74441-0017

FEATURES AND SPECIFICATIONS Features and Benefits s s s s s s s s s 30-pin, 0.80mm (.031”) pitch connector with SMT leads for high-speed data transmission Coplanarity of solder terminals within 0.10mm (.004”) for processing reliability Card entry slot accepts 1.0mm (.039”) thick integrated circuit board for use with MSA-compliant pluggable modules Alignment posts provide stable placement on the PCB during processing Standoffs allow easy PCB cleaning after soldering Tape-and-reel packaging for SMT robotic placement SMT design provides option for connector placement on either side of the PCB High-temperature thermoplastic, UL94V-0, for dimensional stability Select-gold plated contacts with a choice of plating thicknesses for optimizing cost and performance 0.80mm (.031") Pitch Z-Axis Pluggable Host Connector for 10 Gigabit XFP Modules Right Angle, SMT, 30-Pin The 30-pin Z-Axis Pluggable host connector enables the use of emerging gigabit-speed hot-pluggable transceiver modules for horizontal front-panel access. It conforms to the host-board layout as defined in the 10 Gigabit Small Form Factor Pluggable (XFP) Multi-source Agreement (MSA) for 10-Gigabit data rates. Molex is referenced as an approved source in the MSA. The XFP MSA provides a specification for the pluggable module, cage, and host connector to convert serial electrical signals to external serial optical or electrical signals. XFP operates with SONET OC-192, 10 Gigabit Fibre Channel, and 10 Gigabit Ethernet links with the same form-factor module, for an economical 10-Gigabit solution. Module pluggability increases configuration flexibility by providing postponement manufacturing capability and a pay-as-you-populate cost structure for the end-user after installation. The 30-pin host connector features a compact, high bandwidth interface to support the XFI (“Ziffy”) 10Gbps serial electrical interface specification. The connector is typically used in conjunction with an XFP cage, flange and EMI gasket assembly, along with a heat sink and attachment clip, to attach an optical LC duplex or electrical XFP transceiver module to the host board. The XFP MSA group brings together leading networking, system, semiconductor and connector companies, including Molex, from both the telecommunications and datacommunications markets. The Z-Axis Pluggable host connectors are also available in other circuit sizes for use with Small Form-factor Pluggable (SFP), XENPAK, and other 10-Gigabit pluggable transceivers. APPLICATIONS The 30-pin host connector attaches 10-Gigabit XFP pluggable transceivers in a horizontal Z-axis to the host PCB for use in various data networking equipment: s s s s 0.80mm (.031") Pitch Z-Axis Pluggable Host Connector for 10 Gigabit XFP Modules Right Angle, SMT, 30-Pin Switches Routers Servers Storage devicess Typical XFP Application with Modules Mating to Host Connector, EMI Cage Assembly and Heat Sink ORDERING INFORMATION 30-Pin Host Connector Order Number 74441-0007 74441-0017 Select Gold Plating Thickness 0.38mm (15µ") 0.76mm (30µ") Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com Far East South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 V isit o u r W e b si t e at h t t p:/ / www.mo l e x .co m/ 10g i g .h t ml Order No. USA-184 Printed in USA/2.5K/JI/JI/2003.03 © 2003, Molex