75800-0002

FEATURES AND SPECIFICATIONS 0.75mm (.030”) Pitch AMC.0 B+ 170-Circuit Connectors footprint further reduces crosstalk by managing inter-pair affinity and incorporating additional ground vias for isolation. As a result, the AMC.0 B+ connectors achieve crosstalk of less than 3 percent at 12.5 Gbps. Three versions of the Molex AMC.0 B+ connector exist: the standard connector with locating pegs (series 75800), connector without pegs (series 75908) and the 1.15mm (.045”) extended-height connector (series 75791). This taller height is optimized for blade-server applications where cooling is critical. AMC.0 B+ connectors from Molex support the next generation of mezzanine card standards and 12.5 Gbps speeds The 170-circuit AMC.0 B+, or AdvancedMCTM connectors from Molex support the next generation of mezzanine card standards that allow for hot-plugging of high-speed serial interconnects. These connectors support AdvancedTCA (Advanced Telecommunications Computing Architecture), a standard developed by PICMG (PCI Industrial Computer Manufacturers Group). Molex AMC.0 B+ connectors feature controlled impedance and reduced crosstalk, plus a footprint launch optimized for high-speed data rates. This design enables the connector to achieve 12.5 Gbps NRZ (Non Return to Zero) signal transmission. This enhanced 75800 Standard 75908 Pegless 75791 Extended Height Series 75800 Standard AMC.0 B+ Connector Features and Benefits n Insert-molded wafer design provides excellent electrical performance n Press-fit contacts and high-speed footprint for simpler application to PCB and superior signal integrity than competition n Tin or Tin-Lead tail plating supports RoHS requirements and customer preferences for press-fit n Meets PICMG Advanced MCTM specification and industry standard requirements SPECIFICATIONS Reference Information Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: AMC module Designed In: Millimeters Electrical Voltage: 250V AC Current: 1.5A Power Terminal 1.0A Other Terminals Contact Resistance: 60 milliohms max. Dielectric Withstanding Voltage: 80V RMS Insulation Resistance: 500V DC Mechanical Insertion Force to PCB: 6050N (1360 lbf) max. Mating Force: 100N (22 lbf) max. Unmating Force: 65N (14 lbf) max. Durability: 200 cycles Physical Housing: Black Thermoplastic Contact: Copper (Cu) Alloy Plating: Contact Area — 0.76μm Gold (Au) Solder Tail Area — Tin or Tin-Lead (Sn or Sn/Pb) Underplating — Nickel (Ni) PCB Thickness: 2.36mm (.092”) Operating Temperature: -40 to +105ºC APPlICATIONS 0.75mm (.030”) Pitch AMC.0 B+ 170-Circuit Connectors 75800 Standard 75908 Pegless 75791 Extended Height n Telecommunications equipment n For use in the IEEE 1386 market as it transitions to serial buses n General “blade” computing applications n Extended-height version used in non-ATCA applications n Any hot-pluggable high-speed serial bus application ATCA Carrier ATCA Rack ORDERING INFORMATION Order No. Comment Tail Plating Height PCB Peg 75800-0001 75800-0002 75908-0001 75908-0002 75791-0001 75791-0002 With alignment pegs With alignment pegs Without alignment pegs Without alignment pegs Extended height Extended height Tin plated Tin/Lead plated Tin plated Tin/Lead plated Tin plated Tin/Lead plated 21.85mm (.860”) 21.85mm (.860”) 21.85mm (.860”) 21.85mm (.860”) 23.0mm (.905”) 23.0mm (.905”) Yes Yes No No Yes Yes Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com Order No. 987650-0651 Asia Pacific North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com Asia Pacific South Headquarters Jurong, Singapore 65-6268-6868 fesinfo@molex.com Visit our website at www.molex.com Printed in USA/JI/2007.01 European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352 ©2007, Molex