0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
H52N-008-210-AGGE

H52N-008-210-AGGE

  • 厂商:

    MITSUMI(美上美)

  • 封装:

  • 描述:

    H52N-008-210-AGGE - microSD card connectors - Mitsumi Electronics, Corp.

  • 数据手册
  • 价格&库存
H52N-008-210-AGGE 数据手册
MITSUMI microSD card connectors CIM-H32N, H52N, H52R Connectors FEATURES 1. Push-in Push-out eject machanism. Card eject distance 3.8mm 2. Small and tin design Normal mount type [CIM-H32N] : H 1.85mm W 13.7mm Length 16.0mm Reverse mount type [CIM-H52R] : H 1.85mm W 14.0mm Length 16.0mm 3. Prevent card jump out of a connector with brake mechanism. 4. Switch With card detection [Normally open type] 5. Prevent card drop from connector with half lock mechanism. CIM-H52R CIM-H32N HOW TO ORDER 1. CIM-H32N 2. CIM-H52N H32N-008-21 0 - A G G E 1 1 2 3 4 5 6 7 8 2 3 4 5 6 78 Series No. (H32N : Nomal type) No. of contacts (008 : 8pins) Housing material (21 : LCP resin) Housing UL grade (0 : UL94V-0) Contact plating (A : Gold) Contact plating thickness (G : 3µm) Contact read style (G : Angle SMT) Package (E : Taping) H52N-008-21 0 - A G G E 1 1 2 3 4 5 6 7 8 2 3 4 5 6 78 Series No. (H52N : Nomal type) (H52R : Reverse type) No. of contacts (008 : 8pins) Housing material (21 : LCP resin) Housing UL grade (0 : UL94V-0) Contact plating (A : Gold) Contact plating thickness (G : 3µm) Contact read style (G : Angle SMT) Package (E : Taping) MITSUMI microSD card connectors SPECIFICATIONS ELECTRICAL CHARACTERISTICS Rated Voltage Rated Current Withstanding Voltage Insulation Resistance Contact Resistance MECHANICAL CHARACTERISTICS Life (Matching Cycle) Card Insertion Force Eject Force Using Temperature Range 10,000times 2.0N~6.0N 2.0N~6.0N -25~+85°C AC 50V (rms) 0.5A 500V AC (rms) 1minute 1000MΩ min. (Initial value) 100mΩ max. (Initial value) MATERIAL & FINISH Component Parts Housing Contact CD Switch Vdd CD Switch Vss Plate Slider Half Lock Coil Spring Lock Pin Material LCP resin Copper Alloy Copper Alloy Copper Alloy Copper Alloy PA9T resin SUS SUS SUS Finish (Black) Gold plating Gold plating Gold plating - (Black) - Board installation condition Normal type (CIM-H32N) 1.85 16 Card Contact pad side Reverse type (CIM-H52R) Card 1.85 16 Contact pad side MITSUMI DIMENSIONS CIM-H32N 1.36 13.7 1.85 SW [Vss] 0.6 5.3 7.74 5.5 1.2 0.5 SW [Vdd] 0.6 0.8 0.3 5.5 7.74 1.1 (0.3) 5.9 1.96 1.2 1.8 1.8 1.3 (0.6) 1.1 14.7 5.35 14.55 Recommended PWB layout (NTS) ±0.05 16 1.3 0.3 0.95 +0.25 0 Card entrance (7.94) 0.85 0.9 Recommended PWB layout 11.23+0.15 -0.05 Card entrance 2.32 0.75 1.1 7.7 4.75 #1 1.2 11.8 7.7 1.3 0.3 0.8 0.3 11.5 1.75 14.2 24 Lead er of area cove r tap e 200 0 20~3 150~ Packing specification 2.25 40 ±0.2 (10Pitch) 20 4 1.9 1.4 1.4 0.5 3.35 16.5 Tiller area 12~18 Pockets ø150 ø380 Connector parked area 24.4 +2 0 12~18 Pockets Leader area 2 ±0.5 1.4 0.3 0.3 12.5 MITSUMI microSD card connectors CIM-H52R 7.7 14 0.7 #1 4.74 2.11 1.08 1.1 0.7 #8 0.55 1.2 1.2 0.95 +0.15 -0.05 Card entrance 12.6 2.32 11.21 +0.15 -0.05 Card entrance Recommended PWB layout 5.94 3.31 2.28 1.8 16.4 7.7 1.1 1.8 0.7 0.65 8-0.8 (0.3) 200 1.85 0.35 1.65 15.7 13 Packing specification 1.8 1.75 2.65 40 24 ±0.2 (10pitch) 4 Recommended PWB layout (NTS) ±0.05 11.5 0.5 3.35 17.3 Tiller area 12~18 Pockets ø150 16.4 24 Lead ø380 er a f co rea o 0 20~3 ver t ape 150~ Connector parked area 24.4 0 +2 12~18 Pockets Leader area 2 ±0.5 1.8 0.68 4-1.65 15.85 10.8 1.5 1.2 0.6 0.6 1.2 14.8 16
H52N-008-210-AGGE 价格&库存

很抱歉,暂时无法提供与“H52N-008-210-AGGE”相匹配的价格&库存,您可以联系我们找货

免费人工找货