TC1187 NOTES: DS21353B-page 14  2002 Microchip Technology Inc. TC1070/TC1071/TC1187 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. 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Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 05/01/02 © DS21353B-page 16 2002 Microchip Technology Inc. *B35312SD*