SG2003N

SG2000 Series HIGH VOLTAGE MEDIUM CURRENT DRIVER ARRAYS DESCRIPTION The SG2000 series integrates seven NPN Darlington pairs with internal suppression diodes to drive lamps, relays, and solenoids in many military, aerospace, and industrial applications that require severe environments. All units feature open collector outputs with greater than 50V breakdown voltages combined with 500mA current carrying capabilities. Five different input configurations provide optimized designs for interfacing with DTL, TTL, PMOS, or CMOS drive signals. These devices are designed to operate from -55°C to 125°C ambient temperature in a 16 pin dual in line ceramic (J) package and 20 pin Leadless Chip Carrier (LCC). The plastic dual in–line (N) is designed to operate over the commercial temperature range of 0°C to 70°C. FEATURES • • • • • • • Seven npn Darlington pairs -55°C to 125°C ambient operating temperature range Collector currents to 600mA Output voltages from 50V to 95V Internal clamping diodes for inductive loads DTL, TTL, PMOS, or CMOS compatible inputs Hermetic ceramic package HIGH RELIABILITY FEATURES ♦ Available to MIL-STD-883 and DESC SMD ♦ MIL-M38510/14101BEA - JAN2001J ♦ MIL-M38510/14102BEA - JAN2002J ♦ MIL-M38510/14103BEA - JAN2003J ♦ MIL-M38510/14104BEA - JAN2004J ♦ Radiation data available ♦ LMI level "S" processing available PARTIAL SCHEMATICS Rev 1.3b 4/7/2005 Copyright © 1997 1 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570 Microsemi Inc. ABSOLUTE MAXIMUM RATINGS (Note 1) Output Voltage, VCE (SG2000, 2010 series) ................................................ 50V (SG2020 series) .......................................................... 95V Input Voltage, VIN (SG2002,3,4) ............................................................... 30V Continuous Input Current, IIN ........................................ 25mA Note 1. Values beyond which damage may occur. Peak Collector Current, IC (SG2000, 2020) ...................................................... 500mA (SG2010) ................................................................ 600mA Operating Junction Temperature Hermetic (J, L Packages) ......................................... 150°C Plastic (N, Packages) ............................................... 150°C Storage Temperature Range .......................... -65°C to 150°C Lead Temperature (Soldering 10 sec.) ......................... 300°C RoHS Peak Package Solder Reflow Temp. (40 sec. max. exp.)...... 260°C (+0, -5) THERMAL DATA J Package: Thermal Resistance-Junction to Case, θJC .................. 30°C/W Thermal Resistance-Junction to Ambient, θ JA ............... 80°C/W N Package: Thermal Resistance-Junction to Case, θJC .................. 40°C/W Thermal Resistance-Junction to Ambient, θ JA .............. 65°C/W L Package: Thermal Resistance-Junction to Case, θJC .................. 35°C/W Thermal Resistance-Junction to Ambient, θ JA ............ 