0432498924

PRODUCT SPECIFICATION LOW PROFILE RIGHT ANGLE MODULAR JACKS 1.0 SCOPE This Product Specification covers the 1.27 mm (.050 inch) centerline (pitch) printed circuit board (PCB) modular jack connector series with selective gold and tin plating. 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND SERIES NUMBER(S) Low Profile Right Angle Modular Jacks 43249 2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS See the appropriate sales drawings (SDA-43249) for information on dimensions, materials, plating and markings. 2.3 SAFETY AGENCY APPROVALS UL File Number…………………. E107635 CSA File Number………………..LR19980 3.0 REFERENCE DOCUMENTS FCC Rules and Regulations, Part 68, Subpart F REA Bulletin 345-81, PE-76; Specification for modular telephone set hardware ANSI/EIA/TIA-568 IEC-60603-7 UL 1863 MIL-STD-202; General requirements for test specifications 4.0 RATINGS 4.1 VOLTAGE 56.5 V DC 150 V RMS AC (Ringing voltage only) 4.2 CURRENT 1.5 Amps @ 25°C 4.3 TEMPERATURE Operating: - 40°C to + 85°C Nonoperating:* - 40°C to + 85°C *Packaging materials should not exceed + 50°C REVISION: 8 ECR/ECN INFORMATION: TITLE: EC No: UCP2008-0143 DATE: 7/23/2007 DOCUMENT NUMBER: PSX-43249 PRODUCT SPECIFICATION LOW PROFILE RIGHT ANGLE MODULAR JACKS SHEET No. 1 of 5 CREATED / REVISED BY: CHECKED BY: APPROVED BY: JBELL 7/23/2007 LSCHMIDT 7/24/2007 FSMITH 7/25/2007 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION 5.0 PERFORMANCE 5.1 ELECTRICAL REQUIREMENTS DESCRIPTION REVISION: 8 TEST CONDITION REQUIREMENT Contact Resistance (Low Level) Mate connectors: apply a maximum voltage of 20 mV and a current of 15 mA. (Measurement locations in Section 7.0) 10 milliohms MAXIMUM [initial] Insulation Resistance Unmated connector, mounted to a PCB: apply a voltage of 500 VDC between adjacent terminals and between terminals to ground. 500 Megohms MINIMUM Dielectric Withstanding Voltage Mate connectors: apply a voltage of 1000 VAC for 1 minute between adjacent terminals and between terminals to ground. No breakdown; current leakage < 5 mA Temperature Rise Mate connectors: measure the temperature rise at the rated current after: 96 hours Temperature rise; +30°C MAXIMUM ECR/ECN INFORMATION: TITLE: EC No: UCP2008-0143 DATE: 7/23/2007 DOCUMENT NUMBER: PSX-43249 PRODUCT SPECIFICATION LOW PROFILE RIGHT ANGLE MODULAR JACKS SHEET No. 2 of 5 CREATED / REVISED BY: CHECKED BY: APPROVED BY: JBELL 7/23/2007 LSCHMIDT 7/24/2007 FSMITH 7/25/2007 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION 5.2 MECHANICAL REQUIREMENTS DESCRIPTION Connector Mate Force Mate connector at a rate of 25 ± 6 mm (1 ± ¼ inch) per minute. (Gage dimensions in Section 7.0) 22 N (5 lbf) MAXIMUM insertion force Mate connectors up to 500 cycles at a maximum rate of 20 cycles per minute prior to Environmental Tests. Vibration (Random) Mate connectors and vibrate per MIL-STD-202 PCB Separation Forces 8 REQUIREMENT Durability Plug Retention Force REVISION: TEST CONDITION EC No: UCP2008-0143 DATE: 7/23/2007 DOCUMENT NUMBER: PSX-43249 10 milliohms MAXIMUM (change from initial) & Discontinuity < 1 microsecond Apply an axial pullout force on the plug at a rate of 25 ± 6 mm (1 ± ¼ inch) per minute. Apply a perpendicular load on the plug at a rate of 25 ± 6 mm (1 ± ¼ inch) per minute. ECR/ECN INFORMATION: TITLE: 10 milliohms MAXIMUM (change from initial) 89 N (20 lbf) MINIMUM retention force 4.5 N (1 lbf) MINIMUM withdrawal force before solder reflow 89 N (20 lbf) MINIMUM withdrawal force after solder reflow PRODUCT SPECIFICATION LOW PROFILE RIGHT ANGLE MODULAR JACKS SHEET No. 3 of 5 CREATED / REVISED BY: CHECKED BY: APPROVED BY: JBELL 7/23/2007 LSCHMIDT 7/24/2007 FSMITH 7/25/2007 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION 5.3 ENVIRONMENTAL REQUIREMENTS DESCRIPTION Thermal (Cycling) Solderability REVISION: 8 TEST CONDITION Connectors to be placed in 95% relative humidity. Maximum temperature change is 15°C/hour. Cycle linearly per chart below. Mate connectors; expose to 10 cycles of: Duration (Minutes) Temperature °C 30 to 5 120 5 to 30 120 Hold at 30 240 30 to 5 180 Hold at 5 180 DATE: 7/23/2007 DOCUMENT NUMBER: PSX-43249 10 milliohms MAXIMUM (change from initial) & Dielectric Withstanding Voltage: No Breakdown at 500 VAC & Insulation Resistance: 500 Megohms MINIMUM & Visual: No Damage Solder Wetting Dip solder tails in flux and immerse in solder Visual: 95% of immersed area bath at 260±5°C for 5±0.5 seconds. must show no voids, pin holes ECR/ECN INFORMATION: TITLE: EC No: UCP2008-0143 REQUIREMENT PRODUCT SPECIFICATION LOW PROFILE RIGHT ANGLE MODULAR JACKS SHEET No. 4 of 5 CREATED / REVISED BY: CHECKED BY: APPROVED BY: JBELL 7/23/2007 LSCHMIDT 7/24/2007 FSMITH 7/25/2007 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC PRODUCT SPECIFICATION 6.0 PACKAGING Parts shall be packaged to protect against damage during handling, transit and storage. See appropriate sales drawings on Sheet 1 for packaging descriptions. 7.0 GAGES AND FIXTURES 8.0 OTHER INFORMATION REVISION: 8 ECR/ECN INFORMATION: TITLE: EC No: UCP2008-0143 DATE: 7/23/2007 DOCUMENT NUMBER: PSX-43249 PRODUCT SPECIFICATION LOW PROFILE RIGHT ANGLE MODULAR JACKS SHEET No. 5 of 5 CREATED / REVISED BY: CHECKED BY: APPROVED BY: JBELL 7/23/2007 LSCHMIDT 7/24/2007 FSMITH 7/25/2007 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC