75730-0120

FEATURES AND SPECIFICATIONS 4.00mm (.157”) Pitch Micro-Max Power™ High-Current Header 75730 Board-to-Board Low-profile, high-current Micro-Max Power header provides versatile solutions in a compact design Designed for high-current density applications, Molex’s Micro-Max Power header is soldered directly to PCBs such as a Voltage Regulator Module (VRM) or a mother- board using a slotted via. With a current rating of 16.0A per blade at 30°C T-rise, Micro-Max Power may be used in any board-to-board application where power transfer is needed through a nonseparable interface in a compact design. Micro-Max Power headers are available in circuit sizes ranging from 4 to 24 blades in a single-row configuration. Optional voided circuits are available, to allow for use in high-voltage applications. Left to right: 7, 10, and 15 circuit versions Features and Benefits n 4.17mm (.164“) connector height off the PCB, the low-profile design enhances system airflow n Non-separable interface allows for higher current and greater density capability with lower resistance plane-to-plane compared to similar products with separable interfaces or standard stick headers n Compact size improves airflow and saves PCB space n Optional voided circuits with design flexibility for high-voltage applications n Two blade lengths available to accommodate 1.57 to 2.36mm (.050 to .093”) PCB thicknesses SPECIFICATIONS Reference Information Packaging: Tray UL File No.: E29179 Designed In: USA Electrical Voltage: 250V Current: 16.0A at 30°C T-rise Insulation Resistance: 5000 Megohms min. Mechanical Terminal Retention: 7.78 N (1.75 lbs) min. Physical Housing: LCP Contact: Copper (Cu) Alloy Plating: Solder Tail Area – 100µ” Tin (Sn) Underplating – 50µ” Nickel (Ni) overall PCB Thickness: Mother board – 1.57 to 3.18mm (.062 to .125”) Daughter Card – 1.27 to 2.36mm (.050 to .093”) Operating Temperature: -40 to +105°C APPLICATIONS 4.00mm (.157”) Pitch Micro-Max Power™ High-Current Header 75730 Board-to-Board n VRM modules or any application for point-of-load power transfer n Small Form Factor (SFF) PCs, workstations, servers, routers, switches, etc. VRM or Riser Card 4.17 4.00 Mother Board ORDERING INFORMATION Order No. Mother Board : 3.06mm (.120”) Tail Length Circuit Size Order No. Mother Board : 3.81mm (.150”) Tail Length Circuit Size 75730-0104 75730-0106 75730-0108 75730-0110 75730-0112 75730-0114 75730-0116 75730-0118 75730-0120 75730-0122 75730-0124 75730-0150 4 6 8 10 12 14 16 18 20 22 24 Voided Circuits 75730-0204 75730-0206 75730-0208 75730-0210 75730-0212 75730-0214 75730-0216 75730-0218 75730-0220 75730-0222 75730-0224 75730-0250 4 6 8 10 12 14 16 18 20 22 24 Voided Circuits Note: Even circuit sizes shown above. Odd circuit sizes also available, please contact Molex. Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com Order No. 987650-1182 Asia Pacific North Headquarters Asia Pacific South Headquarters European Headquarters Yamato, Kanagawa, Japan Jurong, Singapore Munich, Germany 81-46-265-2325 65-6268-6868 49-89-413092-0 apninfo@molex.com fesinfo@molex.com eurinfo@molex.com Visit our website at www.molex.com/product/micromaxpower.html Printed in USA/JI/2007.06 Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352 ©2007, Molex