120°C/W Note A. Junction Temperature Calculation: TJ = T A + (PD x θJA). Note B. The above numbers for θJC are maximums for the limiting thermal resistance of the package in a standard mounting configuration. The θJA numbers are meant to be guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. RECOMMENDED OPERATING CONDITIONS (Note 2) Output Voltage, VCE SG2000, SG2010 series .............................................. 50V SG2020 series ............................................................. 95V Note 2. Range over which the device is functional. Peak Collector Current, IC SG2000, SG2020 series ........................................... 50mA SG2010 series ........................................................ 500mA Operating Ambient Temperature Range SG2000 Series - Hermetic .......................... -55°C to 125°C SG2000 Series - Plastic .................................. 0° C to 70°C SELECTION GUIDE Device SG2001 SG2002 SG2003 SG2004 SG2011 SG2012 VCE Max 50V 50V 50V 50V 50V 50V IC Max 500mA 500mA 500mA 500mA 600mA 600mA Logic Inputs General Purpose PMOS, CMOS 14V-25V PMOS 5V TTL, CMOS 6V-15V CMOS, PMOS General Purpose PMOS, CMOS 14V-25V PMOS Device SG2013 SG2014 SG2015 SG2021 SG2023 SG2024 VCE Max 50V 50V 50V 95V 95V 95V IC Max 600mA 600mA 600mA 500mA 500mA 500mA Logic Inputs 5V TTL, CMOS 6V-15V CMOS, PMOS High Output TTL General Purpose PMOS, CMOS 5V TTL, CMOS 6V-15V CMOS, PMOS Rev 1.3b Copyright © 1997 2 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570 ELECTRICAL CHARACTERISTICS (Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG2000 series - Hermetic - with -55° C ≤ TA ≤ 125°C and SG2000 series - Plastic - with 0° C ≤ TA ≤ 70° C. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.) SG2001 thru SG2004 Parameter Output Leakage Current (ICEX) Collector - Emitter (VCE(SAT)) Applicable Devices All SG2002 SG2004 All Temp. Test Conditions VCE = 50V VCE = 50V, VIN = 6V VCE = 50V, VIN = 1V IC = 350mA, IB = 850µ A IC = 200mA, IB = 550µ A IC = 100mA, IB = 350µ A IC = 350mA, IB = 500µ A IC = 200mA, IB = 350µ A IC = 100mA, IB = 250µ A IC = 350mA, IB = 500µ A IC = 200mA, IB = 350µ A IC = 100mA, IB = 250µ A VIN = 17V VIN = 3.85V VIN = 5V VIN = 12V IC = 500µ A VCE = 2V, IC = 300mA VCE = 2V, IC = 300mA VCE = 2V, IC = 200mA VCE = 2V, IC = 250mA VCE = 2V, IC = 300mA VCE = 2V, IC = 200mA VCE = 2V, IC = 250mA VCE = 2V, IC = 300mA VCE = 2V, IC = 125mA VCE = 2V, IC = 200mA VCE = 2V, IC = 275mA VCE = 2V, IC = 350mA VCE = 2V, IC = 125mA VCE = 2V, IC = 200mA VCE = 2V, IC = 275mA VCE = 2V, IC = 350mA VCE = 2V, IC = 350mA VCE = 2V, IC = 350mA Limits Units Min. Typ. Max. 100 µA 500 µA 500 µA 1.6 1.8 V 1.3 1.5 V 1.1 1.3 V 1.25 1.6 V 1.1 1.3 V 0.9 1.1 V 1.6 1.8 V 1.3 1.5 V 1.1 1.3 V 480 850 1300 µA 650 930 1350 µA 240 350 500 µA 650 1000 1450 µA 25 50 µA 18 V 13 V 3.3 V 3.6 V 3.9 V 2.4 V 2.7 V 3.0 V 6.0 V 8.0 V 10 V 12 V 5.0 V 6.0 V 7.0 V 8.0 V 500 1000 15 25 pF 250 1000 ns 250 1000 ns 50 µA 1.7 2.0 V TA TA TA TA TA TA TA TA TA = = = = = = = = = TMIN TMIN TMIN 25°C 25°C 25°C TMAX TMAX TMAX Input Current (IIN(ON)) SG2002 SG2003 SG2004 All SG2002 SG2003 TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA = = = = = = = = = = = = = = = = = = = = = = (IIN(OFF)) Input Voltage (VIN(ON)) SG2004 D-C Forward Current Transfer Ratio (hFE) Input Capacitance (CIN) (Note 3) Turn-On Delay (TPLH) Turn-Off Delay (TPHL) Clamp Diode Leakage Current (IR) Clamp Diode Forward Voltage (VF) SG2001 All All All All All TMAX TMIN TMAX TMIN TMIN TMIN TMAX TMAX TMAX TMIN TMIN TMIN TMIN TMAX TMAX TMAX TMAX TMIN 25°C 25°C 25°C 0.5 EIN to 0.5 EOUT 25°C 0.5 EIN to 0.5 EOUT VR = 50V IF = 350mA Note 3. These parameters, although guaranteed, are not tested in production. Rev 1.3b Copyright © 1997 3 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570 ELECTRICAL CHARTACTERISTICS SG2011 thru SG2015 Parameter Output Leakage Current (ICEX) Collector - Emitter (VCE(SAT)) (continued) Applicable Devices All SG2012 SG2014 All Temp. Test Conditions VCE = 50V VCE = 50V, VIN = 6V VCE = 50V, VIN = 1V IC = 500mA, IB = 1100µ A IC = 350mA, IB = 850µ A IC = 200mA, IB = 550µ A IC = 500mA, IB = 600µ A IC = 350mA, IB = 500µ A IC = 200mA, IB = 350µ A IC = 500mA, IB = 600µ A IC = 350mA, IB = 500µ A IC = 200mA, IB = 350µ A VIN = 17V VIN = 3.85V VIN = 5V VIN = 12V VIN = 3V IC = 500µ A VCE = 2V, IC = 500mA VCE = 2V, IC = 500mA VCE = 2V, IC = 250mA VCE = 2V, IC = 300mA VCE = 2V, IC = 500mA VCE = 2V, IC = 250mA VCE = 2V, IC = 300mA VCE = 2V, IC = 500mA VCE = 2V, IC = 275mA VCE = 2V, IC = 350mA VCE = 2V, IC = 500mA VCE = 2V, IC = 275mA VCE = 2V, IC = 350mA VCE = 2V, IC = 500mA VCE = 2V, IC = 350mA VCE = 2V, IC = 500mA VCE = 2V, IC = 350mA VCE = 2V, IC = 500mA VCE = 2V, IC = 500mA VCE = 2V, IC = 500mA TA TA TA TA TA TA TA TA TA = = = = = = = = = TMIN TMIN TMIN 25°C 25°C 25°C TMAX TMAX TMAX Input Current (IIN(ON)) SG2012 SG2013 SG2014 SG2015 All SG2012 SG2013 (IIN(OFF)) Input Voltage (VIN(ON)) SG2014 SG2015 D-C Forward Current Transfer Ratio (hFE) Input Capacitance (CIN) (Note 3) Turn-On Delay (TPLH) Turn-Off Delay (TPHL) Clamp Diode Leakage Current (IR) Clamp Diode Forward Voltage (VF) SG2011 All All All All All TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA = = = = = = = = = = = = = = = = = = = = = = = = TMAX TMIN TMAX TMIN TMIN TMIN TMAX TMAX TMAX TMIN TMIN TMIN TMAX TMAX TMAX TMIN TMIN TMAX TMAX TMIN 25°C 25°C 25°C 0.5 EIN to 0.5 EOUT 25°C 0.5 EIN to 0.5 EOUT VR = 50V IF = 350mA IF = 500mA Limits Units Min. Typ. Max. 100 µA 500 µA 500 µA 1.8 2.1 V 1.6 1.8 V 1.3 1.5 V 1.7 1.9 V 1.25 1.6 V 1.1 1.3 V 1.8 2.1 V 1.6 1.8 V 1.3 1.5 V 480 850 1300 µA 650 930 1350 µA 240 350 500 µA 650 1000 1450 µA 1180 1500 2400 µA 25 50 µA 23.5 V 17 V 3.6 V 3.9 V 6.0 V 2.7 V 3.0 V 3.5 V 10 V 12 V 17 V 7.0 V 8.0 V 9.5 V 3.0 V 3.5 V 2.4 V 2.6 V 450 900 15 25 pF 250 1000 ns 250 1000 ns 50 µA 1.7 2.0 V 2.5 V Note 3. These parameters, although guaranteed, are not tested in production. Rev 1.3b Copyright © 1997 4 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570 ELECTRICAL CHARACTERISTICS SG2021 thru SG2024 Parameter Output Leakage Current (ICEX) Collector - Emitter (VCE(SAT)) (continued) Applicable Devices All SG2024 All Temp. Test Conditions VCE = 95V VCE = 95V, VIN = 1V IC = 350mA, IB = 850µ A IC = 200mA, IB = 550µ A IC = 100mA, IB = 350µ A IC = 350mA, IB = 500µ A IC = 200mA, IB = 350µ A IC = 100mA, IB = 250µ A IC = 350mA, IB = 500µ A IC = 200mA, IB = 350µ A IC = 100mA, IB = 250µ A VIN = 3.85V VIN = 5V VIN = 12V IC = 500µ A VCE = 2V, IC = 300mA VCE = 2V, IC = 200mA VCE = 2V, IC = 250mA VCE = 2V, IC = 300mA VCE = 2V, IC = 200mA VCE = 2V, IC = 250mA VCE = 2V, IC = 300mA VCE = 2V, IC = 125mA VCE = 2V, IC = 200mA VCE = 2V, IC = 275mA VCE = 2V, IC = 350mA VCE = 2V, IC = 125mA VCE = 2V, IC = 200mA VCE = 2V, IC = 275mA VCE = 2V, IC = 350mA VCE = 2V, IC = 350mA VCE = 2V, IC = 350mA Input Current (IIN(ON)) (IIN(OFF)) Input Voltage (VIN(ON)) SG2023 SG2024 All SG2023 TA TA TA TA TA TA TA TA TA = = = = = = = = = TMIN TMIN TMIN 25°C 25°C 25°C TMAX TMAX TMAX SG2024 D-C Forward Current Transfer Ratio (hFE) Input Capacitance (CIN) (Note 3) Turn-On Delay (TPLH) Turn-Off Delay (TPHL) Clamp Diode Leakage Current (IR) Clamp Diode Forward Voltage (VF) SG2021 All All All All All TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA TA = = = = = = = = = = = = = = = = = = = = = TMAX TMAX TMIN TMIN TMIN TMAX TMAX TMAX TMIN TMIN TMIN TMIN TMAX TMAX TMAX TMAX TMIN 25°C 25°C 25°C 0.5 EIN to 0.5 EOUT 25°C 0.5 EIN to 0.5 EOUT VR = 95V IF = 350mA Limits Units Min. Typ. Max. 100 µA 500 µA 1.6 1.8 V 1.3 1.5 V 1.1 1.3 V 1.25 1.6 V 1.1 1.3 V 0.9 1.1 V 1.6 1.8 V 1.3 1.5 V 1.1 1.3 V 650 930 1350 µA 240 350 500 µA 650 1000 1450 µA 25 50 µA 13 V 3.3 V 3.6 V 3.9 V 2.4 V 2.7 V 3.0 V 6.0 V 8.0 V 10 V 12 V 5.0 V 6.0 V 7.0 V 8.0 V 500 1000 15 25 pF 250 1000 ns 250 1000 ns 50 µA 1.7 2.0 V Note 3. These parameters, although guaranteed, are not tested in production. Rev 1.3b Copyright © 1997 5 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570 CHARACTERISTIC CURVES FIGURE 1. OUTPUT CHARACTERISTICS FIGURE 2. OUTPUT CURRENT VS. INPUT VOLTAGE FIGURE 3. OUTPUT CURRENT VS. INPUT CURRENT FIGURE 4. INPUT CHARACTERISTICS - SG2002 FIGURE 5. INPUT CHARACTERISTICS - SG2003 FIGURE 6. INPUT CHARACTERISTICS - SG2004 FIGURE 7. PEAK COLLECTOR CURRENT VS. DUTY CYCLE Rev 1.3b Copyright © 1997 6 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570 CONNECTION DIAGRAMS & ORDERING INFORMATION Package 16-PIN CERAMIC DIP J - PACKAGE (See Notes Below) Ambient Part No. (Note 3) Temperature Range SG2XXXJ/883B SG2023J/DESC JAN2001J JAN2002J JAN2003J JAN2004J SG2XXXJ -55°C -55°C -55°C -55°C -55°C -55°C -55°C to to to to to to to 125°C 125°C 125°C 125°C 125°C 125°C 125°C Connection Diagram 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 16-PIN PLASTIC DIP N - PACKAGE SG2003N SG2023N 0°C to 70°C 0°C to 70°C -55°C to 125° C -55°C to 125° C N Package: RoHS Compliant / Pb-free Transition DC: 0503 N Package: RoHS / Pb-free 100% Matte Tin Lead Finish 3 2 1 20 19 20-PIN CERAMIC LEADLESS CHIP CARRIER L- PACKAGE SG2XXXL/883B SG2XXXL 4 5 6 7 8 18 17 16 15 14 9 10 11 12 13 DW Package (Not Pictured) is 16-Pin Wide Body SOIC, same pinout as J package pictured above. DW Package: RoHS Compliant / Pb-free Transition DC: 0516 DW Package: RoHS / Pb-free 100% Matte Tin Lead Finish Note 1. Contact factory for JAN and DESC product availability. 2. All parts are viewed from the top. 3. See selection guide for specific device types. Rev 1.3b Copyright © 1997 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570 7